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At least 55 records · Page 3

Failure Predictions of Out-of-Autoclave Sandwich Joints with Delaminations Under Flexure Loads

An analysis and a test program was conducted to investigate the damage tolerance of composite sandwich joints. The joints contained a single circular delamination between the face-sheet and the doubler. The coupons were fabricated through out-of-autoclave (OOA) processes, a technology NASA is investigating for joining large composite sections. The four-point bend flexure test was used to induce compression loading into the side of the joint where the delamination was placed. The compression side was chosen since it tends to be one of the most critical loads in launch vehicles. Autoclave cure was used to manufacture the composite sandwich sections, while the doubler was co-bonded onto the sandwich face-sheet using an OOA process after sandwich panels were cured. A building block approach was adopted to characterize the mechanical properties of the joint material, including the fracture toughness between the doubler and face-sheet. Twelve four-point-bend samples were tested, six in the sandwich core ribbon orientation and six in sandwich core cross-ribbon direction. Analysis predicted failure initiation and propagation at the pre-delaminated location, consistent with experimental observations. A building block approach using fracture analyses methods predicted failure loads in close agreement with tests. This investigation demonstrated a small strength reduction due to a flaw of significant size compared to the width of the sample. Therefore, concerns of bonding an OOA material to an in-autoclave material was mitigated for the geometries, materials, and load configurations considered.

Tolerance↗

Design and Analysis of Broad-Band Fixed-Tuned Submillimeter-Waveguide Multipliers using MMIC Style Circuit Topology

The design and analysis of varactor diode doubler, quadrupler and cascaded doubler circuits for 320 and 640 GHz have been completed. A new approach has been employed to produce a tunerless waveguide mount with a very flexible, frequency scaleable, MMIC style multiplier circuit. The concept, design, predicted performance and measurements on some of the constituent mount elements are presented.

varactor diode doubler MMIC style multiplier circu↗

Repair of honeycomb panels with welded breakaway studs

Damaged metallic honeycomb panels can be repaired by drilling holes and welding breakaway studs to both facing sheets. Minimal heat required for welding reduces distortion of highly stressed panels. Repairs can be made without the use of doublers and with greater strength when doublers are used.

Bruce, D. F.↗

Phase control circuits using frequency multiplications for phased array antennas

A phase control coupling circuit for use with a phased array antenna is described. The coupling circuit includes a combining circuit which is coupled to a transmission line, a frequency multiplier circuit which is coupled to the combining circuit, and a recombining circuit which is coupled between the frequency multiplier circuit and phased array antenna elements. In a doubler embodiment, the frequency multiplier circuit comprises frequency doublers and the combining and recombining circuits comprise four-port hybrid power dividers. In a generalized embodiment, the multiplier circuit comprises frequency multiplier elements which multiply to the Nth power, the combining circuit comprises four-part hybrid power dividers, and the recombinding circuit comprises summing circuits.

Mailloux, R. J.↗

Two-pass-internal second-harmonic generation using a prism coupler.

A dispersive quartz prism is used to couple the total second harmonic generated in both directions by an internal cavity frequency doubler. The study shows that the dispersion of air and mirror reflection phase shifts can be compensated for by a slight nonphase match condition in the doubler.

Gonzalez, D. G.↗

Extensive cost reduction studies: Composite empennage component - L-1011 commercial airliner

A series of cover skin laminate studies was conducted. The baseline laminate design is composed of 34 plies with doublers interwoven. This is costly to produce, since the broad goods tape dispersing machine must stop frequently while the doubler plies are inserted by hand during the layup sequence. The use of graphite cloth was investigated for the cover skin. Attention is also given to low resin content prepreg, the selection of optimum tape width, an increase in gap/overlap tolerances, the use of large reusable vacuum bags with mechanical edge seals for production, an integrated laminating center machine, automated hat stiffener processing, a secondary bond assembly process, and a single-stage cure process.

Van Hamersveld, J.↗

Strength and Mechanics of Bonded Scarf Joints for Repair of Composite Materials

Experimental and analytical investigations of scarf joints indicate that slight bluntness of adherend tips induces adhesive stress concentrations which significantly reduce joint strength, and the stress distribution through the adhesive thickness is non-uniform and has significant stress concentrations at the ends of the joint. The laminate stacking sequence can have important effects on the adhesive stress distribution. A significant improvement in joint strength is possible by increasing overlap at the expense of raising the repair slightly above the original surface. Although a surface grinder was used to make most experimental specimens, a hand held rotary bur can make a surprisingly good scarf. Scarf joints wit doublers on one side, such as might be used for repair, bend under tensile loads and may actually be weaker than joints without doublers.

Pipes, R. B.↗

Topics in the optimization of millimeter-wave mixers

This report is in three parts: 1. In the first part a user-oriented computer program for the analysis of single-ended Schottky diode mixers is described. The program is used to compute the performance of a 140-220 GHz mixer and excellent agreement with measurements at 150 and 180 GHz is obtained. A sensitivity analysis indicates the importance of various diode and mount characteristics on the mixer performance. 2. The second part of this report describes a computer program for the analysis of varactor diode multipliers. The diode may operate in either the reverse biased varactor mode or with substantial forward current flow where the conversion mechanism is predominantly resistive. In addition, a design for a varactor diode doubler, tunable over an output frequency range of 150-220 GHz, is given. The doubler has 10-20% conversion efficiency with an instantaneous bandwidth of 3%. 3. The third section of this report contains a description and analysis of i new H-plane rectangular waveguide transformer. The transformer can be made luckily and easily in split-block waveguide using a standard slitting saw. It is particularly suited for use in the millimeter-wave band, replacing conventional electroformed stepped transformers. A theoretical analysis of the transformer is given, and good agreement is obtained with measurements made at X-band. Design curves are included for transitions which have a VSWR <1.2 over a full waveguide band when the impedance ratio is as high as 4 to 1.

Millimeter-wave↗

Redundant, Confined-Explosive Severance Device

Noncontaminating, long, explosive joint with highly reliable separation capability invented for such applications as separation of rocket-motor stages of spacecraft from rockets or Space Shuttle. Two explosive cords housed in tubes held in place by two notched doublers and commercially available fasteners. When either cord fired, its tube expands, bending doublers and causing fracture at adjacent notch.

Bement, Laurence J.↗

Submillimeter sources for radiometry using high power Indium Phosphide Gunn diode oscillators

A study aimed at developing high frequency millimeter wave and submillimeter wave local oscillator sources in the 60-600 GHz range was conducted. Sources involved both fundamental and harmonic-extraction type Indium Phosphide Gunn diode oscillators as well as varactor multipliers. In particular, a high power balanced-doubler using varactor diodes was developed for 166 GHz. It is capable of handling 100 mW input power, and typically produced 25 mW output power. A high frequency tripler operating at 500 GHz output frequency was also developed and cascaded with the balanced-doubler. A dual-diode InP Gunn diode combiner was used to pump this cascaded multiplier to produce on the order of 0.5 mW at 500 GHz. In addition, considerable development and characterization work on InP Gunn diode oscillators was carried out. Design data and operating characteristics were documented for a very wide range of oscillators. The reliability of InP devices was examined, and packaging techniques to enhance the performance were analyzed. A theoretical study of a new class of high power multipliers was conducted for future applications. The sources developed here find many commercial applications for radio astronomy and remote sensing.

Deo, Naresh C.↗

Monolithic millimeter-wave diode grid frequency multiplier arrays

Monolithic diode frequency multiplier arrays, including barrier-N-N(+) (BNN) doubler, multi-quantum-barrier-varactor (MQBV) tripler, Schottky-quantum-barrier-varactor (SQBV) tripler, and resonant-tunneling-diode (RTD) tripler arrays, have been successfully fabricated with yields between 85 and 99 percent. Frequency doubling and/or tripling have been observed for all the arrays. Output powers of 2.4-2.6 W (eta = 10-18 percent) at 66 GHz with the BNN doubler and 3.8-10 W (eta = 1.7-4 percent) at 99 GHz with the SQBV tripler have been achieved.

Liu, Hong-Xia L.↗

Design and Varactors: Operational Considerations. A Reliability Study for Robust Planar GaAs

Preliminary conclusions include: Limits for reverse currents cannot be set. Based on current data we want to avoid any reverse bias current. We know 1 micro-A is too high. Leakage current gets suppressed when operated at 120K. Migration and verification: a) Reverse Bias Voltage will be limited; b) Health check with I/V curve: 1) Minimal reverse voltage shall be x0.75 of the calculated voltage breakdown Vbr; 2) Degradation of the Reverse Bias voltage at given current will be used as indication of ESD incidents or other Damages (high RF power, heat); 3) Calculation of diodes parameter to verify initial health check result in forward direction. RF output power starts to degrade when diode I/V curve is very strongly degraded only. Experienced on 400GHz doubler and 200GHz doubler

THz frequencies↗

Fiber-Coupled Planar Light-Wave Circuit for Seed Laser Control in High Spectral Resolution Lidar Systems

Precise laser remote sensing of aerosol extinction and backscatter in the atmosphere requires a high-power, pulsed, frequency doubled Nd:YAG laser that is wavelength- stabilized to a narrow absorption line such as found in iodine vapor. One method for precise wavelength control is to injection seed the Nd:YAG laser with a low-power CW laser that is stabilized by frequency converting a fraction of the beam to 532 nm, and to actively frequency-lock it to an iodine vapor absorption line. While the feasibility of this approach has been demonstrated using bulk optics in NASA Langley s Airborne High Spectral Resolution Lidar (HSRL) program, an ideal, lower cost solution is to develop an all-waveguide, frequency-locked seed laser in a compact, robust package that will withstand the temperature, shock, and vibration levels associated with airborne and space-based remote sensing platforms. A key technology leading to this miniaturization is the integration of an efficient waveguide frequency doubling element, and a low-voltage phase modulation element into a single, monolithic, planar light-wave circuit (PLC). The PLC concept advances NASA's future lidar systems due to its compact, efficient and reliable design, thus enabling use on small aircraft and satellites. The immediate application for this technology is targeted for NASA Langley's HSRL system for aerosol and cloud characterization. This Phase I effort proposes the development of a potassium titanyl phosphate (KTP) waveguide phase modulator for future integration into a PLC. For this innovation, the proposed device is the integration of a waveguide-based frequency doubler and phase modulator in a single, fiber pigtail device that will be capable of efficient second harmonic generation of 1,064-nm light and subsequent phase modulation of the 532 nm light at 250 MHz, providing a properly spectrally formatted beam for HSRL s seed laser locking system. Fabrication of the integrated PLC chip for NASA Langley, planned for the Phase II effort, will require full integration and optimization of the waveguide components (SHG waveguide, splitters, and phase modulator) onto a single, monolithic device. The PLC will greatly reduce the size and weight, improve electrical- to-optical efficiency, and significantly reduce the cost of NASA Langley s current stabilized HSRL seed laser system built around a commercial off-the-shelf seed laser that is free-space coupled to a bulk doubler and bulk phase modulator.

Cook, Anthony↗

MMIC HEMT Power Amplifier for 140 to 170 GHz

A three-stage monolithic microwave integrated circuit (MMIC) power amplifier that features high-electron-mobility transistors (HEMTs) as gain elements is reviewed. This amplifier is designed to operate in the frequency range of 140 to 170 GHz, which contains spectral lines of several atmospheric molecular species plus subharmonics of other such spectral lines. Hence, this amplifier could serve as a prototype of amplifiers to be incorporated into heterodyne radiometers used in atmospheric science. The original intended purpose served by this amplifier is to boost the signal generated by a previously developed 164-GHz MMIC HEMT doubler and drive a 164-to-328-GHz doubler to provide a few milliwatts of power at 328 GHz.

Samoska, Lorene↗

TPSAS-NF1676L-32227-DND

The ability of a recently proposed cohesive fatigue model to predict the initiation and propagation of skin/stiffener separation was evaluated using a three-point bend (3PB) configuration. The 3PB specimen consists of a quasi-isotropic laminate representing the skin of a fuselage. A shorter doubler representing the flange of a stiffener is co-cured at the center of the specimen. A simplified modeling technique was applied, in which the complex damage mechanisms involved in the separation, such as delamination migration, matrix cracking, bridging, and crack delving are represented by a mixed-mode trilinear cohesive law at the interface between the skin and the doubler. The quasi-static properties of the trilinear law were characterized. The main advantage of the proposed fatigue model is that it relies on quasi-static properties as well as engineering assumptions to compose the shape of the S-N diagram. The model does not require Paris law data, and it is capable of predicting the initiation of separation, the rate of propagation, as well as the effects of crack resistance curves and the stress ratio.

Carlos G Davila↗

A Planar Dielectric-Filled-Parabolic-Feed Frequency Multiplier

In this paper, we present a novel quasi-optical all-planar frequency doubler that could provide an alternative approach to conventional waveguide circuits for millimeter- and submillimeter-wave signal generation. By utilizing a quad-bridge-diode configuration, we are able to isolate the input and the output circuits without the use of complicated filter structures.

frequency doubler waveguide circuits signal genera↗

System-on-chip upgrade of millimeter-wave imaging diagnostics for fusion plasma

Monolithic, millimeter wave “system-on-chip” technology has been employed in chip heterodyne radiometers in a newly developed Electron Cyclotron Emission Imaging (ECEI) system on the DIII-D tokamak for 2D electron temperature and fluctuation diagnostics. The system employs 20 horn-waveguide receiver modules each with customized W-band (75–110 GHz) monolithic microwave integrated circuit chips comprising a W-band low noise amplifier, a balanced mixer, a ×2 local oscillator (LO) frequency doubler, and two intermediate frequency amplifier stages in each module. Compared to previous quasi-optical ECEI arrays with Schottky mixer diodes mounted on planar antennas, the upgraded W-band array exhibits >30 dB additional gain and 20× improvement in noise temperature; an internal eight times multiplier chain is used to provide LO coupling, thereby eliminating the need for quasi-optical coupling. The horn-waveguide shielding housing avoids out-of-band noise interference on each module. The upgraded ECEI system plays an important role for absolute electron temperature and fluctuation measurements for edge and core region transport physics studies. An F-band receiver chip (up to 140 GHz) is under development for additional fusion facilities with a higher toroidal magnetic field. Visualization diagnostics provide multi-scale and multi-dimensional data in plasma profile evolution. Finally, a significant aspect of imaging measurement is focusing on artificial intelligence for science applications.

47 OTHER INSTRUMENTATION↗