Local scale air quality impacts in the Los Angeles Basin from increased port activity during 2021 supply chain disruptions
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SEARCH · Engineering Papers
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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HPC systems now exploit GPUs within their compute nodes to accelerate program performance. As a result, high-end application development has become extremely complex at the node level. In addition to restructuring the node code to exploit the cores and specialized devices, the programmer may need to choose a programming model such as OpenMP or CPU threads in conjunction with an accelerator programming model to share and manage the difference node resources. This comes at a time when programmer productivity and the ability to produce portable code has been recognized as a major concern. In order to offset the high development cost of creating CUDA or OpenCL kernels, directives have been proposed for programming accelerator devices, but their implications are not well known. In this paper, we evaluate the state of the art accelerator directives to program several applications kernels, explore transformations to achieve good performance, and examine the expressiveness and performance penalty of using high-level directives versus CUDA. We also compare our results to OpenMP implementations to understand the benefits of running the kernels in the accelerator versus CPU cores.
Abstract Not Provided
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Abstract not provided.
An existing modeling method, the EMTA (Eshelby-Mori-Tanaka approach) modeling approach [1], is applied to the study of SiC/SiC 2D woven composites for fusion reactor applications for the first time, to the best of our knowledge, with excellent results. We compare EMTA model results to existing thermal conductivity data for these materials and suggest that in the future this approach can be beneficial by providing us with tools to further optimize these composite materials for fusion energy applications since the EMTA method and code can address both thermal and mechanical properties with the same framework.
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One embodiment provides a reactor for material deposition. The reactor includes a chamber and at least one gas nozzle. The chamber includes a pair of susceptors, each having a front side and a back side. The front side mounts a number of substrates. The susceptors are positioned vertically so that the front sides of the susceptors face each other, and the vertical edges of the susceptors are in contact with each other, thereby forming a substantially enclosed narrow channel between the substrates mounted on different susceptors. The gas nozzle includes a gas-inlet component situated in the center and a detachable gas-outlet component stacked around the gas-inlet component. The gas-inlet component includes at least one opening coupled to the chamber, and is configured to inject precursor gases into the chamber. The detachable gas-outlet component includes at least one opening coupled to the chamber, and is configured to output exhaust gases from the chamber.
A case study on spectrally enhanced lighting.
Presentation from the 2011 Water Peer Review in which the presenter discusses power electronics.
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A cooling system for appliances, air conditioners, and other spaces includes a compressor, and a condenser that receives refrigerant from the compressor. The system also includes an evaporator that receives refrigerant from the condenser. Refrigerant received from the condenser flows through an upstream portion of the evaporator. A first portion of the refrigerant flows to the compressor without passing through a downstream portion of the evaporator, and a second portion of the refrigerant from the upstream portion of the condenser flows through the downstream portion of the evaporator after passing through the upstream portion of the evaporator. The second portion of the refrigerant flows to the compressor after passing through the downstream portion of the evaporator. The refrigeration system may be configured to cool an appliance such as a refrigerator and/or freezer, or it may be utilized in air conditioners for buildings, motor vehicles, or other such spaces.
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Abstract not provided.