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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 505 records · Page 28

Desirements of Next Generation Spacecraft Interconnects : The JPL NEXUS Perspective

Objectives of NEXUS (NEXt bUS) (1) A research task funded by JPL R&TD program (2) Develop a common highly-capable next generation avionics interconnect with the following features: (a) Transparently compatible with wired, fiber-optic, and RF physical layers (b) A clear and feasible path-to-flight to ensure infusion into future NASA/JPL missions

fiber-optics↗

Stackable Form-Factor Peripheral Component Interconnect Device and Assembly

A stackable form-factor Peripheral Component Interconnect (PCI) device can be configured as a host controller or a master/target for use on a PCI assembly. PCI device may comprise a multiple-input switch coupled to a PCI bus, a multiplexor coupled to the switch, and a reconfigurable device coupled to one of the switch and multiplexor. The PCI device is configured to support functionality from power-up, and either control function or add-in card function.

Somervill, Kevin M.↗

Evidence of Processing Non-Idealities in 4H-SiC Integrated Circuits Fabricated With Two Levels of Metal Interconnect

The fabrication and prolonged 500 C electrical testing of 4H-SiC junction field effect transistor (JFET) integrated circuits (ICs) with two levels of metal interconnect is reported in another submission to this conference proceedings. While some circuits functioned more than 3000 hours at 500 C, the majority of packaged ICs from this wafer electrically failed after less than 200 hours of operation in the same test conditions. This work examines the root physical degradation and failure mechanisms believed responsible for observed large discrepancies in 500 C operating time. Evidence is presented for four distinct issues that significantly impacted 500 C IC operational yield and lifetime for this wafer.

JFET↗

Evidence of Processing Non-Idealities in 4H-SiC Integrated Circuits Fabricated with Two Levels of Metal Interconnect

The fabrication and prolonged 500 C electrical testing of 4H-SiC junction field effect transistor (JFET) integrated circuits (ICs) with two levels of metal interconnect is reported in another submission to this conference proceedings. While some circuits functioned more than 1000 hours at 500 C, the majority of packaged ICs from this wafer electrically failed after less than 200 hours of operation in the same test conditions. This work examines the root physical degradation and failure mechanisms believed responsible for observed large discrepancies in 500 C operating time. Evidence is presented for four distinct issues that significantly impacted 500 C IC operational yield and lifetime for this wafer.

Microelectronics↗

Analysis of Electrical Grid Capacity by Interconnection for Urban Air Mobility

A wide range of challenges must be overcome to conduct Urban Air Mobility (UAM)operations at scale with electric vertical take-off and landing aircraft as envisioned. This paper documents an analysis of one potential infrastructure challenge for UAM: available electrical grid power capacity. The success of UAM depends on the availability of electricity, which will be increasingly impacted by the proliferation of ground electric vehicles(EVs) over time. Under the best-case assumption that electricity can be transmitted and distributed as needed within each interconnection (i.e., electrical grid), it is estimated that the maximum number of UAM aircraft that can charge simultaneously in the continental United States will decrease by 20% from about 595 thousand in the year 2021 to about 475 thousand in the year 2050due to the projected increase in ground EVs.

electrical grid↗

Analysis of Electrical Grid Capacity by Interconnection for Urban Air Mobility

A wide range of challenges must be overcome to conduct Urban Air Mobility (UAM)operations at scale with electric vertical take-off and landing aircraft as envisioned. This paper documents an analysis of one potential infrastructure challenge for UAM: available electrical grid power capacity. The success of UAM depends on the availability of electricity, which will be increasingly impacted by the proliferation of ground electric vehicles(EVs) over time. Under the best-case assumption that electricity can be transmitted and distributed as needed within each interconnection (i.e., electrical grid), it is estimated that the maximum number of UAM aircraft that can charge simultaneously in the continental United States will decrease by 20% from about 595 thousand in the year 2021 to about 475 thousand in the year 2050due to the projected increase in ground EVs.

electrical grid↗

Development of an Adaptive Droop Control Method for Interconnected Lunar DC Microgrids Using Power Hardware-in-the-Loop

NASA’s Artemis Program outlines the need for a habitat capable of sustaining human life as well as mining and producing raw materials on the lunar surface. This mission is viewed as a means towards deeper space exploration, with plans for reaching Mars and beyond. Human presence on the moon is not possible without the ability to generate and distribute energy, namely electricity, through a network of energy sources, loads, and power converters called a microgrid. Multiple microgrids can be deployed on the moon based on location and need. Separate microgrids will require interconnection to increase resiliency and reliability given the mission’s high criticality. A method for adaptive control over power converters connecting two dc microgrids is proposed. A simulation is modeled after the lunar power system with two approaches to power converter droop control, allowing for a more flexible and adaptive microgrid architecture. Further experiments are conducted using the control methods in a power hardware-in-the-loop test environment to study the performance of hardware converter control used in this application.

dc microgrid↗

Synthesis of micro-sized interconnected Si-C composites

Embodiments provide a method of producing micro-sized Si--C composites or doped Si--C and Si alloy-C with interconnected nanoscle Si and C building blocks through converting commercially available SiO.sub.x (0<x<2) to a silicon framework by calcination, followed by etching and then by carbon filling by thermal deposition of gas containing organic molecules that have carbon atoms.

25 ENERGY STORAGE↗

Fuel cell system with interconnect

The present invention includes an integrated planar, series connected fuel cell system having electrochemical cells electrically connected via interconnects, wherein the anodes of the electrochemical cells are protected against Ni loss and migration via an engineered porous anode barrier layer.

30 DIRECT ENERGY CONVERSION↗

Fuel cell system with interconnect

The present invention includes an integrated planar, series connected fuel cell system having electrochemical cells electrically connected via interconnects, wherein the anodes of the electrochemical cells are protected against Ni loss and migration via an engineered porous anode barrier layer.

Liu, Zhien↗

Via configuration for wafer-to-wafer interconnection

A modification to the standard layout of vias used for vertically-stacked wafer bonding is proposed which has been found to improve the interconnect overlay while avoiding the dishing problems associated with the planarization processes used in the creation of conductive posts within the vias. In particular, the pitch, i.e. the spacing between adjacent posts, is intentionally chosen to be different for each wafer. By using different pitches, there is an increase in the probability of overlap of posts on each wafer, even when one wafer is slightly offset with respect to the other (which is possible when aligning one wafer with another in a standard bonding tool). Advantageously, the use of different pitches allows for the use of relatively small diameter (one micron or less) posts while still creating sufficient overlap for the necessary connections.

Jones, Adam↗

Interconnect for fuel cell stack

A metal interconnect for a fuel cell stack is formed from an electrically conductive metal sheet having at least four stamped slots through the metal sheet, and often many more than four slots. The stamped slots individually extend lengthwise parallel to the direction of fluid flow during operation of the fuel cell stack assembly and are disposed on the metal sheet in a pattern extending parallel and perpendicular to the direction of fluid flow, so as to define at least one metal strip portion between adjacent slots extending parallel to the direction of fluid flow and at least one metal strip portion between adjacent slots extending perpendicular to the direction of fluid flow. The metal strip portion(s) include portions of reduced thickness that allow for fluid flow between adjacent slots and portions of greater thickness that provide discrete locations of electrical connection between the separator plate fuel cell electrode.

30 DIRECT ENERGY CONVERSION↗

Application of MP-PIC on Dual Interconnected Chemical Looping Cold Flow System: Validation Process with Hydrodynamic Experiments

Chemical looping with oxygen uncoupling (CLOU) is a promising carbon capture technologies, that utilizes a dual fluidized bed interconnected by loopseals to selectively separate oxygen from ambient air. This study validated Barracuda-VR® hydrodynamic simulations of dual circulating fluidized bed. The experiments were run on a scaled-down cold-flow unit of a 100 kW dual reactor to find the quantities of interest: circulation rate, bed mass location distribution, and pressure profile. The numerical parameters of time step and grid resolution were studied to find the numeric uncertainty for the quantities of interest. The scenario parameters of flowrates, particle densities, and particle voidage were studied. The uncertainty from the model parameters of tangent-to-wall, drag multiplier, and stress model were studied. Simulation and experimental results matched over some of the parameters studied. These can be used to scale the system back to the 100 kW dual reactor and to a larger system.

Hamilton, Matthew A↗

SOFC interconnect barriers and methods of making same using masks

A novel method to produce thin films spatially disposed on desired areas of workpieces is disclosed. Examples of include the formation of a yttria stabilized zirconia (YSZ) film formed on a desired portion of a stainless steel interconnect for solid oxide fuel cells by Atomic Layer Deposition (ALD). A number of methods to produce the spatially disposed YSZ film structures are described including polymeric and silicone rubber masks. The thin film structures have utility for preventing the reaction of glasses with metals, in particular alkali-earth containing glasses with ferritic stainless steels, allowing high temperature bonding of these materials.

36 MATERIALS SCIENCE↗

Estimation of Electromechanical Modes of Oscillation in the Eastern Interconnection from Ambient PMU Data

A power system's inter-area electromechanical modes of oscillation determine if the system is small-signal stable. Mode meters are tools that estimate the modes based on ambient synchrophasor measurements, allowing continuous monitoring of the system's stability margin. This paper reports on the application of mode meter algorithms to 21 months of synchrophasor measurements from the United States Eastern Interconnection (EI). Estimates for three modes were updated every minute, providing a much more comprehensive set of results than previous studies based on disturbance recordings. The detailed signal designs and mode meter configurations provided in this paper can be used to accelerate mode meter deployments in the EI. Analysis of the mode estimates reveal for the first time how seasonal load changes and system reconfiguration impact the EI system's dynamics.

Follum, James D.↗

Impact of Quaternary-Pumped Storage Hydropower on Frequency Response of U.S. Western Interconnection with High Renewable Penetrations: Preprint

As renewable penetration increases in the United States, maintaining stability and reliability of low-inertia power grid by providing sufficient frequency control capability becomes a challenge. Advanced pumped storage hydro technologies (APSH) will be expected to play an important role for future grid as not only an energy supplier, but also as an ancillary services provider. This paper studies the impact of using quaternary pumped storage hydropower (Q-PSH), as one of the newly proposed APSH technology, to provide primary frequency response. To quantify the impact of Q-PSH on frequency response of the U.S. Western Interconnection, a user-defined dynamic model of Q-PSH is developed on the GE Positive Sequence Load Flow (PSLF) platform and is implemented in a set of detailed U.S. Western Electricity Coordination Council (WECC) planning cases in which renewable penetration levels are 20%, 40%, 60% and 80%. Simulation results show that Q-PSH can help improve frequency nadir and settling frequency comparing to the conventional PSH.

frequency response↗

System and method for scalable optical interconnect for quantum computing

The present disclosure relates to an interconnect system for interfacing an electronic subsystem to a qubit package, wherein the qubit package has a plurality of independent qubits. The system makes use of an optical fiber cable having a plurality of optical fibers, which is interfaced to the electronic subsystem. A 3D optical structure is used which has a plurality of internal waveguides, and which is configured to interface the optical fiber cable to the qubit package. The 3D optical structure further has at least one subsystem for using the plurality of waveguides to receive signals of a first type from at least one of the qubits package or the optical fiber cable, to convert the signals from the first type to a second type, and to transmit the signals in the second type to the other one of the fiber optic cable or the qubit package.

Patra, Susant K.↗