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High Temperature Erosion Modeling in Particle Based CSP Systems

1. Introduction. Wear and erosion damage of materials from solid particle and surface interactions is a major issue in various industries. Although more common in mining and oil and gas production, erosion is becoming a critical issue in renewable technologies as well such as particle based concentrated solar thermal power (CSP) systems. In particle based CSP systems, solid particles are used to absorb solar energy and as thermal storage. However, these particles may cause significant amount of wear to system components while through the system at high temperatures. This damage can be costly, and therefore, requires a greater understanding of solid particle erosion in CSP systems. Throughout the years, models and tools have been developed to predict and control erosion in industries such as oil and gas production. However, these erosion models and erosion prediction tools have been mainly developed based on erosion data for much higher velocities and lower temperatures, i.e. the operating conditions for which the existing models have been built are not pertinent to those expected in CSP system. It is known that erosion depends on many factors such as material properties, erodent particle properties, and particle impact speed and angle. However, the effect of temperature on erosion is not vastly investigated. In this work, a temperature-based correlation is introduced that will be used to modify the existing erosion models to predict erosion rates at velocities and temperatures relevant to Gen3 CSP systems. The existing models are first validated against erosion experiments run at low temperatures and low velocities. Subsequently, a temperature correction term is developed that can extend the existing models to high temperatures, based on the available experimental data showing the effect of temperature on impact erosion. 2. Erosion Models. Continuing sequence of impacts from solid particles on surfaces would result in loss of material due to mechanical interaction between solid surface and particles. Erosion equations have been developed to predict erosion under different conditions and erosion mechanism, including cutting and deformation erosion. These models are mainly either mechanistic, empirical, and semi-mechanistic models, when the latter combine the theory of the erosion mechanism and particle motion with the available experimental data. One of the first empirical correlation was introduced by American Petroleum Institute (API) Recommended Practice (RP) 14E [1]. This correlation was very conservative, and several improved empirical and semi-mechanistic equations were developed in the years following. More recently, the models introduced by Erosion/Corrosion Research Center (E/CRC) at the University of Tulsa and Arabnejad. et al. [2] are frequently used in the literature and industry, as they account for many parameters affecting erosion including particle impact speed and angle, material density and hardness, and particle size and shape. However, both these models were developed based on data at relatively high velocities and also do not take into account any mechanical changes in material associated with thermal cycling at high temperatures. 3. Erosion Prediction at High Temperatures. In this work, the accuracy of Arabnejad et al. model and E/CRC model is investigated to predict impact erosion at conditions relevant to Gen3 CSP systems. Two significant deviations expected in Gen3 systems compared to operating conditions used to build these models are particle impact velocities and system temperature. As a first step, the performance of these models was validated at low velocities and temperatures. Impact erosion experiments were conducted on SS316 coupons using HSP 40/70 ceramic particles. Assuming particle rate of 1 kg/s/m, 0.0254 m of particle curtain thickness, and particle velocity of 1.5 m/s in the system, an overall erosion of 0.59 mm/year was calculated. The experimental results were subsequently compared to those from computational simulations and erosion of 0.47 mm/year was obtained using the Arabnejad et al. model. The results indicated that the models work well at low velocities and low temperature conditions. To account for temperature effect, a mathematical correlation was developed using data published by DUCOM [3] for Inconel 600 eroded by alumina particles at high velocities. The correlation was applied to both Arabnejad et. al model and the E/CRC model. The prediction results from these modified models were within 20% of this experimental data. Predictions of of erosion by the modified E/CRC model at three different temperatures are made. Similar to the calculation at low temperature, a typical CSP system with 1 kg/s/m of particle flow rate per unit length of the particle curtain and a curtain thickness of 0.0254 m is assumed. The annual thickness loss calculations were run for different particle impact velocities, assuming a uniform particle impact area equal to the cross-sectional area of the curtain (particle-particle interactions and dispersion of particles are not considered in obtaining the results). It is observed that erosion increases exponentially as temperature increases. Furthermore, it is also noted that, erosion changes non-linearly with impact velocity. Currently, experiments are also being conducted to measure erosion of SS316 at 800 ºC with HSP 40/70 particles at low impact velocities. We expect to use the results from high temperature testing to further improve the temperature correlation function. Similar models are also being developed for abrasion erosion resulting from particle sliding along the surfaces as well as attrition from particle to particle and particle to surface interactions. References. [1] Institute, A. P. (1991). API Recommended Practice for Design and Installation of Offshore Production Platform Piping System, API RP 14E. [2] Arabnejad, H., Mansouri, A., Shirazi, S. A., and McLaury, B. S. (2015a). Development of mechanistic erosion equation for solid particles. Wear, 332–333, 1044–1050. http://doi.org/10.1016/j.wear.2015.01.031. [3] https://ducom.com/high-temperature-erosion-evaluating-sample-wear/

14 SOLAR ENERGY↗

Distributed fiber sensing systems for 3D combustion temperature field monitoring in coal-fired boilers using optically generated acoustic waves (Final Report)

In this project, we have developed and tested three kinds of fiber optic sensing systems for real time monitoring of temperature variations within an industrial scale boiler furnace. The fiber optic sensing systems target spatial and temporal distributions of high temperature profiles in a boiler furnace in fossil power plants. The reconstructed temperature profile will provide critical input for the control mechanisms to optimize the combustion process. This temperature profile will address the essential problem for fossil power plants in achieving higher efficiency and fewer pollutant emissions. Acoustic pyrometer systems have been used to reconstruct temperature field of power plant boilers based on measuring TOF (times-of-flight) of sound waves along some straight paths in a 2D cross-section of the boiler. In this project, optically generated acoustic signals from a fiber optic sensing system have replaced the acoustic signals generated from an electrical transducer. A 3D reconstruction algorithm replaced the previous 2D model. In this project, three kinds of fiber optic sensing systems have been developed and tested. They are fiber optic sensing system I, fiber optic sensing system II (Distributed Sensing System I) and fiber optic sensing system III (Distributed Sensing System II). For fiber optic sensing system I, the fiber optic ultrasound generator acts as a signal generator. A microphone, hydrophone or other electronic devices serve as a signal receiver. In this system, there are one generator and one receiver. Distance test, water temperature test, air temperature test, air temperature reconstruction, and GE ISBF pilot test were performed by Fiber optic sensing system I. The fiber optic sensing system I successfully detected temperature in all these tests. We got 2D temperature reconstruction results by using the fiber optic sensing system I and it matched the reference data. The fiber optic sensing system I successfully survived in GE ISBF boiler environment (480 °F). For fiber optic sensing system II (Distributed Sensing System I), it is an all optical ultrasound system. The fiber optic ultrasound generator acts as a signal generator. Fiber Bragg Grating (FBG) and Fabry-Perot (FP) sensor act as a signal receiver. In this system, there is one generator and one receiver. Aluminum plate temperature test, furnace high temperature test, and GE ISBF pilot test were performed by the fiber optic sensing system II. Fiber optic sensing system II successfully detected the temperature in all these tests. The fiber optic sensing system II successfully survived at up to 700 °C furnace environment and 320 °C GE ISBF boiler environment. For fiber optic sensing system III (Distributed Sensing System II), it is also an all optical ultrasound system. The fiber optic ultrasound generator acts as a signal generator. Multiple FP fiber sensors act as signal receivers. In this system, there is one generator and three receivers. Three GE ISBF pilot tests were performed by fiber optic sensing system III. The fiber optic sensing system III survived in the cold flow tests in GE’s ISBF pilot test facility. However, we didn’t get high temperature data by using this system since the nanosecond laser issues. During the period of the project, test trials, data simulation and algorithm optimization was performed successfully. For real time temperature field construction, the sampling rate must be fast enough to capture the field variations. The technology of Code-division multiple access (CDMA) is well studied which could allow parallel multiplexing, even if signals overlap in time or frequencies. Moreover, it has been known that extending the length of signal significantly improves SNR. For acoustic signals, these multiplexing techniques have also been widely used, mainly for sonar and acoustic communications. The CDMA modulation technique has been proposed and studied to guarantee high network throughput, low channel access delay and low energy consumption. We have studied the temperature field reconstruction using Gaussian Radial Basis Functions (GRBF)-based approximation approach. Reconstruction of 3D temperature field using Neural Networks with measured TOF and known propagation paths is feasible. 2D and 3D temperature field reconstruction simulation results are achieved. The milestone status is shown in Table 1. We finished milestone 1-8 and milestone 10. For milestone 9, we did three pilot tests by using the fiber optic sensing system III (Distributed Sensing System II) at GE Power. However, due to the failure of the ns laser, we did not get the temperature results. We conducted some additional tasks that were not originally proposed: 1) We fabricated a fiber optic sensing system I and did a pilot test based on this system. 2) In the proposal, we proposed two pilot tests at GE Power. In reality, we finished at least seven pilot tests at GE Power. GE Power has made a lot of efforts for supporting the pilot tests. 3) We got a simulation results based on CDMA. In summary, most of the tasks have been accomplished. The outcome of this project removed a few barriers that hinder the achievement of the final product of the distributed sensing systems. With the successful accomplishment of this project, a prototype of the fiber optic sensing system can be fabricated to attract more interests from companies and other funding agencies.

47 OTHER INSTRUMENTATION↗

High-Temperature Thermometer Using Cr-Doped GdAlO3 Broadband Luminescence

A new concept has been developed for a high-temperature luminescence-based optical thermometer that both shows the desired temperature sensitivity in the upper temperature range of present state-of-the-art luminescence thermometers (above 1,300 C), while maintaining substantial stronger luminescence signal intensity that will allow these optical thermometers to operate in the presence of the high thermal background radiation typical of industrial applications. This objective is attained by using a Cr-doped GdAlO3 (Cr:GdAlO3) sensor with an orthorhombic perovskite structure, resulting in broadband luminescence that remains strong at high temperature due to the favorable electron energy level spacing of Cr:GdAlO3. The Cr:GdAlO3 temperature (and pressure) sensor can be incorporated into, or applied onto, a component s surface when a non-contact surface temperature measurement is desired, or alternatively, the temperature sensor can be attached to the end of a fiber-optic probe that can then be positioned at the location where the temperature measurement is desired. In the case of the fiber-optic probe, both the pulsed excitation and the luminescence emission travel through the fiber-optic light guide. In either case, a pulsed light source provides excitation of the luminescence, and the broadband luminescence emission is collected. Real-time temperature measurements are obtain ed using a least-squares fitting algorithm that determines the luminescence decay time, which has a known temperature dependence established by calibration. Due to the broad absorption and emission bands for Cr:GdAlO3, there is considerable flexibility in the choice of excitation wavelength and emission wavelength detection bands. The strategic choice of the GdAlO3 host is based on its high crystal field, phase stability, and distorted symmetry at the Cr3+ occupation sites. The use of the broadband emission for temperature sensing at high temperatures is a key feature of the invention and is novel since broadband luminescence emission normally shows severe thermal quenching. The tightly bound AlO6 octahedra in GdAlO3 results in a larger energy barrier to nonradiative decays than in other materials and therefore makes using broadband emission for temperature sensing possible at high temperatures. This approach results in a substantial increase in temperature capability. For example, the most commonly used Cr-doped crystal used for luminescence-based temperature measurements, ruby, has only been demonstrated up to 600 C, whereas the Cr:GdAlO3 optical thermometer under development has already been shown to exhibit useful luminescence up to 1,300 C. Because GdAlO3 is non-reactive and is stable in harsh, high-temperature environments, sensors composed of Cr:GdAlO3 will be very well suited for remote high-temperature measurements in engine or industrial environments where its intense high-temperature luminescence will stand out above significant thermal radiation background levels.

Eldridge, Jeffrey↗

Characterization of Low Noise, Precision Voltage Reference REF5025-HT Under Extreme Temperatures

The performance of Texas Instruments precision voltage reference REF5025-HT was assessed under extreme temperatures. This low noise, 2.5 V output chip is suitable for use in high temperature down-hole drilling applications, but no data existed on its performance at cryogenic temperatures. The device was characterized in terms of output voltage and supply current at different input voltage levels as a function of temperature between +210 C and -190 C. Line and load regulation characteristics were also established at six load levels and at different temperatures. Restart capability at extreme temperatures and the effects of thermal cycling, covering the test temperature range, on its operation and stability were also investigated. Under no load condition, the voltage reference chip exhibited good stability in its output over the temperature range of -50 C to +200 C. Outside that temperature range, output voltage did change as temperature was changed. For example, at the extreme temperatures of +210 C and - 190 C, the output level dropped to 2.43 V and 2.32 V, respectively as compared to the nominal value of 2.5 V. At cryogenic test temperatures of -100 C and -150 C the output voltage dropped by about 20%. The quiescent supply current of the voltage reference varied slightly with temperature but remained close to its specified value. In terms of line regulation, the device exhibited excellent stability between -50 C and +150 C over the entire input voltage range and load levels. At the other test temperatures, however, while line regulation became poor at cryogenic temperatures of -100 C and below, it suffered slight degradation at the extreme high temperature but only at the high load level of 10 mA. The voltage reference also exhibited very good load regulation with temperature down to -100 C, but its output dropped sharply at +210 C only at the heavy load of 10 mA. The semiconductor chip was able restart at the extreme temperatures of -190 C and +210 C, and the limited thermal cycling did not influence its characteristics and had no impact on its packaging as no structural or physical damage was observed.

Patterson, Richard↗

Comparison of Satellite, Thermochron and Air Temperatures at Summit, Greenland, During the Winter of 2008/09

Current trends show rise in Arctic surface and air temperatures, including over the Greenland ice sheet where rising temperatures will contribute to increased sea-level rise through increased melt. We aim to establish the uncertainties in using satellite-derived surface temperature for measuring Arctic surface temperature, as satellite data are increasingly being used to assess temperature trends. To accomplish this, satellite-derived surface temperature, or land-surface temperature (LST), must be validated and limitations of the satellite data must he assessed quantitatively. During the 2008/09 boreal winter at Summit, Greenland, we employed data from standard US National Oceanic and Atmospheric Administration (NOAA) air-temperature instruments, button-sized temperature sensors called thermochrons and the Moderate Resolution Imaging Spectroradiometer (MODIS) satellite instrument to (1) assess the accuracy and utility of thermochrons in an ice-sheet environment and (2) compare MODIS-derived LSTs with thermochron-derived surface and air temperatures. The thermochron-derived air temperatures were very accurate, within 0.1+/-0.3 C of the NOAA-derived air temperature, but thermochron-derived surface temperatures were approx. 3 C higher than MODIS-derived LSTs. Though the surface temperature is largely determined by air temperature, these variables can differ significantly. Furthermore, we show that the winter-time mean air temperature, adjusted to surface temperature was approx. 11 C higher than the winter-time mean MODIS-derived LST. This marked difference occurs largely because of satellite-derived LSTs cannot be measured through cloud cover, so caution must be exercised in using time series of satellite LST data to study seasonal temperature trends.

Koenig, Lora S.↗

500 C Electronic Packaging and Dielectric Materials for High Temperature Applications

High-temperature environment operable sensors and electronics are required for exploring the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and application of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high temperature electronics, and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by these high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed. High-temperature environment operable sensors and electronics are required for probing the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and eventual applications of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high electronics and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed.

dielectric performance↗

Sensitivity Effects of High Temperature Overhead Conductors to Line Rating Variables

For traditional overhead transmission lines, the maximum allowable conductor operating temperature on ASCR, AAC, or AAAC lines for determining the static line ratings can be quite low, typically well under 100 C. At these low temperatures, the primary driver for determining static line ratings are assumptions made about the wind speed and direction and the ambient temperature. Assumptions for solar loading and emitted thermal radiation, driven by line emissivity and absorptivity, are secondary factors, and only provide small changes to the static ratings. However, when considering newer high temperature conductors such as ACSS, ACCR, ZTACIR, and ACCC® the maximum allowable conductor temperatures can be significantly higher, up to 250° C. This higher temperature shifts the importance of the emissivity assumptions of the overhead transmission line, due to the nature of the T4 dependence of the radiative heat loss compared to the T1 dependence of the convective heat loss, as well as shifting the dependency on local wind conditions. Typical assumptions in the United States for the emissivity/absorptivity of overhead transmission lines in determining the static ratings are to use a value of 0.5 for both parameters or set a value in the range of 0.7 to 0.9. Recent experimental tests at EPRI have shown that higher emissivity aging assumptions may not be valid in some regions of the US, and that actual values may be much lower (0.25-0.45) than older studies have predicted (0.8-0.9). Here, the assumptions of different US Regional Transmission Operators (RTOs) and different utilities within RTOs are examined for the static ratings for traditional lower operating temperatures up to 100° C as well as with the higher maximum temperature conductors associated with newer conductor designs at 250° C. The sensitivity of the static ratings is examined at both lower and higher temperature conductors with respect to overhead line emissivity and absorptivity, wind speed, wind direction, and solar loading, and ambient temperature. It is shown that the effects of the conductor absorptivity, solar flux and ambient temperature on the static rating are increased when the transmission line has a lower maximum conductor temperature. The effects of the conductor emissivity, wind direction and wind speed have increased effects on the static rating when the transmission line has a higher maximum conductor temperature. In addition, example weather data is used to calculate the conductor temperature with different line emissivity and absorptivity assumptions. This shows the effect of assumptions made for emissivity only has a minor impact for low temperature lines, but for high temperature transmission lines can cause a 150-200° C temperature swing.

24 POWER TRANSMISSION AND DISTRIBUTION↗

Temperature Uncertainty Modeling with Proxy Structural Data as Geostatistical Constraints for Well Siting: An Example Applied to Granite Springs Valley, NV, USA

Utilizing existing temperature and structural information around Granite Springs Valley, Nevada, we build 3D stochastic temperature models with the aim of evaluating the 3D uncertainty of temperature and choosing between candidate exploration well locations . The data used to support the modeling are measured temperatures and structural proxies from 3D geologic modeling, the latter considered "secondary" data. Two stochastic geostatistical techniques are explored for incorporating the structural proxies: cosimulation and local varying mean. With both the cosimulation and local varying mean methods, many equally likely temperature models (i.e., realizations) are produced, from which temperature probability profiles are calculated at candidate well locations. To aid in choosing between the candidate locations, two quantities summarize the temperature probabilities: Vprior and entropy. Vprior quantifies the likelihood for economic temperatures at each candidate location, whereas entropy identifies where new information has the most potential to reduce uncertainty. In general, the cosimulation realizations have smoother spatial structure, and extrapolate high temperatures at candidate locations that are located along the direction of the longest spatial correlation, which are down dip from existing temperature logs. The smooth realizations result in tight temperature probability profiles that are easier to interpret, but they have unrealistic temperature reversals in some locations because the cosimulation technique does not enforce a conductive geothermal gradient as a baseline (i.e., linearly increasing temperature with depth). The local varying mean results produce realizations with more realistic geothermal gradients, with temperatures increasing downward since a depth-temperature relationship is included. However, because they have much noisier spatial nature compared to cosimulation, it is harder to interpret the temperature probability profiles. The different local varying mean results allow the geologist to determine which proxy (e.g., dilation versus distance to fault termination) should be used given the specific geothermal system. In general, Vprior from local varying mean results identify locations that are close to high values for the structural proxies: areas with highe r probabilities for higher temperatures. The entropy results identify where uncertainty is greatest and therefore new drilling information could be most useful. Though these techniques provide useful information, even when applied to areas of sparse data, our comp arison of these two techniques demonstrates the need for new geothermal geostatistics techniques that combine the advantages of these two methods and that are tailored to the spatial uncertainty issues inherent in geothermal exploration.

3D temperature modeling↗

Temperature uncertainty modelling with proxy structural data as geostatistical constraints for well siting: an example applied to Granite Springs Valley, NV, USA

Utilizing existing temperature and structural geology information around Granite Springs Valley, Nevada, we build 3D stochastic temperature models with the aims of evaluating the 3D uncertainty of temperature and choosing between candidate exploration well locations. The data used to support the modelling are measured temperatures and structural proxies from 3D geologic modelling (distance to fault, distance to fault intersections and terminations, Coulomb stress change and dilation tendency), the latter considered ‘secondary’ data. Two stochastic geostatistical techniques are explored for incorporating the structural proxies: cosimulation and local varying mean. With both the cosimulation and local varying mean methods, many equally-likely temperature models (i.e. realizations) are produced, from which temperature probability profiles are calculated at candidate well locations. To aid in choosing between the candidate locations, two quantities summarize the temperature probabilities: V prior and entropy. V prior quantifies the likelihood for economic temperatures at each candidate location, whereas entropy identifies where new information has the most potential to reduce uncertainty. In general, the cosimulation realizations have smoother spatial structure, and extrapolate high temperatures at candidate locations that are located along the direction of the longest spatial correlation, which are down dip from existing temperature logs. The smooth realizations result in tight temperature probability profiles that are easier to interpret, but they have unrealistic temperature reversals in some locations because of the dipping ellipsoid shape created and that the cosimulation technique does not enforce a conductive geothermal gradient as a baseline (i.e. linearly increasing temperature with depth). The local varying mean results produce realizations with more realistic geothermal gradients, with temperatures increasing downward since a depth-temperature relationship is included. However, because they have much noisier spatial nature compared to cosimulation, it is harder to interpret the temperature probability profiles. The different local varying mean results allow the geologist to determine which proxy (e.g. dilation v. distance to fault termination) should be used given the specific geothermal system. In general, V prior from local varying mean results identify locations that are close to high values for the structural proxies: areas with higher probabilities for higher temperatures. The entropy results identify where uncertainty is greatest and therefore new drilling information could be most useful. Though these techniques provide useful information, even when applied to areas of sparse data, our comparison of these two techniques demonstrates the need for new geothermal geostatistics techniques that combine the advantages of these two methods and that are tailored to the spatial uncertainty issues inherent in geothermal exploration.

15 GEOTHERMAL ENERGY↗

Passive Temperature Sensors for Nuclear Applications

Thermocouples are generally used to provide real-time temperature indications in instrumented tests performed at material and test reactors. Passive temperature monitors, such as Silicon Carbide (SiC) and melt wires, may be included in such tests as an independent technique of detecting peak temperatures experienced during irradiation. In less expensive static (drop-in) capsule tests, which have no leads attached for real-time data transmission, melt wires, and SiC temperature monitors (TMs) are essentially the only possibility for peak temperature indication. A melt wire involves placing materials (wires) of a known composition and melting temperature in a test. An inventory is maintained at Material Science Laboratory (MSL) for melt wires ranging in temperatures from 30°C to 1500°C. Unfortunately, melt wires are limited in that it can only detect whether a single temperature is or is not exceeded (melt wire melted or not). SiC TMs, which can also be used to detect peak irradiation temperatures, are advantageous because a single monitor can allow to determine the peak temperature reached within a relatively broad range (100 – 1200°C) resulting in accuracies within ±20°C. Irradiation temperature is determined by measuring a property change after isochronal annealing or during a continuously monitored annealing process using specialized equipment at MSL. Recent research has produced a passive monitor known as sublime temperature monitor. This passive sensor has the capability of recording temperature gradients and pinpointing exactly where a temperature is located along that gradient. Long measurement lengths are achieved with very high accuracy in the location of desired temperature measurements (±2 mm over a 1 m span); however, this sensor has not been deployed in a nuclear reactor. This article will focus only on passive temperature sensors currently being researched and implemented under the Advanced Sensors and Instrumentation (ASI) program at Idaho National Laboratory (INL).

11 - NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗

Benchmark Analysis for the Optical Dilatometry Method Using Silicon Carbide Temperature Monitors

The main objective of this project was to conduct a benchmark analysis for the optical dilatometry method by using NSUF’s SiC temperature monitors: two (2) SiC temperature monitors provided by NSUF’s BSU-8242 experiment and two (2) SiC temperature monitors provided by NSUF’s GE-Hitachi experiment. Per the BSU-8242 experiment, KGT-3597 and KGT-3591 had a design temperature of 400°C and an exposure of 3 dpa. Per the GE-Hitachi experiment, KGT-3341 and KGT-3336 had a design temperature of 290°C +/- 50°C and an exposure of 0.5–1 dpa. The KGT-3336 SiC monitor was split into two pieces during the decontamination process, making the dilatometry method the only way to analyze both those pieces. The BSU-8242 monitors revealed peak irradiation temperatures under the design temperature, and the GE-Hitachi monitors revealed peak irradiation temperatures within the design temperature range. The optical dilatometry method measured the peak irradiation temperature of BSU-8242 KGT-3597 to be 330°C, while the resistivity method measured the peak irradiation temperature of BSU-8242 KGT-3591 to be 320°C +/- 20°C. The optical dilatometry method measured the peak irradiation temperatures of the pieces of GE-Hitachi KGT-3336 to be 260°C (for the larger piece) and 220°C (for the smaller piece), while the resistivity method measured the peak irradiation temperature of GE-Hitachi KGT-3341 to be 300°C, with an accuracy range of -50°C to +20°C. Both methods of SiC temperature monitor analysis produced very similar peak irradiation temperatures for each pair of SiC passive monitors from the two experiments, BSU-8242 and GE-Hitachi. The results show dilatometry method to be a reliable and less time-intensive process for determining irradiation temperatures from passive SiC thermometry.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Ice surface temperature retrieval from AVHRR, ATSR, and passive microwave satellite data: Algorithm development and application

One essential parameter used in the estimation of radiative and turbulent heat fluxes from satellite data is surface temperature. Sea and land surface temperature (SST and LST) retrieval algorithms that utilize the thermal infrared portion of the spectrum have been developed, with the degree of success dependent primarily upon the variability of the surface and atmospheric characteristics. However, little effort has been directed to the retrieval of the sea ice surface temperature (IST) in the Arctic and Antarctic pack ice or the ice sheet surface temperature over Antarctica and Greenland. The reason is not one of methodology, but rather our limited knowledge of atmospheric temperature, humidity, and aerosol vertical, spatial and temporal distributions, the microphysical properties of polar clouds, and the spectral characteristics of snow, ice, and water surfaces. Over the open ocean the surface is warm, dark, and relatively homogeneous. This makes SST retrieval, including cloud clearing, a fairly straightforward task. Over the ice, however, the surface within a single satellite pixel is likely to be highly heterogeneous, a mixture of ice of various thicknesses, open water, and snow cover in the case of sea ice. Additionally, the Arctic is cloudy - very cloudy - with typical cloud cover amounts ranging from 60-90 percent. There are few observations of cloud cover amounts over Antarctica. The goal of this research is to increase our knowledge of surface temperature patterns and magnitudes in both polar regions, by examining existing data and improving our ability to use satellite data as a monitoring tool. Four instruments are of interest in this study: the AVHRR, ATSR, SMMR, and SSM/I. Our objectives are as follows. Refine the existing AVHRR retrieval algorithm defined in Key and Haefliger (1992; hereafter KH92) and applied elsewhere. Develop a method for IST retrieval from ATSR data similar to the one used for SST. Further investigate the possibility of estimating surface temperature from passive microwave data (in conjunction with AVHRR clear sky samples) through the use of 'effective emissivities' and physical relationships between skin temperature and subsurface temperature. Use the general method outlined in MK93 to calculate a 12-year record of clear sky equivalent surface temperatures, or possibly all-sky snow-ice interface physical temperatures, from SMMR and SSM/I, compare these temperatures to climatologies, ECMWF modeled surface temperatures, and surface temperatures predicted by a 2-D ice model. And intercompare several ice surface retrieval methods and validate them against ground measurements from the Swiss Camp on the Greenland ice sheet. Additionally, we intend to develop a surface temperature product based on AVHRR data and possibly blended with drifting buoy and meteorological station temperatures.

Key, Jeff↗

Temperature prediction of space flight experiments by computer thermal analysis

Life sciences experiments are especially sensitive to temperature. A small temperature difference between otherwise identical samples can cause various differences in biological reaction rates. Knowledge of experimental temperatures and temperature histories help to distinguish the effects of microgravity and temperature on spaceflight experiments compared to ground based studies, and allow appropriate controls and sensitivity tests. Up to the present time, the Orbiter (Space Shuttle) has not generally provided temperature measurement instrumentation inside ambient lockers located in the Mid-deck of the Orbiter, or inside similar facilities such as Spacehab and Spacelab, but many pieces of hardware do have temperature recording capability. Most of these temperatures, however, have only been roughly measured or estimated. Such reported experimental temperatures, while accurate within a range of several degrees Celsius, are of limited utility to biological researchers. The temperature controlled lockers used in spaceflight, such as Commerical-Refrigeration Incubation Modules (C-R/IMs), severely reduce the mass and volume available for test samples and do not necessarily provide uniform thermal environments. While these test carriers avoid some of the experimental temperature variations of the ambient lockers, the number of samples which can be accommodated in these temperature controlled units is limited. In the present work, improved models of thermal prediction and control were sought. Temperatures are predicted by thermal analysis software using empirical temperatures recorded during STS-57. These temperatures are compared to data recorded throughout the mission using Ambient Temperature Recorders (ATRs) located within several payload lockers. Additional test cases are undertaken using controlled ground experiments to more precisely determine the reliability of the thermal model. The approach presented should increase the utility of various spaceflight carriers in the support of biological and material science research and ground control studies done in preparation for flight.

Birdsong, M. B.↗

High Frequency Low Amplitude Temperature Oscillations in Loop Heat Pipe Operation

The operating temperature of a loop heat pipe (LHP) with a single evaporator is governed by the compensation chamber (CC) temperature, which in turn is a finction of the evaporator power, condenser sink temperature, and ambient temperature. As the operating condition changes, the CC temperature will change during the transient but eventually reach a new steady temperature. Under certain conditions, however, the LHP never really reaches a true steady state, but instead displays an oscillatory behavior. This paper presents a study on the oscillation of the loop operating temperature with amplitudes on the order of one degree Kelvin and frequencies on the order of 10(exp -1) to 10(exp -2) Hertz. The source of the high frequency temperature oscillation is the fast movement of the vapor front in the condenser section, which usually occurs when the vapor front is near the condenser inlet or the condenser outlet. At these locations, the vapor front is unable to find a stable position for the given operating conditions, and will move back and forth. The movement of the vapor front causes the movement of the liquid in the condenser and the liquid line, leading to oscillations of the CC and the loop temperatures. Factors that affect the vapor front movement include evaporator power, condenser sink temperature, body forces and whether or the CC temperature is actively controlled. As long as there are no large thermal masses attached to the evaporator, the loop can self adjust rather quickly and the vapor front will move rapidly around the condenser inlet or outlet, leading to high frequency temperature oscillations. The amplitude of temperature oscillation is usually the largest in the liquid line, up to 20 degrees Kelvin in many cases, but diminishes to less than one degree Kelvin in the CC. Furthermore, the high frequency temperature oscillation can occur at any CC temperature when the right combination of the evaporator power and condenser sink temperature prevails.

Ku, Jentung↗

Flexible Cryogenic Temperature and Liquid-Level Probes

Lightweight, flexible probes have been developed for measuring temperatures at multiple locations in tanks that contain possibly pressurized cryogenic fluids. If the fluid in a given tank is subcritical (that is, if it consists of a liquid and its vapor), then in one of two modes of operation, the temperature measurements made by a probe of this type can be used to deduce the approximate level of the liquid. The temperature sensors are silicon diodes located at intervals along a probe. If the probe is to be used to measure a temperature gradient along a given axis in the tank, then the probe must be mounted along that axis. In the non-liquid-level-sensing temperature-measurement mode, a constant small electric current is applied to each diode and the voltage across the diode . a known function of the current and temperature . is measured as an indication of its temperature. For the purpose of this measurement, "small electric current" signifies a current that is not large enough to cause a significant increase in the measured temperature. More specifically, the probe design calls for a current of 10 A, which, in the cryogenic temperature range of interest, generates heat at a rate of only about 0.01 mW per diode. In the liquid-level-sensing mode, one applies a larger current (30 mA) to each diode so as to heat each diode appreciably (with a power of about 36 mW in the temperature range of interest). Because the liquid cools the diode faster than does the vapor, the temperature of the diode is less when diode is immersed in the liquid than when it is above the surface of the liquid. Thus, the temperature (voltage) reading from each diode can be used to determine whether the liquid level is above or below the diode, and one can deduce that the liquid level lies between two adjacent diodes, the lower one of which reads a significantly lower temperature. The aforementioned techniques for measuring temperature and deducing liquid level are not new. What is new here are the designs of the probes and of associated external electronic circuitry. In each probe, the diodes and the lead wires are embedded in a strong, lightweight, flexible polyimide strip. Each probe is constructed as an integral unit that includes a multipin input/output plug or socket for solderless connection of the lead wires to the external circuitry. The polyimide strip includes mounting tabs with holes that can accommodate rivets, screws, or other fasteners. Alternatively, a probe can be mounted by use of an epoxy. A probe can be manufactured to almost any length or width, and the diodes can be embedded at almost any desired locations along and across the polyimide strip. In designing a probe for a specific application, one seeks a compromise between (1) minimizing the number of diodes in order to minimize the complexity of input/output connections and external electronic circuitry while (2) using enough diodes to obtain the required precision. Optionally, to minimize spurious heating of the cryogenic fluid, the external circuitry can be designed to apply power to the probe only during brief measurement intervals. Assuming that the external circuitry is maintained at a steady temperature, a power-on interval of only a few seconds is sufficient to obtain accurate data on temperatures and/or the height of the liquid/vapor interface.

Haberbusch, Mark↗

Operation of SOI P-Channel Field Effect Transistors, CHT-PMOS30, under Extreme Temperatures

Electronic systems are required to operate under extreme temperatures in NASA planetary exploration and deep space missions. Electronics on-board spacecraft must also tolerate thermal cycling between extreme temperatures. Thermal management means are usually included in today s spacecraft systems to provide adequate temperature for proper operation of the electronics. These measures, which may include heating elements, heat pipes, radiators, etc., however add to the complexity in the design of the system, increases its cost and weight, and affects its performance and reliability. Electronic parts and circuits capable of withstanding and operating under extreme temperatures would reflect in improvement in system s efficiency, reducing cost, and improving overall reliability. Semiconductor chips based on silicon-on-insulator (SOI) technology are designed mainly for high temperature applications and find extensive use in terrestrial well-logging fields. Their inherent design offers advantages over silicon devices in terms of reduced leakage currents, less power consumption, faster switching speeds, and good radiation tolerance. Little is known, however, about their performance at cryogenic temperatures and under wide thermal swings. Experimental investigation on the operation of SOI, N-channel field effect transistors under wide temperature range was reported earlier [1]. This work examines the performance of P-channel devices of these SOI transistors. The electronic part investigated in this work comprised of a Cissoid s CHT-PMOS30, high temperature P-channel MOSFET (metal-oxide semiconductor field-effect transistor) device [2]. This high voltage, medium-power transistor is designed for geothermal well logging applications, aerospace and avionics, and automotive industry, and is specified for operation in the temperature range of -55 C to +225 C. Table I shows some specifications of this transistor [2]. The CHT-PMOS30 device was characterized at various temperatures over the range of -190 C to +225 C in terms of its voltage/current characteristic curves. The test temperatures included +22, -50, -100, -150, -175, -190, +50, +100, +150, +175, +200, and +225 C. Limited thermal cycling testing was also performed on the device. These tests consisted of subjecting the transistor to a total of twelve thermal cycles between -190 C and +225 C. A temperature rate of change of 10 C/min and a soak time at the test temperature of 10 minutes were used throughout this work. Post-cycling measurements were also performed at selected temperatures. In addition, re-start capability at extreme temperatures, i.e. power switched on while the device was soaking for a period of 20 minutes at the test temperatures of -190 C and +225 C, was investigated.

Patterson, Richard↗

Flexible Cryogenic Temperature and Liquid-Level Probes

Lightweight, flexible probes have been developed for measuring temperatures at multiple locations in tanks that contain possibly pressurized cryogenic fluids. If the fluid in a given tank is subcritical (that is, if it consists of a liquid and its vapor), then in one of two modes of operation, the temperature measurements made by a probe of this type can be used to deduce the approximate level of the liquid. The temperature sensors are silicon diodes located at intervals along a probe. If the probe is to be used to measure a temperature gradient along a given axis in the tank, then the probe must be mounted along that axis. In the temperature-measurement mode, a constant small electric current is applied to each diode and the voltage across the diode a known function of the current and temperature is measured as an indication of its temperature. For the purpose of this measurement, small electric current signifies a current that is not large enough to cause a significant increase in the measured temperature. More specifically, the probe design calls for a current of 10 A, which, in the cryogenic temperature range of interest, generates heat at a rate of only about 0.01 mW per diode. In the liquid-level-sensing mode, one applies a larger current (30 mA) to each diode so as to heat each diode appreciably (with a power of about 36 mW in the temperature range of interest). Because the liquid cools the diode faster than does the vapor, the temperature of the diode is less when the diode is immersed in the liquid than when it is above the surface of the liquid. Thus, the temperature (voltage) reading from each diode can be used to determine whether the liquid level is above or below the diode, and one can deduce that the liquid level lies between two adjacent diodes, the lower one of which reads a significantly lower temperature. The aforementioned techniques for measuring temperature and deducing liquid level are not new. What is new here are the designs of the probes and of associated external electronic circuitry. In each probe, the diodes and the lead wires are embedded in a strong, lightweight, flexible polyimide strip. Each probe is constructed as an integral unit that includes a multipin input/output plug or socket for solderless connection of the lead wires to the external circuitry. The polyimide strip includes mounting tabs with holes that can accommodate rivets, screws, or other fasteners. Alternatively, a probe can be mounted by use of an epoxy. A probe can be manufactured to almost any length or width, and the diodes can be embedded at almost any desired location along and across the polyimide strip. In designing a probe for a specific application, one seeks a compromise between (1) minimizing the number of diodes in order to minimize the complexity of input/output connections and external electronic circuitry while (2) using enough diodes to obtain the required precision. Optionally, to minimize spurious heating of the cryogenic fluid, the external circuitry can be designed to apply power to the probe only during brief measurement intervals. Assuming that the external circuitry is maintained at a steady temperature, a power-on interval of only a few seconds is sufficient to obtain accurate data on temperatures and/or the height of the liquid/vapor interface.

Haberbusch, Mark↗

Magnetic Properties of Fe-49Co-2V Alloy and Pure Fe at Room and Elevated Temperatures

The National Aeronautics and Space Administration (NASA) has a need for soft magnetic materials for fission power and ion propulsion systems. In this work the magnetic properties of the soft magnetic materials Hiperco 50 (Fe-49wt%Cr-2V) and CMI-C (commercially pure magnetic iron) were examined at various temperatures up to 600 C. Toroidal Hiperco 50 samples were made from stacks of 0.35 mm thick sheet, toroidal CMI-C specimens were machined out of solid bar stock, and both were heat treated prior to testing. The magnetic properties of a Hiperco 50 sample were measured at various temperatures up to 600 C and then again after returning to room temperature; the magnetic properties of CMI-C were tested at temperatures up to 400 C. For Hiperco 50 coercivity decreased as temperature increased, and remained low upon returning to room temperature; maximum permeability improved (increased) with increasing temperature and was dramatically improved upon returning to room temperature; remanence was not significantly affected by temperature; flux density at H = 0.1 kA/m increased slightly with increasing temperature, and was about 20% higher upon returning to room temperature; flux density at H = 0.5 kA/m was insensitive to temperature. It appears that the properties of Hiperco 50 improved with increasing temperature due to grain growth. There was no significant magnetic property difference between annealed and aged CMI-C iron material; permeability tended to decrease with increasing temperature; the approximate decline in the permeability at 400 C compared to room temperature was 30%; saturation flux density, B(sub S), was approximately equal for all temperatures below 400 C; B(sub S) was lower at 400 C.

De Groh, Henry C., III↗