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At least 469 records · Page 26

NiAl Coatings Investigated for Use in Reusable Launch Vehicles

As part of its major investment in the area of advanced space transportation, NASA is developing new technologies for use in the second- and third-generation designs of reusable launch vehicles. Among the prototype rocket engines being considered for these launch vehicles are those designed to use liquid hydrogen as the fuel and liquid oxygen as the oxidizer. Advanced copper alloys, such as copper-chromium-niobium (Cu-8(at.%)Cr- 4(at.%)Nb, also referred to as GRCop-84), which was invented at the NASA Glenn Research Center, are being considered for use as liner materials in the combustion chambers and nozzle ramps of these engines. However, previous experience has shown that, in rocket engines using liquid hydrogen and liquid oxygen, copper alloys are subject to a process called blanching, where the material undergoes environmental attack under the action of the combustion gases. In addition, the copper alloy liners undergo thermomechanical fatigue, which often results in an initially square cooling channel deforming into a dog-house shape. Clearly, there is an urgent need to develop new coatings to protect copper liners from environmental attack inside rocket chambers and to lower the temperature of the liners to reduce the probability of deformation and failure by thermomechanical fatigue.

Raj, Sai V.↗

Life Predicted in a Probabilistic Design Space for Brittle Materials With Transient Loads

Analytical techniques have progressively become more sophisticated, and now we can consider the probabilistic nature of the entire space of random input variables on the lifetime reliability of brittle structures. This was demonstrated with NASA s CARES/Life (Ceramic Analysis and Reliability Evaluation of Structures/Life) code combined with the commercially available ANSYS/Probabilistic Design System (ANSYS/PDS), a probabilistic analysis tool that is an integral part of the ANSYS finite-element analysis program. ANSYS/PDS allows probabilistic loads, component geometry, and material properties to be considered in the finite-element analysis. CARES/Life predicts the time dependent probability of failure of brittle material structures under generalized thermomechanical loading--such as that found in a turbine engine hot-section. Glenn researchers coupled ANSYS/PDS with CARES/Life to assess the effects of the stochastic variables of component geometry, loading, and material properties on the predicted life of the component for fully transient thermomechanical loading and cyclic loading.

Nemeth, Noel N.↗

Characterization of Nonlinear Rate Dependent Response of Shape Memory Polymers

Shape Memory Polymers (SMPs) are a class of polymers, which can undergo deformation in a flexible state at elevated temperatures, and when cooled below the glass transition temperature, while retaining their deformed shape, will enter and remain in a rigid state. Upon heating above the glass transition temperature, the shape memory polymer will return to its original, unaltered shape. SMPs have been reported to recover strains of over 400%. It is important to understand the stress and strain recovery behavior of SMPs to better develop constitutive models which predict material behavior. Initial modeling efforts did not account for large deformations beyond 25% strain. However, a model under current development is capable of describing large deformations of the material. This model considers the coexisting active (rubber) and frozen (glass) phases of the polymer, as well as the transitions between the material phases. The constitutive equations at the continuum level are established with internal state variables to describe the microstructural changes associated with the phase transitions. For small deformations, the model reduces to a linear model that agrees with those reported in the literature. Thermomechanical characterization is necessary for the development, calibration, and validation of a constitutive model. The experimental data reported in this paper will assist in model development by providing a better understanding of the stress and strain recovery behavior of the material. This paper presents the testing techniques used to characterize the thermomechanical material properties of a shape memory polymer (SMP) and also presents the resulting data. An innovative visual-photographic apparatus, known as a Vision Image Correlation (VIC) system was used to measure the strain. The details of this technique will also be presented in this paper. A series of tensile tests were performed on specimens such that strain levels of 10, 25, 50, and 100% were applied to the material while it was above its glass transition temperature. After deforming the material to a specified applied strain, the material was then cooled to below the glass transition temperature (Tg) while retaining the deformed shape. Finally, the specimen was heated again to above the transition temperature, and the resulting shape recovery profile was measured. Results show that strain recovery occurs at a nonlinear rate with respect to time. Results also indicate that the ratio of recoverable strain/applied strain increases as the applied strain increases.

Volk, Brent↗

Cryogenic Shrouds for Testing Thermal-Insulation Panels

Cryogenic shrouds have been designed and built for use in thermomechanical testing of samples of thermalinsulation panels on cryogenic vessels. In the original application for which these shrouds were specifically designed, the samples are representative of the large-area thermal-insulation panels on the space-shuttle external tanks that hold liquid hydrogen and liquid oxygen, and the purpose of the testing is to demonstrate the ability of bonded layers in the panels to resist delamination under a combination of applied uniaxial mechanical loads and realistic operational temperatures. Presumably, the shrouds and the tests performed by use of them could be modified to enable similar evaluation of thermomechanical properties of thermal-insulation panels for cryogenic vessels other than the external tanks of the space shuttles. The shrouds are required to enable maintenance of required temperatures on the inner and outer surfaces of the thermal-insulation-panel samples, to enable visual observation of the outer surfaces of the samples, and not to introduce any measurable loads into the panels. For each panel sample, there are two shrouds: one to be mounted on the inner surface (the surface that would be in contact with a tank containing a cryogenic liquid during normal use) and one to be mounted on the outer surface (the surface that would be exposed to ambient air or other warmer environment during normal use). The shrouds for testing specimens of thermal-insulation- panels for the liquid-hydrogen tank are made largely of titanium; the shrouds for testing specimens of thermal- insulation-panels for the liquid-oxygen tank are made largely of an aluminum- lithium alloy. The specific temperature requirements are the following: The inner shroud must make it possible to maintain a temperature of 321 degrees F (196 degrees C) [the approximate temperature of liquid nitrogen] or 453 F (about 269 C) [the approximate temperature of liquid helium] on the inner face of the sample. The outer shroud must make it possible to maintain a temperature between 30 degrees and 0 degrees F (between about 34 degrees and about 18 degrees C) on the outer surface of the sample by blowing a cryogenic gas or missile grade air along that surface. To enable viewing of the outer surface of the sample during testing, the outer shroud includes a window comprising two layers of poly(methyl methacrylate) with a gap between them to reduce fogging. To ensure that the shrouds do not introduce any measurable loads into a panel specimen, the shrouds are cushioned on the specimen by seals made of a fluoropolymer-membrane/fabric composite material and are held in place on the specimen by means of symmetrically placed clamps with poly(tetrafluoroethylene) pads. Instrumentation ports for thermocouples and strain gauges used in the tests are incorporated into the shrouds.

Norris, Jeffrey↗

Phase Transformation and Creep Behavior in Ti50Pd30Ni20 High Temperature Shape Memory Alloy in Compression

The creep behavior and the phase transformation of Ti50Pd30Ni20 High Temperature Shape Memory Alloy (HTSMA) is investigated by standard creep tests and thermomechanical tests. Ingots of the alloy are induction melted, extruded at high temperature, from which cylindrical specimens are cut and surface polished. A custom high temperature test setup is assembled to conduct the thermomechanical tests. Following preliminary monotonic tests, standard creep tests and thermally induced phase transformation tests are conducted on the specimen. The creep test results suggest that over the operating temperatures and stresses of this alloy, the microstructural mechanisms responsible for creep change. At lower stresses and temperatures, the primary creep mechanism is a mixture of dislocation glide and dislocation creep. As the stress and temperature increase, the mechanism shifts to predominantly dislocation creep. If the operational stress or temperature is raised even further, the mechanism shifts to diffusion creep. The thermally induced phase transformation tests show that actuator performance can be affected by rate independent irrecoverable strain (transformation induced plasticity + retained martensite) as well as creep. The rate of heating and cooling can adversely impact the actuators performance. While the rate independent irrecoverable strain is readily apparent early in the actuators life, viscoplastic strain continues to accumulate over the lifespan of the HTSMA. Thus, in order to get full actuation out of the HTSMA, the heating and cooling rates must be sufficiently high enough to avoid creep.

Kumar, Parikshith K.↗

Comprehensive Micromechanics-Analysis Code - Version 4.0

Version 4.0 of the Micromechanics Analysis Code With Generalized Method of Cells (MAC/GMC) has been developed as an improved means of computational simulation of advanced composite materials. The previous version of MAC/GMC was described in "Comprehensive Micromechanics-Analysis Code" (LEW-16870), NASA Tech Briefs, Vol. 24, No. 6 (June 2000), page 38. To recapitulate: MAC/GMC is a computer program that predicts the elastic and inelastic thermomechanical responses of continuous and discontinuous composite materials with arbitrary internal microstructures and reinforcement shapes. The predictive capability of MAC/GMC rests on a model known as the generalized method of cells (GMC) - a continuum-based model of micromechanics that provides closed-form expressions for the macroscopic response of a composite material in terms of the properties, sizes, shapes, and responses of the individual constituents or phases that make up the material. Enhancements in version 4.0 include a capability for modeling thermomechanically and electromagnetically coupled ("smart") materials; a more-accurate (high-fidelity) version of the GMC; a capability to simulate discontinuous plies within a laminate; additional constitutive models of materials; expanded yield-surface-analysis capabilities; and expanded failure-analysis and life-prediction capabilities on both the microscopic and macroscopic scales.

Arnold, S. M.↗

Shape Memory Characteristics of Ti(sub 49.5)Ni(sub 25)Pd(sub 25)Sc(sub 0.5) High-Temperature Shape Memory Alloy After Severe Plastic Deformation

A Ti(49.5)Ni25Pd25Sc(0.5) high-temperature shape memory alloy is thermomechanically processed to obtain enhanced shape-memory characteristics: in particular, dimensional stability upon repeated thermal cycles under constant loads. This is accomplished using severe plastic deformation via equal channel angular extrusion (ECAE) and post-processing annealing heat treatments. The results of the thermomechanical experiments reveal that the processed materials display enhanced shape memory response, exhibiting higher recoverable transformation and reduced irrecoverable strain levels upon thermal cycling compared with the unprocessed material. This improvement is attributed to the increased strength and resistance of the material against defect generation upon phase transformation as a result of the microstructural refinement due to the ECAE process, as supported by the electron microscopy observations.

Atli, K. C.↗

Deformation and Phase Transformation Processes in Polycrystalline NiTi and NiTiHf High Temperature Shape Memory Alloys

The deformation and transformation mechanisms of polycrystalline Ni49.9Ti50.1 and Ni50.3Ti29.7Hf20 (in at.%) shape memory alloys were investigated by combined experimental and modeling efforts aided by an in situ neutron diffraction technique at stress and temperature. The thermomechanical response of the low temperature martensite, the high temperature austenite phases, and changes between these two states during thermomechanical cycling were probed and reported. In the cubic austenite phase, stress-induced martensite, deformation twinning and slip processes were observed which helped in constructing a deformation map that contained the limits over which each of the identified mechanisms was dominant. Deformation of the monoclinic martensitic phase was also investigated where the microstructural changes (texture, lattice strains, and phase fractions) during room-temperature deformation and subsequent thermal cycling were compared to the bulk macroscopic response. When cycling between these two phases, the evolution of inelastic strains, along with the shape setting procedures were examined and used for the optimization of the transformation properties as a function of deformation levels and temperatures. Finally, this work was extended to the development of multiaxial capabilities at elevated temperatures for the in situ neutron diffraction measurements of shape memory alloys on the VULCAN Diffractometer at Oak Ridge National Laboratory.

Benafan, Othmane↗

Nickel-Graphite Composite Compliant Interface and/or Hot Shoe Material

Next-generation high-temperature thermoelectric-power-generating devices will employ segmented architectures and will have to reliably withstand thermally induced mechanical stresses produced during component fabrication, device assembly, and operation. Thermoelectric materials have typically poor mechanical strength, exhibit brittle behavior, and possess a wide range of coefficient of thermal expansion (CTE) values. As a result, the direct bonding at elevated temperatures of these materials to each other to produce segmented leg components is difficult, and often results in localized microcracking at interfaces and mec hanical failure due to the stresses that arise from the CTE mismatch between the various materials. Even in the absence of full mechanical failure, degraded interfaces can lead to increased electrical and thermal resistances, which adversely impact conversion efficiency and power output. The proposed solution is the insertion of a mechanically compliant layer, with high electrical and thermal conductivity, between the low- and high-temperature segments to relieve thermomechanical stresses during device fabrication and operation. This composite material can be used as a stress-relieving layer between the thermoelectric segments and/or between a thermoelectric segment and a hot- or cold-side interconnect material. The material also can be used as a compliant hot shoe. Nickel-coated graphite powders were hot-pressed to form a nickel-graphite composite material. A freestanding thermoelectric segmented leg was fabricated by brazing the compliant pad layer between the high-temperature p- Zintl and low-temperature p-SKD TE segments using Cu-Ag braze foils. The segmented leg stack was heated in vacuum under a compressive load to achieve bonding. The novelty of the innovation is the use of composite material that re duces the thermomechanical stresses en - countered in the construction of high-efficiency, high-temperature therm - o-electric devices. The compliant pad enables the bonding of dissimilar thermoelectric materials while maintaining the desired electrical and thermal properties essential for efficient device operation. The modulus, CTE, electrical, and thermal conductances of the composite can be controlled by varying the ratio of nickel to graphite.

Firdosy, Samad A.↗

Implementation Challenges for Sintered Silicon Carbide Fiber Bonded Ceramic Materials for High Temperature Applications

During the last decades, a number of fiber reinforced ceramic composites have been developed and tested for various aerospace and ground based applications. However, a number of challenges still remain slowing the wide scale implementation of these materials. In addition to continuous fiber reinforced composites, other innovative materials have been developed including the fibrous monoliths and sintered fiber bonded ceramics. The sintered silicon carbide fiber bonded ceramics have been fabricated by the hot pressing and sintering of silicon carbide fibers. However, in this system reliable property database as well as various issues related to thermomechanical performance, integration, and fabrication of large and complex shape components has yet to be addressed. In this presentation, thermomechanical properties of sintered silicon carbide fiber bonded ceramics (as fabricated and joined) will be presented. In addition, critical need for manufacturing and integration technologies in successful implementation of these materials will be discussed.

Singh, M.↗

Integration Science and Technology of Silicon-Based Ceramics and Composites:Technical Challenges and Opportunities

Ceramic integration technologies enable hierarchical design and manufacturing of intricate ceramic and composite parts starting with geometrically simpler units that are subsequently joined to themselves and/or to metals to create components with progressively higher levels of complexity and functionality. However, for the development of robust and reliable integrated systems with optimum performance for high temperature applications, detailed understanding of various thermochemical and thermomechanical factors is critical. Different technical approaches are required for the integration of ceramic to ceramic and ceramic to metal systems. Active metal brazing, in particular, is a simple and cost-effective method to integrate ceramic to metallic components. Active braze alloys usually contain a reactive filler metal (e.g., Ti, Cr, V, Hf etc) that promotes wettability and spreading by inducing chemical reactions with the ceramics and composites. In this presentation, various examples of brazing of silicon nitride to themselves and to metallic systems are presented. Other examples of joining of ceramic composites (C/SiC and SiC/SiC) using ceramic interlayers and the resulting microstructures are also presented. Thermomechanical characterization of joints is presented for both types of systems. In addition, various challenges and opportunities in design, fabrication, and testing of integrated similar (ceramic-ceramic) and dissimilar (ceramic-metal) material systems will be discussed. Potential opportunities and need for the development of innovative design philosophies, approaches, and integrated system testing under simulated application conditions will also be presented.

Singh, M.↗

Precipitation Strengthenable NiTiPd High Temperature Shape Memory Alloys

In binary NiTi alloys, it has long been known that Ni-rich alloys can be heat treated to produce precipitates which both strengthen the matrix against dislocations and improve the behavior of the material under thermal and mechanical cycling. Within recent years, the same effect has been observed in Ni-rich NiTiHf high temperature shape memory alloys and heat treatment regimens have been defined which will reliably produce improved properties. In NiTiPd alloys, precipitation has also been observed, but studies are still underway to define reliable heat treatments and compositions which will provide a balance of strengthening and good thermomechanical properties. For this study, a series of NiTi-32 at.Pd alloys was produced to determine the effect of changing nickeltitanium content on the transformation behavior and heat treatability of the material. Samples were aged at temperatures between 350C and 450C for times up to 100 hours. Actuation type behavior was evaluated using uniaxial constant force thermal cycling (UCFTC) to determine the effect of composition and aging on the material behavior. TEMSEM was used to evaluate the microstructure and determine the types of precipitates formed. The correlation between composition, heat treat, microstructure, and thermomechanical behavior will be addressed and discussed.

Transformation strain↗

Near-Field Heat Transfer Enabled Nanothermomechanical Memory and Logic Devices

A thermomechanical memory/logic device is disclosed. In embodiments, the thermomechanical device includes a first thermally controlled terminal (e.g., hot terminal); a second thermally controlled terminal (e.g., cool terminal/base); a stem or other structure that can be thermally expanded connected to the cool terminal; and a thermal conductive head coupled to the stem. The head can exchange heat with the hot terminal. The stem and head are between the first thermally controlled terminal and the second thermally controlled terminal, wherein the stem expands or contracts in response to heat absorbed or given off by the thermal conductive head, causing the head to move towards the first thermally controlled terminal or towards the second thermally controlled terminal until a stable state is reached. For example, bistable thermal states can be used to implement logic states (e.g., ZERO or ONE states).

Ndao, Sidy↗

A Screening Method Using Pulsed-Power Combined with Infrared Imaging to Detect Pattern Defects in Bulk Metal Foil or Thin Film Resistors

Bulk metal foil and thin film resistors occasionally contain localized defects within the etched resistor pattern. Common defects of this type include in-line constrictions referred to as notches, unremoved resistor material bridges between adjacent pattern lines, and embedded non-conductive particles in the resistor material. Such defects are prone to fracture due to thermomechanical fatigue during powered operation, especially power cycling, resulting in positive resistance change and open circuit failure modes. Common screening methods of optical microscopy, short time overload power tests (e.g., 6.25x rated power for 5 seconds) and burn-in (e.g., 1.5x rated power for 100 hours) are useful, but they are not always effective at removing devices with such defects. An improved method has been developed to screen for localized resistor pattern defects. The method involves the application of brief, high power electrical pulses at a low duty cycle while inspecting the resistor with a high resolution, high speed infrared camera. The following test conditions were found to be suitable for this purpose: 6.25x rated power, 1 to 5 pulses, 50 ms pulse width and 10% duty cycle. During the power pulsing, localized constrictions in the resistor pattern are identifiable as hot spots via the infrared camera. Reject criteria can be established based on observations of hot spots. To assess its effectiveness, a total of two hundred eighty (280) surface mount foil resistors (40 each from 7 different lots) were screened using this infrared technique. The screening identified twenty-nine (29) resistors with significant hot spots in the resistor pattern. All 280 resistors were then subjected to an industry standard 10,000 hour life test at 1x rated power at 70°C with power cycled for 90 minutes on and 30 minutes off. During life testing, three resistors exhibited positive resistance change failure mode. All three failures were due to thermomechanical fatigue failure of localized bridge defects at the locations identified via infrared screening. The results of this evaluation illustrate the benefits of the pulsed-power infrared detection screening technique to identify reliability suspect foil or thin film resistors that may escape common screening methods.

screening↗

A Screening Method Using Pulsed-Power Combined with Infrared Imaging to Detect Pattern Defects in Bulk Metal Foil or Thin Film Resistors

Bulk metal foil and thin film resistors occasionally contain localized defects within the etched resistor pattern. Common defects of this type include in-line constrictions referred to as notches, unremoved resistor material bridges between adjacent pattern lines, and embedded non-conductive particles in the resistor material. Such defects are prone to fracture due to thermomechanical fatigue during powered operation, especially power cycling, resulting in positive resistance change and open circuit failure modes. Common screening methods of optical microscopy, short time overload power tests (e.g., 6.25x rated power for 5 seconds) and burn-in (e.g., 1.5x rated power for 100 hours) are useful, but they are not always effective at removing devices with such defects. An improved method has been developed to screen for localized resistor pattern defects. The method involves the application of brief, high power electrical pulses at a low duty cycle while inspecting the resistor with a high resolution, high speed infrared camera. The following test conditions were found to be suitable for this purpose: 6.25x rated power, 1 to 5 pulses, 50 ms pulse width and 10% duty cycle. During the power pulsing, localized constrictions in the resistor pattern are identifiable as hot spots via the infrared camera. Reject criteria can be established based on observations of hot spots. To assess its effectiveness, a total of two hundred eighty (280) surface mount foil resistors (40 each from 7 different lots) were screened using this infrared technique. The screening identified twenty-nine (29) resistors with significant hot spots in the resistor pattern. All 280 resistors were then subjected to an industry standard 10,000 hour life test at 1x rated power at 70°C with power cycled for 90 minutes on and 30 minutes off. During life testing, three resistors exhibited positive resistance change failure mode. All three failures were due to thermomechanical fatigue failure of localized bridge defects at the locations identified via infrared screening. The results of this evaluation illustrate the benefits of the pulsed-power infrared detection screening technique to identify reliability suspect foil or thin film resistors that may escape common screening methods.

screening↗

A Machine Learning-Derived Atomistic Potential for Y2Si2O7

Incorporation of SiC/SiC ceramic matrix composite (CMC) hot section components into aircraft engines promises to increase efficiency and safety. However, SiC/SiC CMCs are subject to water vapor-induced oxidation and recession at the high temperatures of engine operation, and thus environmental barrier coatings (EBCs) are required to reduce this degradation and enable their widespread adoption. An understanding of EBCs failure mechanisms, including thermochemical and thermomechanical mechanisms, is essential as coating degradation leads to reduced CMC component service life. Computational modeling approaches can provide insight into EBC material properties important for coating design. However, density functional theory (DFT) is computationally expensive and atomistic potentials are lacking for materials of interest. In this work, we utilize a machine learning approach and DFT training data to parameterize atomistic potentials for two candidate EBC materials, Y2Si2O7 and Yb2Si2O7. These potentials enable near DFT-accurate calculations of thermodynamic and thermomechanical properties essential to EBC design.

Cameron J Bodenschatz↗

Real-Time Temperature Field State Observer and Digital Replica to Support Cyber-Physical Testing

Cyber-physical testing is a class of experimental methods in which a system is partitioned into physical and numerical components to study its overall behavior. Transfer systems are typically needed to capture relevant interactions by enforcing appropriate interface conditions between the physical and numerical portions. While cyber-physical testing is often performed using lumped-parameter systems, thermomechanical cyber-physical testing requires the use of thermal actuators as transfer systems to apply a thermal condition over a spatially distributed region or surface. Thus, the interactions between the numerical and physical components are of a distributed nature, i.e., a field rather than point values. In this paper, we develop and experimentally validate a state observer for temperature fields to enable thermomechanical cyber-physical testing. The state observer provides continuous estimates of temperature over a surface of the thermal actuator using only temperature measurements at discrete locations. The estimated temperature field is then leveraged to account for localized mechanical defects in the interface condition. The method consists of building a digital replica of one portion of the control plant. By imposing defects in the digital replica it is used to generate and output the response of a thermal load pattern that represents that of a physical system with mechanical defects.

Manuel Salmeron↗

In-Pile Loss of Coolant Accident Testing at TREAT

Several hot-cell based LOCA test apparatuses still exist in various institutions across the world. These facilities typically surround rods with infrared electrical heaters to simulate LOCA conditions on the cladding. Despite its utility for cladding-focused testing, the furnace-based external heating method creates an inverted temperature gradient in fuel pellets compared to a true LOCA where radioisotope decay heat generates internal heat. Capturing the correct temperature gradient is essential in simulating the thermomechanical stress in fuel pellets, and hence a crucial design parameter investigating FFRD during a postulated LOCA. This thermomechanical stress state, for which the evolution of fuel pellet centerline and cladding temperatures is a good figure of merit, was the primary parameter investigated during conception of the LOCA-SERTTA device.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗