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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 55 records · Page 3
All sourcesNASA NTRSDOE OSTI
DOE OSTI2026

Effect of metal encapsulation on bulk superconducting properties of niobium thin films used in qubits

Niobium metal occupies nearly 100% of the volume of a typical 2D transmon device. While the aluminum Josephson junction is of utmost importance, maintaining quantum coherence across the entire device means that pair-breaking in Nb leads, capacitive pads, and readout resonators can be a major source of decoherence. The established contributors are surface oxides and hydroxides, as well as absorbed hydrogen and oxygen. Metal encapsulation of freshly grown surfaces with non-oxidizing metals, preferably without breaking the vacuum, is a successful strategy to mitigate these issues. While the positive effects of encapsulation are undeniable, it is important to understand its impact on the macroscopic behavior of niobium films. We present a comprehensive study of the bulk superconducting properties of Nb thin films encapsulated with gold and palladium/gold, and compare them to those of bare Nb films. Magneto-optical imaging, magnetization, resistivity, and London and Campbell penetration depth measurements reveal significant differences in encapsulated samples. Both sputtered, and epitaxial Au-capped films exhibit the highest residual resistivity ratio and superconducting transition temperature, as well as the lowest upper critical field, London penetration depth, and critical current. These results are in good agreement with the microscopic theory of anisotropic normal and superconducting states of Nb. We conclude that pair-breaking in the bulk of niobium films, driven by disorder throughout the film rather than just at the surface, is a significant source of quantum decoherence in transmons. We also conclude that gold capping not only passivates the surface but also affects the properties of the entire film, significantly reducing the scattering rate due to defects likely induced by surface diffusion if the film is not protected immediately after fabrication.

Datta, Amlan [Ames Lab; Iowa State U.]↗
DOE OSTI2025

Encapsulation of Monolayer 2D Materials Using Kinetic Energy-Controlled Pulsed Laser Deposition

The integration of monolayer (ML) two-dimensional (2D) materials into next-generation microelectronics, optoelectronics, and sensors is hindered by their sensitivity to environmental exposure. Deposition of additional layers for encapsulation or growth on ML 2D materials by versatile but energetic plasma techniques such as pulsed laser deposition (PLD) has not been considered at the monolayer level because of potential damage caused by hyperthermal species with kinetic energies (KEs) exceeding the threshold displacement energy (TDE) of the ML. Here, we describe a general strategy to understand and mitigate damage during PLD by reducing the incident KE of ablated species below the TDE of the 2D monolayer using background gas collisions. Ion flux diagnostics, combined with in situ Raman spectroscopy of monolayer graphene during PLD of amorphous boron nitride (a-BN) as a dielectric encapsulation layer, show that damage is primarily correlated with fast ions that penetrate the background gas in accordance with Beer’s Law and are often overlooked in ICCD imaging due to the dominance of the bright, delayed plasma luminescence. Significantly, if fast ions are eliminated and a ∼2 nm-thick a-BN layer is “soft landed”, the monolayer graphene is effectively protected from damage by high KE species in the boron nitride plasma plume. Deposited a-BN films display a characteristic dielectric constant of 3.6 at 100 kHz and tunable charge injection properties. Our results enable PLD as a viable option for encapsulation and thin film growth onto ML 2D materials, with implications for both fundamental research and device integration.

2D materials↗
NASA NTRSDate not supplied

Microbes Share Rides Too: Updating Encapsulated Bioburden Estimate Values in Electronic Parts Common to Class D Mission Platforms.

As NASA develops more planetary protection missions that are Category III and in the Class D/rideshare mission platform, there is an increasing reliance on estimation of prelaunch bioburden to understand needs for burn up and breakup analyses or other methods to meet pre-launch bioburden levels. Current levels estimated for the encapsulated bioburden of semiconductor parts cited by NASA have been based on estimates of semiconductor manufacturing approaches from the 1970s that do not incorporate over fifty years of evolving cleanliness of semiconductor manufacturing processes and facilities. This investigation will focus on direct sampling of semiconductor parts for encapsulated bioburden values, drawing upon Goddard’s strength in EEE parts, supply chain management, destructive parts analysis and existing local planetary protection lab facilities to prepare and measure encapsulated bioburden at a statistically significant level for standard electronics parts common to known Class D/rideshare platforms.

planetary protection↗
NASA NTRS2015

Evaluation of Encapsulated Inhibitor for Autonomous Corrosion Protection

This work concerns the development of smart coating technologies based on microencapsulation for the autonomous control of corrosion. Microencapsulation allows the incorporation of corrosion inhibitors into coating which provides protection through corrosion-controlled release of these inhibitors.One critical aspect of a corrosion protective smart coating is the selection of corrosion inhibitor for encapsulation and comparison of the inhibitor function before and after encapsulation. For this purpose, a systematic approach is being used to evaluate free and encapsulated corrosion inhibitors by salt immersion. Visual, optical microscope, and Scanning Electron Microscope (with low-angle backscatter electron detector) are used to evaluate these inhibitors. It has been found that the combination of different characterization tools provide an effective method for evaluation of early stage localized corrosion and the effectiveness of corrosion inhibitors.

Autonomous↗
NASA NTRSDate not supplied

Microbes Share Rides Too: Updating Encapsulated Bioburden Estimate Values in Electronic Parts Common to Class D Missions

As NASA develops more planetary protection missions that are Category III and in the Class D/rideshare mission platform, there is an increasing reliance on estimation of prelaunch bioburden to understand needs for burn up and breakup analyses or other methods to meet pre-launch bioburden levels. Current levels estimated for the encapsulated bioburden of semiconductor parts cited by NASA have been based on estimates of semiconductor manufacturing approaches from the 1970s that do not incorporate the evolving cleanliness of semiconductor manufacturing since that time. This investigation will focus on direct sampling of semiconductor parts for encapsulated bioburden values, drawing upon Goddard’s strength in EEE parts, supply chain management, destructive parts analysis and existing local planetary protection lab facilities to prepare and measure encapsulated bioburden at a statistically significant level for standard electronics parts common to known Class D/rideshare platforms.

planetary protection↗
NASA NTRSDate not supplied

Selecting an Encapsulant for an Aerospace Superconducting Machine

Achieving larger benefits from electrified propulsion in single aisle aircraft (the largest commercial aircraft market segment) necessitates that a significant fraction of their 20 MW or greater propulsion system be electrified. 5 to possibly 20 of the MW-scale electric machines investigated by NASA would be required to meet this need. Approximately 10-20 of NASA’s MW-scale electric machines would be required to reach the necessary power levels. Therefore, electric machines of 5 MW or greater are of interest. However, conventionally cooled high power density MW-scale electric machines still produce a significant amount of waste heat, which makes obtaining these power levels problematic. Highly efficient fully superconducting electric machines (or those with a cryogenically cooled, high purity copper or aluminum stator) are a possible solution but have multiple barriers to be overcome. One such barrier is the durability of superconducting windings. Superconductors are typically brittle, and encapsulants used to hold windings in place are a significant source of stress because of the mismatches in coefficient of thermal expansion at temperatures between room temperature and operational temperatures (20 to 77 K). These encapsulants also form a thermal barrier that can be detrimental to cooling the superconductors. This paper describes an initial study of commercially available encapsulants as it relates to superconducting machine applications along with initial modeling of thermal stress in superconducting windings for a superconducting or cryogenically cooled stator in a 5 MW electric machine.

encapsulant↗
NASA NTRSDate not supplied

Selecting an Encapsulant for an Aerospace Superconducting Machine

Achieving larger benefits from electrified propulsion in single aisle aircraft (the largest commercial aircraft market segment) necessitates that a significant fraction of their 20 MW or greater propulsion system be electrified. These aircraft would require up to 10-20 of today’s state-of-the art machines, which have been demonstrated up to 2.5 MW for aerospace use, and could benefit further from 5 MW+ designs. However, when conventionally cooled, high power density machines still produce a significant amount of waste heat, translating into heavy thermal management and detracting from system benefits. Highly efficient fully superconducting electric machines (or those with a cryogenically cooled, high purity copper or aluminum stator) are a possible solution but have multiple barriers to overcome. One such barrier is the durability of superconducting windings. Superconductors are typically brittle, and encapsulants used to hold windings in place are a significant source of stress due to mismatches in coefficient of thermally induced contraction between ambient and operational temperatures (20 to 77 K). Lack of compliance between the materials at operational temperatures also adds significant stress. These encapsulants also form a thermal barrier that can be detrimental to cooling the superconductors. This work describes an initial study of commercially available encapsulants as it relates to superconducting machine applications, along with initial modeling of thermal stress in superconducting windings for a superconducting or cryogenically cooled stator in a 5 MW electric machine.

encapsulant↗
DOE OSTI2024

Impulse-driven release of gas-encapsulated drops

Gas-encapsulated drops, much like antibubbles, are drops enclosed in a bubble within a liquid. They show potential as payload carriers in fluid transport and mixing techniques where sound waves can be leveraged to induce the collapse of the gas core and the subsequent release of the drop. Here, the interaction of millimetre-sized gas-encapsulated drops with impulsive laser-induced shock waves is investigated to gain fundamental insights into the release process. Experimental synchrotron X-ray phase contrast imaging, which allows the drop dynamics to be visualised inside the encapsulating bubble, is complemented by numerical simulations to study the intricate physics at play. Three drop dynamical release regimes are discovered, namely the drop impact , partial deposition and jet impact regimes. The regime type is mainly dependent on the shape of the bubble interface impacting the drop and the associated Weber and Reynolds numbers. The drop dynamics of the drop impact and partial deposition regimes show similarities with the canonical configuration of drops impacting flat liquid surfaces, whereas the jet impact regime resembles binary drop collisions, which allows existing scaling laws to be applied to describe the underlying processes. The release of the drop is investigated numerically. The time evolution of the drop dissemination within the surrounding liquid discloses enhanced mixing for dynamics involving high Weber and Reynolds numbers such as the drop impact and jet impact regimes.

42 ENGINEERING↗
DOE OSTI2025

Developing the Science Basis for Understanding Polymer Encapsulant Degradation Mechanisms: DuraMAT 2.0 Final Project Report

Polymeric encapsulants are essential materials in photovoltaic modules, protecting sensitive electronics from the environment while providing mechanical integrity to the multilayered assembly. However, these polymeric materials are susceptible to degradation processes driven by the ingress of environmental species, ultraviolet radiation, thermal stresses, and mechanical loading. In this study, we employ a combined atomistic simulation and accelerated aging experimental approach to study the molecular-scale mechanisms of encapsulant degradation. Classical molecular dynamics simulations quantify the diffusion of environmental and degradation species through the polymer matrix, producing composition-specific diffusion coefficients. Reactive simulations characterize activation energy barriers and reaction rate constants for key chemical pathways. In parallel, thermal-desorption analyses coupled with mass spectrometry monitor the emergence and concentration profiles of degradation products under controlled stressor conditions. By integrating simulation and experiment, we establish quantitative correlations between polymer composition, species diffusivity, and chemical reactivity. We anticipate that these relations and quantitative values could serve as high-fidelity inputs to reaction-diffusion models, enabling physics-informed lifetime predictions and guiding the design of more durable encapsulant materials for solar energy applications.

36 MATERIALS SCIENCE↗
NASA NTRS1974

Status of FEP encapsulated solar cell modules used in terrestrial applications

The Lewis Research Center has been engaged in transferring the FEP encapsulated solar cell technology developed for the space program to terrestrial applications. FEP encapsulated solar cell modules and arrays were designed and built expressly for terrestrial applications. Solar cell power systems were installed at three different land sites, while individual modules are undergoing marine environment tests. Four additional power systems are being completed for installation during the summer of 1974. These tests have revealed some minor problems which have been corrected. The results confirm the inherent utility of FEP encapsulated terrestrial solar cell systems.

Ratajczak, A. F.↗
NASA NTRS1974

Recommended practices for encapsulating high voltage assemblies

Preparation and encapsulation of high voltage assemblies are considered. Related problems in encapsulating are brought out in these instructions. A test sampling of four frequently used encapsulating compounds is shown in table form. The purpose of this table is to give a general idea of the working time available and the size of the container required for mixing and de-aerating.

Tankisley, E. W.↗
NASA NTRS1976

Review of world experience and properties of materials for encapsulation of terrestrial photovoltaic arrays

Published and unpublished information relating to encapsulation systems and materials properties was collected by searching the literature and appropriate data bases (over 1,300 documents were selected and reviewed) and by personal contacts including site and company visits. A data tabulation summarizing world experience with terrestrial photovoltaic arrays (50 installations) is presented in the report. Based on criteria of properties, processability, availability, and cost, candidate materials were identified which have potential for use in encapsulation systems for arrays with a lifetime of over 20 years high reliability, an efficiency greater than 10 percent, a total price less than $500/kW, and a production capacity of 500,000 kW/yr. The recommended materials (all commercially available) include, depending upon the device design, various borosilicate and soda-lime glasses and numerous polymerics suitable for specific encapsulation system functions.

Carmichael, D. C.↗
NASA NTRS1977

Evaluation testing of solid encapsulated microcircuits for space applications

Epoxy encapsulated microcircuits were subjected to various thermal, vibration, thermal cycling, and reduced barometric pressure stress tests to obtain electrical, environmental, and failure data. Analyses of the data were employed to derive information on environmental and operating design limits to determine the capability of encapsulated microcircuits to perform in space applications and environments. Seven different part types (four TTL, two CMOS, one linear) from five different manufacturers were subjected to single, multiple, and combinational environmental stress levels to determine: (1) what failure mechanisms are unique to encapsulated microcircuits; (2) how believable are suppliers claims of improved reliability, (3) what stress tests and screens can be used to identify potential early failure, and (4) what stress tests and screens should be avoided to prevent unwanted life degradation.

Robinson, D. D.↗
NASA NTRS1978

Evaluation available encapsulation materials for low-cost long-life silicon photovoltaic arrays

Experimental evaluation of selected encapsulation designs and materials based on an earlier study which have potential for use in low cost, long-life photovoltaic arrays are reported. The performance of candidate materials and encapsulated cells were evaluated principally for three types of encapsulation designs based on their potentially low materials and processing costs: (1) polymeric coatings, transparent conformal coatings over the cell with a structural-support substrate; (2) polymeric film lamination, cells laminated between two films or sheets of polymeric materials; and (3) glass-covered systems, cells adhesively bonded to a glass cover (superstrate) with a polymeric pottant and a glass or other substrate material. Several other design types, including those utilizing polymer sheet and pottant materials, were also included in the investigation.

Carmichael, D. C.↗
NASA NTRS1976

Material and design considerations of encapsulants for photovoltaic arrays in terrestrial applications

Procedures for analyzing cyclic mechanical stresses in encapsulated photovoltaic arrays designed for terrestrial application are discussed. The concept of 'thermal stiffness', the product of alpha and Young's modulus, is presented, and its usefulness for minimizing mechanical stresses is demonstrated. The concept of the 'proportional-limit' helps indicate the upper limit of design stress for plastics. System design is considered with attention to cell dimensions, cell to substrate adhesive, single encapsulant system, double layer encapsulant, and stresses in the interconnects. The permeability of polymeric materials to gases is examined.

Carroll, W.↗
NASA NTRS1979

Integral Glass Encapsulation for Solar Arrays

Work reported was performed during the period from August 1977 to December 1978. The program objective was to continue the development of electrostatic bonding (ESB) as an encapsulation technique for terrestrial cells. Economic analyses shows that this process can be a cost-effective method of producing reliable, long lifetime solar modules. When considered in sufficient volume, both material and equipment costs are competitive with conventional encapsulation systems. In addition, the possibility of integrating cell fabrication into the encapsulation process, as in the case of the preformed cell contacts discussed in this report, offers the potential of significant overall systems cost reduction.

Younger, P. R.↗
NASA NTRS1978

Encapsulant materials for $2/watt terrestrial photovoltaic arrays

Materials properties, cost data, and strawman designs are presented relative to materials for $2/watt terrestrial photovoltaic arrays to meet LSA Project cost goals for 1982. It is shown that encapsulation materials can be categorized in six basic elements: top covers, super-strates, pottants, adhesives, substrates, and bottom covers. The roles of the six basic encapsulant material elements in the encapsulant system are discussed and candidate materials presented.

Maxwell, H.↗
NASA NTRS1978

A life prediction methodology for encapsulated solar cells

This paper presents an approach to the development of a life prediction methodology for encapsulated solar cells which are intended to operate for twenty years or more in a terrestrial environment. Such a methodology, or solar cell life prediction model, requires the development of quantitative intermediate relationships between local environmental stress parameters and the basic chemical mechanisms of encapsulant aging leading to solar cell failures. The use of accelerated/abbreviated testing to develop these intermediate relationships and in revealing failure modes is discussed. Current field and demonstration tests of solar cell arrays and the present laboratory tests to qualify solar module designs provide very little data applicable to predicting the long-term performance of encapsulated solar cells. An approach to enhancing the value of such field tests to provide data for life prediction is described.

Coulbert, C. D.↗