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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 451 records · Page 25
All sourcesNASA NTRSDOE OSTI
NASA NTRS1972

Reaction control system helium pressure regulator filter failure

The failure analysis of the command module reaction control system helium pressure regulators revealed that the filter element end caps were bulged by the helium pressure surge during activation. Some end caps may bulge and also some wire separation may occur during command module reaction control system activations; however, system performance should not be affected. The reaction control system design is acceptable and no change in hardware, system, or activation procedures is required.

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NASA NTRS1973

Development of a hybrid microelectronics solid state relay for 2500 volts isolation and minus 120 C to 80 C thermal cycling range

A hybrid microelectronics solid state relay was developed in a TO-116 package for the MINX project. The relay provides 2500 Vdc input to output isolation and operated from a MHTL logic signal to switch a load of 400 Vdc at 2 mA. The relay is designed to operate in space and survive 1000 thermal cycles of 120 C to 80 C. The use of X-rays for failure analysis in small hybrid circuits proved valuable and the applications of vacuum deposited Parylene as a dielectric coating proved extremely valuable.

Sater, B. L.↗
NASA NTRS1973

Parts, materials, and processes experience summary, volume 2

This summary provides the general engineering community with the accumulated experience from ALERT reports issued by NASA and the Government-Industry. Data Exchange Program, and related experience gained by Government and industry. It provides expanded information on selected topics by relating the problem area (failure) to the cause, the investigation and findings, the suggestions for avoidance (inspections, screening tests, proper part applications, requirements for manufacturer's plant facilities, etc.), and failure analysis procedures. Diodes, integrated circuits, and transistors are covered in this volume.

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NASA NTRS1973

Parts, Materials, and Processes Experience Summary

The ALERT program, a system for communicating common problems with parts, materials, and processes, is condensed and catalogued. Expanded information on selected topics is provided by relating the problem area (failure) to the cause, the investigations and findings, the suggestions for avoidance (inspections, screening tests, proper part applications), and failure analysis procedures. The basic objective of ALERT is the avoidance of the recurrence of parts, materials, and processed problems, thus improving the reliability of equipment produced for and used by the government.

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NASA NTRS1972

Summary of the nondestructive evaluation session

Advanced material systems and designs require improved nondestructive evaluation (NDE) techniques for quality control, failure analysis and properties monitoring. Some advanced NDE techniques such as infrared scanning systems, laser holographic applications and the use of the Mossbauer effect are outlined. Applications of these techniques are discussed for evaluating the new space shuttle external insulation materials, aircraft structures and engine components, and precursors to crack initiation and growth.

Stinebring, R. C.↗
NASA NTRS1974

A study of RSI under combined stresses

The behavior of typical rigidized surface insulation material (RSI) under combined loading states was investigated. In particular, the thermal stress states induced during reentry of the space shuttle were of prime concern. A typical RSI tile was analyzed for reentry thermal stresses under computed thermal gradients for a model of the RSI material. The results of the thermal stress analyses were then used to aid in defining typical combined stress states for the failure analysis of RSI.

Kibler, J. J.↗
NASA NTRS1974

Boundary layers in centrifugal compressors

The utility of boundary-layer theory in the design of centrifugal compressors is demonstrated. Boundary-layer development in the diffuser entry region is shown to be important to stage efficiency. The result of an earnest attempt to analyze this boundary layer with the best tools available is displayed. Acceptable prediction accuracy was not achieved. The inaccuracy of boundary-layer analysis in this case would result in stage efficiency prediction as much as four points low. Fluid dynamic reasons for analysis failure are discussed with support from flow data. Empirical correlations used today to circumnavigate the weakness of the theory are illustrated.

Dean, R. C., Jr.↗
NASA NTRS1976

The Helios experiment 5 antenna mechanism

The Experiment 5 Antenna deployment problem onboard Helios A, the failure analysis, and changes in design, test, and operation which led to a successful deployment of both antennas during the early Helios B mission phase are described.

Mueller, J. W.↗
NASA NTRS1976

Nickel cadmium cell composite reliability model

Ni-Cd battery reliability has become a critical design parameter with the increasing need for longer life and optimally designed secondary battery power systems in space as well as in more mundane applications. It is the purpose of this paper to present a state-of-the-art Ni-Cd cell reliability model as a function of cumulative cyclic operation, cell temperature and cyclic depth-of-discharge. In addition, a simple and convenient cell failure analysis technique will be presented in which the reliability, the distribution, and the distribution parameters can be determined by visual inspection.

Kirsch, W. W.↗
NASA NTRS1976

Interference fits and stress-corrosion failure

It is pointed out that any proper design of interference fit fastener, interference fit bushings, or stress coining processes should consider both the stress-corrosion susceptibility and fatigue-life improvement together. Investigations leading to such a methodology are discussed. A service failure analysis of actual aircraft parts is considered along with the stress-corrosion susceptibility of cold-working interference fit bushings. The optimum design of the amount of interference is considered, giving attention to stress formulas and aspects of design methodology.

Hanagud, S.↗
NASA NTRS1977

An active nutation damper for spacecraft

An active nutation damping device, consisting of an angular accelerometer, a dc motor driven flywheel, and associated electronics, was developed for spacecraft use. This damping system was used on the Lageos spacecraft, launched 4 May 1976, to control nutation buildup during the long coast period after the third stage separation. Of many electrical and mechanical design choices, an angular rather than linear accelerometer offered some advantages but problems developed in adapting the angular accelerometer to spacecraft use. The damper package was evaluated and proven on a three axis gas-bearing simulator that duplicated the Lageos spacecraft critical flight dynamics. A failure analysis of the damper assembly was performed. Performance of the damper during the Lageos flight has confirmed the preflight evaluation and analysis.

Abercrombie, R. A.↗
NASA NTRS1977

An active nutation damper for spacecraft

An active nutation damping device, consisting of an angular accelerometer, a dc-motor-driven flywheel, and associated electronics, developed for spacecraft use is described. This damping system was used on the LAGEOS spacecraft to control nutation buildup during the long coast period (approximately 75 minutes) after the third stage separation. The damper package was evaluated and proven on a three-axis gas-bearing simulator that duplicated the LAGEOS spacecraft critical flight dynamics. In addition, a failure analysis of the damper assembly was performed. Performance of the damper during the LAGEOS flight has confirmed the preflight evaluation and analysis.

Abercrombie, R. A.↗
NASA NTRS1978

Ku-band signal design study

Analytical tools, methods and techniques for assessing the design and performance of the space shuttle orbiter data processing system (DPS) are provided. The computer data processing network is evaluated in the key areas of queueing behavior synchronization and network reliability. The structure of the data processing network is described as well as the system operation principles and the network configuration. The characteristics of the computer systems are indicated. System reliability measures are defined and studied. System and network invulnerability measures are computed. Communication path and network failure analysis techniques are included.

Rubin, I.↗
NASA NTRS1978

Typical uses of NASTRAN in a petrochemical industry

NASTRAN was principally used to perform failure analysis and redesign process equipment. It was also employed in the evaluation of vendor designs and proposed design modifications to existing process equipment. Stress analysis of forced draft fans, distillation trays, metal stacks, jacketed pipes, heat exchangers, large centrifugal fans, and agitator support structures are described.

Winter, J. R.↗
NASA NTRS1979

Removing overcoatings from microcircuits

Silicone resin of elastomer overcoatings are removed more quickly from microcircuit chips with hot concentrated sulfuric acid. Process takes few minutes as compared to day or two, using commercial solvents based on toluene, xylene, and like. Overcoatings are removed to expose circuit for failure analysis.

Belcher, J. G., Jr.↗
NASA NTRS1980

JANTX1N3893 diode

Diodes manufactured by Siemens and Motorola were tested. Testing of Motorola diodes was stopped in all 3 groups because 50% failure-rate limit was reached. Siemens lot endured more testing in groups 1 and 2 and completed testing on group 3. Failure analysis was performed for group 2 testing.

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NASA NTRS1980

JANTX1N5615 switching diode

Diodes manufactured by Semtech and Micro Semiconductor were tested. Both sample lots exceeded 50% fail-rate in all groups. Failure analysis was performed for groups 2 and 3.

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NASA NTRS1980

JANTX1N5618 switching diode

Diodes tested were manufactured by Semtech and Micro Semiconductor. Semtech sample lots completed all three testings with only one catastrophic failure. All three Micro Semiconductor lots had several failure that were submitted for failure analysis.

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