A microelectronic data system for wind-tunnel research
Microelectronic analog data and digital command control system for transonic dynamic wind tunnel tests of research aircraft models
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Microelectronic analog data and digital command control system for transonic dynamic wind tunnel tests of research aircraft models
Fast scan infrared microscope for measuring thermal and electromechanical parameters affecting reliability of microelectronic devices
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Hybrid assembly processes for packaging of thin film and semiconductor microelectronic devices
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The Roadmap begins with an assessment of needs from the microelectronics for aerospace applications viewpoint. Needs Assessment is divided into materials, packaging components, and radiation characterization of packaging.
Advances in microelectronics technologies over the past several decades have truely revolutionized modern society in almost every aspect of human endeavor.
Future small satellite systems for both Earth observation as well as deep-space exploration are greatly enabled by the technological advances in deep sub-micron microelectronics technologies.
Describes the New Millenium Program, including the scope of the Microelectronics Systems IPDT as well as its current membership. Also summarizes the results of the IPDT technology roadmapping process. They describe the technologies selected as well as the avionics architecture chosen for validation of the first NMP spacecraft, to be launched inJauary 1998.
Material degradation during the fabrication of microelectronic devices has plagued the space industry for many years owing to the layering of many dissimilar metals to create these devices. Often, commonly used materials and systems are overlooked as potential sources of material degradation. This technical bulletin highlights extensive research to isolate probable causes of this degradation.
Design philosophy and fabrication technology of microelectronic function blocks for spacecraft electronic equipment
Microelectronic function blocks and their use in low level amplifiers for space applications
Design, fabrication and performance of minimum power microelectronic circuits and subsystems
Failure analyses on eleven microelectronic devices subjected to temperature-stress cycling, and life testing