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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 55 records · Page 3
All sourcesNASA NTRSDOE OSTI
NASA NTRS1972

Flight-test results from two total temperature probes for air-data measurements up to 2014 K (3625 R)

An experimental temperature probe package containing a fluidic oscillator temperature probe and a shielded thermocouple temperature probe was tested during several X-15 flights. The X-15 flights provided greatly varying test conditions, including a wide range of rapidly changing total temperatures and Mach numbers which extended from subsonic to hypersonic speeds. Within restricted ranges of free-stream Mach number, free-stream unit weight flow, and local stagnation pressure, both probes yielded ramp outputs of temperature parallel to ramp inputs of free-stream total temperature. Within these ranges both probes were used to determine total temperature in the Mach 6 temperature environment. Because ambient temperature was known, both probes were used to estimate velocity and Mach number.

Nugent, J.↗
NASA NTRS1999

Chip Scale Package Integrity Assessment by Isothermal Aging

Many aspects of chip scale package (CSP) technology, with focus on assembly reliability characteristics, are being investigated by the JPL-led consortia. Three types of test vehicles were considered for evaluation and currently two configurations have been built to optimize attachment processes.

chipscale↗
NASA NTRS2011

Ascent Heating Thermal Analysis on Spacecraft Adaptor Fairings

When the Crew Exploration Vehicle (CEV) is launched, the spacecraft adaptor (SA) fairings that cover the CEV service module (SM) are exposed to aero heating. Thermal analysis is performed to compute the fairing temperatures and to investigate whether the temperatures are within the material limits for nominal ascent aeroheating case. The ascent heating is analyzed by using computational fluid dynamics (CFD) and engineering codes at Marshall Space Flight Center. The aeroheating environment data used for this work is known as Thermal Environment 3 (TE3) heating data. One of the major concerns is with the SA fairings covering the CEV SM and the SM/crew launch vehicle (CLV) flange interface. The TE3 heating rate is a function of time, wall temperature, and the spatial locations. The implementation of the TE3 heating rate as boundary conditions in the thermal analysis becomes challenging. The ascent heating thermal analysis on SA fairings and SM/CLV flange interface are performed using two commercial software packages: Cullimore & Ring (C&R) Thermal Desktop (TD) 5.1 and MSC Patran 2007r1 b. TD is the pre-and post-processor for SINDA, which is a finite-difference-based solver. In TD, the geometry is built and meshed, the boundary conditions are defined, and then SINDA is used to compute temperatures. MSC Pthermal is a finite-element- based thermal solver. MSC Patran is the pre- and post-processor for Pthermal. Regarding the boundary conditions, the convection, contact resistance, and heat load can be imposed in different ways in both programs. These two software packages are used to build the thermal model for the same analysis to validate each other and show the differences in the modeling details.

Wang, Xiao Yen↗
NASA NTRS2001

Effect of thermal cycling ramp rate on CSP assembly reliability

A JPL-led chip scale package consortium of enterprises recently joined together to pool in-kind resources for developing the quality and reliability of chip scale packages for a variety of projects. The experience of the consortium in building more than 150 test vehicle assemblies, single and double sided multilayer PWBs, and the environmental test results has now been published as a chip scale package guidelines document.

accelerated thermal cycle chip scale package solde↗
NASA NTRS2000

Thermal cycling test results of CSP and RF assemblies

A JPL-led chip scale package (CSP) Consortium of enterprises, composed of representing agencies and private companies, recently joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.

chip scale package CSP thermal cycle solder joint ↗
NASA NTRS1999

CSP Assembly Reliability

Reviews the many factors that affect interconnect reliability of emerging chip scale package (CSP) assemblies. These include: package type, package build, board design, and assembly variables.

chip scale package CSP solder joint reliability th↗
NASA NTRS1997

Telecommunications for Mars Rovers and Robotic Missions

The Mars exploration program of NASA and the international community will evolve from an early emphasis on orbital remote sensing toward in situ science activity on, or just above, the Martian surface.

communications packages↗
NASA NTRS2013

Appendix 2. Guide for Running AgMIP Climate Scenario Generation Tools with R in Windows, Version 2.3

This Guide explains how to create climate series and climate change scenarios by using the AgMip Climate team's methodology as outlined in the AgMIP Guide for Regional Assessment: Handbook of Methods and Procedures. It details how to: install R and the required packages to run the AgMIP Climate Scenario Generation scripts, and create climate scenarios from CMIP5 GCMs using a 30-year baseline daily weather dataset. The Guide also outlines a workflow that can be modified for application to your own climate data.

handbooks↗