Effects of Plume Targeted Cooling on Residual Stress in Controlled Atmosphere Plasma Sprayed Coatings
Thermal spray processes can benefit from cooling to maintain substrate temper, reduce processing times, and manage thermally induced residual stresses. “Plume quenching” is a plume-targeted cooling technique which has been shown to reduce substrate temperatures by redirection of hot plume gases using a lateral argon curtain injected into the plume, while limiting interaction with the substrate or affecting coating properties. Here, this study explores the use of this technique for residual stress management by reducing the thermally driven component in nickel and tantalum coatings on titanium and aluminum substrates. The in-situ residual stress profiles were measured for all substrate and coating pairings during spraying and cooling, and the deposition and thermal stresses recorded. For substrate and coating pairings where the predominant component of residual stress was thermal (driven by a large difference in coefficient of thermal expansion, Δα, between coating and substrate), plume quenching reduced both the thermal stress and the final stress state of the coating. This was seen primarily in tantalum on aluminum coatings where the Δα was -17 × 10 -6 /°C, and thermal stress was reduced by 7.5% and 22.4% for the plume quenching rates of 50 and 100 slpm, respectively.