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Results for “Multilayer Ceramic Capacitors”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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41 records · Page 3

All sources NASA NTRS DOE OSTI

NASA NTRS2016

500 C Electronic Packaging and Dielectric Materials for High Temperature Applications

High-temperature environment operable sensors and electronics are required for exploring the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and application of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high temperature electronics, and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by these high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed. High-temperature environment operable sensors and electronics are required for probing the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and eventual applications of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high electronics and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed.

dielectric performance↗

NASA NTRS1989

Electrochemical Cell for Obtaining Oxygen from Carbon Dioxide Atmospheres

To support human life on the Martian surface, an electrochemical device will be required to obtain oxygen from the carbon dioxide rich atmosphere. The electrolyte employed in such a device must be constructed from extremely thin, dense membranes to efficiently acquire the oxygen necessary to support life. A forming process used industrially in the production of multilayer capacitors and electronic substrates was adapted to form the thin membranes required. The process, known as the tape casting, involves the suspension consisting of solvents and binders. The suspension is passed under a blade, resulting in the production of ceramic membranes between 0.1 and 0.5 mm thick. Once fired, the stabilized zirconia membranes were assembled into the cell design by employing a zirconium phosphate solution as the sealing agent. The resulting ceramic-to-ceramic seals were found to be structurally sound and gas-tight. Furthermore, by using a zirconia-based solution to assemble the cell, the problem of a thermal expansion mismatch was alleviated. By adopting an industrial forming process to produce thin membranes, an electrochemical cell for obtaining oxygen from carbon dioxide was produced. The proposed cell design is unique in that it does not require a complicated manifold system for separating the various gases present in this process, nor does it require a series of complex electrical connections. Thus, the device can reliably obtain the vital oxygen supply from the toxic carbon dioxide atmosphere.

Hooker, Matthew↗

NASA NTRSDate not supplied

Design and Assembly Process Implementation for Embedding Passive and Active Components Introduction to IPC-7092

"This presentation describes the design and assembly challenges for implementing passive and active components, in either formed or inserted methodology, into a printed board. The completed structure including internal electronic components is ready for surface mount and/or through-hole component attachment. The multilayered structure becomes a complete product ready for further processing in an assembly process and be made from organic, inorganic (ceramic) or both types of material."

embedded circuitry↗

DOE OSTI2024

Stacked-Die SiC Half-Bridge Module with Minimum Loop Inductance

Minimizing parasitic inductance of power modules is needed to advance their electrical performance. Innovation in the past decade has driven down the inductance of SiC half-bridge power modules to around 1–2 nH by using multilayer, embedded, and hybrid structures. Further reduction becomes difficult, mainly limited by the excessive interconnects required for the planar placement of vertical conducting chips. To address this, a vertically stacked-die approach is proposed in this paper, taking advantage of the vertical conducting nature of the SiC chips. With ceramic decoupling capacitors integrated, 0.48 nH overall loop inductance is achieved and validated by experimental measurement. This paper also discusses potential approaches to further reduce the inductance.

Ribeiro, Pedro↗

NASA NTRS1991

Casting Of Multilayer Ceramic Tapes

Procedure for casting thin, multilayer ceramic membranes, commonly called tapes, involves centrifugal casting at accelerations of 1,800 to 2,000 times normal gravitational acceleration. Layers of tape cast one at a time on top of any previous layer or layers. Each layer cast from slurry of ground ceramic suspended in mixture of solvents, binders, and other components. Used in capacitors, fuel cells, and electrolytic separation of oxygen from air.

Collins, Earl R., Jr.↗