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At least 487 records · Page 27

The determination of minority carrier lifetimes in direct band-gap semiconductors by monitoring intensity-modulated luminescence radiation

When an extrinsic, direct band-gap semiconductor sample is irradiated by photons of an energy higher than the energy of the band gap between valence and conduction bands, excess electron-hole pairs are generated which, while diffusing through the sample, produce luminescence via radiative recombination. If, furthermore, the intensity of the impinging beam of photons is modulated sinusoidally, the luminescence radiation escaping from the sample will be phase shifted with respect to the original photon beam in a characteristic way. It will be shown that by measuring the phase shift at different modulation frequencies, the Shockley-Read-Hall lifetime of minority carriers may be ascertained. The method is nondestructive inasmuch as there is no need to fabricate p-n junctions or Ohmic contacts, nor is it necessary to remove already existing Ohmic contacts of angle lap the surface, etc., procedures often needed when determining lifetimes with the scanning electron microscope (in which case a p-n junction must be present).

Von Roos, O.↗

Rapid adhesive bonding concepts for specimen and panel fabrication and field repair

The NASA Langley Research Center has developed bonding concepts for aerospace composite materials which employ induction heating to directly apply heat to the bond line and/or adherends without simultaneously heating the entire structure, supports, and fixtures of a bonding assembly. These methods have demonstrated bonding process time reductions of two to three orders of magnitude, by comparison with conventional press molding. Attention is presently given to rapid adhesive bonding for lap shear specimens for aerospace panel bonding or field repair, as well as for the field repair requirements of metallic and advanced polymeric matrix composite structures.

Stein, B. A.↗

Semi-2-interpenetrating polymer networks of high temperature systems

A semi-interpenetrating (semi-IPN) polymer system of the semi-2-IPN type is described in which a polymer of acetylene-terminated imidesulfone (ATPISO2) is cross linked in the presence of polyimidesulfone (PISO2). Six different formulations obtained by mixing of either ATPISO2-1n or ATPISO2-3n with PISO2 in three different proportions were characterized in terms of glass transition temperature, thermooxidative stability, inherent viscosity, and dynamic mechanical properties. Adhesive (lap shear) strength was tested at elevated temperatures on aged samples of adhesive scrim cloth prepared from each resin. Woven graphite (Celion 1000)/polyimide composites were tested for flexural strength, flexural modulus, and shear strength. The network polymers have properties intermediate between those of the component polymers alone, have greatly improved processability over either polyimide, and are able to form good adhesive bonds and composites, making the semi-2-IPN systems superior materials for aerospace structures.

Hanky, A. O.↗

Measuring Hole Elongation in Bolted Joints

Measurement does not affect joint parameters. Verification of analytical and strength-prediction methods for bolted composite joints based generally on data obtained experimentally from double-lap-joint specimens. In mechanically fastened joints, stresses maximal at fastener holes. Ability to measure accurately hole elongations without affecting joint parameters provides better understanding of elastic and plastic behavior of joint material leading to failure mechanisms in mechanically fastened joints required for design of more-efficient, lightweight composite joints.

Wichorek, G. R.↗

Solid-state Bonding of Superplastic Aluminum Alloy 7475 Sheet

Experimental works were carried out to study the feasibility of solid state bonding of superplastic aluminum 7475 sheet. Amount of deformation, bonding time, surface cleaning method and intermediate layer were the process parameters investigated. Other parameters, held constant by the superplastic forming condition which is required to obtain a concurrent solid state bonding, are bonding temperature, bonding pressure and atmosphere. Bond integrity was evaluated through metallographic examination, X-ray line scan analysis, SEM fractographic analysis and lap shear tests. The early results of the development program indicated that sound solid state bonding was accomplished for this high strength 7475 alloy with significant amounts of deformation. A thin intermediate layer of the soft 5052 aluminum alloy aided in achieving a solid state bonding by reducing the required amount of plastic deformation at the interface. Bond strength was substantially increased by a post bond heat treatment.

Byun, T. D. S.↗

Comparison of Bond in Roll-bonded and Adhesively Bonded Aluminums

Lap-shear and peel test measurements of bond strength have been carried out as part of an investigation of roll bonding of 2024 and 7075 aluminum alloys. Shear strengths of the bonded material in the F temper are in the range of 14 to 16 ksi. Corresponding peel strengths are 120 to 130 lb/inch. These values, which are three to five times those reported in the literature for adhesively bonded 2024 and 7075, are a result of the true metallurgical bond achieved. The effects of heat-treating the bonded material are described and the improvements in bond strength discussed relative to the shear strength of the parent material. The significance of the findings for aerospace applications is discussed.

Schwensfeir, R. J., Jr.↗

High-temperature Adhesive Development and Evaluation

High-temperature adhesive systems are evaluated for short and long-term stability at temperatures ranging from 232C to 427C. The resins selected for characterization include: NASA Langley developed polyphenylquinoxaline (PPQ), and commercially available polyimides (PI). The primary method of bond testing is single lap shear. The PPQ candidates are evaluated on 6A1-4V titanium adherends with chromic acid anodize and phosphate fluoride etch surface preparations. The remaining adhesives are evaluated on 15-5 PH stainless steel with a sulfuric acid anodize surface preparation. Preliminary data indicate that the PPQ adhesives tested have stability to 3000 hours at 450F with chromic acid anodize surface preparation. Additional studies are continuing to attempt to improve the PPQ's high-performance by formulating adhesive films with a boron filler and utilizing the phosphate fluoride surface preparation on titanium. Evaluation of the polyimide candidates on stainless-steel adherends indicates that the FM-35 (American Cyanamid), PMR-15 (U.S. Polymeric/Ferro), TRW partially fluorinated polyimide and NR 150B2S6X (DuPont) adhesives show sufficient promise to justify additional testing.

Hendricks, C. L.↗

Factors Affecting the Processing of Epoxy Film Adhesives

The increasing awareness that adhesive performance is controlled not only by the condition of the adherend surface but also the condition or state of the adhesive and the process parameters used during fabrication is expected to result in improved reliability, as well as bond performance. The critical process variables which have been found to control adhesive bond formation and ultimate bond strength in 250F and 350F curing epoxy adhesives are described in terms of fabrication parameters and adhesive characteristics. These include the heat-up rate and cure temperature during processing and the adhesive moisture content and age condition (degree of advancement). The diagnostic methods used to delineate the effects of these process variables on adhesive performance are illustrated. These are dielectric, thermomechanical (TMA) and dynamic mechanical (DMA) analyses. Correlation of test results with measured mechanical tensile lap shear strengths of bonded joints is presented and the results briefly discussed in terms of the additives and hardeners used in the adhesive systems.

Pike, R. A.↗

Rapid adhesive bonding and field repair of aerospace materials

Adhesive bonding in the aerospace industry typically utilizes autoclaves or presses which have considerable thermal mass. As a consequence, the rates of heatup and cooldown of the bonded parts are limited and the total time and cost of the bonding process are often relatively high. Many of the adhesives themselves do not inherently require long processing times. Bonding could be performed rapidly if the heat was concentrated in the bond lines or at least in the adherends. Rapid Adhesive Bonding concepts are developed to utilize induction heating techniques to provide heat directly to the bond line and/or adherends without heating the entire structure, supports, and fixtures of a bonding assembly. Bonding times for specimens can be cut by a factor of 10 to 100 compared to standard press or autoclave bonding. The development of Rapid Adhesive Bonding for lap shear specimens (per ASTM D1002 and D3163), for aerospace panel or component bonding, and for field repair needs of metallic and advanced fiber reinforced polymeric-matrix composite structures is reviewed. Equipment and procedures are described for bonding and repairing thin sheets, simple geometries, and honeycomb core panels.

Stein, B. A.↗

Mixed-mode cyclic debonding of adhesively bonded composite joints

A combined experimental-analytical investigation to characterize the cyclic failure mechanism of a simple composite-to-composite bonded joint is conducted. The cracked lap shear (CLS) specimens of graphite/epoxy adherend bonded with EC-3445 adhesive are tested under combined mode 1 and 2 loading. In all specimens tested, fatigue failure occurs in the form of cyclic debonding. The cyclic debond growth rates are measured. The finite element analysis is employed to compute the mode 1, mode 2, and total strain energy release rates (i.e., GI, GII, and GT). A wide range of mixed-mode loading, i.e., GI/GII ranging from 0.03 to 0.38, is obtained. The total strain energy release rate, G sub T, appeared to be the driving parameter for cyclic debonding in the tested composite bonded system.

Rezaizadeh, M. A.↗

Evaluation of high temperature structural adhesives for extended service, phase 4

The evaluation of three phenylquinoxaline polymers as high temperature structural adhesives is presented. These included an experimental crisskubjabke oiktner (X-PQ) and two experimental materials (PPQ-2501) and (PPQ-HC). Lap shear, crack extension, and climing drum peel specimens were fabricated from all three polymers, and tested after thermal, combined thermal/humidity, and stressed Skydrol exposure. All three polymers generally performed well as adhesives at initial test temperatures from 219K (-67 F) to 505K (450 F) and after humidity exposure. The 644K (700 F) cured test specimens exhibited superior Skydrol resistance and thermal stability at 505K (450 F) when compared to the 602K (625 F) cured test specimens.

Hendricks, C. L.↗

NASA seat experiment and occupant responses

Results of the crash test of a remotely piloted transport aircraft instrumented to measure a NASA energy-absorbing transport seat are given. Human tolerance limits to acceleration and a dynamic response index model are discussed. It was found that the acceleration levels at the rear of the airplane were quite low and were below the stroking threshold of the NASA EA-seat. Therefore, dummies in the standard and EA-seat responded approximately the same. All longitudinal accelerations were quite low for the primary impact with very low forces measured in the lap belts. The vertical (spineward) acceleration levels measured in the dummies were also relatively low and very survivable from an impact tolerance standpoint. The pilot with an 18 G peak acceleration received by far the highest vertical acceleration and could have possibly received slight spinal injury.

Fasanella, E. L.↗

The application of thermodynamic and spectroscopic techniques to adhesion in the polyimide/Ti 6-4 and polyphenylquinoxaline/Ti 6-4 systems

The results of calorimetric measurements of Ti adherend surfaces are presented. The measurements were carried out after several chemical pretreatments and after fracture of several lap shear samples aged at high temperature. The exact composition of the Ti samples was Ti(6 percent Al-4 percent V). The adhesives used were polyimides and polyphenylquinoxalines (PPQ). Each chemical pretreatment was accompanied by a unique spectroscopic feature which was characterized by XPS, SEM, and specular reflectance infrared spectroscopy. The energetics of the interaction between primer solutions and the Ti adherend were evaluated by microcalorimetry. Changes in the structure of the surface oxide layer upon heating of the adherend were deduced from immersion temperatures of the PI and PPQ solutions. The XPS and SEM data are given is a table.

Dias, S.↗

Evaluation of high temperature structural adhesives for extended service

The preliminary evaluation of crosslinked polyphenyl quinoxaline (X-PPQ), LARC-TPI, ethyl terminated polysulfone (ETPS), and crosslinked polyimide (X-PI) as adhesives is presented. Lap shear strength stability under thermal, combined thermal/humidity, and stressed and unstressed Skydrol exposure was determined. The X-PPQ, LARC-TPI, and X-PI exhibited good adhesive performance at 505K (450 F) after 1000 hours at 505K. These three polymers also performed well after exposure to combined elevated temperature/high humidity, as well as, to Skydrol while under stress. The ETPS exhibited good ambient temperature adhesive properties, but performed poorly under all other exposure conditions, presumably due to inadequate chain extension and crosslinking.

Hendricks, C. L.↗

A fracture mechanics approach for designing adhesively bonded joints

An analytical and experimental investigation was undertaken to determine if the adhesive debond initiation stress could be predicted for arbitrary joint geometries. The analysis was based upon a threshold total strain-energy-release rate (Gth) concept. Two bonded systems were tested: T300/5208 graphite/epoxy adherends bonded with either EC-3445 or FM-300 adhesive. The Gth for each adhesive was determined from cracked-lap-shear (CLS) specimens by initiation tests. Finite-element analyses of various tapered CLS specimen geometries predicted the specimen stress at which the total strain-energy-release rate (GT) equaled Gth at the joint tip. Experiments verified the predictions. The approach described herein predicts the maximum stress at which an adhesive joint can be cycled yet not debond. Furthermore, total strain-energy-release rate appeared to be the driving parameter for cyclic debonding and debond initiation in structural adhesives. In addition, debond initiation and growth were found to occur with virtually no peel stress present.

Johnson, W. S.↗

Repeatability of mixed-mode adhesive debonding

The repeatability of debond growth rates in adhesively bonded subjected to constant-amplitude cyclic loading was studied. Debond growth rates were compared from two sets of cracked-lap-shear specimens that were fabricated by two different manufacturers and tested in different laboratories. The fabrication method and testing procedures were identical or both sets of specimens. The specimens consisted of aluminum adherends bonded with FM-73 adhesive. Critical values of strain-energy-release rate were also determined from specimens that were monotonically loaded to failure. The test results showed that the debond growth rates for the two sets of specimens were within a scatter band which is similar to that observed in fatigue crack growth in metals. Cyclic debonding occurred at strain-energy-release rates that were more than an order of magnitude less than the critical strain-energy-release rate in static tests.

Everett, R. A., Jr.↗

Characterization of Mode I and mixed-mode delamination growth in T300/5208 graphite/epoxy

The roles played by Mode I and Mode II strain-energy release rates (G-I and G-II, respectively) in inducing delamination growth under static and fatigue loading were investigated, using T300/5208 graphite/epoxy specimens. Double cantilever beam (DCB) specimens and cracked lap shear (CLS) specimens were used for pure Mode I and mixed-mode tests, respectively. Fatigue-induced delamination growth was characterized by constant-amplitude fatigue tests at a minimum to maximum cyclic load ratio of 0.05 and a frequency of 10 Hz. During the tests, the maximum and minimum strain-energy release rates (Gmax, Gmin) and the delamination growth rate (da/dN) were monitored. Static tests on mixed-mode CLS specimens measured the total strain-energy release rate, which was broken into G-I and G-II components using finite-element analysis. A power-law relationship between da/dN and G-Imax, and da/dN and Gmax were obtained from fatigue test results on DCB and CLS specimens, respectively. The power law for a pure Mode II delamination was derived from CLS results by subtracting the contribution due to G-I.

Ramkumar, R. L.↗

Process optimization of a thermoplastic polyimidesulphone

The detailed characterization of an experimental thermoplastic polyimidesulfane adhesive based on 3,3 prime-diaminodiphenylsulfone and 3,3 prime,4,4 prime-benzophenone tetracarboxylic dianhydride was studied. Model compounds were also examined. Thermal cyclization of the amide-acid to the imide was studied by a variety of techniques including DSC, TGA, MS, in situ diffuse reflectance-FTIR, and flow measurement. Characterizations were continued during the processing of adhesive tapes and the fabrication, bonding, and testing of lap shear specimens. Results provide fundamental insights into the role of cure chemistry, and the effects of residual solvent and volatile produces on processing and performance. These insights and the resulting chemical models should lead to more efficient processing cycles for these and other related thermoplastic adhesive systems.

Dezern, J. F.↗