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Results for “THERMAL STRESS”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 55 records · Page 3
All sourcesNASA NTRSDOE OSTI
NASA NTRS1974

On thermal stress failure of the SNAP-19A RTG heat shield

Results of a study on thermal stress problems in an amorphous graphite heat shield that is part of the launch-abort protect system for the SNAP-19A radio-isotope thermoelectric generators (RTG) that will be used on the Viking Mars Lander are presended. The first result is from a thermal stress analysis of a full-scale RTG heat source that failed to survive a suborbital entry flight test, possibly due to thermal stress failure. It was calculated that the maximum stress in the heat shield was only 50 percent of the ultimate strength of the material. To provide information on the stress failure criterion used for this calculation, some heat shield specimens were fractured under abort entry conditions in a plasma arc facility. It was found that in regions free of stress concentrations the POCO graphite heat shield material did fracture when the local stress reached the ultimate uniaxial stress of the material.

Pitts, W. C.↗
NASA NTRS1980

The effect of thermal stresses on the integrity of three built-up aircraft structures

A Mach 6 flight was simulated in order to examine heating effects on three frame/skin specimens. The specimens included: a titanium truss frame with a lockalloy skin; a stainless steel z-frame with a lockalloy skin; and a titanium z-frame with a lockalloy skin. Thermal stresses and temperature were measured on these specimens for the purpose of examining their efficiency, performance, and integrity. Measured thermal stresses were examined with respect to material yield strengths, buckling criteria, structural weight, and geometric locations. Principal thermal stresses were studied from the standpoint of uniaxial stress assumptions. Measured thermal stresses were compared to predicted values.

Jenkins, J. M.↗
NASA NTRS1979

Effect of element density on the NASTRAN calculated mechanical and thermal stresses of a spar

A NASTRAN model of a spar was examined to determine the sensitivity of calculated axial thermal stresses and bending stresses to changes in element density of the model. The thermal stresses calculated with three different element densities resulted in drastically differing values. The position of the constraint also significantly affected the value of the calculated thermal stresses. Mechanical stresses calculated from an applied loading were insensitive to element density.

Jenkins, J. M.↗
NASA NTRS1990

Reduction of thermal stresses in continuous fiber reinforced metal matrix composites with interface layers

The potential of using an interface layer to reduce thermal stresses in the matrix of composites with a mismatch in coefficients of thermal expansion of fiber and matrix was investigated. It was found that compliant layers, with properties of readily available materials, do not have the potential to reduce thermal stresses significantly. However, interface layers with high coefficient of thermal expansion can compensate for the mismatch and reduce thermal stresses in the matrix significantly.

Jansson, S.↗
NASA NTRS1984

Thermal-stress analysis for a wood composite blade

A thermal-stress analysis of a wind turbine blade made of wood composite material is reported. First, the governing partial differential equation on heat conduction is derived, then, a finite element procedure using variational approach is developed for the solution of the governing equation. Thus, the temperature distribution throughout the blade is determined. Next, based on the temperature distribution, a finite element procedure using potential energy approach is applied to determine the thermal-stress distribution. A set of results is obtained through the use of a computer, which is considered to be satisfactory. All computer programs are contained in the report.

Fu, K. C.↗
NASA NTRS2004

Damage Assessment of Stress-Thermal Cycled high temperature

We report on the characterization of bismaleimide and polyimide carbon fiber composite, microcrack development under stress thermal cycling loading. Such cycles range from cryogenic temperatures associated with cryogenic fuel (LN, LOX) containment to high temperatures of 300 degrees Celsius associated with future hypervelocity aeropropulsion systems. Microcrack development thresholds as a function of temperature range of the thermal cycle; the number of cycles; the applied stress level imposed on the composite are reported. We have conducted stress-thermal cycles on thin bismaleimide-woven carbon fiber foils for three temperature range cycles: 1. Ambient temperature - -196 degrees celsius. 2. Ambient temperature - 150 degrees Celsius; 200 degrees Celsius; 250 degrees Celsius. 3. -196 degrees Celsius - 250 degrees Celsius. The Principle findings are that the full cycles from -196 degrees Celsius to to 250 degrees Celsius cause the most significant microcrack of development. These observations indicate that the high temperature portion of the cycle under load causes fiber-matrix interface failure and subsequent exposure to higher stresses at the cryogenic, low temperature region results in composite matrix microcracking as a result of the additional stresses associate with the fiber-matrix thermal expansion mismatch. Our initial studies for 12 ply PMR-II-50 polyimide/M60JB carbon fabric [0f,90f,90f,0f,0f,90f]ls composites will be presented. The stress-thermal cycle test procedure for these will be described. Moisture absorption characteristics between cycles will be used to monitor interconnected microcrack development. The applied stress level will be 75% of the composite cryogenic (-196 degrees Celsius) ultimate strength.

Ju, Jae-Hyung↗
NASA NTRS1982

Transient thermal stress problem for a circumferentially cracked hollow cylinder

The transient thermal stress problem for a hollow elasticity cylinder containing an internal circumferential edge crack is considered. It is assumed that the problem is axisymmetric with regard to the crack geometry and the loading, and that the inertia effects are negligible. The problem is solved for a cylinder which is suddenly cooled from inside. First the transient temperature and stress distributions in an uncracked cylinder are calculated. By using the equal and opposite of this thermal stress as the crack surface traction in the isothermal cylinder the crack problem is then solved and the stress intensity factor is calculated. The numerical results are obtained as a function of the Fourier number tD/b(2) representing the time for various inner-to-outer radius ratios and relative crack depths, where D and b are respectively the coefficient of diffusivity and the outer radius of the cylinder.

Nied, H. F.↗
NASA NTRS2003

Damage Assessment of Stress-Thermal Cycled High Temperature

We report on the characterization of bismaleimide and polyimide carbon fiber composite, microcrack development under stress thermal cycling loading. Such cycle range from cryogenic temperatures associated with cryogenic fuel (LN, LOX) containment to high temperatures of 300 degrees associated with future hypervelocity aeropropulsion systems. Microcrack development thresholds as a function of temperature range of the thermal cycle, the number of cycles, and the applied stress level imposed on the composite are reported. We have conducted stress-thermal cycles on thin bismaleimide-woven carbon fiber foils for three temperature range cycles. The principle findings are that the full cycles from -196 degree celsius up to 250 degree celsius cause the most significant microcrack development. These observations indicate that the high temperature portion of the cycle under load causes fiber-matrix interface failure and subsequent exposure to higher stresses at the cryogenic, low temperature region results in composite matrix microcracking as a result of the additional stresses associated with the fiber-matrix thermal expansion mismatch. Our initial studies for 12 ply PMR-II-50 polyimide/M6OJB carbon fabric [0f, 90f, 90f, 0f, 0f, 90f] composites will be presented. The stress-thermal cycle test procedure for these will be described. Moisture absorption characteristics between cycles will be used to monitor interconnected microcrack development. The applied stress level will be 75 percent of the composite cryogenic -196 degree celsius ultimate strength.

Ju, Jach-Yung↗
NASA NTRS1985

Thermal stress analysis of a new turbine shroud seal concept

The thermal stress field of a two piece turbine shroud seal concept was analyzed and results compared to one piece designs by finite element analysis. The two piece seal has independently formed structure (substrate) and ceramic components that are assembled at ambient conditions. The boundary conditions used for analysis were hot gas surface temperatures of 1370 and 1650 C (2500 and 3000 F) and cooled surface temperature of 700 C (1285 F). The resulting thermal stress field, of the two piece seal when compared to the one piece seals in the region of all ceramic material, was reduced substantially.

Handschuh, R. F.↗
NASA NTRS1989

High intensity acoustic tests of a thermally stressed aluminum plate in TAFA

An investigation was conducted in the Thermal Acoustic Fatigue Apparatus at the Langley Research Center to study the acoustically excited random motion of an aluminum plate which is buckled due to thermal stresses. The thermal buckling displacements were measured and compared with theory. The general trends of the changes in resonances frequencies and random responses of the plate agree with previous theoretical prediction and experimental results for a mechanically buckled plate.

Ng, Chung Fai↗
NASA NTRS1983

A study of the effect of apparent strain on thermal stress measurement for two types of elevated temperature strain gages

A weldable type strain gage was used to measure low level thermal stress in an elevated temperature environment. Foil strain gages used in a comparative manner reveal that the apparent strain of weldable strain gages is not sufficiently known to acquire accurate low level thermal stress data. Apparent strain data acquired from coupon tests reveals a large scatter in apparent strain characteristics among the weldable strain gages. It is concluded that apparent strain data for individual weldable strain gages must be required prior to installation if valid thermal stress data is to be obtained through the temperature range of room temperature to 755 K (900 F).

Jenkins, J. M.↗
NASA NTRS1974

Thermal stress studies using optical holographic interferometry

The application of holography to thermal stress studies is discussed. Interference fringes as produced by holograms and their interpretation are reviewed in relation to workpiece displacement. Three potential mechanisms are given to explain thermal displacement as detected by holographic methods. Results of some thermal stressing studies are reported, including tests on a live rocket motor.

Harris, W. J.↗
NASA NTRS1976

Thermal-stress fatigue behavior of twenty-six superalloys

The comparative thermal-stress fatigue resistances of 26 nickeland cobalt-base alloys were determined by fluidized bed tests. Cycles to cracking differed by almost three orders of magnitude for these materials, with directional solidification and surface protection showing definite benefit. The alloy-coating combination with the highest thermal-stress fatigue resistance was directionally solidified NASA TAZ-8A with an RT-SP coating. Its oxidation resistance was also excellent, showing approximately a 1/2 percent weight loss after 14,000 fluidized bed cycles.

Bizon, P. T.↗
NASA NTRS1989

Thermal Stresses In Space-Shuttle Wing

Combined thermal deformations of wing-skin panel and TPS would not tear SIP layer. Report presents analysis of thermal stresses induced in skin panel, thermal-protection system (TPS), and strain-isolation pad (SIP) of Space Shuttle orbiter. Purpose of analysis to determine whether any part of above mentioned structures overstressed and overdeformed under reentry heating, assuming one TPS tile lost at end of reentry heating.

Ko, William L.↗
NASA NTRS1980

Thermal stress response of General Purpose Heat Source (GPHS) aeroshell material

A thermal stress test was conducted to determine the ability of the GPHS aeroshell 3 D FWPF material to maintain physical integrity when exposed to a severe heat flux such as would occur from prompt reentry of GPHS modules. The test was performed in the Giant Planetary Facility at NASA's Ames Research Center. Good agreement was obtained between the theoretical and experimental results for both temperature and strain time histories. No physical damage was observed in the test specimen. These results provide initial corroboration both of the analysis techniques and that the GPHS reentry member will survive the reentry thermal stress levels expected.

Grinberg, I. M.↗
NASA NTRS1987

Thermal stress cycling of GaAs solar cells

Thermal stress cycling was performed on gallium arsenide solar cells to investigate their electrical, mechanical, and structural integrity. Cells were cycled under low Earth orbit (LEO) simulated temperature conditions in vacuum. Cell evaluations consisted of power output values, spectral response, optical microscopy and ion microprobe mass analysis, and depth profiles on both front surface inter-grid areas and metallization contact grid lines. Cells were examined for degradation after 500, 5,000, 10,000 and 15,245 thermal cycles. No indication of performance degradation was found for any vendor's cell lot.

Francis, Robert W.↗