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At least 523 records · Page 29
All sourcesNASA NTRSDOE OSTI
NASA NTRS1992

Brine shrimp development in space: ground-based data to shuttle flight results

The brine shrimp, Artemia salina, has been used as a model system to assess microgravity effects on developing organisms. Following fertilization and early development, the egg can arrest in early gastrula as a dehydrated cyst stage that is stable to harsh environments over long time periods. When salt water is added, the cysts can reactivate, with embryonic development and egg hatching occurring in about 24 h. A series of larval molts or instars, over about a 2 week period, results in the adult crustacean. We have assessed these developmental events in a closed syringe system, a bioprocessing module, in ground-based studies, and have conducted preliminary in-orbit experiments aboard the Space Shuttle Atlantis during the flights of STS-37 and STS-43. Although the in-flight data are limited, spectacular degrees of development have been achieved.

NASA Discipline Number 93-10↗
NASA NTRS2005

A Concept for the Inclusion of Analytical and Computational Capability in Existing Systems for Measurement of Neutron Flux

For approximately two decades, efforts have been sponsored by NASA's Marshall Space Flight Center to make possible high-speed, automated classification and quantification of constituent materials in various harsh environments. MSFC, along with the Air Force/Arnold Engineering Development Center, has led the work, developing and implementing systems that employ principles of emission and absorption spectroscopy to monitor molecular and atomic particulates in gas plasma of rocket engine flow fields. One such system identifies species and quantifies mass loss rates in H2/O2 rocket plumes. Other gases have been examined and the physics of their detection under numerous conditions were made a part of the knowledge base for the MSFC/USAF team. Additionally, efforts are being advanced to hardware encode components of the data analysis tools in order to address real-time operational requirements for health monitoring and management. NASA has a significant investment in these systems, warranting a spiral approach that meshes current tools and experience with technological advancements. This paper addresses current systems - the Optical Plume Anomaly Detector (OPAD) and the Engine Diagnostic Filtering System (EDIFIS) - and discusses what is considered a natural progression: a concept for migrating them towards detection of high energy particles, including neutrons and gamma rays. The proposal outlines system development to date, basic concepts for future advancements, and recommendations for accomplishing them.

Patrick, Clinton↗
NASA NTRS2005

Coherent Anti-Stokes Raman Spectroscopy (CARS) Measurements in Supersonic Combustors at NASA Langley Research Center

This paper describes the recent use of coherent anti-Stokes Raman spectroscopy (CARS) to study supersonic combustion at NASA Langley Research Center. CARS is a nonlinear optical measurement technique used to measure temperature and species mole fractions remotely in harsh environments. A CARS system has been applied to two different combustor geometries at NASA Langley. Both experiments used the same vitiated wind-tunnel facility to create an air flow that simulates flight at Mach numbers of 6 and 7 for the combustor inlet and both experiments used hydrogen fuel. In the first experiment, the hydrogen was injected supersonically at a 30-degree angle with respect to the incoming flow. In the second experiment, the hydrogen was injected sonically at normal incidence. While these injection schemes produced significantly different flow features, the CARS method provided mean temperature, N2, O2 and H2 maps at multiple downstream locations for both. The primary aim of these measurements was to provide detailed flowfield information for computational fluid dynamics (CFD) code validation.

Danehy, Paul M.↗
NASA NTRS2004

Solid oxidized fuel cells seals leakage setup and testing

As the world s reserves of fossil fuels are depleted, the U.S. Government, as well as other countries and private industries, is researching solutions for obtaining power, answers that would be more efficient and environmentally friendly. For a long time engineers have been trying to obtain the benefits of clean electric power without heavy batteries or pollution-producing engines. While some of the inventions proved to be effective (i.e. solar panels or windmills) their applications are limited due to dependency on the energy source (i.e. sun or wind). Currently, as energy concerns increase, research is being carried out on the development of a Solid Oxide Fuel Cell (SOFC). The United States government is taking a proactive role in expanding the technology through the Solid State Energy Conversion Alliance (SECA) Program, which is coordinated by the Department of Energy. into an electrical energy. This occurs by the means of natural tendency of oxygen and hydrogen to chemically react. While controlling the process, it is possible to harvest the energy given off by the reaction. SOFCs use currently available fossil fuels and convert a variety of those fuels with very high efficiency (about 40% more efficient than modem thermal power plants). At the same time they are almost entirely nonpolluting and due to their size they can be placed in remote areas. The main fields where the application of the fuel cells appears to be the most useful for are stationary energy sources, transportation, and military applications. structure and materials must be resolved. All the components must be operational in harsh environments including temperatures reaching 800 C and cyclic thermal- mechanical loading. Under these conditions, the main concern is the requirement for hermetic seals to: (1) prevent mixing of the fuel and oxidant within the stack, (2) prevent parasitic leakage of the fuel from the stack, (3) prevent contamination of the anode by air leaking into the stack, (4) electrically isolate the individual cells within the stack, and (5) mechanically bond the cell components. The sealing challenges are aggravated by the need to maintain hermetic boundaries between the different flow paths within the fuel cell throughout cycled operation. Within the timeframe of my tenure, the main objective is to assist in building a state-of-art test facility.

Bastrzyk, Marta B.↗
NASA NTRS2004

LERCIP 2004 Summary

This summer I am continuing my project from the previous two summers. My work involves ohmic contacts to N-type silicon carbide (Sic) devices. My mentor, Dr. Robert Okojie, is developing the technology behind high performance sensors and actuators for harsh environments. Sic is useful because it is able to operate at temperatures up to 600 C and it is resistant to radiation damage. This allows sensors and electronics to be placed in new locations, such as inside a jet engine or in space application without using heavy shielding. Ultimately this results in more efficient, smarter engine technology, reduced launch weights for spacecraft, and high power and high temperature electronics. A fundamental part of Sic devices is the ohmic contact. The contact is the interface between the semiconductor (Sic) and external circuitry. The current flowing in and out the devices is through the contact. Ensuring that these contacts remain ohmic (linear I-V behavior) allows us to fabricate devices that do not waste power at the metallurgical junction. Another key part is maintaining a low contact resistance. It is desired to maintain minimum energy loss by avoiding a rectifying electrical characteristic. My project is to develop and implement a testing procedure for measuring the contact resistance while the device is operating at high temperature. It is important to measure the contacts while simulating the true operating environment as closely as possible. For this reason, measurements are taken while the device is heated at intervals up to 600 C in air. To test the long tern reliability of the devices, the high temperature measurements are repeated after heating the sample for long intervals in air. A new set of data is gathered after heating for a total of 100, 200 and then 400 hours. The current as a function of voltage and the contact resistance was measured using the four point probe technique. The four point probe method is chosen because it measures contact resistance while eliminating error due to wire resistance and calibration issues.

DeAngelis, David↗
NASA NTRS2000

Deep Etching Process Developed for the Fabrication of Silicon Carbide Microsystems

Silicon carbide (SiC), because of its superior electrical and mechanical properties at elevated temperatures, is a nearly ideal material for the microminiature sensors and actuators that are used in harsh environments where temperatures may reach 600 C or greater. Deep etching using plasma methods is one of the key processes used to fabricate silicon microsystems for more benign environments, but SiC has proven to be a more difficult material to etch, and etch depths in SiC have been limited to several micrometers. Recently, the Sensors and Electronics Technology Branch at the NASA Glenn Research Center at Lewis Field developed a plasma etching process that was shown to be capable of etching SiC to a depth of 60 mm. Deep etching of SiC is achieved by inductive coupling of radiofrequency electrical energy to a sulfur hexafluoride (SF6) plasma to direct a high flux of energetic ions and reactive fluorine atoms to the SiC surface. The plasma etch is performed at a low pressure, 5 mtorr, which together with a high gas throughput, provides for rapid removal of the gaseous etch products. The lateral topology of the SiC microstructure is defined by a thin film of etch-resistant material, such as indium-tin-oxide, which is patterned using conventional photolithographic processes. Ions from the plasma bombard the exposed SiC surfaces and supply the energy needed to initiate a reaction between SiC and atomic fluorine. In the absence of ion bombardment, no reaction occurs, so surfaces perpendicular to the wafer surface (the etch sidewalls) are etched slowly, yielding the desired vertical sidewalls.

Beheim, Glenn M.↗
NASA NTRS2001

Long-Term Durability of a Matrix for High-Temperature Composites Predicted

Polymer matrix composites (PMC's) are being increasingly used in applications where they are exposed for long durations to harsh environments such as elevated temperatures, moisture, oils and solvents, and thermal cycling. The exposure to these environments leads to the degradation of structures made from these materials. This also affects the useful lifetimes of these structures. Some of the more prominent aerospace applications of polymer matrix composites include engine supports and cowlings, reusable launch vehicle parts, radomes, thrust-vectoring flaps, and the thermal insulation of rocket motors. This demand has led to efforts to develop lightweight, high-strength, high-modulus materials that have upper-use temperatures over 316 C. A cooperative program involving two grants to the Massachusetts Institute of Technology and in-house work at the NASA Glenn Research Center was conducted to identify the mechanisms and the measurement of mechanical and physical properties that are necessary to formulate a mechanism-based model for predicting the lifetime of high-temperature polymer matrix composites. The polymer that was studied was PMR-15 polyimide, a leading matrix resin for use in high-temperature-resistant aerospace composite structures such as propulsion systems. The temperature range that was studied was from 125 to 316 C. The diffusion behavior of PMR-15 neat resin was characterized and modeled. Thermogravimetric analysis (TGA) was also conducted in nitrogen, oxygen, and air to provide quantitative information on thermal and oxidative degradation reactions. A new low-cost technique was developed to collect chemical degradation data for isothermal tests lasting up to 4000 hr in duration. In the temperature range studied, results indicate complex behavior that was not observed by previous TGA tests, including the presence of weight-gain reactions. These were found to be significant in the initial periods of aging from 125 to 225 C. Two types of weight loss reactions dominated at aging temperatures above 225 C. One was concentrated at the surface of the polymer and was very active at temperatures above 225 C. The second was observed to dominate in the latter stages of aging at temperatures below 260 C. This three-reaction model satisfactorily explains past findings that the degradation mechanism of PMR-15 appears to change around 316 C. It also indicates that the second weight gain mechanism is a significant factor at temperatures below 204 C. On the basis of these results, a predictive model was developed for the thermal degradation of PMR-15 at 316 C. A comparison of data generated by this model with actual experimental data is shown in the following figure.

Bowles, Kenneth J.↗
NASA NTRS2001

Packaging Technology Developed for High-Temperature Silicon Carbide Microsystems

High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as sensors and electronics for space missions to the inner solar system, sensors for in situ combustion and emission monitoring, and electronics for combustion control for aeronautical and automotive engines. However, these devices cannot be used until they can be packaged in appropriate forms for specific applications. Suitable packaging technology for operation temperatures up to 500 C and beyond is not commercially available. Thus, the development of a systematic high-temperature packaging technology for SiC-based microsystems is essential for both in situ testing and commercializing high-temperature SiC sensors and electronics. In response to these needs, researchers at Glenn innovatively designed, fabricated, and assembled a new prototype electronic package for high-temperature electronic microsystems using ceramic substrates (aluminum nitride and aluminum oxide) and gold (Au) thick-film metallization. Packaging components include a ceramic packaging frame, thick-film metallization-based interconnection system, and a low electrical resistance SiC die-attachment scheme. Both the materials and fabrication process of the basic packaging components have been tested with an in-house-fabricated SiC semiconductor test chip in an oxidizing environment at temperatures from room temperature to 500 C for more than 1000 hr. These test results set lifetime records for both high-temperature electronic packaging and high-temperature electronic device testing. As required, the thick-film-based interconnection system demonstrated low (2.5 times of the room-temperature resistance of the Au conductor) and stable (decreased 3 percent in 1500 hr of continuous testing) electrical resistance at 500 C in an oxidizing environment. Also as required, the electrical isolation impedance between printed wires that were not electrically joined by a wire bond remained high (greater than 0.4 GW) at 500 C in air. The attached SiC diode demonstrated low (less than 3.8 W/mm2) and relatively consistent dynamic resistance from room temperature to 500 C. These results indicate that the prototype package and the compatible die-attach scheme meet the initial design standards for high-temperature, low-power, and long-term operation. This technology will be further developed and evaluated, especially with more mechanical tests of each packaging element for operation at higher temperatures and longer lifetimes.

Chen, Liang-Yu↗
NASA NTRS2002

High-Temperature Gas Sensor Array (Electronic Nose) Demonstrated

The ability to measure emissions from aeronautic engines and in commercial applications such as automotive emission control and chemical process monitoring is a necessary first step if one is going to actively control those emissions. One single sensor will not give all the information necessary to determine the chemical composition of a high-temperature, harsh environment. Rather, an array of gas sensor arrays--in effect, a high-temperature electronic "nose"--is necessary to characterize the chemical constituents of a diverse, high-temperature environment, such as an emissions stream. The signals produced by this nose could be analyzed to determine the constituents of the emission stream. Although commercial electronic noses for near-room temperature applications exist, they often depend significantly on lower temperature materials or only one sensor type. A separate development effort necessary for a high-temperature electronic nose is being undertaken by the NASA Glenn Research Center, Case Western Reserve University, Ohio State University, and Makel Engineering, Inc. The sensors are specially designed for hightemperature environments. A first-generation high-temperature electronic nose has been demonstrated on a modified automotive engine. This nose sensor array was composed of sensors designed for hightemperature environments fabricated using microelectromechanical-systems- (MEMS-) based technology. The array included a tin-oxide-based sensor doped for nitrogen oxide (NOx) sensitivity, a SiC-based hydrocarbon (CxHy) sensor, and an oxygen sensor (O2). These sensors operate on different principles--resistor, diode, and electrochemical cell, respectively--and each sensor has very different responses to the individual gases in the environment. A picture showing the sensor head for the array is shown in the photograph on the left and the sensors installed in the engine are shown in the photograph on the right. Electronics are interfaced with the sensors for temperature control and signal conditioning, and packaging designed for high temperatures is necessary for the array to survive the engine environment.

Hunter, Gary W.↗
NASA NTRS2002

Bulk Micromachined 6H-SiC High-g Piezoresistive Accelerometer Fabricated and Tested

High-g accelerometers are needed in certain applications, such as in the study and analysis of high-g impact landings and projectiles. Also, these accelerometers must survive the high electromagnetic fields associated with the all-electric vehicle technology needed for aerospace applications. The choice of SiC is largely due to its excellent thermomechanical properties over conventional silicon-based accelerometers, whose material properties inhibit applicability in high electromagnetic radiation and high temperatures (>150 C) unless more complex and sometimes costly packaging schemes are adopted. This work was the outcome of a NASA Glenn Research Center summer internship program, in collaboration with Cornell University and the Munitions Directorate of the U.S. Air Force in Eglin, Florida. It aimed to provide the enabling technology infrastructure (modeling, fabrication, and validation) for the implementation of SiC accelerometers designed specifically for harsh environments.

Okojie, Robert S.↗
NASA NTRS2002

CARES/Life Used for Probabilistic Characterization of MEMS Pressure Sensor Membranes

Microelectromechanical systems (MEMS) devices are typically made from brittle materials such as silicon using traditional semiconductor manufacturing techniques. They can be etched (or micromachined) from larger structures or can be built up with material deposition processes. Maintaining dimensional control and consistent mechanical properties is considerably more difficult for MEMS because feature size is on the micrometer scale. Therefore, the application of probabilistic design methodology becomes necessary for MEMS. This was demonstrated at the NASA Glenn Research Center and Case Western Reserve University in an investigation that used the NASA-developed CARES/Life brittle material design program to study the probabilistic fracture strength behavior of single-crystal SiC, polycrystalline SiC, and amorphous Si3N4 pressurized 1-mm-square thin-film diaphragms. These materials are of interest because of their superior high-temperature characteristics, which are desirable for harsh environment applications such as turbine engine and rocket propulsion system hot sections.

Nemeth, Noel N.↗
NASA NTRS2005

Welding in Space: Lessons Learned for Future In Space Repair Development

Welds have been made in the harsh environment of space only twice in the history of manned space flight. The United States conducted the M5 12 experiment on Skylab and the former Soviet Union conducted an Extravehicular Activity. Both experiments demonstrated electron beam welding. A third attempt to demonstrate and advance space welding was made by the Marshall Space Flight Center in the 90's but the experiment was demanifested as a Space Shuttle payload. This presentation summarizes the lessons learned from these three historical experiences in the areas of safety, design, operations and implementation so that welding in space can become an option for in space repair applications.

Russell, C. K.↗
NASA NTRS2002

High Temperature MEMS for Turbine Engine Applications

The presentation will discuss Microelectromechanical Systems (MEMS) research and development activities and technologies being conducted at NASA Glenn Research Center to address the needs of harsh environment applications. The focus will be on silicon carbide based h4EMS for high temperature, high power and high radiation environment as well as high temperature sensor technologies which are made possible by MEMS processing techniques. These technologies can enable new measurements and capabilities for future turbine engines. All the presentation materials are publicly available and have been presented/published before.

Hunter, Gary W.↗
NASA NTRS2003

Power Electronics Being Developed for Deep Space Cryogenic Applications

Electronic circuits and systems designed for deep space missions need to operate reliably and efficiently in harsh environments that include very low temperatures. Spacecraft that operate in such cold environments carry a large number of heaters so that the ambient temperature for the onboard electronics remains near 20 C. Electronics that can operate at cryogenic temperatures will simplify system design and reduce system size and weight by eliminating the heaters and their associated structures. As a result, system development and launch cost will be reduced. At the NASA Glenn Research Center, an ongoing program is focusing on the development of power electronics geared for deep space low-temperature environments. The research and development efforts include electrical components design, circuit design and construction, and system integration and demonstration at cryogenic temperatures. Investigations are being carried out on circuits and systems that are targeted for use in NASA missions where low temperatures will be encountered: devices such as ceramic and tantalum capacitors, metal film resistors, semiconductor switches, magnetics, and integrated circuits including dc/dc converters, operational amplifiers, voltage references, and motor controllers. Test activities cover a wide range of device and circuit performance under simple as well as complex test conditions, such as multistress and thermal cycling. The effect of low-temperature conditions on the switching characteristics of an advanced silicon-on-insulator field effect transistor is shown. For gate voltages (VGS) below 2.6 V, drain currents at -190 C are lower than drain currents at room temperature (20 C).

Patterson, Richard L.↗
NASA NTRS2003

Microelectromechanical System (MEMS) Device Being Developed for Active Cooling and Temperature Control

High-capacity cooling options remain limited for many small-scale applications such as microelectronic components, miniature sensors, and microsystems. A microelectromechanical system (MEMS) using a Stirling thermodynamic cycle to provide cooling or heating directly to a thermally loaded surface is being developed at the NASA Glenn Research Center to meet this need. The device can be used strictly in the cooling mode or can be switched between cooling and heating modes in milliseconds for precise temperature control. Fabrication and assembly employ techniques routinely used in the semiconductor processing industry. Benefits of the MEMS cooler include scalability to fractions of a millimeter, modularity for increased capacity and staging to low temperatures, simple interfaces, limited failure modes, and minimal induced vibration. The MEMS cooler has potential applications across a broad range of industries such as the biomedical, computer, automotive, and aerospace industries. The basic capabilities it provides can be categorized into four key areas: 1) Extended environmental temperature range in harsh environments; 2) Lower operating temperatures for electronics and other components; 3) Precision spatial and temporal thermal control for temperature-sensitive devices; and 4) The enabling of microsystem devices that require active cooling and/or temperature control. The rapidly expanding capabilities of semiconductor processing in general, and microsystems packaging in particular, present a new opportunity to extend Stirling-cycle cooling to the MEMS domain. The comparatively high capacity and efficiency possible with a MEMS Stirling cooler provides a level of active cooling that is impossible at the microscale with current state-of-the-art techniques. The MEMS cooler technology builds on decades of research at Glenn on Stirling-cycle machines, and capitalizes on Glenn s emerging microsystems capabilities.

Beach, Duane E.↗
NASA NTRS2003

High-Temperature Sprayable Phosphor Coating Developed for Measuring Surface Temperatures

The use of phosphor thermography for noncontact temperature measurements in harsh environments has been proven over the last decade, but it has suffered from difficult application procedures such as vapor deposition or sputtering techniques. We have developed a high-temperature-sensitive paint that is easily applied with commercially available paint-spraying equipment and have successfully demonstrated it to temperatures up to 1500 C. Selected phosphors have also shown measurable signals to 1700 C, thus allowing a combination of phosphors to be used in high-temperature binders to make surface temperature measurements from ambient to over 1500 C. Phosphor thermography is an optical technique that measures the time response of fluorescence light, which is a function of the phosphor temperature. The phosphors are excited with short wavelength light (ultraviolet or blue), and they emit light at a longer wavelength. This technique has a benefit over other temperature measurements, such as thermocouples and infrared thermography, in difficult environments such as high blackbody backgrounds, vibration, flames, high electromagnetic noise, or where special windows may be needed. In addition, the sprayable phosphor paints easily cover large or complicated structures, providing full-surface information with a single measurement. Oak Ridge National Laboratories developed and tested the high-temperature binders and phosphors under the direction of the NASA Glenn Research Center. Refractory materials doped with rare earth metals were selected for their performance at high temperature. Survivability, adhesion, and material compatibility tests were conducted at high temperatures in a small furnace while the fluorescent response from the phosphors was being measured. A painted sample in a furnace with a clearly visible fluorescing dot excited by a pulsed laser is shown. Measuring the decay time of this fluorescence yields the surface temperature. One new paint was recently tested in a rocket test stand at Glenn. The floor of a square duct nozzle was painted, and full-field lifetime decay measurements were acquired for multiple firings of the rocket. Good agreement with predicted results was obtained, matching temperature gradients along the length of the nozzle and clearly showing shock structures. These good results were very satisfactory given that the measurements were made looking through the combustion plume. Infrared pyrometry was incapable of making the surface measurements because of the interference from the rocket exhaust, which contaminated the infrared signature.

Bencic, Timothy J.↗
NASA NTRS2003

Improved Silicon Carbide Crystals Grown From Atomically Flat Surfaces

The NASA Glenn Research Center is demonstrating that atomically flat (i.e., step-free) silicon carbide (SiC) surfaces are ideal for realizing greatly improved wide bandgap semiconductor films with lower crystal defect densities. Further development of these improved films could eventually enable harsh-environment electronics beneficial to jet engine and other aerospace and automotive applications, as well as much more efficient and compact power distribution and control. The technique demonstrated could also improve blue-light lasers and light-emitting-diode displays.

Neudeck, Philip G.↗
NASA NTRS2004

Integrity of Ceramic Parts Predicted When Loads and Temperatures Fluctuate Over Time

Brittle materials are being used, and being considered for use, for a wide variety of high performance applications that operate in harsh environments, including static and rotating turbine parts for unmanned aerial vehicles, auxiliary power units, and distributed power generation. Other applications include thermal protection systems, dental prosthetics, fuel cells, oxygen transport membranes, radomes, and microelectromechanical systems (MEMS). In order for these high-technology ceramics to be used successfully for structural applications that push the envelope of materials capabilities, design engineers must consider that brittle materials are designed and analyzed differently than metallic materials. Unlike ductile metals, brittle materials display a stochastic strength response because of the combination of low fracture toughness and the random nature of the size, orientation, and distribution of inherent microscopic flaws. This plus the fact that the strength of a component under load may degrade over time because of slow crack growth means that a probabilistic-based life-prediction methodology must be used when the tradeoffs of failure probability, performance, and useful life are being optimized. The CARES/Life code (which was developed at the NASA Glenn Research Center) predicts the probability of ceramic components failing from spontaneous catastrophic rupture when these components are subjected to multiaxial loading and slow crack growth conditions. Enhancements to CARES/Life now allow for the component survival probability to be calculated when loading and temperature vary over time.

Nemeth, Noel N.↗