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At least 55 records · Page 3

Economic analysis of precious metal recovery from electronic waste through gas-assisted microflow extraction

The recycling of end-of-life (EoL) electronic products is motivated by the enormous investment of resources in their creation and the environmental concerns associated with electronic waste (e-waste). Hydrometallurgical methods that utilize conventional leaching and solvent extraction are often applied to extract target materials from e-waste; however, these techniques have significant technical and economic limitations when extracting high-value, low concentration metals from complex waste streams. This study proposes and evaluates a novel process based on gas-assisted microflow extraction (GAME) that efficiently recovers precious metals from waste printed circuit boards (WPCBs). Further, an economic analysis is conducted to verify the economic feasibility of the GAME-based process at an industrial scale. The economic outputs are further investigated to identify the most cost-effective production strategies, particularly with respect to the plant feedstock rate. It is envisioned that this study may establish a paradigm for making economically-informed decisions for sustainable technologies.

42 ENGINEERING↗

Flexible PCB Windings Size Optimization for Winding AC Resistance Minimization Under the Sinusoidal Voltage Regime

In this paper, optimization of the winding AC resistance of the flexible printed circuit board (FPCB) wire windings is performed. A one-dimensional model of the FPCB winding is introduced and an equation for the FPCB winding AC resistance and its low and medium frequency approximation are derived. The approximate FPCB winding AC resistance equation is used to derive optimum thickness of the FPCB winding conductor thickness at which minimum of winding AC resistance (global optimum) is achieved. The Finite Element Method analysis and experimental verification of derived equations (winding resistance, impedance, power loss, and temperature measurements) is performed in order validate derived model and winding resistance equation.

42 ENGINEERING↗

Detecting Hardware Trojans in PCBs Using Side Channel Loopbacks

Malicious modifications to printed circuit boards (PCBs) are known as hardware Trojans. These may arise when malafide third parties alter PCBs premanufacturing or postmanufacturing and are a concern in safety-critical applications, such as industrial control systems. In this research, we examine how data-driven detection can be utilized to detect such Trojans at run-time. We develop a flexible and reconfigurable PCB test bed derived from the popular open-source programmable logic controller (PLC) platform “OpenPLC.” We then develop a Trojan detection framework, which utilizes and analyzes multimodal side channels (e.g., timing, magnetic signals, power, and hardware performance counters). We consider defender-configurable input/output (I/O) loopback test, comparison with design-document baselines, and magnetometer-aided monitoring of system behavior under defender-chosen excitations. Our approach can extend to golden-free environments. Golden (known-good) versions of the PCBs are assumed not available, but design information, datasheets, and component-level data are available. We demonstrate the efficacy of our approach on a range of Trojans instantiated in the test bed.

42 ENGINEERING↗

Intrinsic thermal interfacial resistance measurement in bonded metal–polymer foils

Heat conduction through bonded metal–polymer interfaces often limits the overall heat transfer in electronic packaging, batteries, and heat recovery systems. To design the thermal circuit in such systems, it is essential to measure the thermal interfacial resistance (TIR) across ~1 µm to 100 µm junctions. Previously reported TIR of metal–polymer junctions utilize ASTM E1530-based two-block systems that measure the TIR by applying pressure across the interface through external heating and cooling blocks. Here, we report a novel modification of the ASTM-E1530 technique that employs integrated heaters and sensors to provide an intrinsic TIR measurement of an adhesively bonded metal–polymer junction. We design the measurement technique using finite element simulations to either passively suppress or actively compensate the lateral heat diffusion through the polymer, which can minimize the systematic error to ≲5%. Through proof-of-concept experiments, we report the TIR of metal–polymer interfaces made from DuPont’s Pyralux double-side copper-clad laminates, commonly used in flexible printed circuit boards. Our TIR measurement errors are <10%. We highlight additional sources of errors due to non-idealities in the experiment and discuss possible ways to overcome them. Our measurement technique is also applicable to interfaces that are electrically insulating such as adhesively joined metal–metal junctions and sputter-coated or welded metal–polymer junctions. Altogether, the technique is capable of measuring TIR ≳10 –5 m 2 KW –1 in bonded metal–polymer foils and can be tailored for in situ measurements in flexible electronics, circuit packaging, and other hybrid metal–polymer systems.

47 OTHER INSTRUMENTATION↗

Boards having solderless interconnects

This disclosure provides systems, methods, and apparatus related to printed circuit boards. In one aspect, a device includes a first board and a second board. The first board includes at least two pins defined at an end of the first board. The first pin and the second pin are positioned along a first line and parallel to the first line. The second board includes at least two slots defined at an end of the second board. The first slot and the second slot are positioned along a second line and are angled from the second line by about ±10° to 15°. Each of the pins in the first board is engaged with each of the slots in the second board and forms an electrical connection between the first pin and the first slot and the second pin and the second slot.

Wielandt, Stijn↗

BICEP Array: 150 GHz Detector Module Development

The Background Imaging of Cosmic Extragalactic Polarization (BICEP)/Keck (BK) collaboration is currently leading the quest for the highest-sensitivity measurements of the polarized cosmic microwave background (CMB) anisotropies on a degree scale with a series of cryogenic telescopes, of which BICEP Array (BA) is the latest Stage-3 upgrade with a total of ~ 32,000 detectors. The instrument comprises 4 receivers spanning 30–270 GHz, with the low-frequency 30/40 GHz deployed to the South Pole Station in late 2019. The full complement of receivers is forecast to set the most stringent constraints on the tensor-to-scalar ratio r. Building on these advances, the overarching small-aperture telescope concept is already being used as the reference for further Stage-4 experiment design. This paper describes the development of the BICEP Array 150 GHz detector module and its fabrication requirements, with highlights on the high-density time division multiplexing (TDM) design of the cryogenic circuit boards. The low-impedance wiring required between the detectors and the frst stage of superconducting quantum interference device amplifers is crucial to maintaining a stable bias current on the detectors. Here, a novel multilayer FR4 Printed Circuit Board with superconducting traces, capable of reading out up to 648 detectors, is detailed along with its validation tests. An ultra-high-density TDM detector module concept we developed for a CMB-S4-like experiment that allows up to 1920 detectors to be read out is also presented. TDM has been chosen as the detector readout technology for the Cosmic Microwave Background Stage-4 (CMB-S4) experiment based on its proven low-noise performance, predictable costs, and overall maturity of the architecture. The heritage for TDM is rooted in mm- and sub-mm-wave experiments dating back 20 years and has since evolved to support a multiplexing factor of 64x in Stage-3 experiments.

79 ASTRONOMY AND ASTROPHYSICS↗

Low-Power, Flexible Sensor Arrays with Solderless Board-to-Board Connectors for Monitoring Soil Deformation and Temperature

Landslides are a global and frequent natural hazard, affecting many communities and infrastructure networks. Technological solutions are needed for long-term, large-scale condition monitoring of infrastructure earthworks or natural slopes. However, current instruments for slope stability monitoring are often costly, require a complex installation process and/or data processing schemes, or have poor resolution. Wireless sensor networks comprising low-power, low-cost sensors have been shown to be a crucial part of landslide early warning systems. Here, we present the development of a novel sensing approach that uses linear arrays of three-axis accelerometers for monitoring changes in sensor inclination, and thus the surrounding soil’s deformation. By combining these deformation measurements with depth-resolved temperature measurements, we can link our data to subsurface thermal–hydrological regimes where relevant. In this research, we present a configuration of cascaded I2C sensors that (i) have ultra-low power consumption and (ii) enable an adjustable probe length. From an electromechanical perspective, we developed a novel board-to-board connection method that enables narrow, semi-flexible sensor arrays and a streamlined assembly process. The low-cost connection method relies on a specific FR4 printed circuit board design that allows board-to-board press fitting without using electromechanical components or solder connections. The sensor assembly is placed in a thin, semi-flexible tube (inner diameter 6.35 mm) that is filled with an epoxy compound. The resulting sensor probe is connected to an AA-battery-powered data logger with wireless connectivity. We characterize the system’s electromechanical properties and investigate the accuracy of deformation measurements. Our experiments, performed with probes up to 1.8 m long, demonstrate long-term connector stability, as well as probe mechanical flexibility. Furthermore, our accuracy analysis indicates that deformation measurements can be performed with a 0.390 mm resolution and a 95% confidence interval of ±0.73 mm per meter of probe length. This research shows the suitability of low-cost accelerometer arrays for distributed soil stability monitoring. In comparison with emerging low-cost measurements of surface displacement, our approach provides depth-resolved deformation, which can inform about shallow sliding surfaces.

deformation monitoring↗

RF mixing modules for superconducting qubit room temperature control systems v1.0

We have developed a series of compact RF mixing boards by integrating I/Q quadrature mixing, IF(intermediate frequency)/LO(local oscillator)/RF power level adjustments, and DC (direct current) bias fine tuning on a 40 mm × 80 mm 4-layer PCB (printed circuit board) board with EMI (electromagnetic interference) shielding.

Huang, Gang↗

High Precision, High Frequency Printed Antennas

An emerging trend in advanced manufacturing is printed electronics and sensors. The ability to print customized electronics and sensors integrated into functional packages is a growing need within a variety of growing markets such as smart manufacturing, internet of things (IoT), and the small satellite industry. Both Oak Ridge National Laboratory (ORNL) and the MITRE Corporation have seedling research efforts evaluating the potential for future printed electronic systems. High frequency, wide-bandwidth phased array antennas (i.e. >45 GHz) open the door to new applications. However, such sensors require currently prohibitively small feature sizes for commercial 3D printing technologies along with increasing challenges with connecting the driving electronics to such features. An additional finding with related advanced manufacturing challenges is the rapid production of 3D additive connectors for integration with commercial printed circuit boards (PCBs), primarily for advanced in-circuit inspection techniques. This work is developing additive manufacturing processes for producing connected and conductive fine scale 3D features. The primary focus was on aerosol-jet printing (AJP), which has a small minimum resolution (<50 µm) but is traditionally printed flat with small height/width aspect ratios <<1, and developing controls to enable fully 3D, high aspect ratio, and unsupported features. In Phase 1 of this effort, baselines of process performance were characterized, and test coupons produced for both ultra-high frequency antennas and microstructures to support reverse engineering of PCBs. In Phase 2, these efforts will be extended for system demonstration of ultra-high frequency antenna arrays, as well as reverse engineering circuitry for dense PCBs.

42 ENGINEERING↗

PRINTED, PLANAR MICROWAVE CONNECTOR WITH MULTIPLE SIGNAL LINES

Microwave connectors with a planar geometry have been demonstrated using additive manufacturing techniques. This planar form factor is expected to enable connectors to be integrated directly with other components onto a printed circuit board. The connectors were developed with multiple signal lines that will increase the density of signal connections to PCBs, eliminating the physical constraints of single-signal COTS microwave connectors. This work developed electromagnetic models (using Ansys HFSS) of these planar connectors to predict performance and optimize connector design. Materials and printing processes were developed to fabricate the connectors based on high-temperature PEEK thermoplastics. The multiple signal connectors were designed to operate over the 1-6GHz band and are built upon the single signal printed planar geometry connector introduced in a previous paper [1].

Additive Manufacturing↗

Thermal Management of Wide-Bandgap Semiconductor Amplifiers Used for Plasma Heating and Control

Princeton Fusion Systems (PFS) has designed, built, and tested a Load Switch printed circuit board (PCB) to demonstrate the capabilities of 2 kV silicon carbide (SiC) cascodes in development by Qorvo towards plasma heating and control applications. Initial tests have been conducted at low power (~100 W) for validation with thermal finite element analysis (FEA) modeling performed by the National Renewable Energy Laboratory (NREL). Comparisons of experimental data with the thermal modeling results, along with considerations for operating in plasma systems, will be discussed.

CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SU↗

Development of NDE/NDT Tools for High-Volume & High-Speed Inspection of CFRP Structures in Automotive Manufacturing

Main advantages of the air-coupled ultrasound testing (ACUT) and electromagnetic testing (EMT) techniques for NDE of CFRP composites were non-contact sensing, scalability for high-speed inspection, cost-effectiveness, and non-hazardous operation. Despite these advantages, no systems that would satisfy the project requirements were commercially available. Hence, one of the major efforts of the Michigan State University (MSU) team at the initial stage of the project was to close this technological gap by developing, optimizing, and validating array sensors that would provide sufficient sensitivity, spatial coverage, and resolution for robust defect detection. Optimization of the ACUT and EMT sensor designs was performed using experimentally validated finite element models. Initial experiments using array probes were conducted on relatively flat CFRP samples. In parallel, the MSU team designed and assembled a portable platform with two robotic arms. The robots were equipped with newly designed sensors that enabled high-speed NDE of curved CFRP parts. Presently, the developed robotic platform can be used as a demo/template NDE system, which is easily adaptable to manufacturing environments and in-line NDE. The ACUT NDE system developed by the MSU team used a high-power 4-channel pulser receiver for parallel data acquisition. The array probes were designed by stacking commercially available ACUT transducers, which operated in the frequency range between 100 kHz and 500 kHz. MSU optimized the excitation procedure and developed wave focusing cones so as to reduce the crosstalk between the transducers and to provide higher pulse repletion frequency (PRF). The through-transmission (TT) and single-side access (SSA) inspection modes were successfully implemented. In the TT-ACUT, structural defects in CFRP were detected by passing ultrasonic waves through the test part. Hence, the ACUT transmitters and receivers needed to be placed on the opposite sides of the test part. In the SSA-ACUT, guided waves (GW) were excited in the test part using the transmitters and were sensed by the receivers from the same side. Multi-channel TT-ACUT and SSA-ACUT provided high-speed NDE, and were successfully validated on CFRP test samples with interlaminar delaminations and other embedded defects The EM techniques developed by the MSU team included: 1) eddy current testing (ECT), 2) capacitive imaging (CI) and hybrid dual-mode imaging. In ECT, structural damage was detected in CFRP using coils sensor arrays. In ECT, the excitation magnetic field is generated by passing an alternating current through a coil, which is placed above the test sample. The excitation field penetrates the conductive sample and induces the eddy currents in its transect. In turn, the eddy currents generate the reaction field, which affects the total field sensed by a coil. Hence, the presence of structural flaws will alter the eddy current flow and the picked-up signal. ECT is mostly sensitive to local changes of the electric conductivity of the test sample, and CFRPs are mostly conductive in the direction of carbon fibers. Hence, ECT was well suited for the detection of fiber damage/fiber irregularities. The MSU team developed printed circuit boards (PCB) with coil sensor arrays optimized for NDE of CFRP. Unlike most commercial probes designed for ECT of metallic structures, the MSU array probes were designed for operation in [1-10] MHz frequency range, which was optimal for low-conductive CFRP. Multiple sensing topologies (coil groups excitation/sensing arrangements) were implemented and successfully validated. Capacitive Imaging (CI) technique developed by MSU was complementary to ECT. In contrast to ECT, which was sensitive to local changes of the electrical conductivity, the CI was sensitive to local changes of the dielectric constant. Therefore, CI could provide information about matrix damage/matrix irregularities in CFRP. The MSU CI sensor arrays were made of multiple circular or rectangular open-plate capacitors printed on PCB. Sensors of this type are not commercially available. In addition to ECT and CI, the MSU team developed a hybrid (dual-mode) inductive/capacitive measurement technique that synergistically combined the benefits of inductive and capacitive sensing for rapid NDE of fiber reinforced polymer (FRP) composite structures. Fiber damage and fiber irregularities in FRPs were detected by configuring hybrid sensors as coil sensors. Similarly, matrix damage, matrix irregularities and interlaminar delaminations were detected by configuring hybrid sensors as capacitive sensors. ECT and CI were performed sequentially by means of electronic switching. Hence, eliminating the need for mounting two separate sensor arrays on the probe. Portable robotic platform was developed by MSU for multi-technique high-speed NDE of CFRP test parts. The platform had two 6-axis robots, which enabled inspection of curved parts in approximately a 6×6×6 ft 3 active scan area. On the software side, the MSU team integrated scripts for NDE hardware control with scripts for robot motion control. MSU also implemented automated path planning for the robots, reconstruction of part’s surfaces via stereovision, 3D rendering of inspection data, and image processing algorithms for enhanced defect detection. Automotive composite parts manufactured by Plasan Composites from Phase I were used to validate the ACUT and EMT techniques on representative testbeds. Among those parts were three X-braces for a Dodge Viper, one composite calibration plaque with known defects at known locations, and four other test sections, including sections from a front splitter, a corner section from a composite hood, and a high-pressure RTM panel made using non crimp fabric. Other test samples included CFRP and GFRP calibration plates with fiber/matrix defects fabricated at MSU/CVRC.

36 MATERIALS SCIENCE↗

Flex-PCB Quench Antenna Developments at FNAL

We report flexible printed-circuit-board-based quench antenna arrays have been developed at FNAL since 2017. They proved to be low-noise, low-cost, sensitive, and non-invasive sensors for quench characterization in superconducting magnets, having the potential to extend even to quench detection. Starting with applications of small area sensors of this type, we have explored feasibility for operations at high pressure, and have invested in multi-channel quench antenna arrays covering the complete area of the innermost magnet layer of the conductor. We've also tested and optimized sensor geometry and relative orientations to increase sensitivity and spatial resolution. Beyond developments of warm and cold bore antennas, we've progressed to concepts which attach quench antennas to the conductor surfaces of accelerator magnets. Multiple programs and projects at FNAL and collaborating institutions benefited from this work already and our plans target further extensions of capabilities and applicability of these devices. In this paper we present the logic behind the development steps taken so far, status of our work and direction of near-term research on quench antennas at Fermilab.

43 PARTICLE ACCELERATORS↗

Online Monitoring of Medium Voltage Cable Systems with Spread Spectrum Time Domain and Frequency Domain Reflectometry

In-service failures of wave energy convertor (WEC) cable systems can have a significant cost and power availability impact. Close parallel research 2019 data showed > 1B£ and 9 Terra-Watt-Hours associated with global off-shore wind (OSW) cable failures (Strang-Moran 2020). OSW is a closely related technology but currently is significantly cheaper than WEC technology. For wave energy to compete, the problem of reliable cable transmission must be mitigated. This project develops isolation technology to allow online high frequency reflectometry testing of medium voltage cables (1 to 10 kV and higher) without arcing or damage to the test instrument. Online spread spectrum time domain reflectometry (SSTDR) testing has been established for low voltage cable systems in the aircraft and rail industry and the ability to detect and locate cable flaws of interest is well understood. Extending reflectometry testing to medium voltage systems could enable detection of cable damage before failures occur thereby allowing repair and replacement of damaged cable segments to be scheduled and managed. The seedling project succeeded to pass and receive high frequency SSTDR signals onto a cable up to 1 kV using a parallel trace isolation circuit board that can be connected onto the test cable. The approach used a novel circuit design for which an invention disclosure has been filed. A proposed sapling project would extend the technology toward the higher operating voltages used by WEC systems, thereby enabling online SSTDR cable monitoring. The goal of the seedling project was to extend the capability of the ARENA cable/motor test bed to address medium voltages and to develop a high pass filter isolation architecture to protect the reflectometry instrument from the low frequency (DC – 60 Hz) line voltage while allowing the high frequency diagnostic signal to pass to and from the test instrument to the live line. Initial efforts focused on passive LCR filter circuits to reduce 60 Hz levels below 10 volts from a 10 kV line while allowing the MHz high frequency chirps to pass onto the cables and for mV signals to be detected. We discovered that the parasitic loss behavior of real high voltage components precluded this approach from working. An alternate approach was adapted for the electric field to couple between two parallel traces on a printed circuit board much like a radio-frequency coupler. The challenge here was and is to have the parallel traces close enough to each other to effectively pass the high frequency chirp onto the live line and receive any reflected signal from any encountered impedance change along the cable. This reflected signal will be in the mV range. The traces however must be far enough apart to not allow arcing on the board. A design with 3 mm spacing was determined to allow the high frequency signal to pass onto the live line and receive the mV signal back into the instrument while reducing the 60 Hz voltage amplitude by >80 dB (more than a factor of 10,000) without allowing arcing from across the parallel traces. This was confirmed by simulation and test.

16 TIDAL AND WAVE POWER↗

Sandia National Laboratories FY20 Progress Report

The Energetic Neutrons campaign led by Sandia National Laboratories (SNL) had a successful year testing electronic devices and printed circuit boards (PCBs) under 14 MeV neutron irradiation at OMEGA. During FY20 the Energetic Neutrons campaign increased the number and complexity of experiments, continued collaborations with external organizations, and generated knowledge that supports SNL’s National Security mission. In FY20 the Energetic Neutrons campaign was executed by an early career team led by a new PI. The SNL team members were trained to take over new responsibilities during the shot day to increase the number and complexity of experiments in the campaigns. Also, in FY20 for the first time the Energetic Neutrons campaign had a graduate student contributing with pre and post-irradiation characterizations at SNL of the semiconductor devices irradiated at OMEGA. In FY20 SNL collaborated with the Air Force Nuclear Weapons Center (AFNWC) and supported experiments related to radiation effects in semiconductor devices. SNL also gave the opportunity to ride along to Los Alamos National Laboratory and multiple scientists from MIT and LLE. SNL continued using the last two generations of the Neutron Effects Diagnostics (NEDs) to field active and passive experiments but also redesigned the latest generation of the NEDs to accommodate larger components and improve the vacuum sealing as shown in figure 1a. The redesigned NEDs allowed SNL to perform active tests of a high voltage (HV) PCB for the first time at OMEGA; where signals before, during and after the irradiation were recorded. The HV PCB installed in one of the SNL NEDs is shown in figure 1b where a 3D-printed nosecone was used to check for mechanical and electrical interference. Passive irradiations of multiple components were followed up with leakage current, gain measurements and radiation-induced defect characterization.

42 ENGINEERING↗

Trace-Level, Multi-Gas Detection for Food Quality Assessment Based on Decorated Silicon Transistor Arrays

Multiplexed gas detection at room temperature is critical for practical applications, such as for tracking the complex chemical environments associated with food decomposition and spoilage. Here, an integrated array of multiple silicon-based, chemical-sensitive field effect transistors (CSFETs) is presented to realize selective, sensitive, and simultaneous measurement of gases typically associated with food spoilage. CSFETs decorated with sensing materials based on ruthenium, silver, and silicon oxide are used to obtain stable room-temperature responses to ammonia (NH 3 ), hydrogen sulfide (H 2 S), and humidity, respectively. For example, one multi-CSFET sensor signal changes from its baseline by 13.34 in response to 1 ppm of NH 3 , 724.45 under 1 ppm H 2 S, and 23.46 under 80% relative humidity, with sensitive detection down to 10 ppb of NH 3 and H 2 S. To demonstrate this sensor for practical applications, the CSFET sensor array is combined with a custom-printed circuit board into a compact, fully integrated, and portable system to conduct real-time monitoring of gases generated by decomposing food. By using existing silicon-based manufacturing methodologies, this room-temperature gas sensing array can be fabricated reproducibly and at low cost, making it an attractive platform for ambient gas measurement needed in food safety applications.

36 MATERIALS SCIENCE↗

Innovative Method for Reliable Measurement of PEM Water Electrolyzer Component Resistances

Understanding the sheet resistance of porous electrodes is essential for improving the performance of polymer electrolyte membrane (PEM) water electrolyzers and related technologies. Despite its importance, existing methods often fail to provide reliable and comprehensive data, especially for porous materials with complex morphologies and non‐uniform thicknesses. This study introduces a robust and straightforward method for determining the sheet resistance of porous electrodes using a novel probe concept based on industrial printed circuit board (PCB) technology. This probe measures resistance across ten distances, ranging from 250 µm to 2500 µm, enabling local mapping of resistance. The study focuses on the sheet resistance of key components in PEM water electrolyzers, including the gas diffusion layer (GDL), porous transport layer (PTL), and catalyst layers deposited on a membrane. Additionally, an image‐processing‐based method is presented to obtain the thickness distribution of the studied catalyst layers, facilitating a detailed analysis of the electrical in‐plane resistivity with thickness variations. Overall, this methodology has the potential to expedite material integration and bridge the gap between electrode engineering and single‐cell testing, thereby advancing the development of PEM water electrolyzers.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Implementation of Ion Mobility Spectrometry-Based Separations in Structures for Lossless Ion Manipulations (SLIM)

Structures for Lossless Ion Manipulations (SLIM) is a powerful variant of traveling wave ion mobility spectrometry (TW-IMS) that uses a serpentine pattern of microelectrodes deposited onto printed circuit boards to achieve ultralong ion path lengths (13.5 m). Ions are propelled through SLIM platforms via arrays of TW electrodes while RF and DC electrodes provide radial confinement, establishing near lossless transmission. The recent ability to cycle ions multiple times through a SLIM has allowed ion path lengths to exceed 1000 m, providing unprecedented separation power and the ability to observe ion structural conformations unobtainable with other IMS technologies. The combination of high separation power, high signal intensity, and the ability to couple with mass spectrometry places SLIM in the unique position of being able to address longstanding proteomics and metabolomics challenges by allowing the characterization of isomeric mixtures containing low abundance analytes.

Hollerbach, Adam L.↗