X-Ray CT Scans - Rodents Set 5
A collection of x-ray computed tomography scans of specimens from the Museum of Southwestern Biology.
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A collection of x-ray computed tomography scans of specimens from the Museum of Southwestern Biology.
A collection of x-ray computed tomography scans of specimens from the Museum of Southwestern Biology.
A collection of x-ray computed tomography scans of wooden Matryoshka dolls.
A collection of x-ray computed tomography scans of candy.
A collection of x-ray computed tomography scans of candy.
A collection of x-ray computed tomography scans of candy.
A collection of x-ray computed tomography scans of candy.
A collection of x-ray computed tomography scans of mineral specimens from private collections.
Abstract not provided.
A collection of x-ray computed tomography scans of owl pellets from a private collection collected during the summer of 2022.
Presented by NETL at Oklahoma State University, Caney Shale Viewing, Chesapeake Rock Lab, 02/20
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High density interconnects are required for increased input/output for microelectronics applications, incentivizing the development of Cu electrochemical deposition (ECD) processes for high aspect ratio through-silicon vias (TSVs). This work outlines Cu ECD processes for 62.5 μ m diameter TSVs, etched into a 625 μ m thick silicon substrate, a 10:1 aspect ratio. Cu ECD in high aspect ratio features relies on a delicate balance of electrolyte composition, solution replenishment, and applied voltage. Implementing a CuSO 4 -H 2 SO 4 electrolyte, which contains suppressor and a low chloride concentration, allows for a tunable relationship between applied voltage and localized deposition in the vias. A stepped potential waveform was applied to move the Cu growth front from the bottom of the via to the top. Sample characterization was performed through mechanical cross-sections and X-ray computed tomography (CT) scans. The CT scans revealed small seam voids in the Cu electrodeposit, and process parameters were tuned accordingly to produce void-free Cu features. During the voltage-controlled experiments, measured current data showed a characteristic current minimum, which was identified as an endpoint detection method for Cu deposition in these vias. We believe this is the first report of this novel endpoint detection method for TSV filling.
X-ray computed tomography (CT) scanning is used to study the physical characteristics of soil and sediment cores, allowing scientists to analyze stratigraphy without destroying core integrity. Microbiologists often work with geologists to understand the microbial properties in such cores; however, we do not know whether CT scanning alters microbial DNA such that DNA sequencing, a common method of community characterization, changes as a result of X-ray exposure. Our objective was to determine whether CT scanning affects the estimates of the composition of microbial communities that exist in cores. Sediment cores were extracted from a salt marsh and then submitted for CT scanning. We observed a minimal effect of CT scanning on microbial community composition in the sediment cores either when the cores were examined shortly after recovery from the field or after the cores had been stored for several weeks. In contrast, properties such as sediment layer and marsh location did affect microbial community structure. While we observed that CT scanning did not alter microbial community composition as a whole, we identified a few amplicon sequence variants (13 out of 7,037) that showed differential abundance patterns between scanned and unscanned samples among paired sample sets. Our overall conclusion is that the CT-scanning conditions typically used to obtain images for geological core characterization do not significantly alter microbial community structure. We stress that minimizing core exposure to X-rays is important if cores are to be studied for biological properties. Future investigations might consider variables, such as the length and energy of radiation exposure, the volume of the core, or the degree, to which microbial communities are stressed as important factors in assessing the impact of X-rays on microbes in geological cores.
We present a publicly accessible database centered around multi-scale Computed Tomographic (CT) imaging of samples from the BCH-03 well, supplemented by a wide range of supporting geological analyses (Brown, et al., 2022). The data include detailed petrologic descriptions of core samples, core-scale medical CT scans, high-resolution micro-CT scans, thin section photomicrographs, elemental abundance data from X-ray diffraction, velocity wave measurements, and helium porosimetry of the matrix.
SAND2022-14692 O Virtual Volumes is a CAD2VR plugin that gives users a powerful and intuitive way of exploring volumetric data in a three-dimensional (3D) virtual reality (VR) environment. It enables viewing of and interaction with volumetric and voxel data derived from sources such computed tomography (CT) scans. Current 2D software solutions for viewing CT scans and other volumetric data forces the user to look through "slices" of their data across anatomical planes. In Virtual Volumes, the user can intuitively interact, scale, crop, colorize, and threshold their data in a 3D VR environment. Sandia National Laboratories is a multimission laboratory managed and operated by National Technology & Engineering Solutions of Sandia, LLC, a wholly owned subsidiary of Honeywell International Inc., for the U.S. Department of Energy’s National Nuclear Security Administration under contract DE-NA0003525.
Conventional surface roughness measurement techniques require direct access to internal surfaces, often necessitating destructive sectioning of test articles. Computed tomography (CT) offers a non-destructive alternative for internal surface characterization, but its application in metrology remains unstandardized and sensitive to machine resolution and operator technique. This study investigates the feasibility of using CT scanning to quantify areal surface roughness in metal AM heat exchanger tubes with three distinct internal geometries: ribbed, discrete W, and featureless. CT-derived surface parameters were extracted using custom Python scripts and compared to measurements obtained from a focus variation microscope calibrated against a known standard. Results show that CT-based roughness measurements closely matched microscope values for the discrete W specimen, deviations between CT and microscope measurements were minimal—less than 1 µm—indicating reliable reconstruction. In contrast, the ribbed and featureless specimens, with lower roughness values showed greater discrepancies. The findings suggest that CT scanning can be a viable non-destructive metrology tool for AM parts with surface roughness above approximately 8 µm. For smoother surfaces, current CT capabilities may not provide sufficient accuracy, highlighting the need for resolution-aware workflows and further standardization in CT-based surface metrology.