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At least 505 records · Page 28

All sources NASA NTRS DOE OSTI

DOE OSTI2018

Monolithic active pixel radiation detector with shielding techniques

A monolithic active pixel radiation detector including a method of fabricating thereof. The disclosed radiation detector can include a substrate comprising a silicon layer upon which electronics are configured. A plurality of channels can be formed on the silicon layer, wherein the plurality of channels are connected to sources of signals located in a bulk part of the substrate, and wherein the signals flow through electrically conducting vias established in an isolation oxide on the substrate. One or more nested wells can be configured from the substrate, wherein the nested wells assist in collecting charge carriers released in interaction with radiation and wherein the nested wells further separate the electronics from the sensing portion of the detector substrate. The detector can also be configured according to a thick SOA method of fabrication.

47 OTHER INSTRUMENTATION↗

DOE OSTI2021

Porting CMS Heterogeneous Pixel Reconstruction to Kokkos

Programming for a diverse set of compute accelerators in addition to the CPU is a challenge. Maintaining separate source code for each architecture would require lots of effort, and development of new algorithms would be daunting if it had to be repeated many times. Fortunately there are several portability technologies on the market such as Alpaka, Kokkos, and SYCL. These technologies aim to improve the developer productivity by making it possible to use the same source code for many different architectures. In this paper we use heterogeneous pixel reconstruction code from the CMS experiment at the CERNL LHC as a realistic use case of a GPU-targeting HEP reconstruction software, and report experience from prototyping a portable version of it using Kokkos. The development was done in a standalone program that attempts to model many of the complexities of a HEP data processing framework such as CMSSW. We also compare the achieved event processing throughput to the original CUDA code and a CPU version of it.

Childers, Taylor↗

DOE OSTI2022

Apparatus and method for high dynamic range counting by pixelated detectors

The present disclosure relates to an apparatus and methods for generating a hybrid image by high-dynamic-range counting. In an embodiment, the apparatus includes a processing circuitry configured to acquire an image from a pixelated detector, obtain a sparsity map of the acquired image, the sparsity map indicating low-flux regions of the acquired image and high-flux regions of the acquired image, generate a low-flux image and a high-flux image based on the sparsity map, perform event analysis of the acquired image based on the low-flux image and the high-flux image, the event analysis including detecting, within the low-flux image, incident events by an event counting mode, multiply, by a normalization constant, resulting intensities of the high-flux image and the detected incident events of the low-flux image, and generate the hybrid image by merging the low-flux image and the high-flux image.

Bammes, Benjamin↗

DOE OSTI2023

The design and test results of A Giga-Bit Cable Receiver (GBCR) for the ATLAS Inner Tracker Pixel Detector

This paper presents the design and test results of a Gigabit Cable Receiver ASIC called GBCR for the HL-LHC upgrade of the ATLAS Inner Tracker (ITk) pixel detector. Three prototypes (GBCR1, GBCR2, and GBCR3) have been designed in the CERN-identified 65 nm CMOS technology. GBCR receives seven (GBCR2) or six (GBCR3) channels (RX) each at 1.28 Gbps from the front-end readout chip RD53B via flex cables up to 1 meter and Twinax cables up to 5 meters and sends the equalized and retimed signals to lpGBT. Both GBCR2 and GBCR3 ASICs have two transmitting channels (TX) that pre-emphasize the signals from lpGBT before sending them to RD53B through the same cables. No Single-Event Upset (SEU) is observed in any tested channels of GBCR2 in a 400 MeV proton beam. The extrapolated bit error rate for the future HL-LHC application is below 8*10^(-16), significantly below the specified BER criterion. GBCR3 is designed to improve the immunity to single-event-upset by applying the Triple Modular Redundancy (TMR) technology to all RX channels. The retimed signals from GBCR3 have less total jitter than those from GBCR2 (35 ps versus 79 ps). Each receiver channel of GBCR3 consumes 75% more power than that of GBCR2.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

DOE OSTI2023

PIXEL2020: Tenth International Workshop on Semiconductor Pixel Detectors for Particles and Imaging

This workshop covers various topics related to pixel detector technology. Development and applications will be discussed for charged particle tracking in High Energy Physics, Nuclear Physics, Astrophysics, and X-ray imaging in Astronomy, Biology, Medicine and Material Science. The conference program will also include reports on front and back end electronics, radiation effects, low mass mechanics and construction techniques, and new technologies such as monolithic and 3D integrated detectors.

Sally, Seidel↗

DOE OSTI2015

The overvoltage protection module for the power supply system for the pixel detector at Belle II experiment at KEK

In this paper the overvoltage protection modules (OVP) for the power supply (PS) system of the Belle II pixel detector (PXD) are described. The aim of the OVP is to protect the detector and associated electronics against overvoltage conditions. Most critical in the system are voltages supplying the front-end ASICs. The PXD detector consists of the DEPFET sensor modules with integrated chips like the Drain Current Digitizer, the Switcher and the Data Handling Processor. These chips, implemented in modern sub-micron technologies, are quite vulnerable to variations in the supply voltages. The PXD will be placed in the Belle II experiment as close as possible to the interaction point, where access during experiment is very limited or even impossible, thus the PS and OVP systems exploit the remote-sensing method. Overvoltage conditions are due to failures of the PS itself, wrong setting of the output voltages or transient voltages coming out of hard noisy environment of the experiment. The OVP modules are parts of the PS modules. For powering the PXD 40 PS modules are placed 15 m outside the Belle II spectrometer. Each one is equipped with the OVP board. All voltages (22) are grouped in 4 domains: Analog, Digital, Steering and Gate which have independent grounds. The OVP boards are designed from integrated circuits from Linear Technology. All configurations were simulated with the Spice program. The control electronics is designed in a Xilinx CPLD. Two types of integrated circuits were used. LT4356 surge stopper protects loads from high voltage transients. The output voltages are limited to a safe value and also protect loads against over current faults. For less critical voltages, the LTC2912 voltage monitors are used that detect under-voltage and overvoltage events. It has to be noted that the OVP system is working independently of any other protection of the PS system, which increases its overall reliability. (authors)

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

DOE OSTI2015

Characterization of silicon 3D pixel detectors for the ATLAS Forward Physics experiment

The ATLAS Forward Physics (AFP) project aims to measure protons scattered under a small angle from the pp collisions in ATLAS. In order to perform such measurements, a new silicon tracker, together with a time-of-flight detector for pile-up removal, are planned to be installed at ∼210 m from the interaction point and at 2-3 mm from the LHC proton beam. To cope with such configuration and maximize the physics outcome, the tracker has to fulfil three main requirements: endure highly non-uniform radiation doses, due to the very inhomogeneous beam profile, have slim and efficient edges to improve the acceptance of the tracker, and provide good position resolution. Recent laboratory and beam test characterization results of AFP prototypes will be presented. Slim-edged 3D pixel detectors down to 100-200 μm were studied and later non-uniformly irradiated (with a peak fluence of several 10{sup 15} n{sub eq}/cm{sup 2}) to determine the fulfilment of the AFP requirements. (authors)

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

DOE OSTI2025

In-pixel integration of signal processing and AI/ML based data filtering for particle tracking detectors

We present the first physical realization of in-pixel signal processing with integrated AI-based data filtering for particle tracking detectors. Building on prior work that demonstrated a physics-motivated edge-AI algorithm suitable for ASIC implementation, this work marks a significant milestone toward intelligent silicon trackers. Our prototype readout chip performs real-time data reduction at the sensor level while meeting stringent requirements on power, area, and latency. The chip is taped-out in 28nm TSMC CMOS bulk process, which has been shown to have sufficient radiation hardness for particle experiments. This development represents a key step toward enabling fully on-detector edge AI, with broad implications for data throughput and discovery potential in high-rate, high-radiation environments such as the High-Luminosity LHC.

Parpillon, Benjamin [Fermilab; Illinois U., Chicag↗

DOE OSTI2019

Deep neural network for pixel-level electromagnetic particle identification in the MicroBooNE liquid argon time projection chamber

Not Available

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

DOE OSTI2014

Pixel detectors for diffraction-limited storage rings

Dramatic advances in synchrotron radiation sources produce ever-brighter beams of X-rays, but those advances can only be used if there is a corresponding improvement in X-ray detectors. With the advent of storage ring sources capable of being diffraction-limited (down to a certain wavelength), advances in detector speed, dynamic range and functionality is required. While many of these improvements in detector capabilities are being pursued now, the orders-of-magnitude increases in brightness of diffraction-limited storage ring sources will require challenging non-incremental advances in detectors. This article summarizes the current state of the art, developments underway worldwide, and challenges that diffraction-limited storage ring sources present for detectors.

47 OTHER INSTRUMENTATION↗

DOE OSTI2016

Pixel sensors with slim edges and small pitches for the CMS upgrades for HL-LHC

Here, planar n-in-n silicon detectors with small pitches and slim edges are being investigated for the innermost layers of tracking devices for the foreseen upgrades of the LHC experiments. Sensor prototypes compatible with the CMS readout, fabricated by Sintef, were tested in the laboratory and with a 120 GeV/c proton beam at the Fermilab test beam facility before and after irradiation with up to 2 × 10 15 neq/cm 2 fluence. Preliminary results of the data analysis are presented.

43 PARTICLE ACCELERATORS↗

DOE OSTI2023

Advanced Mixed-Mode Pixel Array Detector for X-rays Above 20 keV (Final Report)

The objective of the work reported upon was to perform research and development and test advanced prototype imaging x-ray detectors needed to meet pressing scientific research needs at U.S. x-ray synchrotron user facilities. The high x-ray brightness of the Nation’s x-ray synchrotron sources in the DOE National Laboratories holds promise to advance science and technology in a broad range of fundamental and applied disciplines, including physics, chemistry, biomedical areas and engineering. At present, progress in many areas is being limited not by the x-ray source but by the lack of imaging x-ray detectors capable of meeting experimental needs. Specifically, there is pressing need for imaging detectors with high dynamic range, low noise, high frame rates and the ability to capture x-ray images with x-rays of energy > 20 keV. This Final Technical Report summarizes progress made at Cornell University on novel integrating x-ray detectors that address these characteristics.

36 MATERIALS SCIENCE↗

NASA NTRS2002

Integrated imaging sensor systems with CMOS active pixel sensor technology

This paper discusses common approaches to CMOS APS technology, as well as specific results on the five-wire programmable digital camera-on-a-chip developed at JPL. The paper also reports recent research in the design, operation, and performance of APS imagers for several imager applications.

double sampling↗

NASA NTRS2001