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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 55 records · Page 3
All sourcesNASA NTRSDOE OSTI
DOE OSTI2016

Development of the electron cooling simulation program for JLEIC

In the JLab Electron Ion Collider (JLEIC) project the traditional electron cooling technique is used to reduce the ion beam emittance at the booster ring, and to compensate the intrabeam scattering effect and maintain the ion beam emittance during collision at the collider ring. A new electron cooling process simulation program has been developed to fulfill the requirements of the JLEIC electron cooler design. The new program allows the users to calculate the electron cooling rate and simulate the cooling process with either DC or bunched electron beam to cool either coasting or bunched ion beam. It has been benchmarked with BETACOOL in aspect of accuracy and efficiency. In typical electron cooling process of JLEIC, the two programs agree very well and we have seen a significant improvement of computational speed using the new one. Being adaptive to the modern multicore hardware makes it possible to further enhance the efficiency for computationally intensive problems. The new program is being actively used in the electron cooling study and cooler design for JLEIC. We will present our models and some simulation results in this paper.

Zhang, He↗
DOE OSTI2017

Simulation Study on JLEIC High Energy Bunched Electron Cooling

In the Jefferson Lab (JLab) Electron Ion Collider (JLEIC) project the traditional electron cooling technique is used to reduce the ion beam emittance at the booster ring, and to compensate the intrabeam scattering effect and maintain the ion beam emittance during the collision at the collider ring. Different with other electron coolers using DC electron beam, the proposed electron cooler at the JLEIC ion collider ring uses high energy bunched electron beam, provided by an ERL. In this paper, we report the new electron cooling simulation program developed at JLab to fulfil specific simulation requirements of JLEIC and some recent simulation study on how the electron cooling rate will be affected by the bunched electron beam properties, such as the correlation between the longitudinal position and momentum, the bunch size, and the Larmor emittance.

Zhang, He↗
DOE OSTI2014

The influence of longitudinal space charge fields on the modulation process of coherent electron cooling

Initial modulation in Coherent electron cooling (CeC) scheme relies on ion charge screening by electrons. In a CeC system with bunched electron beam, the long-range longitudinal space charge force is inevitably induced. For a relatively dense electron beam, it can be comparable or even greater than the attractive force from the ion. Hence, space-charge field influence to the modulation process could be important. If the longitudinal Debye length is much smaller than the electron bunch length, the modulation induced by the ion happens locally. In this case, the long-range longitudinal space charge field can be approximated as a uniform electric field across the region. In this paper we developed an analytical model to study the dynamics of ion shielding in the presence of a uniform electric field. We are solving the coupled Vlasov-Poisson equation system for infinite anisotropic electron plasma and estimate the influences of the longitudinal space charge field to the modulation process. We present numerical estimates for a case of the proof of CeC principle experiment at RHIC.

43 PARTICLE ACCELERATORS↗
DOE OSTI2016

Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component

Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

36 MATERIALS SCIENCE↗
DOE OSTI2016

Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component

Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗
DOE OSTI2018

Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component

Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Chainer, Timothy J.↗
DOE OSTI2024

Collisional simulations of the modulator section in coherent electron cooling

The first section of any coherent electron cooling (CeC) system is the modulator, where the density of the electron beam is modulated by the copropagating ion beam. This density modulation is a result of Coulomb collisions between the individual particles of the two beams. The pairwise, stochastic part of the interactions impacts the overall performance of the CeC process. We present the first simulations of the density modulations of the electron beams from a collisional picture of the dynamics, considering the proof-of-principle CeC experiments at Brookhaven National Laboratory. These simulations were performed using PHAD, which is the first efficient, large-scale collisional numerical method in beam physics that we have previously developed and benchmarked. Realistic beam distributions and external fields have been optimized to provide strong modulation signals necessary for variations of coherent electron cooling systems. Cooling performance limits and potential collisionless simulation pitfalls are pointed out. Published by the American Physical Society 2024

43 PARTICLE ACCELERATORS↗
DOE OSTI2025

Machine protection system for coherent electron cooling experiment

The coherent electron cooling (CeC) experiment employs a 15 MeV electron beam with up to a few milliamperes current which is capable of destroying the vacuum equipment or intercepting beam diagnostics. The high-current beam can be delivered to two different dumps. RF systems include normal conducting and superconducting cavities which also require protection from abnormal conditions. In this paper, we describe in detail the design and operation of the machine protection system for the CeC accelerator.

43 PARTICLE ACCELERATORS↗
DOE OSTI2011

Coherent Electron Cooling Demonstration Experiment

Coherent electron cooling (CEC) is considered to be on of potential candidates capable of cooling high-energy, high-intensity hadron beams to very small emittances. It also has a potential to significantly boost luminosity of high-energy hadron-hadron and electron-hadron colliders. In a CEC system, a perturbation of the electron density caused by a hadron is amplified and fed back to the hadrons to reduce the energy spread and the emittance of the beam. Following the funding decision by DoE office of Nuclear Physics, we are designing and building coherent electron cooler for a proof-of-principle experiment at RHIC to cool 40 GeV heavy ion beam. In this paper, we describe the layout of the CeC installed into IP2 interaction region at RHIC. We present the design of the CeC cooler and results of preliminary simulations.

Litvinenko, Vladimir N.↗
DOE OSTI2018

Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader

Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Chainer, Timothy J.↗
DOE OSTI2018

Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader

Methods are provided for facilitating cooling of an electronic component. The methods include providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

42 ENGINEERING↗
DOE OSTI2018

Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader

Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Chainer, Timothy J.↗
DOE OSTI2021

Demonstration of Electron Cooling using a Pulsed Beam from an Electrostatic Electron Cooler

Electron cooling continues to be an invaluable technique to reduce and maintain the emittance in hadron storage rings in cases where stochastic cooling is inefficient and radiative cooling is negligible. Extending the energy range of electron coolers beyond what is feasible with the conventional, electrostatic approach necessitates the use of RF fields for acceleration and, thus, a bunched electron beam. To experimentally investigate how the relative time structure of the two beams affects the cooling properties, we have set up a pulsed-beam cooling device by adding a synchronized pulsing circuit to the conventional electron source of the CSRm cooler at Institute of Modern Physics *. We show the effect of the electron bunch length and longitudinal ion focusing strength on the temporal evolution of the longitudinal and transverse ion beam profile and demonstrate the detrimental effect of timing jitter as predicted by theory and simulations. Compared to actual RF-based coolers, the simplicity and flexibility of our setup will facilitate further investigations of specific aspects of bunched cooling such as synchro-betatron coupling and phase dithering.

Bruker, M. W.↗
DOE OSTI2021

Demonstration of Electron Cooling using a Pulsed Beam from an Electrostatic Electron Cooler

Electron cooling continues to be an invaluable technique to reduce and maintain the emittance in hadron storage rings in cases where stochastic cooling is inefficient and radiative cooling is negligible. Extending the energy range of electron coolers beyond what is feasible with the conventional, electrostatic approach necessitates the use of RF fields for acceleration and, thus, a bunched electron beam. To experimentally investigate how the relative time structure of the two beams affects the cooling properties, we have set up a pulsed-beam cooling device by adding a synchronized pulsing circuit to the conventional electron source of the CSRm cooler at Institute of Modern Physics *. We show the effect of the electron bunch length and longitudinal ion focusing strength on the temporal evolution of the longitudinal and transverse ion beam profile and demonstrate the detrimental effect of timing jitter as predicted by theory and simulations. Compared to actual RF-based coolers, the simplicity and flexibility of our setup will facilitate further investigations of specific aspects of bunched cooling such as synchro-betatron coupling and phase dithering.

Bruker, M. W.↗
DOE OSTI2019

Notes on adjusting gold ion momentum in RHIC to optimize electron cooling at injection

The proposed electron cooling of low-energy gold ions in RHIC and the detection of ion-electron recombination are reviewed in [1]. Optimal cooling requires that the gold ions have the same velocity as the electrons in the cooling section of the RHIC ring. This can be accomplished by making small adjustments of either the ion or the electron momentum.Such adjustments are necessary because although we can set the momentum with good accuracy, this may not be good enough to land precisely on the sweet spot where, as detected by the recombination monitor, the cooling is maximized.

43 PARTICLE ACCELERATORS↗
DOE OSTI2023

First benchmarked electron cooling simulations from first principles

We present the first microscopic electron cooling simulations from first principles with accurate prediction of cooling time. These simulations were performed using our previously developed numerical method, PHAD, which is the first efficient large-scale collisional numerical method in beam physics. The simulation results are benchmarked with the experimental data of the low energy bunched electron cooling of ion beams at the storage ring CSRm at the IMP facility in China. Here, we have accurately considered the nonlinear dynamics in the whole accelerator system in addition to the electron cooling section. As a result, our simulations correctly reproduced cooling times of the experiments from first principles and without any tuning or fitting parameters in the code.

43 PARTICLE ACCELERATORS↗