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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Sterilization effects on soldered and welded joints, electronic equipment processes and materials, electric connectors, and wiring and cabling accessories
Effect of quenching on ductile-brittle bend transition temperature of chromium wire
Effect of quenching on ductile-brittle bend transition temperature of Cr-35Re wire
Thermocouple wire size and configuration effects on internal temperature measurements in charring ablator
Technique for dynamic calibration of hot wire anemometers
Design and fabrication techniques for wiring pattern used for interconnecting network circuits of automatic mask sets
Forced convection heat transfer correlations for hydrogen, helium, and nitrogen gases flowing through helical tungsten wire matrices at high surface temperatures
Schlieren and hot wire exploration of wakes in wind tunnel supersonic flows
Laminar flow and heat transfer coefficient analyses of film boiling from horizontal wire
Increasing brightness of discharge column using underwater electrical explosion of wire
Ground and flight tests to evaluate lunar landing research vehicle fly-by-wire control system
Wire-connected electronic packaging module system providing change capability, design flexibility, arrangement freedom and volumetric efficiency
Heat loss and recovery temperature of fine wires in transonic transitional flow regime, noting experimental and computational results
Mathematical models of flow and filtration performance of wire cloth filter media in series and parallel configuration
For several kinds of wire gauze the difference in static, dynamic and total or absolute pressure in front of and behind the gauze were determined for comparison with the pressure drop caused by an airplane radiator, such gauze being used on airplane models to represent the radiator.
The use of lead in electronics has come under increasing scrutiny. Given the trends in both Japan and Europe, it is highly likely that the U.S. will be driven by commercial interests to phase out of lead in electronics usage. This paper presents data collected on a recent NASA project to focus on finding suitable alternatives to eutectic tin-lead solders and solder pastes. The first phase of this project dealt with determining the most feasible candidates to replace tin-lead and to determine suitable processing operations in assemblies printed wiring boards.
Aluminum has been identified as a compound within regolith and is likely to become a core component of our infrastructure on the lunar surface as in-situ resource utilization (ISRU) capabilities are advanced Large-scale components, outfitting, and repairs of aluminum materials can be fabricated with robotic wire arc additive manufacturing (WAAM) in order to inhabit the moon’s surface long term WAAM is a high value process for lunar advanced manufacturing as it does not require special containment to reduce explosion hazards such as powder-based additive processes and feedstock The welding process of cold metal transfer (CMT) is a relatively new variation of gas metal arc welding (GMAW, also known as MIG) that relies on the detection of a short circuit in the welding process to control the deposition droplet action, resulting in lower heat input and splatter compared to conventional MIG welding The past year was spent developing the CMT-WAAM process for aluminum materials, tested specialty feedstock, tested within the high vacuum environment, and advanced the MSFC capability to perform complex toolpathing from solid models Upcoming and future work includes large depositions working towards material certification for multiple feedstocks, in-situ monitoring, work to use recycled materials for the AM feedstock, and the design and fabrication of a parabolic flight experiment payload.