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At least 523 records · Page 29

Laser drilling of vias in dielectric for high density multilayer LSHI thick film circuits

A design analysis of a high density multilevel thick film digital microcircuit used for large scale integration is presented. The circuit employs 4 mil lines, 4 mil spaces and requires 4 mil diameter vias. Present screened and fired thick film technology is limited on a production basis to 16 mil square vias. A process whereby 4 mil diameter vias can be fabricated in production using laser technology was described along with a process to produce 4 mil diameter vias for conductor patterns which have 4 mil lines and 4 mil spacings.

Cocca, T.↗

Mineralogy and petrology of basaltic fragments from the Luna 24 drill core

The petrology of rock fragments and monomineralic grains from Luna 24 samples is described, and a petrogenetic scheme for the derivation of Mare Crisium basalts is presented. Components of the rock fragments include subophitic basalts, metabasalts, late-stage fragments, olivine vitrophyres, and non-mare lithic fragments of possible cumulate origin. Among the monomineralic grains (which are much more abundant than the rock fragments) are pyroxene, plagioclase, olivine, ilmenite and native Fe.

Coish, R. A.↗

Method for milling and drilling glass

A process for machining glass by placing a rotating carbide working surface under minimum pressure against an area of glass to be worked is described. Concurrently the region between the working surface and the area of glass is wet with a lubricant consisting essentially of a petroleum carrier, a complex mixture of esters and a complex mixture of naturally occurring aromatic oils.

Rice, S. H.↗