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At least 487 records · Page 27

All sources NASA NTRS DOE OSTI

DOE OSTI2015

The overvoltage protection module for the power supply system for the pixel detector at Belle II experiment at KEK

In this paper the overvoltage protection modules (OVP) for the power supply (PS) system of the Belle II pixel detector (PXD) are described. The aim of the OVP is to protect the detector and associated electronics against overvoltage conditions. Most critical in the system are voltages supplying the front-end ASICs. The PXD detector consists of the DEPFET sensor modules with integrated chips like the Drain Current Digitizer, the Switcher and the Data Handling Processor. These chips, implemented in modern sub-micron technologies, are quite vulnerable to variations in the supply voltages. The PXD will be placed in the Belle II experiment as close as possible to the interaction point, where access during experiment is very limited or even impossible, thus the PS and OVP systems exploit the remote-sensing method. Overvoltage conditions are due to failures of the PS itself, wrong setting of the output voltages or transient voltages coming out of hard noisy environment of the experiment. The OVP modules are parts of the PS modules. For powering the PXD 40 PS modules are placed 15 m outside the Belle II spectrometer. Each one is equipped with the OVP board. All voltages (22) are grouped in 4 domains: Analog, Digital, Steering and Gate which have independent grounds. The OVP boards are designed from integrated circuits from Linear Technology. All configurations were simulated with the Spice program. The control electronics is designed in a Xilinx CPLD. Two types of integrated circuits were used. LT4356 surge stopper protects loads from high voltage transients. The output voltages are limited to a safe value and also protect loads against over current faults. For less critical voltages, the LTC2912 voltage monitors are used that detect under-voltage and overvoltage events. It has to be noted that the OVP system is working independently of any other protection of the PS system, which increases its overall reliability. (authors)

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

DOE OSTI2015

Characterization of silicon 3D pixel detectors for the ATLAS Forward Physics experiment

The ATLAS Forward Physics (AFP) project aims to measure protons scattered under a small angle from the pp collisions in ATLAS. In order to perform such measurements, a new silicon tracker, together with a time-of-flight detector for pile-up removal, are planned to be installed at ∼210 m from the interaction point and at 2-3 mm from the LHC proton beam. To cope with such configuration and maximize the physics outcome, the tracker has to fulfil three main requirements: endure highly non-uniform radiation doses, due to the very inhomogeneous beam profile, have slim and efficient edges to improve the acceptance of the tracker, and provide good position resolution. Recent laboratory and beam test characterization results of AFP prototypes will be presented. Slim-edged 3D pixel detectors down to 100-200 μm were studied and later non-uniformly irradiated (with a peak fluence of several 10{sup 15} n{sub eq}/cm{sup 2}) to determine the fulfilment of the AFP requirements. (authors)

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

DOE OSTI2025

In-pixel integration of signal processing and AI/ML based data filtering for particle tracking detectors

We present the first physical realization of in-pixel signal processing with integrated AI-based data filtering for particle tracking detectors. Building on prior work that demonstrated a physics-motivated edge-AI algorithm suitable for ASIC implementation, this work marks a significant milestone toward intelligent silicon trackers. Our prototype readout chip performs real-time data reduction at the sensor level while meeting stringent requirements on power, area, and latency. The chip is taped-out in 28nm TSMC CMOS bulk process, which has been shown to have sufficient radiation hardness for particle experiments. This development represents a key step toward enabling fully on-detector edge AI, with broad implications for data throughput and discovery potential in high-rate, high-radiation environments such as the High-Luminosity LHC.

Parpillon, Benjamin [Fermilab; Illinois U., Chicag↗

DOE OSTI2019

Deep neural network for pixel-level electromagnetic particle identification in the MicroBooNE liquid argon time projection chamber

Not Available

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

DOE OSTI2016

Pixel sensors with slim edges and small pitches for the CMS upgrades for HL-LHC

Here, planar n-in-n silicon detectors with small pitches and slim edges are being investigated for the innermost layers of tracking devices for the foreseen upgrades of the LHC experiments. Sensor prototypes compatible with the CMS readout, fabricated by Sintef, were tested in the laboratory and with a 120 GeV/c proton beam at the Fermilab test beam facility before and after irradiation with up to 2 × 10 15 neq/cm 2 fluence. Preliminary results of the data analysis are presented.

43 PARTICLE ACCELERATORS↗

DOE OSTI2023

Advanced Mixed-Mode Pixel Array Detector for X-rays Above 20 keV (Final Report)

The objective of the work reported upon was to perform research and development and test advanced prototype imaging x-ray detectors needed to meet pressing scientific research needs at U.S. x-ray synchrotron user facilities. The high x-ray brightness of the Nation’s x-ray synchrotron sources in the DOE National Laboratories holds promise to advance science and technology in a broad range of fundamental and applied disciplines, including physics, chemistry, biomedical areas and engineering. At present, progress in many areas is being limited not by the x-ray source but by the lack of imaging x-ray detectors capable of meeting experimental needs. Specifically, there is pressing need for imaging detectors with high dynamic range, low noise, high frame rates and the ability to capture x-ray images with x-rays of energy > 20 keV. This Final Technical Report summarizes progress made at Cornell University on novel integrating x-ray detectors that address these characteristics.

36 MATERIALS SCIENCE↗

NASA NTRS2002

Integrated imaging sensor systems with CMOS active pixel sensor technology

This paper discusses common approaches to CMOS APS technology, as well as specific results on the five-wire programmable digital camera-on-a-chip developed at JPL. The paper also reports recent research in the design, operation, and performance of APS imagers for several imager applications.

double sampling↗

NASA NTRS2001