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At least 487 records · Page 27

Enabling Radiation Tolerant Systems for Space

A hazard to all spacecraft orbiting the Earth is the existence of a harsh environment with its subsequent effects. The effects can provide damaging or even disabling effects on spacecraft and its instruments. One of the most recognized and serious of the different space environments is ionizing radiation and its effects on spacecraft and spacecraft systems. This is increasingly becoming more of an issue for all missions due to the use of lighter composite materials, smaller satellites, and smaller electronics. NASA's Space Environments and Effects (SEE) Program was established to develop new plateaus of technical capability to reduce the cost of NASA's missions and provide leading-edge exploratory and focused technology to promote continued U.S. preeminence in space. The SEE Program has an "Implementation Plan" to develop roadmaps and fund technical tasks to enable radiation systems for space.

Kauffman, Billy↗

Strain Gages in use at NASA Langley: A Technical Review

Surface mounted strain gages and strain gage application techniques are as varied as they are versatile. There is an abundance of technical literature, available throughout the strain gage community, offering techniques for installing strain gages and methods of obtaining useful information from them. This paper, while providing more of the same, will focus its discussions on recent Langley developments for using strain gages reliably and accurately in very harsh environments. With Langley's extensive use of wind tunnel balances, its ongoing effort in materials development, and its currently focused activities in structural testing, the use of strain gages in unusual and demanding environments has led to several innovative improvements in the "how to gage it" department. Several of these innovations will be addressed that hopefully will provide some practical information for the strain gage user who is finding the test environment and (or) the materials to be tested too demanding for previously utilized strain gage application technology. Specifically, this paper will include discussions in the following three areas: (1) technical considerations when gaging cryogenic wind tunnel balances, including areas for improving accuracy and reliability; (2) addressing technical difficulties associated with gaging composite test articles and certain alloys for testing at temperatures approaching -450F, or elevated temperatures up to 350F, or both temperatures inclusive during the same test scenario; (3) gaging innovations for testing metal/matrix and carbon/carbon composites at temperatures above 700F.

Moore, Thomas C., Sr.↗

Rare Earth Optical Temperature Sensor

A new optical temperature sensor suitable for high temperatures (greater than 1700 K) and harsh environments is introduced. The key component of the sensor is the rare earth material contained at the end of a sensor that is in contact with the sample being measured. The measured narrow wavelength band emission from the rare earth is used to deduce the sample temperature. A simplified relation between the temperature and measured radiation was verified experimentally. The upper temperature limit of the sensor is determined by material limits to be approximately 2000 C. The lower limit, determined by the minimum detectable radiation, is found to be approximately 700 K. At high temperatures 1 K resolution is predicted. Also, millisecond response times are calculated.

Chubb, Donald L.↗

Durability Evaluation of a Thin Film Sensor System With Enhanced Lead Wire Attachments on SiC/SiC Ceramic Matrix Composites

An advanced thin film sensor system instrumented on silicon carbide (SiC) fiber reinforced SiC matrix ceramic matrix composites (SiC/SiC CMCs), was evaluated in a Mach 0.3 burner rig in order to determine its durability to monitor material/component surface temperature in harsh environments. The sensor system included thermocouples in a thin film form (5 microns thick), fine lead wires (75 microns diameter), and the bonds between these wires and the thin films. Other critical components of the overall system were the heavy, swaged lead wire cable (500 microns diameter) that contained the fine lead wires and was connected to the temperature readout, and ceramic attachments which were bonded onto the CMCs for the purpose of securing the lead wire cables, The newly developed ceramic attachment features a combination of hoops made of monolithic SiC or SiC/SiC CMC (which are joined to the test article) and high temperature ceramic cement. Two instrumented CMC panels were tested in a burner rig for a total of 40 cycles to 1150 C (2100 F). A cycle consisted of rapid heating to 1150 C (2100 F), a 5 minute hold at 1150 C (2100 F), and then cooling down to room temperature in 2 minutes. The thin film sensor systems provided repeatable temperature measurements for a maximum of 25 thermal cycles. Two of the monolithic SiC hoops debonded during the sensor fabrication process and two of the SiC/SiC CMC hoops failed during testing. The hoops filled with ceramic cement, however, showed no sign of detachment after 40 thermal cycle test. The primary failure mechanism of this sensor system was the loss of the fine lead wire-to-thin film connection, which either due to detachment of the fine lead wires from the thin film thermocouples or breakage of the fine wire.

Lei, Jih-Fen↗

Long Term Degradation of Resin for High Temperature Composites

The durability of polymer matrix composites exposed to harsh environments is a major concern. Surface degradation and damage are observed in polyimide composites used in air at 125 to 300 C. It is believed that diffusion of oxygen into the material and oxidative chemical reactions in the matrix are responsible. Previous work has characterized and modeled diffusion behavior, and thermogravimetric analyses (TGAs) have been carried out in nitrogen, air, and oxygen to provide quantitative information on thermal and oxidative reactions. However, the model developed using these data was not able to capture behavior seen in isothermal tests, especially those of long duration. A test program that focuses on lower temperatures and makes use of isothermal tests was undertaken to achieve a better understanding of the degradation reactions under use conditions. A new low-cost technique was developed to collect chemical degradation data for isothermal tests lasting over 200 hr in the temperature range 125 to 300 C. Results indicate complex behavior not captured by the previous TGA tests, including the presence of weight-adding reactions. Weight gain reactions dominated in the 125 to 225 C temperature range, while weight loss reactions dominated beyond 225 C. The data obtained from isothermal tests was used to develop a new model of the material behavior. This model was able to fully capture the behavior seen in the tests up to 275 C. Correlation of the current model with both isothermal data at 300 C and high rate TGA test data is mediocre. At 300 C and above, the reaction mechanisms appear to change. Attempts (which failed) to measure non-oxidative degradation indicate that oxidative reactions dominate the degradation at low temperatures. Based on this work, long term isothermal testing in an oxidative atmosphere is recommended for studying the degradation behavior of this class of materials.

Patekar, Kaustubh A.↗

Electro-Active Polymer (EAP) Actuators for Planetary Applications

NASA is seeking to reduce the mass, size, consumed power, and cost of the instrumentation used in its future missions. An important element of many instruments and devices is the actuation mechanism and electroactive polymers (EAP) are offering an effective alternative to current actuators. In this study, two families of EAP materials were investigated, including bending ionomers and longitudinal electrostatically driven elastomers. These materials were demonstrated to effectively actuate manipulation devices and their performance is being enhanced in this on-going study. The recent observations are reported in this paper, include the operation of the bending-EAP at conditions that exceed the harsh environment on Mars, and identify the obstacles that its properties and characteristics are posing to using them as actuators. Analysis of the electrical characteristics of the ionomer EAP showed that it is a current driven material rather than voltage driven and the conductivity distribution on the surface of the material greatly influences the bending performance. An accurate equivalent circuit modeling of the ionomer EAP performance is essential for the design of effective drive electronics. The ionomer main limitations are the fact that it needs to be moist continuously and the process of electrolysis that takes place during activation. An effective coating technique using a sprayed polymer was developed extending its operation in air from a few minutes to about four months. The coating technique effectively forms the equivalent of a skin to protect the moisture content of the ionomer. In parallel to the development of the bending EAP, the development of computer control of actuated longitudinal EAP has been pursued. An EAP driven miniature robotic arm was constructed and it is controlled by a MATLAB code to drop and lift the arm and close and open EAP fingers of a 4-finger gripper. Keywords: Miniature Robotics, Electroactive Polymers, Electroactive Actuators, EAP Materials

Bar-Cohen, Y.↗

Development of Electronics for Low Temperature Space Missions

The operation of electronic systems at cryogenic temperatures is anticipated for many future NASA space missions such as deep space probes and planetary surface exploration. For example, an unheated interplanetary probe launched to explore the rings of Saturn would reach an average temperature near Saturn of about -183 C. In addition to surviving the deep space harsh environment, electronics capable of low temperature operation would contribute to improving circuit performance, increasing system efficiency, and reducing payload development and launch costs. Terrestrial applications where components and systems must operate in low temperature environments include cryogenic instrumentation, superconducting magnetic energy storage, magnetic levitation transportation system, and arctic exploration. An on-going research and development program on low temperature electronics at the NASA Glenn Research Center focuses on the development of efficient power systems capable of surviving and exploiting the advantages of low temperature environments. Inhouse efforts include the design, fabrication, and characterization of low temperature power systems and the development of supporting technologies for low temperature operations, such as dielectric and insulating materials, semiconductor devices, passive power components, opto-electronic devices, as well as packaging and integration of the developed components into prototype flight hardware.

Patterson, Richard L.↗

Modeling of Horns for Sonic/Ultrasonic Applications

JPL has a requirement for telerobotic tools for planetary sample acquisition, which require low power and have the ability to work in harsh environments. We are currently investigating the possibility of using ultrasonic horns to develop a family of ultrasonic tools for these environments. In an effort to determine control parameters a one-dimensional Mason's model for a stepped ultrasonic horn assembly was developed which includes the effects of mechanical and electrical losses in the piezoelectric material and acoustic elements. The model is separated into three regions; the piezoelectric stack including stress bolt the backing layer and the horn. The model is found to predict the impedance data of the horn assembly very accurately up to the first coupled (radial) resonance. The model also allows for the calculation of the velocity and force and power delivered to each acoustic element. FEM modeling and accelerometer data from the horn tip were used to corroborate the model. The difficulties associated with modeling the load impedance of various devices will be discussed and current directions noted.

Sherrit, Stewart↗

Technical Challenges in Reliable Microelectronics Packaging of Microelectromechanical Systems (MEMS) for Space Applications

MEMS have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, chemical sensors, artificial nose, etc. Standard semiconductor microelectronics packaging needs the integrated circuits (IC) to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the reliable IC packaging technology. Active elements or microstructures in MEMS devices often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it measures to assure the packaging technology of MEMS. MEMS technology has a major application in developing a microspacecraft for space systems provided reliability of MEMS packaging technology is sufficiently addressed. This MEMS technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively. This paper discusses the latest developments in the MEMS technology and challenging technical issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices for microspacecraft applications.

Ramesham, Rajeshuni↗

Assessment and Assurance of Microelectronics Packaging Technology of Microelectromechanical Systems (MEMS)

Microelectromechanical systems (MEMS) have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, etc. Standard semiconductor microelectronics packaging needs the integrated circuits to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the packaging technology. In the case of MEMS the microstructures (active elements) often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it 'measures to assure the MEMS technology by lowering the risk to zero. MEMS technology has a major application in developing a microspacecraft for space systems provided assurance of MEMS technology is sufficiently addressed nondestructively. This technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's safety and mission assurance goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively by teaming-up with the other NASA centers using the limited resources available. This paper discusses the latest developments in the MEMS technology and challenging issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices based on silicon, poly-silicon, and other materials for microspacecraft applications considering the space environment and reliability assurance qualification guidelines in perspective. Acknowledgments: The above research work is supported by the NASA Electronics Parts and Packaging Program (NEPP) and performed by the Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA under a contract with the NASA - Code Q for the Office of Safety and Mission Assurance Program 323-79.

Ramesham, Rajeshuni↗

Space Environmental Effects Testing and Characterization of the Candidate Solar Sail Material Aluminized Mylar

The usage of solar sails as a propellantless propulsion system has been proposed for many years. The technical challenges associated with solar sails are fabrication of ultralightweight films, deploying the sails and controlling the spacecraft. Integral to all these challenges is the mechanical property integrity of the sail while exposed to the harsh environment of space. This paper describes testing and characterization of a candidate solar sail material, Aluminized Mylar. This material was exposed to a simulated Geosynchronous Transfer Orbit (GTO) and evaluated by measuring thermooptical and mechanical property changes. Testing procedures and results are presented.

Edwards, D. L.↗

So What's an RTG and Are They Safe?

When one considers space missions to the outer edges of our solar system and far beyond, our sun cannot be relied on to produce the required spacecraft (s/c) power. Solar energy diminishes as the square of the distance from the Sun. At Mars it is only 43% of that at earth. At Jupiter, it falls off to only 3.6% of Earth's. By the time we get out to Pluto, solar energy is only .066% what it is on Earth. Beyond the orbit of Mars, it is not practical to depend on solar power for a s/c. However, the farther out we go the more power we need to heat the s/c and to transmit data back to Earth over the long distances. On Earth, knowledge is power. In the outer solar system, power is knowledge. Solar arrays only operate at 19% efficiency, are very vulnerable to damage from radiation and temperature extremes, and cannot be used for even nearby missions that operate in extended darkness, or under the surface of a planet or moon. Twenty-six U.S. space missions, from the Transit to Cassini, have used radioisotope power systems and heater units to take s/c to the far reaches of our solar system and have demonstrated an outstanding record of safety and reliability. Radioisotope thermoelectric generators (RTG's) have proven to be safe, reliable, maintenance-free, and capable of providing both thermal and electrical power for decades under the harsh environments of deep space. RTG's have no problem operating in the high radiation belts of space, the extreme temperatures, or the severe dust storms of Mars, and they have proven to be the most reliable power source ever flown on U.S. s/c. For example, the two Pioneer s/c operated for more than two decades and the Voyager s/c may last for 40 years. RTG's are not nuclear reactors, they serve only as power generators and are not involved in the propulsion of the s/c. They operate on the principle of thermoelectric generation that converts heat directly into electricity, they have no moving parts, are extremely reliable, and have met or exceeded all safety and performance expectations. Federal laws and regulations require analysis and evaluation of the safety risks and any potential environmental impacts. Extensive safety testing of RTG's and RTG components has been performed by the U.S. Department of Energy (DOE) to demonstrate the ability to survive accidents related to Space Shuttle launches and assure that the systems would be safe under all accident conditions, including accidents at or near the launch pad or during orbital reentry. Many design improvements have been made over the four decades that RTG's have been flown on space missions. This paper outlines the operation and safety standards of RTG's and the advanced developments expected to be used on future deep space missions such as the Europa Orbiter, Pluto/Kuiper Express, Solar Probe, Europa Lander, and Titan Explorer missions.

Barret, Chris↗

Low Temperature Testing of a Radiation Hardened CMOS 8-Bit Flash Analog-to-Digital (A/D) Converter

Power processing electronic systems, data acquiring probes, and signal conditioning circuits are required to operate reliably under harsh environments in many of NASA:s missions. The environment of the space mission as well as the operational requirements of some of the electronic systems, such as infrared-based satellite or telescopic observation stations where cryogenics are involved, dictate the utilization of electronics that can operate efficiently and reliably at low temperatures. In this work, radiation-hard CMOS 8-bit flash A/D converters were characterized in terms of voltage conversion and offset in the temperature range of +25 to -190 C. Static and dynamic supply currents, ladder resistance, and gain and offset errors were also obtained in the temperature range of +125 to -190 C. The effect of thermal cycling on these properties for a total of ten cycles between +80 and - 150 C was also determined. The experimental procedure along with the data obtained are reported and discussed in this paper.

Gerber, Scott S.↗

Electronic Components and Systems for Cryogenic Space Applications

Electronic components and systems capable of operation at cryogenic temperatures are anticipated in many future NASA space missions such as deep space probes and planetary surface exploration. For example, an unheated interplanetary probe launched to explore the rings of Saturn would reach an average temperature near Saturn of about - 183 C. In addition to surviving the deep space harsh environment, electronics capable of low temperature operation would contribute to improving circuit performance, increasing system efficiency, and reducing payload development and launch costs. Terrestrial applications where components and systems must operate in low temperature environments include cryogenic instrumentation, superconducting magnetic energy storage, magnetic levitation transportation system, and arctic exploration. An on-going research and development program at the NASA Glenn Research Center focuses on the development of reliable electronic devices and efficient power systems capable of surviving in low temperature environments. An overview of the program will be presented in this paper. A description of the low temperature test facilities along with selected data obtained from in-house component testing will also be discussed. Ongoing research activities that are being performed in collaboration with various organizations will also be presented.

Patterson, R. L.↗

Modeling of Solid Waste Processing Options in BIO-Plex

BIO-Plex is a ground-based test bed currently under development by NASA for testing technologies and practices that may be utilized in future long-term life support missions. All aspects of such an Advanced Life Support (ALS) System must be considered to confidently construct a reliable system, which will not only allow the crew to survive in harsh environments, but allow the crew time to perform meaningful research. Effective handling of solid wastes is a critical aspect of the system, especially when recovery of resources contained in the waste is required. This is particularly important for ALS Systems configurations that include a Biomass Production Chamber. In these cases, significant amounts of inedible biomass waste may be produced, which can ultimately serve as a repository of necessary resources for sustaining life, notably carbon, water, and plant nutrients. Numerous biological and physicochemical solid waste processing options have been considered. Biological options include composting, aerobic digestion, and anaerobic digestion. Physicochemical options include pyrolysis, SCWO (supercritical water oxidation), various incineration configurations, microwave incineration, magnetically assisted gasification, and low temperature plasma reaction. Modeling of these options is a necessary step to assist in the design process. A previously developed top-level model of BIO-Plex implemented in MATLAB Simulink (r) for the use of systems analysis and design has been adopted for this analysis. Presently, this model only considered incineration for solid waste processing. Present work, reported here, includes the expansion of this model to include a wider array of solid waste processing options selected from the above options, bearing in mind potential, near term solid waste treatment systems. Furthermore, a trade study has also been performed among these solid waste processing technologies in an effort to determine the ideal technology for long-term life support missions.

Rodriguez, Luis F.↗

A Fiber-Optic Probe Design for Combustion Chamber Flame Detection Applications-Design Criteria, Performance Specifications, and Fabrication Technique

This paper documents the design and development of the fiber-optic probes utilized in the flame detection systems used in NASA Langley Research Center's 8-Foot High Temperature Tunnel (8-ft HTT). Two independent flame detection systems are utilized to monitor the presence and stability of the main-burner and pilot-level flames during facility operation. Due to the harsh environment within the combustor, the successful development of a rugged and efficient fiber-optic probe was a critical milestone in the development of these flame detection systems. The final optical probe design for the two flame detection systems resulted from research that was conducted in Langley's 7-in High Temperature Pilot Tunnel (7-in HTT). A detailed description of the manufacturing process behind the optical probes used in the 8-ft HTT is provided in Appendix A of this report.

Borg, Stephen E.↗

Aerothermal Instrumentation Loads To Implement Aeroassist Technology in Future Robotic and Human Missions to MARS and Other Locations Within the Solar System

The strategy of NASA to explore space objects in the vicinity of Earth and other planets of the solar system includes robotic and human missions. This strategy requires a road map for technology development that will support the robotic exploration and provide safety for the humans traveling to other celestial bodies. Aeroassist is one of the key elements of technology planning for the success of future robot and human exploration missions to other celestial bodies. Measurement of aerothermodynamic parameters such as temperature, pressure, and acceleration is of prime importance for aeroassist technology implementation and for the safety and affordability of the mission. Instrumentation and methods to measure such parameters have been reviewed in this report in view of past practices, current commercial availability of instrumentation technology, and the prospects of improvement and upgrade according to the requirements. Analysis of the usability of each identified instruments in terms of cost for efficient weight-volume ratio, power requirement, accuracy, sample rates, and other appropriate metrics such as harsh environment survivability has been reported.

Parmar, Devendra S.↗

Optical Scattering Characterization for the Glennan Microsystems Microscale Particulate Classifier

Small sensors that are tolerant to mechanically and thermally harsh environments present the possibility for in-situ particle characterization in propulsion, industrial, and planetary science applications. Under a continuing grant from the Glennan Microsystems Initiative to the Microgravity Fluids Physics Branch of the NASA-Glenn Research Center, a Microscale Particle Classifier (MiPAC) instrument is being developed. The MiPAC instrument will be capable of determining the size distribution of airborne particles from about 1 nm to 30 micrometers, and will provide partial information as to the concentration, charge state, shape, and structure of the particles, while being an order of magnitude smaller in size and lighter in weight than presently commercially available instruments. The portion of the instrument that will characterize the nm-range particles will employ electrical mobility techniques and is being developed under a separate grant to Prof. David Pui of the University of Minnesota. The portion of the instrument that will characterize the micrometer-size particles such as dirt, pollens, spores, molds, soot, and combustion aerosols will use light scattering techniques. The development of data analysis techniques to be employed in the light scattering portion of the instrument is covered by this grant.

Lock, James A.↗