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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 487 records · Page 27
All sourcesNASA NTRSDOE OSTI
DOE OSTI2023

Reliability Improvement by Fault-Tolerant Operation of NPC Inverter for Motor Driving

The high-reliability operation of three-level inverters is crucial to prevent equipment damage, process downtime, and economic losses. This article investigates a three-level neutral-point-clamped inverter under all possible combinations of open-circuit and short-circuit faults and proposes a new postfault operation method without adding extra hardware. This method provides comprehensive solution for operations after single and multiple-device failures, increasing the inverter reliability by 24%. This article classified postfault modulations and uncovered previously unknown fault scenarios that can be addressed using the proposed control method. A new postfault modulation based on space vector modulation with virtual vectors is proposed. The feasibility of the proposed control method is verified by simulation and an experiment for one fault scenario in a three-level neutral-point-clamped inverter with a 3.73 kW motor load. Furthermore, this article contributes to improving the reliability of three-level inverters.

42 ENGINEERING↗
DOE OSTI2021

Reliability-Informed Life Cycle Warranty Cost and Life Cycle Analysis of Newly Manufactured and Remanufactured Units

Standard life cycle techniques such as life cycle warranty cost (LCWC) analysis and life cycle analysis (LCA) are used to respectively quantify the relative economical and environmental advantages of remanufactured goods while simultaneously identifying avenues for improvement. In this paper, we contribute to the literature on life cycle studies by incorporating reliability into LCWC analysis and LCA with the goal of improving long-term/multiple life cycle decision making. We develop a branched power-law model to incorporate the physical degradation mechanisms leading to reduced reuse rates of system parts over multiple life cycles. We then follow a standard LCA protocol to quantify the difference between a new unit and its remanufactured version in terms of environmental impact items such as abiotic depletion potential, global warming potential, and energy consumption. We then devise four practical warranty policies that vary in the choice of replacement and/or provision for extended warranty. All possible replacement scenarios for multiple life cycles are explored for each policy and a mathematically rigorous framework is provided, where the reliability information is used to calculate probabilistic LCWC and life cycle impact items. This reliability-informed LCWC analysis and LCA framework enables design engineers to compare design options and warranty policies by quantifying both economical and environmental impacts to aid in decision making. Although the framework is presented in a general form applicable to any engineered system, we demonstrate the utility of this framework by using a case study of an infinitely variable transmission used in agricultural equipment.

42 ENGINEERING↗
DOE OSTI2020

GPU Lifetimes on Titan Supercomputer: Survival Analysis and Reliability

George Ostrouchov, Don Maxwell, Rizwan Ashraf, Mallikarjun Shankar, and James Rogers. 2020. GPU Lifetimes on Titan Supercomputer: Survival Analysis and Reliability. In Proceedings of the International Conference for High Performance Computing, Networking, Storage and Analysis (SC '20). Association for Computing Machinery, New York, NY, USA. Data and code for SC20 paper about Titan GPU reliability analysis: https://github.com/olcf/TitanGPULife. Includes R code to generate graphics for paper and additional analyses. See code/README for instructions. Includes original Titan GPU reliability data on over 100,000 collective hours of operation: data/titan.gpu.history.txt - history data, data/titan.service.txt - service nodes for exclusion. Includes output data files produced by code/TitanGPUmodel.Rmd: data/gc_full.csv - cleaned up data (see paper and R code); data/gc_summary_loc.csv - one record per GPU (variables: SN, time, nlife, nloc, last, col, row, cage, slot, node, max_loc_events, time_max_loc, dbe, dbe_loc, otb, otb_loc, out, batch, days, years, dead, dead_otb, dead_dbe) (see paper and R code). Includes .Rmd analysis document as TitanGPUmode.html. Includes Python code to process data/gc_full.csv into graphics from time-between-failure analyses: See code/tbf-analyses/README for instructions.

42 ENGINEERING↗
DOE OSTI2022

Reliability and Resiliency in South Asia's Power Sector - Pathways for Research, Modeling, and Implementation

Reliability and resilience are the core principles of power system planning and operations around the world. Power systems in South Asia are transforming with increasing penetration of clean energy generation resources, emerging technologies, increasing electricity demand and electrification. At the same time, these power systems are facing challenges posed by extreme weather events and climate change. All these factors would add furthermore importance to the reliability and resilience of future power systems in South Asia. This has motivated us to better understand the country specific challenges and chalk out the pathways for research, modelling and implementation in South Asia. Our research, experience in the region and feedback from key stakeholders indicate following as the key areas where more work is needed to improve reliability and resilience of power systems in the region: Renewable energy Data for power system studies, New Tools and Studies, Resilience Planning, Resource Adequacy, Advanced RE Forecasting, Cybersecurity, Load Forecasting, and Coordinated Planning and Operations.

29 ENERGY PLANNING, POLICY, AND ECONOMY↗
DOE OSTI2022

Reliability Evaluation of Bifacial and Monofacial Glass/Glass Modules with EVA and non-EVA Encapsulants

The market share for bifacial modules is projected to be doubled from 30% to 60% in the next ten years. For the monofacial crystalline silicon glass/backsheet (G/B) modules, extensive reliability data has been available for over 40 years. However, practically little/no long-term field or accelerated reliability test data is available for the new generation glass/glass (G/G) bifacial modules and glass/transparent (G/T) bifacial modules. Therefore, the primary motivation of this project was to identify the reliability strengths and weaknesses of new generation G/G modules compared to G/B modules. In this 3-year project, the goal was to objectively recommend the best construction materials for the new generation G/G (bifacial) modules through a systematic experimental approach with appropriate tasks including: Evaluation of field retrieved old-generation G/G modules; Inspection of new-generation G/G modules installed in the plants; Evaluation of new-generation G/G, G/B and G/T modules using EAST (Extended Accelerated Stress Testing), CAST (Combined Accelerated Stress Testing) and FAST (Field Accelerated Stress Testing); and, dynamic literature search and review. Major accomplishments and outcomes of this project are: Accomplishments: Evaluated more than 60 field retrieved modules and constructed and characterized more than 135 mini-modules with three substrate types (G, B, and T), two encapsulant types (EVA and POE), and two cell types (monofacial and bifacial) as well as evaluated more than 30 commercial G/G and G/B modules; Subjected all the modules to multitude characterization tests and various indoor and outdoor accelerated stress tests including FAST (Field Accelerated Stress Testing), EAST (Extended Accelerated Stress Testing), and CAST (Combined Accelerated Stress Testing) to identify and correlate the failure modes in both field and lab tests. Outcomes: Based on the accelerated test results and handling/mounting experience obtained in this project, the recommended best construction for the glass/glass modules is: “Framed GG modules with cut-cells and POE encapsulant (UVpass front; UVpass back).” However, from a statistical and manufacturing point of view (along with stakeholders surveys), the following cautionary notes are added to the above-mentioned recommendation: (i) Cut cells could introduce a higher level of manufacturing issues, including a higher number of cell interconnects; (ii) POE encapsulant is more expensive than EVA and could present a delamination risk and lower throughput during manufacturing due to lower adhesion strength. Other encapsulants, such as coextruded EPE (EVA/POE/EVA), are also recommended to be investigated. The potential public benefit of the proposed project is to present the strengths and weaknesses of glass/glass modules, so an informed procurement decision can be made.

14 SOLAR ENERGY↗
DOE OSTI2022

Wind Turbine Drivetrain Reliability [Slides]

Pitch bearings, main bearings, and gearboxes in conventional wind turbine drivetrains often do not meet their 20-year minimum specified lifetime, resulting in turbine downtime as well as expensive, time-consuming repairs or replacements. The dominant failure modes of the drivetrain components and the conditions that lead to their failure are not fully accounted for during product design or routinely modeled for life management. Drivetrain reliability improvements and O&M cost reductions remain top priorities for both land-based and offshore wind turbines, especially as wind turbines continue to be deployed in increasingly remote and offshore locations, continue to increase in size, and are becoming expected to be in service beyond their original design life, all of which correspond to an increase in the impact of any reliability issues on O&M costs. This presentation summarizes the most recent activities by NREL and ANL on drivetrain reliability.

17 WIND ENERGY↗
DOE OSTI2023

Wind Turbine Generator Reliability Analysis to Reduce Operations and Maintenance (O&M) Costs

Wind turbine major systems (blades, pitch, main bearing, gearbox, and generator) are integrated into a composite system. Specifications for these systems and components are developed to achieve symmetry of operation, avoiding negative interaction. For instance, the main bearing, gearbox, and generator (drivetrain) components are interdependent, functioning in unison for efficient energy production. Hence, wind resource and grid interactions affecting the drivetrain impact the performance and reliability of the turbine generator. This paper discusses generator reliability covering the technology evolution over the last 20 years. EPRI's Wind Network for Enhanced Reliability (WinNER) web-based tool and Shermco Industries databases are presented, and conclusions are drawn regarding failures specific to generator design, manufacturing, and operating conditions. Additionally, this paper compares the life expectancy of stator-fed configurations and doubly fed generator systems.

17 WIND ENERGY↗
DOE OSTI2022

Evaluation of the Reliability of Passive Infrared (PIR) Occupancy Sensors for Residential Indoor Lighting

Solid-state lighting (SSL) technologies have penetrated the general illumination market in recent years, largely replacing conventional technologies such as incandescent and fluorescent lighting. Most of the initial excitement about light-emitting diode (LED) sources for SSL devices focused on their energy savings potential resulting from vast improvements in source efficiency and luminous efficacy compared with conventional illumination products. More recently, the focus has shifted toward other aspects of lighting application efficiency, namely intensity effectiveness and spectral efficiency, because of the ease of controlling both the light intensity of LEDs with drive voltage and the color properties of the LED-based illuminators. To capitalize on the energy savings of increased intensity effectiveness and spectral efficiency, a lighting control system (LCS) is often used. While the current penetration of LCSs is relatively modest, it is anticipated that lighting controls (i.e., connected lighting, controls and LED and conventional lighting) could have an installed penetration as higher as 46% by the year 2035, saving an additional 1.3 quads of energy. Despite the large energy savings that can be gained from using LCSs, standard test methods for evaluating sensors employed in LCSs and reliability data of the LCSs and their components are generally lacking. The National Electrical Manufacturers Association (NEMA) developed the only standard, NEMA WD 7-2011 (R2016), to test occupancy and motion sensor performance (herein referred to as “the NEMA protocol”). In a previous U.S. Department of Energy (DOE) effort, some concerns of the NEMA protocol were identified (e.g., strict height and weight limits on test subjects, large amounts of manual effort, sometimes inconsistent repeatability). During the current work, a consistent detection length test (DLT) and a Robotic Sensor Evaluation System (RoboSES) were developed to alleviate some of these concerns. RoboSES acts as a human surrogate by using thermal pads on a mannequin and a remote-controlled mobile base to test a sensor’s field of view (FOV). This report builds on the earlier DOE efforts to understand sensor technologies used in LCSs for general illumination. Specifically, this report describes the optimization of RoboSES, characterizes and establishes test methods to assess the reliability of multiple passive infrared (PIR) sensors, and reports the findings of robustness and reliability testing on two commercial PIR sensors intended for residential applications. The information presented in this report is gained from up to 4,000 hours (hrs) of accelerated stress tests (ASTs).

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗
DOE OSTI2024

Maintaining Grid Reliability: Lessons From Renewable Integration Studies

The U.S. Department of Energy (DOE) and other organizations have sponsored numerous research studies over the last two decades to examine the effect of increased wind and solar deployment on grid reliability, including a number of studies that examine grids deriving more than 50% of annual energy from wind and solar. In this report, we discuss key findings from both the research body of knowledge and real-world practice related to grid reliability, and we demonstrate how to plan for and achieve continued reliability in the future as wind and solar deployment increase.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2020

Assessing the Reliability of Relevant Tweets and Validation Using Manual and Automatic Approaches for Flood Risk Communication

While Twitter has been touted as a preeminent source of up-to-date information on hazard events, the reliability of tweets is still a concern. Our previous publication extracted relevant tweets containing information about the 2013 Colorado flood event and its impacts. Using the relevant tweets, this research further examined the reliability (accuracy and trueness) of the tweets by examining the text and image content and comparing them to other publicly available data sources. Both manual identification of text information and automated (Google Cloud Vision, application programming interface (API)) extraction of images were implemented to balance accurate information verification and efficient processing time. The results showed that both the text and images contained useful information about damaged/flooded roads/streets. This information will help emergency response coordination efforts and informed allocation of resources when enough tweets contain geocoordinates or location/venue names. This research will identify reliable crowdsourced risk information to facilitate near real-time emergency response through better use of crowdsourced risk communication platforms.

54 ENVIRONMENTAL SCIENCES↗
DOE OSTI2026

Repowering: The Other Side of the Reliability Coin

Extreme weather, cracked backsheets, severe PID, poorly built modules, and installation flaws - all can compromise a solar plant's health and force repowering long before end of life. With more than 70% of U.S. PV capacity less than seven years old, the fleet is young, but its rapid expansion has introduced new materials and system designs that are still being tested under real-world conditions. As a result, reliability - not economics - is what most often drives repowering decisions. Repowering is frequently assumed to be an economically motivated choice, but our work shows that reliability concerns are the real trigger. Drawing from industry interviews, case studies, and modeling, we highlight the physical, electrical, and policy barriers owners face when deciding whether to repair, repower, or decommission. At the same time, repowering can create opportunities: renewed interconnection periods, improved energy yields, and strategic upgrades to extend system value. We present a quantitative framework using NLR's System Advisor Model (SAM) and PV in Circular Economy (PV ICE) tool to evaluate trade-offs across financial, material, and energy impacts. These findings provide practical guidance for navigating the realities of repowering today and underscore the critical role of reliability in shaping the future performance and sustainability of the PV fleet.

14 SOLAR ENERGY↗
NASA NTRS1962

Design Reliability Measurement and Evaluation

Reliability measurement by data collection and evaluation is considered. Parameters are defined and restrictions established. Reliability estimation of sub-systems and parts as a preliminary to system estimation is reviewed, and rules are established. Confidence levels of sub-systems and parts versus combined system are analyzed. Estimation planning is discussed. Tests planned for accept-reject reliability decision are very briefly considered.

RELIABILITY↗
NASA NTRS1994

Software analysis handbook: Software complexity analysis and software reliability estimation and prediction

This handbook documents the three software analysis processes the Space Station Software Analysis team uses to assess space station software, including their backgrounds, theories, tools, and analysis procedures. Potential applications of these analysis results are also presented. The first section describes how software complexity analysis provides quantitative information on code, such as code structure and risk areas, throughout the software life cycle. Software complexity analysis allows an analyst to understand the software structure, identify critical software components, assess risk areas within a software system, identify testing deficiencies, and recommend program improvements. Performing this type of analysis during the early design phases of software development can positively affect the process, and may prevent later, much larger, difficulties. The second section describes how software reliability estimation and prediction analysis, or software reliability, provides a quantitative means to measure the probability of failure-free operation of a computer program, and describes the two tools used by JSC to determine failure rates and design tradeoffs between reliability, costs, performance, and schedule.

Computer systems design↗
NASA NTRS2005

Design for ASIC reliability for low-temperature applications

In this paper, we present a methodology to design for reliability for low temperature applications without requiring process improvement. The developed hot carrier aging lifetime projection model takes into account both the transistor substrate current profile and temperature profile to determine the minimum transistor size needed in order to meet reliability requirements. The methodology is applicable for automotive, military, and space applications, where there can be varying temperature ranges. A case study utilizing this methodology is given to design for reliability into a custom application-specific integrated circuit (ASIC) for a Mars exploration mission.

reliability↗
NASA NTRS2006

Design Parameters Influencing Reliability of CCGA Assembly: A Sensitivity Analysis

Area Array microelectronic packages with small pitch and large I/O counts are now widely used in microelectronics packaging. The impact of various package design and materials/process parameters on reliability has been studied through extensive literature review. Reliability of Ceramic Column Grid Array (CCGA) package assemblies has been evaluated using JPL thermal cycle test results (-50(deg)/75(deg)C, -55(deg)/100(deg)C, and -55(deg)/125(deg)C), as well as those reported by other investigators. A sensitivity analysis has been performed using the literature da to study the impact of design parameters and global/local stress conditions on assembly reliability. The applicability of various life-prediction models for CCGA design has been investigated by comparing model's predictions with the experimental thermal cycling data. Finite Element Method (FEM) analysis has been conducted to assess the state of the stress/strain in CCGA assembly under different thermal cycling, and to explain the different failure modes and locations observed in JPL test assemblies.

reliability↗
NASA NTRS2004

Qualification and Reliability for MEMS and IC Packages

Advanced IC electronic packages are moving toward miniaturization from two key different approaches, front and back-end processes, each with their own challenges. Successful use of more of the back-end process front-end, e.g. microelectromechanical systems (MEMS) Wafer Level Package (WLP), enable reducing size and cost. Use of direct flip chip die is the most efficient approach if and when the issues of know good die and board/assembly are resolved. Wafer level package solve the issue of known good die by enabling package test, but it has its own limitation, e.g., the I/O limitation, additional cost, and reliability. From the back-end approach, system-in-a-package (SIAP/SIP) development is a response to an increasing demand for package and die integration of different functions into one unit to reduce size and cost and improve functionality. MEMS add another challenging dimension to electronic packaging since they include moving mechanical elements. Conventional qualification and reliability need to be modified and expanded in most cases in order to detect new unknown failures. This paper will review four standards that already released or being developed that specifically address the issues on qualification and reliability of assembled packages. Exposures to thermal cycles, monotonic bend test, mechanical shock and drop are covered in these specifications. Finally, mechanical and thermal cycle qualification data generated for MEMS accelerometer will be presented. The MEMS was an element of an inertial measurement unit (IMU) qualified for NASA Mars Exploration Rovers (MERs), Spirit and Opportunity that successfully is currently roaring the Martian surface

inertial measurement unit↗
NASA NTRS2004

A Statistical Approach to Characterizing the Reliability of Systems Utilizing HBT Devices

This paper presents a statistical approach to characterizing the reliability of systems with HBT devices. The proposed approach utilizes the statistical reliability information of the HBT individual devices, along with the analysis on the critical paths of the system, to provide more accurate and more comprehensive reliability information about the HBT systems compared to the conventional worst-case method.

hetero bipolar transistors (HBTs)↗
NASA NTRS2011

Reliability of Sn/Pb and Lead-Free (SnAgCu) Solders of Surface Mounted Miniaturized Passive Components for Extreme Temperature (-185 C to +125 C) Space Missions

Surface mount electronic package test boards have been assembled using tin/lead (Sn/Pb) and lead-free (Pb-free or SnAgCu or SAC305) solders. The soldered surface mount packages include ball grid arrays (BGA), flat packs, various sizes of passive chip components, etc. They have been optically inspected after assembly and subsequently subjected to extreme temperature thermal cycling to assess their reliability or future deep space, long-term, extreme temperature environmental missions. In this study, the employed temperature range (-185oC to +125oC) covers military specifications (-55oC to +100oC), extreme old Martian (-120oC to +115oC), asteroid Nereus (-180oC to +25oC) and JUNO (-150oC to +120oC) environments. The boards were inspected at room temperature and at various intervals as a function of extreme temperature thermal cycling and bake duration. Electrical resistance measurements made at room temperature are reported and the tests to date have shown some change in resistance as a function of extreme temperature thermal cycling and some showed increase in resistance. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work will be carried out to understand the reliability of packages under extreme temperature applications (-185oC to +125oC) via continuously monitoring the daisy chain resistance for BGA, Flat-packs, lead less chip packages, etc. This paper will describe the experimental reliability results of miniaturized passive components (01005, 0201, 0402, 0603, 0805, and 1206) assembled using surface mounting processes with tin-lead and lead-free solder alloys under extreme temperature environments.

extreme temperatures,↗