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Die Attachment for -120 C to +20 C Thermal Cycling of Microelectronics for Future Mars Rovers: An Overview

Active thermal control for electronics on Mars Rovers imposes a serious penalty in weight, volume, power consumption, and reliability. Thus, we propose that thermal control be eliminated for future Rovers. From a functional standpoint there is no reason that the electronics could not operate over the entire temperature range of the Martian environment, which can vary from a low of approximately equal -90 C to a high of approximately equal +20 C during the Martian night and day. The upper end of this range is well within that for conventional electronics. Although the lower end is considerably below that for which conventional--even high-reliability electronics is designed or tested, it is well established that electronic devices can operate to such low temperatures. The primary concern is reliability of the overall electronic system, especially in regard to the numerous daily temperature cycles that it would experience over the duration of a mission on Mars. Accordingly, key reliability issues have been identified for elimination of thermal control on future Mars Rovers. One of these is attachment of semiconductor die onto substrates and into packages. Die attachment is critical since it forms a mechanical, thermal and electrical interface between the electronic device and the substrate or package. This paper summarizes our initial investigation of existing information related to this issue, in order to form an opinion whether die attachment techniques exist, or could be developed with reasonable effort, to withstand the Mars thermal environment for a mission duration of approximately I year. Our conclusion, from a review of literature and personal contacts. is that die attachment can be made sufficiently reliable to satisfy the requirements of future Mars Rovers. Moreover, it appears that there are several possible techniques from which to choose and that the requirements could be met by judicious selection from existing methods using hard solders, soft solders, or organic adhesives. Thus from the standpoint of die attachment. it appears feasible to eliminate thermal control for Rover electronics. We recommend that this be further investigated and verified for the specific hardware and thermal conditions appropriate to Mars Rovers.

Kirschman, Randall K.↗

Mars Science Laboratory Launch Pad Thermal Control

This paper will describe the challenges faced in accommodating the warm Multi Mission Radioisotope Thermoelectric Generator (MMRTG) during the pre-launch phases of integration, launch pad operations as well as during launch. Predictions of temperatures during these phases will be presented when all the cooling systems (HRS and A/C) are operational. In-air tests conducted on the spacecraft in December 2008 to simulate the launch conditions were very successful and showed that all components would be within their allowable limits during these phases. Results of these tests will be shared in this paper.

Radioisotope Thermoelectric Generator (RTG)↗

Thermal Insulation for Mars Surface Exploration

There is currently a significant amount of interest in Mars exploration by NASA to send a series of orbiting spacecraft and landers to Mars over the next decade. For the science and engineering systems that will land on the surface of Mars, there is a great challenge for thermal control.

mars↗

Cryogenic propellant thermal control system design considerations, analyses, and concepts applied to a Mars human exploration mission

This paper analyzes, defines, and sizes cryogenic storage thermal control systems that meet the requirements of future NASA Mars human exploration missions. The design issues of this system include the projection of the existing Multilayer Insulation data base for cryogenic storage to much thicker (10 cm or more) insulation systems, the unknown heat leak from mechanical interfaces, and the thermal and structural performance effects of the large tank sizes required for a Mars mission. Acknowledging these unknown effects, heat loss projections are made based on extrapolation of the existing data base. The results indicate that hydrogen, methane, and oxygen are feasible propellants, and that the best suited thermal control sytems are 'thick' MLI, thermodynamic vent sytems, cryocoolers, and vacuum jackets.

Plachta, David W.↗