Tunable Stabilization of Cuprous Ions via Kinetic and Thermodynamic Control of Cu Electrodeposition in Non-Aqueous Media
In this work, significant stabilization of Cu + ions is achieved in non-aqueous electrolytes containing TFSI - and Cl - anions with diglyme as solvent. When Cl - is absent, stabilization of Cu + occurs due to the very low stability constant of Cu 2+ in diglyme. However, in the presence of relatively low Cl - concentrations (i.e., equimolar relative to Cu 2+ ), both Cu + and Cu 2+ form extremely stable Cu 2+ / + [Cl - ] complexes resulting in a similar to 1200 mV negative shift of the Cu + /0 redox couple relative to that of more easily reduced Cu + [TFSI - ][Cl - ] complexes. Furthermore, these results suggest that the lower solvation energies and wider electrochemical stability windows of non-aqueous solvents relative to water enable anions to play a much more significant role in guiding complexation behavior-providing new possibilities for (electro)chemical stabilization of reactive intermediates and highlighting the wealth of unexplored opportunities for electrolyte design in non-aqueous systems.