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42 records · Page 3

Real Time Characterization of Solid/Liquid Interfaces During Directional Solidification

A X-Ray Transmission Microscope (XTM) has been developed to observe in real time and in-situ solidification phenomenon at the solid/liquid interface. Recent improvements in the horizontal Bridgman furnace design provides real-time magnification (during solidification) up to 12OX. The increased magnification has enabled for the first time the XTM imaging of real-time growth of fibers and particles with diameters of 3-6 micrometers. Further, morphological transitions from planar to cellular interfaces have also been imaged. Results from recent XTM studies on Al-Bi monotectic system, Al-Au eutectic system and interaction of insoluble particles with s/I interfaces in composite materials will be presented. An important parameter during directional solidification of molten metal is the interfacial undercooling. This parameter controls the morphology and composition at the s/I interface. Conventional probes such as thermocouples, due to their large bead size, do not have sufficient resolution for measuring undercooling at the s/I interface. Further, the intrusive nature of the thermocouples also distorts the thermal field at the s/I interface. To overcome these inherent problems we have recently developed a compact furnace which utilizes a non-intrusive technique (Seebeck) to measure undercooling at the S/I interface. Recent interfacial undercooling measurements obtained for the Pb-Sn system will be presented. The Seebeck measurement furnace in the future will be integrated with the XTM to provide the most comprehensive tool for real time characterization of s/I interfaces during solidification.

Sen, S.↗

Numerical Modeling and In-Situ Observations of the Dynamics of the Solid/Liquid Interface Morphology During Directional Solidification of Alloys

The departure from interface planarity and the subsequent evolution to a periodic array of cells or dendrites is a fundamental process that characterizes most microstructures in solidified alloys. The growing demand for high quality alloys and semiconductor crystals requires a precise methodology to predict and subsequently control both the interface morphology and the distribution of impurities, additives, and phases in the grown crystal. Apart from its practical significance, the study of morphological evolution has also been viewed as a means to unearth a general paradigm for pattern formation in nature. A previously developed 2D numerical model for the solid/liquid interface tracking has been further refined and used to simulate the time-evolution of the perturbations on the interface. The dynamics of the local growth velocity, interface undercooling and solute concentration at the interface has been theoretically predicted by means of the numerical model for Al-Cu and Pb-Sn alloys. The model shows that perturbations with a wavelengths, lambda greater than a critical wavelength lambda(sub c) continue to grow in time whereas perturbations with lambda < lambda(sub c) cease to propagate. The model further predicts that under certain conditions perturbation can also propagate along the interface. Comparison of these predictions with existing theories of pattern formation and experimental results will be discussed.

Catalina, Adrian V.↗

Effects of Traveling Magnetic Field on Dynamics of Solidification

TMF is based on imposing a controlled phase-shift in a train of electromagnets, forming a stack. Thus, the induced magnetic field can be considered to be travelling along the axis of the stack. The coupling of this traveling wave with an electrically conducting fluid results in a basic flow in a form of a single axisymmetric roll. The magnitude and direction of this flow can be remotely controlled. Furthermore, it is possible to localize the effect of this force field though activating only a number of the magnets. This force field generated in the fluid can, in principle, be used to control and modify convection in the molten material. For example, it can be used to enhance convective mixing in the melt, and thereby modify the interface shape, and macrosegregation. Alternatively, it can be used to counteract thermal and/or solutal buoyancy forces. High frequency TMF can be used in containerless processing techniques, such as float zoning, to affect the very edge of the fluid so that Marangoni flow can be counter balanced. The proposed program consists of basic fundamentals and applications. Our goal in conducting the following experiments and analyses is to establish the validity of TMF as a new tool for solidification processes. Due to its low power consumption and simplicity of design, this tool may find wide spread use in a variety of space experiments. The proposed ground based experiments are intended to establish the advantages and limitations of employing this technique. In the fundamentals component of the proposed program, we will use theoretical tools and experiments with mercury to establish the fundamental aspects of TMF-induced convection through a detailed comparison of theoretical predictions and experimental measurements of flow field. In this work, we will conduct a detailed parametric study involving the effects of magnetic field strength, frequency, wave vector, and the fluid geometry. The applications component of this work will be focused on investigating the effect of TMF on the following solidification and pre-directional solidification processes: (1) Bridgman growth of Ga:Ge with the goal of counteracting the buoyancy-driven convection; (2) Mixing of Pb-Ga and Pb-Sn alloys with the aim of initiating and maintaining a uniform melt prior to solidification processing; and (3) Float Zone growth with the aim of identifying, through simulations and model experiments, conditions needed to counteract Marangoni flow in a microgravity environment. The proposed research has strong relevance to microgravity research and the objectives of the NRA. TMF can provide a unique and accurate mechanism for generation and control of desirable flow patterns for microgravity research. These attributes have significant relevance to 1) Alloy mixing prior to solidification in a microgravity environment. TMF can provide this mixing with a low level of power consumption; (2) TMF can offset the deleterious effects of Marangoni convection in microgravity containerless processing. Thus, TMF can be instrumental in further understanding this phenomena; (3) Generation of controlled flows will allow the investigation of the effect of these flows on growth morphology and growth kinetics; and (4) On Earth, TMF has the potential to significantly counter-balance thermosolutal convection, thereby creating conditions similar to those obtained in microgravity. Once demonstrated, this new tool for use in solidification has the strong potential to find applications in a host of microgravity material research projects.

Mazuruk, Konstantin↗

Coarsening Experiment Prepared for Flight

The Coarsening in Solid-Liquid Mixtures-2 (CSLM-2) experiment is a materials science spaceflight experiment whose purpose is to investigate the kinetics of competitive particle growth within a liquid matrix. During coarsening, small particles shrink by losing atoms to larger particles, causing the larger particles to grow. In this experiment, solid particles of tin will grow (coarsen) within a liquid lead-tin eutectic matrix. The following figures show the coarsening of tin particles in a lead-tin (Pb-Sn) eutectic as a function of time. By conducting this experiment in a microgravity environment, we can study a greater range of solid volume fractions, and the effects of sedimentation present in terrestrial experiments will be negligible. The CSLM-2 experiment flew November 2002 on space shuttle flight STS-113 for operation on the International Space Station, but it could not be run because of problems with the Microgravity Science Glovebox in the U.S. Laboratory module. Additional samples will be sent to ISS on subsequent shuttle flights.

Hickman, J. Mark↗

Projection Method for Flows with Large Density Variations

Numerical models of solidification including a mushy zone are notoriously inefficient; most of them are based on formulations that require the coupled solution of the velocity components in the momentum equation greatly restricting the range of applicability of the models. There are only two models known to the authors that have used a projection or fractional step formulation, but none of these were used to model problems of any significant size. A third model was only applied to a partial mushy zone with no all-fluid region. Our initial attempts at modeling directional solidification in the presence of a developing mushy zone using a projection formulation encountered very serious difficulties once solidification starts. These difficulties were traced to the inability of the method to deal with large local density differences in the vicinity of the fluid-mush interface. As a result, a modified formulation of the projection method has been developed, that maintains the coupling between the body force and the pressure gradient and is presented in this work. The new formulation is shown to be robust and efficient, and can be applied to problems involving very large meshes. This is illustrated in this work through its application to simulations involving Pb-Sb and Pb-Sn alloys.

Heinrich, Juan C.↗

A Study of Solder Alloy Ductility for Cryogenic Applications

For aerospace applications it is important to understand the mechanical performance of components at the extreme temperature conditions seen in service. For solder alloys used in microelectronics, cryogenic temperatures can prove problematic. At low temperatures Sn-based solders undergo a ductile to brittle transition that leads to brittle cracks, which can result in catastrophic failure of electronic components, assemblies and spacecraft payloads. As industrial processes begin to move away from Pb-Sn solder, it is even more critical to characterize the behavior of alternative Sn-based solders. Here we report on initial investigations using a modified Charpy test apparatus to characterize the ductile to brittle transformation temperature of nine different solder systems.

solders↗