Engineering Papers⌕ Search

SEARCH · Engineering Papers

Results for “SiP”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 55 records · Page 3
All sourcesNASA NTRSDOE OSTI
NASA NTRS2018

2.5/3D Daisy Chain Reliability Evaluation

The objective of this task is to evaluate thermal cycle behavior of advanced 2.5/3D electronics — commercial-off the-shelf (COTS) —packages of different configurations assembled onto printed circuit boards (PCBs). Three key approaches were considered for evaluation. The first approach focused on the through-mold via (TMV™) technology at assembly level. The second approach focused on evaluation of 2.5D (also known as, System in Package (SiP)) in fine pitch ball grid array (FPGA). The third approach focused on evaluation of through-silicone-via (TSV) technologies. This report presents the test results for TMV™ and SiP packaging technologies and reliability, and it also provides lessons learned on quality assurance methods. Specifically, the report presents the test matrix for various 3D TMV™ packaging assembly configurations and reliability characterizations performed under two accelerated thermal cycling (ATC) and accelerated thermal shock cycling (ATSC) conditions. The ATC and ATSC were performed in the range of –55°C to 125°C and –100°C to 100°C, respectively. The report also includes assembly of a SiP— a 60-mm fine-pitch ball-grid array (FPGA) interposer with an IC at the center and six chip-scale package (CSP) daisy chains at the periphery—with package assembly characterizations. After assembly, the daisy chains were subjected to ATCs in the range of –40°C to 125°C for reliability evaluation. Finally, for both TMV™ and SiP packaging configurations, characterizations results by X-ray, optical imaging, and daisy-chain resistance evaluations were also presented.

Ghaffarian, Reza↗
NASA NTRS1980

Structural tests on a tile/strain isolation pad thermal protection system

The aluminum skin of the space shuttle is covered by a thermal protection system (TPS) consisting of a low density ceramic tile bonded to a matted-felt material called strain insulation pad (SIP). The structural characteristics of the TPS were studied experimentally under selected extreme load conditions. Three basic types of loads were imposed: tension, eccentrically applied tension, and combined in-plane force and transverse pressure. For some tests, transverse pressure was applied rapidly to simulate a transient shock wave passing over the tile. The failure mode for all specimens involved separation of the tile from the SIP at the silicone rubber bond interface. An eccentrically applied tension load caused the tile to separate from the SIP at loads lower than experienced at failure for pure tension loading. Moderate in-plane as well as shock loading did not cause a measurable reduction in the TPS ultimate failure strength. A strong coupling, however, was exhibited between in-plane and transverse loads and displacements.

Williams, J. G.↗
NASA NTRS1980

Microstructural characterization of the HRSI thermal protection system for space shuttle

Components of the space shuttle high temperature reusable surface insulation (HRSI) system were microscopically characterized, both separately and as a system, to obtain information needed for stress analysis models of the thermal protection system. A tension specimen of the HRSI system was loaded in steps and was microscopically observed at each load condition to demonstrate the tension failure mode associated with strain isolation pad (SIP) behavior. A local failure occurred which should be associated with transfer of load through transverse fibers in the SIP. Stress concentrations attributed to the SIP behavior necessitated strengthening of the HRSI by densification of the RSI at the bondline. An HRSI tile was microscopically characterized after the densification process. The densified surface layer blended into the RSI which caused a gradual change in density. The gradation in density does not appear to represent a sharp discontinuity in elastic modulus between the densified layer and the parent material.

Ransone, P. O.↗
NASA NTRS1983

Effect of strain isolator pad modulus on inplane strain in Shuttle Orbiter thermal protection system tiles

The thermal protection system used on the Space Shuttle orbiter to determine strains in the reusable surface insulation tiles under simulated flight loads was investigated. The effects of changes in the strain isolator pad (SIP) moduli on the strains in the tile were evaluated. To analyze the SIP/tile system, it was necessary to conduct tests to determine inplane tension and compression modulus and inplane failure strain for the densified layer of the tiles. It is shown that densification of the LI-900 tile material increases the modulus by a factor of 6 to 10 and reduces the failure strain by about 50%. It is indicated that the inplane strain levels in the Shuttle tiles in the highly loaded regions are approximately 2 orders of magnitude lower than the failure strain of the material. It is concluded that most of the LI-900 tiles on the Shuttle could be mounted on a SIP with tensile and shear stiffnesses 10 times those of the present SIP without inplane strain failure in the tile.

Sawyer, J. W.↗
NASA NTRS1982

Interfacial fracture of Space-Shuttle thermal-protection system

Stable crack growth and fracture at the interface of undensified LI-900 reusable surface insulation (RSI) tile and the Nomex strain isolation pad (SIP) of the Space-Shuttle thermal-protection system (TPS) were modeled by double-edged notch-tension specimens. These specimens were loaded under uniaxial tension or 50-Hz cyclic loading and the resultant stable crack growth leading to eventual fracture was monitored by a videocamera. These tests showed that successive local tear-outs due to local tensile overload in the RSI tile resulted in the interfacial fracture where the crack-tip opening angle, CTOA, of the SIP was related to initiation and intermittent stable crack propagation. Fractures in similar static and dynamic test specimens using densified LI-900 RSI tiles occurred in the undensified regions of the RSI tiles. These failures were consistent with the above failure mechanism based on the local tensile strength of the undensified LI-900 RSI tile. The intermittent stable crack growth of undensified LI-900 RSI tile was reproduced by a deterministic, two-dimensional finite-element model with SIP of variable elastic moduli.

Komine, A.↗
NASA NTRS2004

Tethers as Debris: Simulating Impacts of Kevlar Tethers on Shuttle Tiles

In a previous paper I examined the effects of impacts of polymer tethers on aluminum plates using the SPHC hydrodynamic code. In this paper I apply tether models to a new target - models of Space Shuttle tiles developed during the STS 107 accident investigation. In this three-dimensional simulation, a short tether fragment strikes a single tile supported on an aluminum backing plate. A tile of the LI-900 material is modeled. Penetration and damage to the tile and the backwall are characterized for three normal impact velocities. The tether is modeled as a bundle of eight 1-mm strands, with the bundle having dimensions 2-mm x 4-mm x 20-cm. The bulk material properties used are those of Kevlar(TradeMark) 49, for which a Mie-Gruneisen multiphase equation of state (eos) is used. In addition, the strength model is applied in a linear sense, such that tensile loads along the strand length are supported, but there is no strength in the lateral directions. Tile models include the various layers making up the tile structure. The outermost layer is a relatively dense borosilicate glass, known as RCG, 0.5-mm thick. The RCG layer is present on the top and four sides of the tile. Below this coating is the bulk of the tile, 1.8- in thick, made of LI-900, a product consisting of rigidized fiberous silica with a density of 9 lWft3. Below the main insulating layer is a bottom layer of the same material that has been treated to increase its density by approximately 69% to improve its strength. This densified layer is bonded to a Strain Isolation Pad (SIP), modeled as a refractory felt fabric. The SIP is bonded to an aluminum 2024 wall 0.1-in thick. The tile and backwall materials use a Me-Gruneisen multiphase eos, with the exception of the SIP felt, which uses a fabric equation of state. Fabrics must be crushed to the full bulk material density before bulk material properties and a Mie-Gruneisen eos are applied. Tether fragment impact speeds of 3,7, and 10 km/s are simulated, with impact velocities normal to the tile face. Damage results are presented in tabular format.

Evans, Steven W.↗
NASA NTRS2024

High Ice Water Content in Tropical Mesoscale Convective Systems (A Conceptual Model)

The phenomenon of high ice water content (HIWC) occurs in mesoscale convective systems (MCSs) when a large number of small ice particles with typical sizes of a few hundred micrometers, concentrations of the order of 10 2 –10 3 L −1 , and IWC exceeding 1 g m −3 are present at high altitudes. HIWC regions in MCSs may extend vertically up to 10 km above the melting layer and horizontally up to hundreds of kilometers, filling large volumes of the convective systems. HIWC has great geophysical significance due to its effect on precipitation formation, the hydrological cycle, and the radiative properties of MCSs. It is also recognized as a hazard for commercial aviation operations since it can result in engine power loss and in the malfunctioning of aircraft data probes. This study summarizes observational and numerical simulation efforts leading to the development of a conceptual model for the production of HIWC in tropical MCSs based on the data collected during the HAIC–HIWC campaign. It is hypothesized that secondary ice production (SIP) in the vicinity of the melting layer plays a key role in the formation and sustainability of HIWC. In situ observations suggest that the major SIP mechanism in the vicinity of the melting layer is related to the fragmentation of freezing drops (FFDs). Both in situ data and numerical simulations suggest that the recirculation of drops through the melting layer led to the amplification of SIP. The proposed conceptual model and simulation results motivate further efforts to extend reproducible laboratory measurements.

high ice water content↗
NASA NTRS1975

A small instrument pointing system for shuttle sortie missions

A small instrument pointing system (SIPS) has been conceptually designed as a means of interfacing smaller astronomical instruments with the ESA spacelab system on shuttle sortie missions. Small instruments are defined as being up to 0.9 meter in diameter, three meters in length, and 340 kilograms in mass. Two independently supported instruments are deployed on a common pedestal to give a hemispherical field of view. The instruments are each supported at their centers-of-mass in bi-axial gimbal systems for fine pointing. An optional roll gimbal can be used to give roll about the line of sight. Instruments are held in environmental canisters which protect them thermally, and acoustically as well as from contamination. The canister facilitates instrument integration and provides interfaces to all spacelab subsystems. The SIPS is a total instrument support system for small sortie mission instruments.

Henrikson, C. C.↗
NASA NTRS1980

Photoelastic tests on models of thermal protection system for space shuttle orbiter

The thermal protection system (TPS) of the space shuttle orbiter vehicle, consisting of ceramic tile/adhesive/strain isolator pad/adhesive/aluminum substructure, was modeled photoelasticity. A highly sensitive photoelastic material was used in the models to show the nature of the stress-transfer between the strain isolation pad (SIP) and the ceramic tile through the RTV-adhesive layer. Isochromatic fringe patterns were obtained for models subjected to tension and combined tension and bending. Tests indicated that the load-transfer between the SIP and the photoelastic material occurred at discrete locations causing stress concentrations in the photoelastic material. Stress concentration factors of the order of 1.9 were measured, but as the observed photoelastic response was an integrated effect through the model thickness, the local stress concentration factors at the SIP/tile interface could be even higher.

Prabhakaran, R.↗
NASA NTRS1980

Substructure procedure for including tile flexibility in stress analysis of shuttle thermal protection system

A substructure procedure to include the flexibility of the tile in the stress analysis of the shuttle thermal protection system (TPS) is described. In this procedure, the TPS is divided into substructures of (1) the tile which is modeled by linear finite elements and (2) the SIP which is modeled as a nonlinear continuum. This procedure was applied for loading cases of uniform pressure, uniform moment, and an aerodynamic shock on various tile thicknesses. The ratios of through-the-thickness stresses in the SIP which were calculated using a flexible tile compared to using a rigid tile were found to be less than 1.05 for the cases considered.

Giles, G. L.↗
NASA NTRS1981

Mission load dynamic tests of two undensified Space shuttle thermal protection system tiles

Two tests of undensified Space Shuttle thermal protection tiles under combined static and dynamic loads were conducted. The tiles had a density of approximately 144 Kg/cum (LI900 tiles) and were mounted on a strain isolation pad which was 0.41 cm (.160 inch) thick. A combined static and dynamic mission stress histogram representative of the W-3 area of the wing of the orbiter vehicle was applied. The stress histogram was provided by the space shuttle project. Results presented include: tabulation of measured peak and root-mean-square (RMS) accelerations in both compression and tension; peak SIP stress in compression and tension, peak and RMS amplitude response ratios; lateral to vertical response ratios; response time histories; peak stress distributions (histograms), and SIP extension measured both with and without static tension at various mission times.

Leatherwood, J. D.↗
NASA NTRS1982

Application of In Situ Fiberization for fabrication of improved strain isolation pads and graphite epoxy composites

The feasibility of applying the in situ fiberization process to the fabrication of strain isolation pads (SIP) for the Space Shuttle and to the fabrication of graphite-epoxy composites was evaluated. The ISF process involves the formation of interconnected polymer fiber networks by agitation of dilute polymer solutions under controlled conditions. High temperature polymers suitable for SIP use were fiberized and a successful fiberization of polychloro trifluoroethylene, a relatively high melting polymer, was achieved. Attempts to fiberize polymers with greater thermal stability were unsuccessful, apparently due to characteristics caused by the presence of aromaticity in the backbone of such materials. Graphite-epoxy composites were fabricated by interconnecting two dimensional arrays of graphite fiber with polypropylene IS fibers with subsequent epoxy resin impregnation. Mechanical property tests were performed on laminated panels of this material to evaluate intralaminar and interlaminar shear strength, and thus fracture toughness. Test results were generally unpromising.

Rosser, R. W.↗
NASA NTRS1982

Mechanical properties of the Shuttle Orbiter thermal protection system strain isolator pad

An experimental investigation conducted to determine the static and fatigue properties of the Strain Isolator Pad (SIP) used on the Shuttle Orbiter Thermal protection system is described. Static tension-compression and shear test results show that the SIP is highly nonlinear and that it possesses a large hysteresis, a large low modulus region for low stress levels, and stress-strain properties that are highly sensitive to strain rate and previous load history. In addition, the shear properties are also found to be sensitive to forces applied normal to the plane of the pad and to the orientation of the material. For the undensified tile/SIP system, static and fatigue failure takes place at the SIP/tile interface at low stress levels and for a small number of cycles.

Sawyer, J. W.↗
NASA NTRS1982

Analytical and experimental evaluations of Space Shuttle TPS tile vibration response

Analytical studies and laboratory experiments have been performed to evaluate the vibration response of the Space Shuttle Thermal Protection System (TPS) tiles due to the intense rocket generated acoustic noise during lift-off. The TPS tiles are mounted over the exterior of the Space Shuttle Orbiter structure through Strain Isolation Pads (SIP) which protect the tiles from thermal induced shear loads at their interface. The analytical predictions indicate that the response of a typical tile is governed by the structural vibration inputs through the SIP under the tile at frequencies below 250 Hz, and by the direct acoustic excitation over the exterior surface of the tile at frequencies above 250 Hz. An evaluation of the laboratory test data for this same tile, in which conditioned (partial) coherent output spectral analysis procedures were used, leads to exactly the same conclusion. The results demonstrate the power of conditioned spectral analysis procedures in identifying vibration response mechanisms when two or more of the inputs are highly correlated.

Piersol, A. G.↗
NASA NTRS1982

Edge softening of the Shuttle TPS strain isolation pad

Tensile tests and an analytical investigation were performed to characterize the edge softening behavior of the strain isolation pad (SIP) between the Orbiter skin and thermal protection system. The tensile tests were carried out with varying sizes of disk-shaped specimens bonded between aluminum disks. The specimens strength and stiffness were determined on the basis of specimen size, and an analytical model of the microstructural stress-strain characteristics was developed. Strength and stiffness were found to decrease near the free edges because through-the-thickness fibers located there were not anchored. No size dependence at maximum load was observed in specimens between 0.75-4.0 in. thick. In-plane and out-of-plane coupling in deformation was detected. The model gave accurate predictions of the tensile behavior of the SIP as a function of distance to a free edge.

Ransone, P. O.↗
NASA NTRS1982

Sputter-ion plating of coatings for protection of gas-turbine blades against high-temperature oxidation and corrosion

Considerable effort is being devoted to the development of overlay coatings for protecting critical components such as turbine blades against high-temperature oxidation, corrosion, and erosion damage in service. The most commercially advanced methods for depositing coatings are electron-beam evaporation and plasma spraying. Sputter-ion plating (SIP) offers a potentially cheaper and simpler alternative method for depositing overlays. Experimental work on SIP of Co-Cr-Al-Y and Ni-Cr-Al-Ti alloy coatings is described. Results are presented of metallographic assessment of these coatings, and of the results obtained from high-velocity testing using a gas-turbine simulator rig.

Coad, J. P.↗
NASA NTRS1983

Spacelab Data Processing Facility

The Spacelab Data Processing Facility (SDPF) processes, monitors, and accounts for the payload data from Spacelab and other Shuttle missions and forwards relevant data to various user facilities worldwide. The SLDPF is divided into the Spacelab Input Processing System (SIPS) and the Spacelab Output Processing System (SOPS). The SIPS division demultiplexes, synchronizes, time tags, quality checks, accounts for the data, and formats the data onto tapes. The SOPS division further edits, blocks, formats, and records the data on tape for shipment to users. User experiments must conform to the Spacelab's onboard High Rate Multiplexer (HRM) format for maximum process ability. Audio, analog, instrumentation, high density, experiment data, input/output data, quality control and accounting, and experimental channel tapes along with a variety of spacelab ancillary tapes are provided to the user by SLDPF.

Source record↗
NASA NTRS1987

Thermal stress analysis of space shuttle orbiter wing skin panel and thermal protection system

Preflight thermal stress analysis of the space shuttle orbiter wing skin panel and the thermal protection system (TPS) was performed. The heated skin panel analyzed was rectangular in shape and contained a small square cool region at its center. The wing skin immediately outside the cool region was found to be close to the state of elastic instability in the chordwise direction based on the conservative temperature distribution. The wing skin was found to be quite stable in the spanwise direction. The potential wing skin thermal instability was not severe enough to tear apart the strain isolation pad (SIP) layer. Also, the preflight thermal stress analysis was performed on the TPS tile under the most severe temperature gradient during the simulated reentry heating. The tensile thermal stress induced in the TPS tile was found to be much lower than the tensile strength of the TPS material. The thermal bending of the TPS tile was not severe enough to cause tearing of the SIP layer.

Ko, William L.↗