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At least 487 records · Page 27
All sourcesNASA NTRSDOE OSTI
NASA NTRS2004

Solar Array in Simulated LEO Plasma Environment

Six different types of solar arrays have been tested in large vacuum chambers. The low Earth orbit plasma environment was simulated in plasma vacuum chambers, where the parameters could be controlled precisely. Diagnostic equipment included spherical Langmuir probes, mass spectrometer, low-noise CCD camera with optical spectrometer, video camera, very sensitive current probe to measure arc current, and a voltage probe to register variations in a conductor potential. All data (except video) were obtained in digital form that allowed us to study the correlation between external parameters (plasma density, additional capacitance, bias voltage, etc) and arc characteristics (arc rate, arc current pulse width and amplitude, gas species partial pressures, and intensities of spectral lines). Arc inception voltages, arc rates, and current collections are measured for samples with different coverglass materials and thickness, interconnect designs, and cell sizes. It is shown that the array with wrapthrough interconnects have the highest arc threshold and the lowest current collection. Coverglass design with overhang results in decrease of current collection and increase of arc threshold. Doubling coverglass thickness causes the increase in arc inception voltage. Both arc inception voltage and current collection increase significantly with increasing a sample temperature to 80 C. Sustained discharges are initiated between adjacent cells with potential differences of 40 V for the sample with 300 m coverglass thickness and 60 V for the sample with 150 m coverglass thickness. Installation of cryogenic pump in large vacuum chamber provided the possibility of considerable outgassing of array surfaces which resulted in significant decrease of arc rate. Arc sites were determined by employing a video-camera, and it is shown that the most probable sites for arc inception are triple-junctions, even though some arcs were initiated in gaps between cells. It is also shown that the arc rate increases with increasing of ion collection current. The analysis of optical spectra (240-800 nm) reveals intensive narrow atomic lines (Ag, H) and wide molecular bands (OH, CH, SiH, SiN) that confirms a complicated mechanism of arc plasma generation. The results obtained seem to be important for the understanding of the arc inception mechanism, which is absolutely essential for progress toward the design of high-voltage solar array for space application.

Vayner, Boris↗
NASA NTRS1997

Mechanical continuity and reversible chromosome disassembly within intact genomes removed from living cells

Chromatin is thought to be structurally discontinuous because it is packaged into morphologically distinct chromosomes that appear physically isolated from one another in metaphase preparations used for cytogenetic studies. However, analysis of chromosome positioning and movement suggest that different chromosomes often behave as if they were physically connected in interphase as well as mitosis. To address this paradox directly, we used a microsurgical technique to physically remove nucleoplasm or chromosomes from living cells under isotonic conditions. Using this approach, we found that pulling a single nucleolus or chromosome out from interphase or mitotic cells resulted in sequential removal of the remaining nucleoli and chromosomes, interconnected by a continuous elastic thread. Enzymatic treatments of interphase nucleoplasm and chromosome chains held under tension revealed that mechanical continuity within the chromatin was mediated by elements sensitive to DNase or micrococcal nuclease, but not RNases, formamide at high temperature, or proteases. In contrast, mechanical coupling between mitotic chromosomes and the surrounding cytoplasm appeared to be mediated by gelsolin-sensitive microfilaments. Furthermore, when ion concentrations were raised and lowered, both the chromosomes and the interconnecting strands underwent multiple rounds of decondensation and recondensation. As a result of these dynamic structural alterations, the mitotic chains also became sensitive to disruption by restriction enzymes. Ion-induced chromosome decondensation could be blocked by treatment with DNA binding dyes, agents that reduce protein disulfide linkages within nuclear matrix, or an antibody directed against histones. Fully decondensed chromatin strands also could be induced to recondense into chromosomes with pre-existing size, shape, number, and position by adding anti-histone antibodies. Conversely, removal of histones by proteolysis or heparin treatment produced chromosome decondensation which could be reversed by addition of histone H1, but not histones H2b or H3. These data suggest that DNA, its associated protein scaffolds, and surrounding cytoskeletal networks function as a structurally-unified system. Mechanical coupling within the nucleoplasm may coordinate dynamic alterations in chromatin structure, guide chromosome movement, and ensure fidelity of mitosis.

NASA Discipline Cell Biology↗
NASA NTRS2004

Baseline Testing of Ultracapacitors for the Next Generation Launch Technology (NGLT) Project

The NASA John H. Glenn Research Center initiated baseline testing of ultracapacitors for the Next Generation Launch Transportation (NGLT) project to obtain empirical data for determining the feasibility of using ultracapacitors for the project. There are large transient loads associated with NGLT that require either a very large primary energy source or an energy storage system. The primary power source used for these tests is a proton exchange membrane (PEM) fuel cell. The energy storage system can consist of devices such as batteries, flywheels, or ultracapacitors. Ultracapacitors were used for these tests. Ultracapacitors are ideal for applications such as NGLT where long life, maintenance-free operation, and excellent low-temperature performance is essential. State-of-the-art symmetric ultracapacitors were used for these tests. The ultracapacitors were interconnected in an innovative configuration to minimize interconnection impedance. PEM fuel cells provide excellent energy density, but not good power density. Ultracapacitors provide excellent power density, but not good energy density. The combination of PEM fuel cells and ultracapacitors provides a power source with excellent energy density and power density. The life of PEM fuel cells is shortened significantly by large transient loads. Ultracapacitors used in conjunction with PEM fuel cells reduce the transient loads applied to the fuel cell, and thus appreciably improves its life. PEM fuel cells were tested with and without ultracapacitors, to determine the benefits of ultracapacitors. The report concludes that the implementation of symmetric ultracapacitors in the NGLT power system can provide significant improvements in power system performance and reliability.

Eichenberg, Dennis J.↗
NASA NTRS2005

Baseline Testing of Ultracapacitors for the Next Generation Launch Technology (NGLT) Project

The NASA John H. Glenn Research Center initiated baseline testing of ultracapacitors for the Next Generation Launch Transportation (NGLT) project to obtain empirical data for determining the feasibility of using ultracapacitors for the project. There are large transient loads associated with NGLT that require either a very large primary energy source or an energy storage system. The primary power source used for these tests is a proton exchange membrane (PEM) fuel cell. The energy storage system can consist of devices such as batteries, flywheels, or ultracapacitors. Ultracapacitors were used for these tests. Ultracapacitors are ideal for applications such as NGLT where long life, maintenance-free operation, and excellent low-temperature performance is essential. State-of-the-art symmetric ultracapacitors were used for these tests. The ultracapacitors were interconnected in an innovative configuration to minimize interconnection impedance. PEM fuel cells provide excellent energy density, but not good power density. Ultracapacitors provide excellent power density, but not good energy density. The combination of PEM fuel cells and ultracapacitors provides a power source with excellent energy density and power density. The life of PEM fuel cells is shortened significantly by large transient loads. Ultracapacitors used in conjunction with PEM fuel cells reduce the transient loads applied to the fuel cell, and thus appreciably improves its life. PEM fuel cells were tested with and without ultracapacitors, to determine the benefits of ultracapacitors. The report concludes that the implementation of symmetric ultracapacitors in the NGLT power system can provide significant improvements in power system performance and reliability.

Eichenberg, Dennis J.↗
NASA NTRS2001

Packaging Technology Developed for High-Temperature Silicon Carbide Microsystems

High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as sensors and electronics for space missions to the inner solar system, sensors for in situ combustion and emission monitoring, and electronics for combustion control for aeronautical and automotive engines. However, these devices cannot be used until they can be packaged in appropriate forms for specific applications. Suitable packaging technology for operation temperatures up to 500 C and beyond is not commercially available. Thus, the development of a systematic high-temperature packaging technology for SiC-based microsystems is essential for both in situ testing and commercializing high-temperature SiC sensors and electronics. In response to these needs, researchers at Glenn innovatively designed, fabricated, and assembled a new prototype electronic package for high-temperature electronic microsystems using ceramic substrates (aluminum nitride and aluminum oxide) and gold (Au) thick-film metallization. Packaging components include a ceramic packaging frame, thick-film metallization-based interconnection system, and a low electrical resistance SiC die-attachment scheme. Both the materials and fabrication process of the basic packaging components have been tested with an in-house-fabricated SiC semiconductor test chip in an oxidizing environment at temperatures from room temperature to 500 C for more than 1000 hr. These test results set lifetime records for both high-temperature electronic packaging and high-temperature electronic device testing. As required, the thick-film-based interconnection system demonstrated low (2.5 times of the room-temperature resistance of the Au conductor) and stable (decreased 3 percent in 1500 hr of continuous testing) electrical resistance at 500 C in an oxidizing environment. Also as required, the electrical isolation impedance between printed wires that were not electrically joined by a wire bond remained high (greater than 0.4 GW) at 500 C in air. The attached SiC diode demonstrated low (less than 3.8 W/mm2) and relatively consistent dynamic resistance from room temperature to 500 C. These results indicate that the prototype package and the compatible die-attach scheme meet the initial design standards for high-temperature, low-power, and long-term operation. This technology will be further developed and evaluated, especially with more mechanical tests of each packaging element for operation at higher temperatures and longer lifetimes.

Chen, Liang-Yu↗
NASA NTRS2005

3-D Packaging: A Technology Review

Traditional electronics are assembled as a planar arrangement of components on a printed circuit board (PCB) or other type of substrate. These planar assemblies may then be plugged into a motherboard or card cage creating a volume of electronics. This architecture is common in many military and space electronic systems as well as large computer and telecommunications systems and industrial electronics. The individual PCB assemblies can be replaced if defective or for system upgrade. Some applications are constrained by the volume or the shape of the system and are not compatible with the motherboard or card cage architecture. Examples include missiles, camcorders, and digital cameras. In these systems, planar rigid-flex substrates are folded to create complex 3-D shapes. The flex circuit serves the role of motherboard, providing interconnection between the rigid boards. An example of a planar rigid - flex assembly prior to folding is shown. In both architectures, the interconnection is effectively 2-D.

Strickland, Mark↗
NASA NTRS2005

Temperature Tolerant Evolvable Systems Utilizing FPGA Boards and Bias-Controlled Amplifiers

Space missions often require radiation and extreme-temperature hardened electronics to survive the harsh environments beyond Earth's atmosphere. Traditional approaches to preserve electronics incorporate shielding, insulation and redundancy at the expense of power and weight. However, a novel way of bypassing these problems is the concept of evolutionary hardware. A reconfigurable device, consisting of several switches interconnected with analog/digital parts, is controlled by an evolutionary processor (EP). When the EP detects degradation in the circuit it sends signals to reconfigure the switches, thus forming a new circuit with the desired output. This concept has been developed since the mid-l990s, but one problem remains-the EP cannot degrade substantially. For this reason, extensive testing at extreme temperatures (-180 to 120 C) has been done on devices found on FPGA boards (taking the role of the EP), such as the Analog to Digital and the Digital to Analog Converter. The EP is used in conjunction with a bias-controlled amplifier and a new prototype relay board, which is interconnected with 6 G4-FETs, a tri-input transistor-like element developed at JPL. The greatest improvements to be made lie in the reconfigurable device, so future design and testing of the G4-FET chip is required.

Kumar, Nikhil R.↗
NASA NTRS2005

High Resolution Aerospace Applications using the NASA Columbia Supercomputer

This paper focuses on the parallel performance of two high-performance aerodynamic simulation packages on the newly installed NASA Columbia supercomputer. These packages include both a high-fidelity, unstructured, Reynolds-averaged Navier-Stokes solver, and a fully-automated inviscid flow package for cut-cell Cartesian grids. The complementary combination of these two simulation codes enables high-fidelity characterization of aerospace vehicle design performance over the entire flight envelope through extensive parametric analysis and detailed simulation of critical regions of the flight envelope. Both packages. are industrial-level codes designed for complex geometry and incorpor.ats. CuStomized multigrid solution algorithms. The performance of these codes on Columbia is examined using both MPI and OpenMP and using both the NUMAlink and InfiniBand interconnect fabrics. Numerical results demonstrate good scalability on up to 2016 CPUs using the NUMAIink4 interconnect, with measured computational rates in the vicinity of 3 TFLOP/s, while InfiniBand showed some performance degradation at high CPU counts, particularly with multigrid. Nonetheless, the results are encouraging enough to indicate that larger test cases using combined MPI/OpenMP communication should scale well on even more processors.

Mavriplis, Dimitri J.↗
NASA NTRS2000

Thermally conductive support structure

A structure for supporting and at least transferring heat energy away from at least a first heat source interconnected thereto is disclosed. In one embodiment, the structure includes a deck member having a plurality of layers of thermally conductive fibers packed within a matrix material. Fibers of at least a first layer are orientable to transfer heat energy toward at least a first sidewall of the deck member, and fibers of at least a second layer are orientable about .+-.45.degree. relative to the fibers of the first layer to enhance the structural strength of the deck member. In another embodiment, fibers of at least a first layer of thermally conductive fibers of the deck member are orientable to transfer heat energy from a first heat source to a second, cooler heat source, both of which are interconnectable to the deck member, such that the first and second heat sources operate at substantially uniform temperatures. In this embodiment, fibers of at least a second layer of thermally conductive fibers are orientable about .+-.45.degree. relative to the fibers of the first layer to enhance the structural strength of the deck member. Fibers of at least a third layer of thermally conductive fibers are orientable substantially orthogonally relative to the fibers of the first layer to transfer heat energy away from at least the first heat source to at least a first sidewall of the deck member.

Herzl, Alfred↗
NASA NTRS1988

Space station architecture, module, berthing hub, shell assembly, berthing mechanism and utility connection channel

A space station (20) includes a plurality of modules (24) and berthing hubs (22), joined by interconnections (26) which are sideways connectable. The modules (24) and hubs (22) are fastened together in a triangular configuration in three dimensions. The interconnections (26) include a pair of opposed, axially aligned, flanged ports (50) and a clamp latch (52) formed from a plurality of sections (54, 56 and 58) hinged along their length and extending circumferentially around the flanged ports (50). A hermetic seal (63) is formed between the ports (50). A utilities connection channel (68) extends between the ports (50). The channel (68) has a shell (70) with utilities connectors (74) movable between an extended position to mating connectors in the modules (24) and a withdrawn position. Assembly sequence and common module shell structure is detailed.

Cohen, Marc M.↗
NASA NTRS1991

Multilayer ceramic oxide solid electrolyte for fuel cells and electrolysis cells

A unitary layered ceramic structure is disclosed which comprises co-sintered layers. The co-sintered structure comprises a sintered central layer of yttria stabilized zirconia (YSZ) which is about 8 mole percent yttria and having a density of at least about 95% of theoretical, and sintered outer layers of strontium lanthanum manganite (LSM) having the approximate molecular composition La.sub.0.8 Sr.sub.0.2 MnO.sub.3, having a density from about 50 to about 60% of theoretical, and having interconnected porosity from about 40 to 50% with an interconnected pore diameter from about one micron to about five microns. The sintered central layer is sandwiched by and bonded and sintered to the outer layers and is essentially free of significant amounts of manganese. A process for making the unitary composition-of-matter is also disclosed which involves tape casting a LSM tape and then on top thereof casting a YSZ tape. The process comprises presintering LSM powder at 1250.degree. F., crushing the presintered commercially available LSM powder, forming a slurry with the crushed LSM, a binder and solvent, tape casting the slurry and allowing the slurry to air dry. A mixture of commercially available submicron size particle YSZ powder is milled with a dispersant and solvent to disperse the YSZ particles thereby forming a dispersed YSZ slurry. The YSZ slurry is then tape cast on the dried LSM tape. If desired, a third layer of LSM can be cast on top of the dried YSZ layer. After drying the composite LSM/YSZ and LSM/YSZ/LSM tapes are fired at 1300.degree. C. No migration of manganese into the YSZ layer was observed with scanning electron microscope/edax in the sintered multilayer tape.

Schroeder, James E.↗
NASA NTRS1991

Offset truss hex solar concentrator

A solar energy concentrator system comprises an offset reflector structure made up of a plurality of solar energy reflector panel sections interconnected with one another to form a piecewise approximation of a portion of a (parabolic) surface of revolution rotated about a prescribed focal axis. Each panel section is comprised of a plurality of reflector facets whose reflective surfaces effectively focus reflected light to preselected surface portions of the interior sidewall of a cylindrically shaped solar energy receiver. The longitudinal axis of the receiver is tilted at an acute angle with respect to the optical axis such that the distribution of focussed solar energy over the interior surface of the solar engine is optimized for dynamic solar energy conversion. Each reflector panel section comprises a flat, hexagonally shaped truss support framework and a plurality of beam members interconnecting diametrically opposed corners of the hexagonal framework recessed within which a plurality of (spherically) contoured reflector facets is disposed. The depth of the framework and the beam members is greater than the thickness of a reflector facet such that a reflector facet may be tilted (for controlling the effective focus of its reflected light through the receiver aperture) without protruding from the panel section.

White, John E.↗
NASA NTRS1981

Temperature stabilized linkage

A temperature compensated passive linkage for interconnecting two members having different coefficients of expansion. Preferably the linkage is utilized for interconnecting the stabilizer of a plane with its elevator. The stabilizer may be a graphite epoxy composite while the elevator may consist of aluminum-fiberglass. The differences in the rate of expansion of the two members is compensated by the linkage of the invention which in turn will move a side load hinge fitting to minimize aerodynamic and mechanical problems.

Ohgi, George Y.↗
NASA NTRS1984

Method of making an airfoil

An improved method of making an airfoil includes stacking plies in two groups. A separator ply is positioned between the two groups of plies. The groups of plies and the separator ply are interconnected to form an airfoil blank. The airfoil blank is shaped, by forging or other methods, to have a desired configuration. The material of the separator ply is then dissolved or otherwise removed from between the two sections of the airfoil blank to provide access to the interior of the airfoil blank. Material is removed from inner sides of the two separated sections to form core receiving cavities. After cores have been placed in the cavities, the two sections of the airfoil blank are interconnected and the shaping of the airfoil is completed. The cores are subsequently removed from the completed airfoil.

Moracz, Donald J.↗
NASA NTRS2001

Chip packaging technique

A hermetically sealed package for at least one semiconductor chip is provided which is formed of a substrate having electrical interconnects thereon to which the semiconductor chips are selectively bonded, and a lid which preferably functions as a heat sink, with a hermetic seal being formed around the chips between the substrate and the heat sink. The substrate is either formed of or includes a layer of a thermoplastic material having low moisture permeability which material is preferably a liquid crystal polymer (LCP) and is a multiaxially oriented LCP material for preferred embodiments. Where the lid is a heat sink, the heat sink is formed of a material having high thermal conductivity and preferably a coefficient of thermal expansion which substantially matches that of the chip. A hermetic bond is formed between the side of each chip opposite that connected to the substrate and the heat sink. The thermal bond between the substrate and the lid/heat sink may be a pinched seal or may be provided, for example by an LCP frame which is hermetically bonded or sealed on one side to the substrate and on the other side to the lid/heat sink. The chips may operate in the RF or microwave bands with suitable interconnects on the substrate and the chips may also include optical components with optical fibers being sealed into the substrate and aligned with corresponding optical components to transmit light in at least one direction. A plurality of packages may be physically and electrically connected together in a stack to form a 3D array.

Jayaraj, Kumaraswamy↗
NASA NTRS1976

Dual mode solid state power switch

A solid state amplifier has an output transistor stage and an input transistor stage interconnected as a Darlington circuit. An interstage transistor interconnecting the collectors of the two stages of the Darlington circuit is connected with the first stage transistor in a compound configuration. When the load current furnished by the amplifier is less than a predetermined value, the output stage operates as a simple saturated switch with its base drive current flowing through the emitter-base junction of the first stage which produces no collector current because the base-emitter junction of the interstage transistor is reverse-biased. When the load current exceeds said predetermined value, the interstage transistor begins to conduct allowing the input and output stages to operate as a Darlington amplifier and diverting a significant portion of the base drive current of the output transistor back into the load.

Maus, Louis C.↗
NASA NTRS1982

Solar array construction

An interconnect tab on each cell of a first set of circular solar cells connects that cell in series with an adjacent cell in the set. This set of cells is arranged in alternate columns and rows of an array and a second set of similar cells is arranged in the remaining alternate columns and rows of the array. Three interconnect tabs on each solar cell of the said second set are employed to connect the cells of the second set to one another, in series and to connect the cells of the second set to those of the first set in parallel. Some tabs (making parallel connections) connect the same surface regions of adjacent cells to one another and others (making series connections) connect a surface region of one cell to the opposite surface region of an adjacent cell; however, the tabs are so positioned that the array may be easily assembled by depositing the cells in a certain sequence and in proper orientation.

Crouthamel, Marvin S.↗
NASA NTRS1986

Method of making an airfoil

An improved method of making an airfoil includes stacking plies in two groups. A separator ply is positioned between the two groups of plies. The groups of plies and the separator ply are interconnected to form an airfoil blank. The airfoil blank is shaped, by forging or other methods, to have a desired configuration. The material of the separator ply is then dissolved or otherwise removed from between the two sections of the airfoil blank to provide access to the interior of the airfoil blank. Material is removed from inner sides of the two separated sections to form core receiving cavities. After cores have been placed in the cavities, the two sections of the airfoil blank are interconnected and the shaping of the airfoil is completed. The cores are subsequently removed from the completed airfoil.

Moracz, Donald J.↗