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Results for “INTERCONNECTIONS”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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The programming and performance challenges of memory-semantic interconnects for scientific computing.
Abstract not provided.
Sub-10um Pitch Hybrid Direct Bond Interconnect Development for Die-to-Die Hybridization.
Abstract not provided.
Sub-10um Pitch Hybrid Direct Bond Interconnect Development for Die-to-Die Hybridization.
Abstract not provided.
A Study of Network Congestion in Two Supercomputing High-Speed Interconnects.
Abstract not provided.
High-Efficiency Lasers with Integrated External Modulators for Petabit-Class Interconnects (HELIEM PCI).
Abstract not provided.
Integrating Energy Storage -- Grid Interconnection Standards and Policy as a Model.
Abstract not provided.
Fabrication of Optical Interconnects Using Direct Laser Writing.
Abstract not provided.
Interconnection Writ Large: Non-Technical solutions to connecting renewables and storage to the grid.
Abstract not provided.
Evaluation of novel interconnect technologies for ASC applications.
Abstract not provided.
Credit based flow control mechanism for use in multiple link width interconnect systems
Flow control credit management is provided when converting traffic from a first parallel link width on a first link to a second parallel link width on a second link A current value is calculated for a variable flow control credit exchange rate (R) associated with the first and second links. A first flow control credit indicator is received on the second link, and a credit amount calculated based on the first flow control credit indicator and R. A second flow control credit indicator for the credit amount is then transmitted on the first link.
Evaluating Interconnection Schemes for Semi-Transparent Perovskite Mini-Modules
This work evaluates the critical issues surrounding P1, P2, and P3 scribing for semi-transparent perovskite module integration. We find that P1 scribing procedures are well-translated from other thin-film technologies. P2 scribing is best performed with a mechanical scribe, but remains a source of series resistance. P3 scribing is found to cause an increase in scribing dead area and a potential degradation source.
High-density fabric systems interconnected with multi-port aggregated cables
A multi-port aggregated cable includes: a plurality of duplex optical fibers, each duplex optical fiber having a first end and a second end; a first optical interface attached to each of the duplex optical fibers at the first end thereof and defining multiple ports, one for each of the duplex optical fibers, the first optical interface aggregating the duplex optical fibers at the first end thereof; and a second optical interface attached to each of the duplex optical fibers at the second end thereof and defining multiple ports, one for each of the duplex optical fibers, the second optical interface aggregating the duplex optical fibers at the second end thereof.
Circuit board interconnect decals
A circuit component decal comprising a transparent sheet and an opaque circuit pattern. The transparent sheet includes opposing top and bottom surfaces and a number of edges. The opaque circuit pattern includes an electronic component footprint and a number of circuit lead paths. The electronic component footprint includes a number of contact points representing the location of leads of the electronic component. The circuit lead paths extend from the contact points to the edges of the transparent sheet. The opaque circuit pattern corresponds to only a section of a complete circuit pattern and is configured to block energy from reaching a first portion of the intermediate substrate when the transparent sheet is positioned on the intermediate substrate so as to form the section of the complete circuit pattern.
Fabrication of Optical Interconnects Using Direct Laser Writing.
Abstract not provided.
INDEPENDENT AND INTERCONNECTED INTERPENETRTING POLYMER NETWORK FORMATION IN DUAL-CURE THERMOSET RESINS.
Abstract not provided.
The Exascale Computing Project: Hardware Evaluation for Interconnects.
Abstract not provided.
Poster: Forced Oscillations in the Western Interconnection with the Pacific DC Intertie Wide Area Damping Controller.
Abstract not provided.