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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 55 records · Page 3
All sourcesNASA NTRSDOE OSTI
NASA NTRS1970

Controlled etching of printed-circuit boards

Ferric chloride in an aqueous medium etches copper from the surface of printed-circuit boards. Ferric ions are reduced to ferrous ions resulting in a reduced etching rate.

Kovell, S. P.↗
NASA NTRS1975

Testing of printed circuit board solder joints by optical correlation

An optical correlation technique for the nondestructive evaluation of printed circuit board solder joints was evaluated. Reliable indications of induced stress levels in solder joint lead wires are achievable. Definite relations between the inherent strength of a solder joint, with its associated ability to survive stress, are demonstrable.

Espy, P. N.↗
NASA NTRSDate not supplied

An Overview of Printed Circuit Board Risks and Supplier Capability

This NESC Webinar provides the audience a snapshot of quality variations in printed circuit boards, as assessed, using experiences in processing and risk analysis of PCB structural integrity coupons. The presentation will focus on PCB quality metrics, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across suppliers, the associated root cause(s) behind these non-conformance, suggestions of mitigation plans and most importantly – the relation of these non-conformances to end item reliability. The statistical trends will then be matched with the current state of the domestic PCB supplier base, its key challenges and opportunities. The presentation further discusses the methods applied at GSFC for evaluating candidate PCB technologies that promote the adoption of higher throughput and faster processing technology for GSFC missions.

printed cricuit boards, supplier capability, risk ↗
NASA NTRS1966

Process produces accurate registry between circuit board prints

Tapes and quick-mount circles of contrasting colors aid in obtaining precise registry between the two circuits of two-sided printed circuit boards. The tapes and circles are mounted on opposite sides of transparent plastic film to define the conductive path and feed-through hole locations.

Source record↗
DOE OSTI2024

Investigation of a Multi-Rotor Triboelectric Nanogenerator Using a Modular Flexible Circuit Board Stack

Triboelectric nanogenerators (TENGs) are a nascent class of energy harvester that are being explored for scavenging energy from small ocean waves. To date, they have been integrated in wave energy converters (WECs) designed to capture random motion caused by the perturbations of the ocean surface. Blue economy applications such as ocean observation can benefit greatly from more substantial wave-derived power, as such, the power output of existing TENG WECs must be increased several-fold to become viable. This study describes the conceptualization of a rotary TENG, and the subsequent efforts to increase its power output by stacking multiple stator and rotor pairs. In the latter part of this study, we introduce a novel means of incorporating a friction element into the design of the TENG by employing flexible printed circuit board (PCB) rotors. At rest, these flexible rotors will contact the stator, building static charges due to friction, at speed, these flexible rotors will be decoupled from the stator, reducing friction and allowing faster rotation. Initial results indicate that the power output of the flexible PCB rotor does not produce more power than a rigid, acrylic disk rotor, however the current output of the prototype is boosted, and the prototype is far more compact, allowing for a higher energy density than the rigid rotor prototype.

bench testing↗
DOE OSTI2025

Adhesively Bonded Copper and Polyimide for Flexible Printed Circuit Boards: A Data-Driven Degradation Study Under Accelerated Aging

The long-term durability of polyimide laminated adhesive based flexible printed circuit boards (PCBs) is critical to the microelectronics industry. The interface of the adhesive layer binding the polyimide and copper layers is particularly vulnerable since decreased bonding strength can lead to deadhesion, performance loss, and premature device failure. Here, in this study, adhesive-bonded polyimide and copper samples are subjected to 1000 h of damp heat exposure (85 °C/85%RH) to evaluate the impact of moisture and copper inclusion on the adhesive bonding performance. Significant copper diffusion through the adhesive layer is observed, which, combined with moisture uptake, is found to substantially weaken interfacial adhesion in copper-containing samples, thereby reducing device lifetime. Observed surface and bulk material changes are correlated to adhesion strength using the network structural equation modeling (netSEM) approach, resulting in a robust predictive model of performance degradation based on measurable materials properties.

Chemistry↗
NASA NTRSDate not supplied

An Overview of Printed Circuit Board Risks and Supplier Capability (Reuse Document ID 20205007963)

This HDPUG Webinar provides the audience a snapshot of quality variations in printed circuit boards, as assessed, using experiences in processing and risk analysis of PCB structural integrity coupons. The presentation will focus on PCB quality metrics, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across suppliers, the associated root cause(s) behind these non-conformance, suggestions of mitigation plans and most importantly – the relation of these non-conformances to end item reliability. The statistical trends will then be matched with the current state of the domestic PCB supplier base, its key challenges and opportunities. The presentation further discusses the methods applied at GSFC for evaluating candidate PCB technologies that promote the adoption of higher throughput and faster processing technology for GSFC missions.

printed cricuit boards, supplier capability, risk ↗
NASA NTRS1985

Edge Labels for Multilayer Circuit Boards

Quick visual inspection identifies out-of-place layers. Small copper pads or other labels on layers present regular pattern if multilayer circuit board properly assembled and irregular pattern if one or more layers in wrong place. New method faster, cheaper, and more reliable than earlier methods.

Rossi, P. J.↗
NASA NTRS2012

Reducing Printed Circuit Board Emissions with Low-Noise Design Practices

This paper presents the results of an experiment designed to determine the effectiveness of adopting several low-noise printed circuit board (PCB) design practices. Two boards were designed and fabricated, each consisting of identical mixed signal circuitry. Several important differences were introduced between the board layouts: one board was constructed using recommended low-noise practices and the other constructed without such attention. The emissions from the two boards were then measured and compared, demonstrating an improvement in radiated emissions of up to 22 dB.

Bradley, Arthur T.↗
NASA NTRS1975

Packaging printed circuit boards: A production application of interactive graphics

The structure and use of an Interactive Graphics Packaging Program (IGPP), conceived to apply computer graphics to the design of packaging electronic circuits onto printed circuit boards (PCB), were described. The intent was to combine the data storage and manipulative power of the computer with the imaginative, intuitive power of a human designer. The hardware includes a CDC 6400 computer and two CDC 777 terminals with CRT screens, light pens, and keyboards. The program is written in FORTRAN 4 extended with the exception of a few functions coded in COMPASS (assembly language). The IGPP performs four major functions for the designer: (1) data input and display, (2) component placement (automatic or manual), (3) conductor path routing (automatic or manual), and (4) data output. The most complex PCB packaged to date measured 16.5 cm by 19 cm and contained 380 components, two layers of ground planes and four layers of conductors mixed with ground planes.

Perrill, W. A.↗
NASA NTRS1978

Ultrasonic evaluation of high-voltage circuit boards

Ultrasonic transmission technique, using reflector plate, indicates resistance to corona formation. Technique is useful as tool for mapping specific panels to permit selecting best areas of laminate for circuit board use. Procedure is relatively safe, fast, inexpensive, and uses commercially-available equipment.

Klima, S. J.↗
NASA NTRS2004

Printed Circuit Board Design with HDL Designer

Staying up to date with the latest CAD tools both from a cost and time perspective is difficult. Within a given organization there may be experts in Printed Circuit Board Design tools and experts in FPGA/VHDL tools. Wouldn't it be great to have someone familiar with HDL Designer be able to design PCBs without having to learn another tool? This paper describes a limited experiment to do this.

Winkert, Thomas K.↗
NASA NTRS1989

Using multiple sensors for printed circuit board insertion

As more and more activities are performed in space, there will be a greater demand placed on the information handling capacity of people who are to direct and accomplish these tasks. A promising alternative to full-time human involvement is the use of semi-autonomous, intelligent robot systems. To automate tasks such as assembly, disassembly, repair and maintenance, the issues presented by environmental uncertainties need to be addressed. These uncertainties are introduced by variations in the computed position of the robot at different locations in its work envelope, variations in part positioning, and tolerances of part dimensions. As a result, the robot system may not be able to accomplish the desired task without the help of sensor feedback. Measurements on the environment allow real time corrections to be made to the process. A design and implementation of an intelligent robot system which inserts printed circuit boards into a card cage are presented. Intelligent behavior is accomplished by coupling the task execution sequence with information derived from three different sensors: an overhead three-dimensional vision system, a fingertip infrared sensor, and a six degree of freedom wrist-mounted force/torque sensor.

Sood, Deepak↗
NASA NTRS1983

Terminal Strip Facilitates Printed-Circuit Board Changes

Laminanted copper and polyimide terminal strip makes it easy to modify printed-circuit (PC) board, after board has been fabricated. When epoxied over conductors or insulating portion of PC board, strip provides series of solder-coated copper conductor pads to which integrated-circuit leads are soldered for functional changes. Terminal strips accommodate leads on dual inline IC package or as staggered single or multiple leads on planar mounted flatpacks.

Pinto, E. A.↗
NASA NTRS1967

Investigation of Solder Cracking Problems on Printed Circuit Boards

A Solder Committee designated to investigate a solder cracking phenomena occurring on the SATURN electrical/electronic hardware found the cause to be induced stress in the soldered connections rather than faulty soldering techniques. The design of the printed circuit (PC) board assemblies did not allow for thermal expansion of the boards that occurred during normal operation. The difference between the thermal expansion properties of the boards and component lead materials caused stress and cracking in the soldered connections. The failure mechanism and various PC boards component mounting configurations are examined in this report. Effective rework techniques using flanged tubelets, copper tubelets, and soft copper wiring are detailed. Future design considerations to provide adequate strain relief in mounting configurations are included to ensure successful solder terminations.

CIRCUIT BOARD↗