SEARCH · Engineering Papers
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.
This fiscal year we investigated the kinetic mechanism of electroplating of titanium on stainless steel substrates, as well as the influence of additives on the brightness and smoothness of this plating, as related to the FY24 LD-TCF proposal.
Electroplating of electric contact switching elements
Cleaning, pickling, and electroplating processes to minimize hydrogen embrittlement of ultrahigh strength steels
Annealing in S vapor greatly improves the performance of electroplated Cu2ZnSnS4 (CZTS) solar cells based on the bifacial configuration of Al-doped ZnO (AZO, front contact)/ZnO/CdS/CZTS/indium tin oxide (ITO, back contact), as compared to H2S annealing in our previous works. S-vapor annealing does not cause severe damage to the conductivity of the ITO back contact. The highest device efficiency of 5.8% was reached under 1 sun illumination from the AZO side. The well-preformed devices based on the ITO back contact demonstrate smaller series resistances and better fill factors, as compared to our substrate-type devices using Mo back contacts. An interfacial reaction at the ITO back contact has been revealed in experiments, which contributes to the formation of SnO2-enriched interfacial layer and diffusion of In from ITO into CZTS through the Sn sites. Incorporation of In does not significantly change the optical and structural properties or the grain size of CZTS absorbers.
To develop a high-Sn-content AgCuZnSn brazing filler metal, the BAg50CuZn was used as the base filler metal and a Sn layer was electroplated upon it. Then, the 304 stainless steel and the H62 brass were induction-brazed with the Sn-plated brazing filler metals. The microstructures of the joints were examined with an optical microscope, a scanning electron microscope and an x-ray diffractometer. The corresponding mechanical properties were obtained with a universal tensile testing machine. The results indicated that the induction brazed joints consisted of the Ag phase, the Cu phase and the CuZn phase. When the content of Sn in the Sn-plated Ag brazing filler metal was 6.0 or 7.2 wt.%, the Cu{sub 5}Zn{sub 8}, the Cu{sub 41}Sn{sub 11} and the Ag{sub 3}Sn phases appeared in the brazed joint. The tensile strength of the joints brazed with the Sn-plated filler metal was higher compared to the joints with the base filler metal. When the content of Sn was 6.0 wt.%, the highest tensile strength of the joint reached to 395 MPa. The joint fractures presented a brittle mode, mixed with a low amount of ductile fracture, when the content of Sn exceeded 6.0 wt.%.
Corrosion of nickel and copper electroplated coatings on SS316H in molten FLiNaK salt was studied. 500- and 1000-hour static corrosion tests were performed in molten FLiNaK at 700 degrees Celsius. Characterization of the coatings following corrosion indicated that they did not degrade in the molten salt during the corrosion experiment and fully protected the underlying SS316H from chromium dissolution. Interdiffusion between the copper coating and SS316H was extremely limited, interdiffusion between the nickel coating and SS316H. Diffusion modelling revealed that the nickel coatings still significantly reduced chromium dissolution over 60 years despite the interdiffusion.
Poor fast-charge capabilities limit the usage of rechargeable Li metal anodes. Understanding the connection between charging rate, electroplating mechanism, and Li morphology could enable fast-charging solutions. In this report we develop a combined electroanalytical and nanoscale characterization approach to resolve the current-dependent regimes of Li plating mechanisms and morphology. Measurement of Li + transport through the solid electrolyte interphase (SEI) shows that low currents induce plating at buried Li||SEI interfaces, but high currents initiate SEI-breakdown and plating at fresh Li||electrolyte interfaces. The latter pathway can induce uniform growth of {110}-faceted Li at extremely high currents, suggesting ion-transport limitations alone are insufficient to predict Li morphology. At battery relevant fast-charging rates, SEI-breakdown above a critical current density produces detrimental morphology and poor cyclability. Thus, prevention of both SEI-breakdown and slow ion-transport in the electrolyte is essential. This mechanistic insight can inform further electrolyte engineering and customization of fast-charging protocols for Li metal batteries.
We report the Young’s modulus and deformation behavior of electroplated mossy lithium at room temperature investigated by flat punch indentation inside an argon-filled glovebox. The Young’s modulus of the mossy lithium with a porosity of about 62.3 % is measured to be about 2 GPa, which is smaller than that (~7.8 GPa) of bulk Li. Both the mossy and bulk lithium show clearly indentation creep behavior. Despite its highly porous microstructure, the impression creep velocity of the mossy lithium is less than one-thirtieth of that of bulk lithium under the same stress. We proposed possible mechanisms for the significantly higher deformation and creep resistance of the mossy lithium over bulk lithium. These findings are key to developing mechanical suppression approaches to improve the cycling stability of lithium metal electrodes.
As the demand for more efficient SRF technology continues to rise, so does the need to improve the performance of Nb3Sn, the most promising alternative to niobium. Leveraging recent breakthroughs in Nb3Sn research from Cornell University and Fermilab, namely the electrochemical synthesis-based growth of Nb3Sn and the centrifugal barrel polishing (CBP) technique to smoothen the final Nb3Sn film, our primary goal is to reduce surface roughness while preserving the film’s quality. We present promising RF results from an electroplated cavity that underwent mechanical polishing using the CBP technique, which showed an increase in the maximum accelerating gradient compared to the baseline test. However, contamination-induced Q-slope limited performance. Temperature mapping reveals quench location and heating response before, during and after quench.
For Inertial Confinement Fusion (ICF) implosions, a design based on gradients of high and mid Z materials could potentially be more robust than single element capsule systems. To that end, gold and silver alloys were electroplated on 2.0 mm diameter surrogate brass spheres using a new flow–based pulsed plating method specifically designed to minimize surface roughness without reducing plating rates. The coatings were analyzed by scanning electron microscope (SEM) and white light interferometry for surface topography, and by energy dispersive x-ray spectroscopy (EDX) to determine near-surface gold and silver compositions. The alloy range attainable was 15 to 85 weight percent gold using 1:1 and 1:3 silver to gold ratio plating baths at applied potentials of -0.7 volts to -1.8 volts. This range was bounded by the open circuit potential of the system and hydrogen evolution, and in theory could be extended by using ionic liquids or aprotic solutions. Preliminary gradient trials proved constant composition alloy data could be translated to smooth gradient plating, albeit at higher gold compositions.
Pacific Northwest National Laboratory supported the U.S. High Performance Research Reactor Convert program via the Fuel Fabrication Pillar by evaluating the technical challenges and opportunities related to the use of electroplating the Zr vapor barrier on U-Mo fuel.
Equatorial bands are fabricated to provide a locating fit for the hemispheres of hollow spherical rotors which are then jointed by electroplating. Several nonmagnetic materials may be used to form the joint, such as aluminum, copper, iron, gold, plantinum, and zinc.
Because introduction of hydrogen during bright-cadmium electroplating of high strength steels causes hydrogen-stress cracking, a program was undertaken to evaluate various processes and materials. Report describes effectiveness of inhibitors for reducing hydrogen absorption by steels.
Literature review on pickling inhibitors and cadmium electroplating processes to minimize hydrogen absorption by ultrahigh strength steels
Contact resistance of electroplated flat conductor cable conductors
Activation process forms adherent electrodeposits of copper, nickel, and chromium on titanium alloy. Good adhesion of electroplated deposits is obtained by using acetic-hydrofluoric acid anodic activation process.
Molybdenum and niobium are often electroplated and subsequently stripped of copper. Since general standard plating techniques produce poor quality coatings, general procedures have been optimized and specified to give good results.