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At least 55 records · Page 3

An Evaluation of Ultra-High Pressure Regulator for Robotic Lunar Landing Spacecraft

The Robotic Lunar Lander Development (RLLD) Project Office at NASA Marshall Space Flight Center (MSFC) has studied several lunar surface science mission concepts. These missions focus on spacecraft carrying multiple science instruments and power systems that will allow extended operations on the lunar surface. Initial trade studies of launch vehicle options for these mission concepts indicate that the spacecraft design will be significantly mass-constrained. To minimize mass and facilitate efficient packaging, the notional propulsion system for these landers has a baseline of an ultra-high pressure (10,000 psig) helium pressurization system that has been used on Defense missiles. The qualified regulator is capable of short duration use; however, the hardware has not been previously tested at NASA spacecraft requirements with longer duration. Hence, technical risks exist in using this missile-based propulsion component for spacecraft applications. A 10,000-psig helium pressure regulator test activity is being carried out as part of risk reduction testing for MSFC RLLD project. The goal of the test activity is to assess the feasibility of commercial off-the-shelf ultra-high pressure regulator by testing with a representative flight mission profile. Slam-start, gas blowdown, water expulsion, lock-up, and leak tests are also performed on the regulator to assess performance under various operating conditions. The preliminary test results indicated that the regulator can regulate helium to a stable outlet pressure of 740 psig within the +/- 5% tolerance band and maintain a lock-up pressure less than +5% for all tests conducted. Numerous leak tests demonstrated leakage less than 10-3 standard cubic centimeters per second (SCCS) for internal seat leakage at lock-up and less than10-5 SCCS for external leakage through the regulator ambient reference cavity. The successful tests have shown the potential for 10,000 psig helium systems in NASA spacecraft and have reduced risk associated with hardware availability and hardware ability to meet RLL mission requirements.

Burnside, Christopher

FY2025 Status Report: Model 9975 O Ring Fixture Long-Term Leak Performance

Leak testing experiments to monitor the aging performance of Viton® GLT and GLT-S O-rings used in the model 9975 shipping package have been ongoing since 2004 at Savannah River National Laboratory. Seventy tests using mock-up 9975 primary containment vessels (PCVs) with GLT O-rings were assembled and heated to temperatures ranging from 200 to 450 °F. Due to material substitution, fourteen tests with GLT-S O-rings were initiated in 2008 and heated to temperatures ranging from 200 to 400 °F. The conditioning temperatures are elevated compared to the calculated maximum O-ring temperature in a 9975 package in storage, 158 °F, to accelerate aging and enable observations of O-ring failures in a reasonable time frame. The mock-up PCV fixtures are leak tested periodically, and all GLT O-ring fixtures aged at 350 °F or above have failed to maintain a leak-tight seal. Eight GLT O-ring fixtures aged at 300 °F have failed after 2.8 to 5.7 years at temperature while the remaining fixtures at 300 °F were retired from testing following more than five years of aging without failure. Two of these retired fixtures were returned to testing and heated to 350 °F to evaluate the impact of additional heating at higher temperature for aged O-rings. Fixture #20 failed after 3 months while fixture #18 failed after 9 months at 350 °F. These O-rings demonstrated that aged and in-service O-rings can continue to be used, even at higher temperatures, after being in storage, and their leak performance are consistent with other samples at 350 °F. There has been one GLT O-ring fixture which failed after 13.4 years of aging at 200 °F. However, 20 other GLT O-rings aging at 200 °F have remained leak-tight for over 16.9 years and remain in test. There are two GLT O-ring fixtures at 270 °F; one fixture has failed after 12.9 years while the other fixture remains in test after 12.5 years. All GLT-S O-ring fixtures aged at 300 °F or above have failed their leak test. No failures have yet been observed in GLT-S O-ring fixtures aging at 250 °F for 14.9 years, while one GLT-S O-ring fixture failed after 12.4 years at 200 °F. The leak testing data to date suggest the GLT and GLT-S O-rings aging in the K-Area Complex (KAC) storage at temperatures of 158 °F might maintain a leak-tight seal for up to 59 years. Data from the O-ring fixtures are generally consistent with results from compression stress-relaxation testing and provide confidence in the predictive models based on those results. However, uncertainty exists in extrapolating these elevated temperature results to the lower temperatures of interest for normal storage in KAC. The collective data from these test efforts suggest the minimum O-ring service life at KAC normal storage conditions should be at least 34 years for GLT and GLT-S O-rings. Measurement of compression set in O-rings removed from failed fixtures, compared to that from KAC surveillance O-rings, indicate significant margin remains for O-rings still in service in 9975 packages in KAC. Aging and periodic leak testing will continue for the remaining 24 mock-up PCV fixtures.

12 MANAGEMENT OF RADIOACTIVE AND NON-RADIOACTIVE W

Fracture control plan for propellant and pressurant tanks

To assure the functional integrity of the GLL-RPM fuel and pressurized gas tank, all activities during entire lifetime of the tank, from manufacture to the end of the mission, must be monitored. Specifications are given for all procedures which influence the tank structure including design, manufacture, cleaning, test operations, and storage. Tests to be conducted to demonstrate that requirements of the fracture control plan are satisfied include static tests, cyclic load tests, proof tests, He-leak test, and acceptance tests.

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An Evaluation of a High Pressure Regulator for NASA's Robotic Lunar Lander Spacecraft

The Robotic Lunar Lander (RLL) development project office at NASA Marshall Space Flight Center is currently studying several lunar surface science mission concepts. The focus is on spacecraft carrying multiple science instruments and power systems that will allow extended operations on the lunar surface or other air-less bodies in the solar system. Initial trade studies of launch vehicle options indicate the spacecraft will be significantly mass and volume constrained. Because of the investment by the DOD in low mass, highly volume efficient components, NASA has investigated the potential integration of some of these technologies in space science applications. A 10,000 psig helium pressure regulator test activity has been conducted as part of the overall risk reduction testing for the RLL spacecraft. The regulator was subjected to typical NASA acceptance testing to assess the regulator response to the expected RLL mission requirements. The test results show the regulator can supply helium at a stable outlet pressure of 740 psig within a +/- 5% tolerance band and maintain a lock-up pressure less than the +5% above nominal outlet pressure for all tests conducted. Numerous leak tests demonstrated leakage less than 10-3 standard cubic centimeters per second (SCCS) for the internal seat leakage at lock-up and less than 10-5 SCCS for external leakage through the regulator body. The successful test has shown the potential for 10,000 psig helium systems in NASA spacecraft and has reduced risk associated with hardware availability and hardware ability to meet RLL mission requirements.

Burnside, Christopher G.

Miniature, Lightweight, One-Time-Opening Valve

The figure depicts the main parts of a prototype miniature, lightweight, onetime- opening valve. Like some other miniature one-time-opening valves reported in previous issues of NASA Tech Briefs, this valve is opened by melting a material that blocks the flow path. This valve is designed to remain closed at some temperature between room temperature and cryogenic temperature until the time of opening. The prototype valve includes a 1/8-in. (3-mm) aluminum tube, one end of which is plugged with a solder comprising about 37 weight percent of lead and 63 weight percent of tin. The tube and the solder both have a coefficient of thermal expansion of 23 micron/m-K at room temperature. Before plugging, the interior surface of the plug end of the tube is cleaned with a commercial flux paste developed specifically for preparing aluminum for bonding with lead/tin solder. The solder is then melted into the cleaned end of the tube, forming the plug. In a test, the plugged tube was pressurized to 1,000 psi (6.9 MPa) with helium and leak-tested. It was then cooled to a temperature of 77 K (about 196 C) and again leak-tested at the same pressure. Finally, at a lower pressure, the plugged end of the tube was heated to about 200 C (the melting temperature of the solder is 183 C), causing the solder plug to be ejected (see figure). It has been estimated that in a subsequent version of the valve, the plug could be melted by electrical heating, using a nichrome wire having a mass of only 10 g.

Jones, Jack

Payload and Components Real-Time Automated Test System (PACRATS), Data Acquisition of Leak Rate and Pressure Data Test Procedure

The purpose of this activity is to provide the Mechanical Components Test Facility (MCTF) with the capability to obtain electronic leak test and proof pressure data, Payload and Components Real-time Automated Test System (PACRATS) data acquisition software will be utilized to display real-time data. It will record leak rates and pressure/vacuum level(s) simultaneously. This added functionality will provide electronic leak test and pressure data at specified sampling frequencies. Electronically stored data will provide ES61 with increased data security, analysis, and accuracy. The tasks performed in this procedure are to verify PACRATS only, and are not intended to provide verifications for MCTF equipment.

Rinehart, Maegan L.

Hermetic Seal Designs for Sample Return Sample Tubes

Prototypes have been developed of potential hermetic sample sealing techniques for encapsulating samples in a ≈1-cm-diameter thin-walled sample tube that are compatible with IMSAH (Integrated Mars Sample Acquisition and Handling) architecture. Techniques include a heat-activated, finned, shape memory alloy plug; a contracting shape memory alloy activated cap; an expanding shape memory alloy plug; and an expanding torque plug. Initial helium leak testing of the shape memory alloy cap and finned shape memory alloy plug seals showed hermetic- seal capability compared against an industry standard of <1×10-8 atm-cc/s He. These tests were run on both clean tubes and dirty tubes dipped in MMS (Mojave Mars Simulant). The leak tests were also performed after thermal cycling between -135 and +55 ºC to ensure seal integrity after Martian diurnal cycles. Developmental testing is currently being done on the expanding torque plug, and expanding shape memory alloy plug seal designs. The finned shape memory alloy (SMA) plug currently shows hermetic sealing capability based on preliminary tests.

Younse, Paulo J.

Model 9975 O Ring Fixture Long-Term Leak Performance (FY2024 Status Report)

Leak testing experiments to monitor the aging performance of Viton ® GLT and GLT-S O-rings used in the model 9975 shipping package have been ongoing since 2004 at Savannah River National Laboratory. Seventy tests using mock-up 9975 primary containment vessels (PCVs) with GLT O-rings were assembled and heated to temperatures ranging from 200 to 450 °F. Due to material substitution, fourteen tests with GLT-S O-rings were initiated in 2008 and heated to temperatures ranging from 200 to 400 °F. The conditioning temperatures are elevated compared to the calculated maximum O-ring temperature in a 9975 package in storage, 158 °F, to accelerate aging and enable observations of O-ring failures in a reasonable time frame. The mock-up PCV fixtures are leak tested periodically, and all GLT O-ring fixtures aging at 350 °F or above have failed to maintain a leak-tight seal. Eight GLT O-ring fixtures aging at 300 °F have failed after 2.8 to 5.7 years at temperature while the remaining fixtures at 300 °F were retired from testing following more than five years of aging without failure. Two of these retired fixtures were returned to testing and heated to 350 °F to evaluate the impact of additional heating at higher temperature for aged O-rings. Fixture #20 failed after 3 months of testing while fixture #18 remained leak tight. These O-rings demonstrated that aged and in-service O-rings can continue to be used, even at higher temperatures, after being in storage, and their leak performance are consistent with other samples at 350 °F.

42 ENGINEERING

Technical Challenges in Reliable Microelectronics Packaging of Microelectromechanical Systems (MEMS) for Space Applications

MEMS have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, chemical sensors, artificial nose, etc. Standard semiconductor microelectronics packaging needs the integrated circuits (IC) to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the reliable IC packaging technology. Active elements or microstructures in MEMS devices often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it measures to assure the packaging technology of MEMS. MEMS technology has a major application in developing a microspacecraft for space systems provided reliability of MEMS packaging technology is sufficiently addressed. This MEMS technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively. This paper discusses the latest developments in the MEMS technology and challenging technical issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices for microspacecraft applications.

Ramesham, Rajeshuni

Assessment and Assurance of Microelectronics Packaging Technology of Microelectromechanical Systems (MEMS)

Microelectromechanical systems (MEMS) have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, etc. Standard semiconductor microelectronics packaging needs the integrated circuits to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the packaging technology. In the case of MEMS the microstructures (active elements) often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it 'measures to assure the MEMS technology by lowering the risk to zero. MEMS technology has a major application in developing a microspacecraft for space systems provided assurance of MEMS technology is sufficiently addressed nondestructively. This technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's safety and mission assurance goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively by teaming-up with the other NASA centers using the limited resources available. This paper discusses the latest developments in the MEMS technology and challenging issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices based on silicon, poly-silicon, and other materials for microspacecraft applications considering the space environment and reliability assurance qualification guidelines in perspective. Acknowledgments: The above research work is supported by the NASA Electronics Parts and Packaging Program (NEPP) and performed by the Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA under a contract with the NASA - Code Q for the Office of Safety and Mission Assurance Program 323-79.

Ramesham, Rajeshuni

Initial evaluation tests of General Electric Company 12.0 ampere hour nickel cadmium spacecraft cells with design variables

All evaluation tests were performed at room ambient pressure and temperature, with discharges at a 2 hour rate. Tests consisted of phenolphthalein leak tests, three capacity tests, an auxiliary electrode test, a charge retention test, an internal short test, a charge efficiency test, overcharge tests, and a pressure versus capacity test. Results of the tests and recommendations for improvements in manufacturing are presented.

Harkness, J. D.

Bayonet for superfluid helium transfer in space

A prototype superfluid helium bayonet for potential space applications has been developed and evaluated with a low heat leak test apparatus. Measured heat leak of the 13 mm (1/2 inch) bayonet pair is 0.21 W at 1.8 K with an uncertainty of +0.09/-0.05 W. Bayonets are fabricated with thin, electron beam (EB) welded tubes which are EB welded to machined nose and flange pieces. Low heat leak structural integrity is provided by a 0.9 mm thickness of filament wound fiberglass-epoxy. Superfluid creep is restricted by KEL-F nose seals which form vacuum-tight extensions to the bayonet cold end pieces.

Mcintosh, G. E.

Coolant Leak from ISS External Active Thermal Control System (EATCS) – An Examination of Most Probable

The Port (P1) and Starboard (S1) External Active Thermal Control Systems (EATCS) are single phase, mechanically pumped ammonia loops that operate independently to cool the majority of the hardware and payloads onboard the International Space Station (ISS). A slow ammonia leak was detected using pressure and quantity telemetry five years after the P1 EATCS was activated. The leak gradually accelerated to a rate that locating and isolating the leak became imperative to maintain cooling capability. Partial pressure measurements from the Robotic External Leak Locator (RELL) scan surveys narrowed the search to the supply and return jumpers connecting one of three radiators to the system. Subsequently, the ISS crew performed high definition video surveys during an Extravehicular Activity (EVA), or spacewalk, and ammonia flakes were observed projecting from the jumpers. Thus, the ground teams were confident that the culprit for the ammonia leak was the jumpers. The ammonia leak stopped after ground teams remotely isolated and vented those jumpers and associated radiator. Both jumpers were removed and returned to the ground, and a root cause investigation was conducted. A calibrated leak test determined the bulk of the ammonia leaked through a pair of seals in a Quick Disconnect (QD), or connector, on one end of the return jumper. The return jumper QD was dissected, visually inspected, chemically tested and evaluated. The results indicated the most probable cause of the accelerating ammonia leak was due to defective seals, plating delamination underneath the seals, and on-orbit thermal cycles exacerbating the delamination. Both jumpers were refurbished, relaunched to the ISS, and scheduled to be reinstalled during an EVA in 2022. It appeared the issue was unique, but recently the S1 EATCS is showing signs of an accelerating ammonia leak, and RELL scans narrowed the source to a similar pair of radiator jumpers.

Thermal Control

Coolant Leak from ISS External Active Thermal Control System (EATCS) – An Examination of Most Probable

The Port (P1) and Starboard (S1) External Active Thermal Control Systems (EATCS) are single phase, mechanically pumped ammonia loops that operate independently to cool majority of the hardware and payloads onboard the International Space Station (ISS). A slow ammonia leak was detected using pressure and quantity telemetry five years after the P1 EATCS was activated. The leak gradually accelerated to a rate that locating and isolating the leak became imperative to maintain cooling capability. Partial pressure measurements from the Robotic External Leak Locator (RELL) scan surveys narrowed the search to the supply and return jumpers connecting one of three radiators to the system. Subsequently, the ISS crew performed high definition video surveys during an Extravehicular Activity (EVA), or spacewalk, and ammonia flakes were observed projecting from the jumpers. Thus, the ground teams were confident that the culprit of the ammonia leak were the jumpers. The ammonia leak stopped after ground teams remotely isolated and vented those jumpers and associated radiator. Both jumpers were removed and returned to the ground, and a root cause investigation was conducted. A calibrated leak test determined the bulk of the ammonia leaked through a pair of seals in a Quick Disconnect (QD), or connector, on one end of the return jumper. The return jumper QD was dissected, visually inspected, chemically tested and evaluated. The results indicated the most probable cause of the accelerating ammonia leak was due to defective seals, plating delamination underneath the seals, and on-orbit thermal cycles exacerbating the delamination. Both jumpers were refurbished, relaunched to the ISS, and scheduled to be reinstalled during an EVA in 2022. It appeared the issue was unique, but recently the S1 EATCS is showing signs of an accelerating ammonia leak, and RELL scans narrowed the source to a similar pair of radiator jumpers.

Thermal Control

Coolant Leak from ISS External Active Thermal Control System (EATCS) – An Examination of Most Probable

The Port (P1) and Starboard (S1) External Active Thermal Control Systems (EATCS) are single phase, mechanically pumped ammonia loops that operate independently to cool majority of the hardware and payloads onboard the International Space Station (ISS). A slow ammonia leak was detected using pressure and quantity telemetry five years after the P1 EATCS was activated. The leak gradually accelerated to a rate that locating and isolating the leak became imperative to maintain cooling capability. Partial pressure measurements from the Robotic External Leak Locator (RELL) scan surveys narrowed the search to the supply and return jumpers connecting one of three radiators to the system. Subsequently, the ISS crew performed high-definition video surveys during an Extravehicular Activity (EVA), or spacewalk, and ammonia flakes were observed projecting from the jumpers. Thus, the ground teams were confident that the culprit of the ammonia leak were the jumpers. The ammonia leak stopped after ground teams remotely isolated and vented those jumpers and associated radiator. Both jumpers were removed and returned to the ground, and a root cause investigation was conducted. A calibrated leak test determined the bulk of the ammonia leaked through a pair of seals in a Quick Disconnect (QD), or connector, on one end of the return jumper. The return jumper QD was dissected, visually inspected, chemically tested and evaluated. The results indicated the most probable cause of the accelerating ammonia leak was due to defective seals, plating delamination underneath the seals, and on-orbit thermal cycles exacerbating the delamination. Both jumpers were refurbished, relaunched to the ISS, and scheduled to be reinstalled during an EVA in 2022. It appeared the issue was unique, but recently the S1 EATCS is showing signs of an accelerating ammonia leak, and RELL scans narrowed the source to a similar pair of radiator jumpers.

Darnell Cowan

Initial evaluation tests of Eagle-Picher Industries 9.0 ampere-hour nickel-cadmium spacecraft cells for the heat capacity mapping mission satellite and the stratospheric aerosol and gas experiment satellite

The results of tests to insure that all cells put into the life cycle program are of high quality are reported. The tests consisted of the following: phenolptalein leak tests, internal short test, charge efficiency test, and overcharge tests. The results of tests for 10 cells are tabulated.

Harkness, J. D.

Hermetic edge sealing of photovoltaic modules

The edge sealing technique is accomplished by a combination of a chemical bond between glass and aluminum, formed by electrostatic bonding, and a metallurgical bond between aluminum and aluminum, formed by ultrasonic welding. Such a glass to metal seal promises to provide a low cost, long lifetime, highly effective hermetic seal which can protect module components from severe environments. Development of the sealing techniques and demonstration of their effectiveness by fabricating a small number of dummy modules, up to eight inches square in size, and testing them for hermeticity using helium leak testing methods are reviewed. Non-destructive test methods are investigated.

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