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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 451 records · Page 25
All sourcesNASA NTRSDOE OSTI
NASA NTRS1994

Digital Linear Tape (DLT) technology and product family overview

The demand that began a couple of years ago for increased data storage capacity continues. Peripheral Strategies (a Santa Barbara, California, Storage Market Research Firm) projects the amount of data stored on the average enterprise network will grow by 50 percent to 100 percent per year. Furthermore, Peripheral Strategies says that a typical mid-range workstation system containing 30GB to 50GB of storage today will grow at the rate of 50 percent per year. Dan Friedlander, a Boulder, Colorado-based consultant specializing in PC-LAN backup, says, 'The average NetWare LAN is about 8GB, but there are many that have 30GB to 300GB.....' The substantial growth of storage requirements has created various tape technologies that seek to satisfy the needs of today's and, especially, the next generations's systems and applications. There are five leading tape technologies in the market today: QIC (Quarter Inch Cartridge), IBM 3480/90, 8mm, DAT (Digital Audio Tape) and DLT (Digital Linear Tape). Product performance specifications and user needs have combined to classify these technologies into low-end, mid-range, and high-end systems applications. Although the manufacturers may try to position their products differently, product specifications and market requirements have determined that QIC and DAT are primarily low-end systems products while 8mm and DLT are competing for mid-range systems applications and the high-end systems space, where IBM compatibility is not required. The 3480/90 products seem to be used primarily in the IBM market, for interchangeability purposes. There are advantages and disadvantages for each of the tape technologies in the market today. We believe that DLT technology offers a significant number of very important features and specifications that make it extremely attractive for most current as well as emerging new applications, such as Hierarchical Storage Management (HSM). This paper will demonstrate why we think that the DLT technology and family of DLT products will become the technology of choice for most new applications in the mid-range and high-end (non-IBM) markets.

Lignos, Demetrios↗
DOE OSTI2022

Optimization of WAAM Process to Produce AUSC Components with Increased Service Life

Additive manufacturing has the potential to revolutionize industrial hardware and unlock efficiency gains through the fabrication of geometries and architectures not possible by conventional processing. Wire Arc Additive manufacturing (WAAM) process is a class of directed energy deposition process enabling higher build rate and allowing custom wire feedstock allowing spatial variation of microstructure. The larger spot size and lower speed creates a larger melt pool, reducing residual stress and often time creating directional/columnar microstructure for Ni-superalloy. The use of flexible platform provides freedom in deposition strategy, which can accommodate complex substrates, including feature addition onto existing structures, non-flat layers, and repair methods. However, the certification of the final component needs to match the strength requirement. Hence, the quality of the component produced is stringently monitored to avoid buildup of residual stress, cracks, porosity and to reduce detrimental segregated phases commonly observed during alloy solidification. Simulation plays a huge role in predicting the melt pool dimension and can be used to optimize the process parameter. Similar development is also required to perform physics-based modeling of microstructural development in WAAM that can predict the microstructural features during solidification and can be used to optimize the process more effectively. To move toward this goal, Raytheon Technologies Research Center together with Siemens worked to create a set of computational tools to control the process parameters, enable on-line measurements and acquisition with feedback to the optimized process parameters, and eventually track material evolution through each step of the additive process. Computational fluid dynamics is used for accurate prediction and calibration of the thermal field during WAAM process. and phase field models for microstructure evolution as a function of processing parameters to establish a connection between additive parameters and the final microstructure. Here we report cellular automata (CA) model development to predict the dendritic microstructure evolution with surface and bulk nuclei for single track and multiple layers. The CA model was developed to account for secondary element addition and predict segregation, local melting, and latent heat release as well as prediction of Euler angles from orientation information and validated against experiments. This framework was utilized to tailor spatially-varying composition in a part by appropriately controlling the microstructure evolution during the additive process. Functionally graded Haynes 282 alloy with high Cr content at the surface was tested for oxidation and mechanical properties. An advanced physics-based reaction-diffusion model predicting the simultaneous creation of chromium oxide and alumina is developed and validated to extend life expectancy of the WAAM manufactured high temperature part. A machine-learning data-driven framework establishing the process-structure relationship from a dataset of real microstructure images and corresponding process history data has been developed and implemented in the NX Siemens design system. The digital twin configuration along with the tool path generation enabled prediction of WAAM component buildup time and the techno-economic analysis provided a favorable option for all 4 cases with 15-40% cost reduction.

33 ADVANCED PROPULSION SYSTEMS↗
DOE OSTI2026

Hybrid Additive Manufacturing and Electric Field-Assisted Sintering of High-temperature Heat Exchangers via Sacrificial Channel Molds

A hybrid manufacturing approach, integrating additive manufacturing (AM) with powder methodology via electric field-assisted sintering (EFAS), was developed for the fabrication of high-temperature compact heat exchangers (CHX) from refractory metals. The methodology employed additively manufactured sacrificial channel molds (SCMs) as shapeholders for CHX channels, which were embedded in metal powders using EFAS. Following embedding, the SCMs were chemically dissolved to form the internal channel network. SCMs were fabricated using both digital light processing (DLP) and direct ink writing (DIW) from chemically reactive, calcium-based ceramic feedstocks with varying ratios of Al2O3 reinforcement. The microstructure, phase composition, and dissolution behavior of both as-printed and embedded SCMs were investigated. The shrinkage behavior of the SCMs embedded in refractory metals, as well as the interfacial characteristics between the SCMs and metal matrix, were studied. The results showed that the SCMs containing sufficient chemical reactive ceramics dissolved effectively before and after embedding. The as-printed SCMs retained the phase composition of their feedstocks, but the embedded SCMs containing calcium-based ceramics and Al2O3 exhibited the formation of calcium aluminates due to high temperature exposure during embedding. Most SCMs exhibited a cellular Al2O3 network filled with Ca-rich ceramics. Shrinkage after embedding was strongly dependent on SCM density, with lower density SCMs exhibiting greater shrinkage. A thin SCM-affected zone was observed at the metal matrix surface, characterized by increased porosity compared to the bulk matrix. This effect was attributed to infiltration of the SCM materials into powder particle boundaries under pressure, followed by their removal during dissolution. This study demonstrates the feasibility of manufacturing CHXs from hard-to-process refractory metals for use in harsh environments.

36 - MATERIALS SCIENCE↗
DOE OSTI2014

Digital radiography exposure indices: A review

Digital radiography (DR) technologies have the advantage of a wide dynamic range compared to their film-screen predecessors, however, this poses a potential for increased patient exposure if left unchecked. Manufacturers have developed the exposure index (EI) to counter this, which provides radiographers with feedback on the exposure reaching the detector. As these EIs were manufacturer-specific, a wide variety of EIs existed. To offset this, the international standardised EI has been developed by the International Electrotechnical Commission (IEC) and the American Association of Physicists in Medicine (AAPM). The purpose of this article is to explore the current literature relating to EIs, beginning with the historical development of the EI, the development of the standardised EI and an exploration of common themes and studies as evidenced in the research literature. It is anticipated that this review will provide radiographers with a useful guide to understanding EIs, their application in clinical practice, limitations and suggestions for further research.

60 APPLIED LIFE SCIENCES↗
DOE OSTI2022

Statistical Estimation of Strain Using Spatial Correlation Functions

Ex-situ estimation of strains from deformed micrographs is not possible as there are no persistent features which can be tracked. Two point spatial statistics enable the rigorous quantification of spatial patterns in heterogeneous media. In this paper, we propose a novel method for estimating strains directly from dissimilar micrographs using a continuum mechanics approach. Rather than operating directly on images from sequential frames, as is done in digital image correlation, we operate on different microstructure realizations. This is made possible by comparing the spatial autocorrelation maps of deformed and undeformed micrographs rather than direct comparison of images. Additionally, a Bayesian framework is proposed for quantifying uncertainty. We first illustrate the efficacy of this method on speckle pattern images from digital image correlation experiments. Then, we demonstrate that the method is capable of operating on dissimilar micrographs using deformed synthetic binary microstructures. Finally, we present a case study on polycrystalline additively manufactured 316L deformed via tension. The proposed method works well and we discuss implications and limitations of the presented work.

36 MATERIALS SCIENCE↗
DOE OSTI2023

Contact-Less Integrity Verification of Microelectronics Using Near-Field EM Analysis

Modern microelectronics life-cycle and supply chain ecosystem bring multiple untrusted entities, which can compromise their integrity. A major integrity issue of microelectronics stems from piracy of intellectual properties (IP) and counterfeiting, which causes significant revenue loss to the semiconductor manufacturers. Further, these components often lead to compromised functionality, reliability, security, and safety of an electronic system. This paper presents secure information transmission and probing methods for verifying the integrity of digital integrated circuit (ICs) based on their electromagnetic (EM) near-field emissions and thereby protecting systems against counterfeit components. The proposed method has been tested on both high-level instructions executed by microprocessors or Systems-on-Chip (serving as examples of software), and also logic circuits within FPGA fabrics and ASICs (serving as examples of hardware). The authentication information required by each digital system is generated using a pseudo-random number generator circuit and securely transmitted via near-field magnetic emissions. The authorized party can probe these emissions using a near-field probe, process the acquired signals to improve the signal-to-noise ratio (SNR), and then recover the secure information through matched filtering. Experimental results from commercial SoCs are used to demonstrate the proposed technique. Methods for reducing EM interference during integrity verification of both FPGAs and ASICs are also described.

47 OTHER INSTRUMENTATION↗
NASA NTRS1992

Heterojunction bipolar transistor technology for data acquisition and communication

Heterojunction Bipolar Transistor (HBT) technology has emerged as one of the most promising technologies for ultrahigh-speed integrated circuits. HBT circuits for digital and analog applications, data conversion, and power amplification have been realized, with speed performance well above 20 GHz. At Rockwell, a baseline AlGaAs/GaAs HBT technology has been established in a manufacturing facility. This paper describes the HBT technology, transistor characteristics, and HBT circuits for data acquisition and communication.

Wang, C.↗
NASA NTRS1997

Burst Mode ASIC-Based Modem

The NASA Lewis Research Center is sponsoring the Advanced Communication Technology Insertion (ACTION) for Commercial Space Applications program. The goal of the program is to expedite the development of new technology with a clear path towards productization and enhancing the competitiveness of U.S. manufacturers. The industry has made significant investment in developing ASIC-based modem technology for continuous-mode applications and has made investigations into East, reliable acquisition of burst-mode digital communication signals. With rapid advances in analog and digital communications ICs, it is expected that more functions will be integrated onto these parts in the near future. In addition custom ASIC's can also be developed to address the areas not covered by the other IC's. Using the commercial chips and custom ASIC's, lower-cost, compact, reliable, and high-performance modems can be built for demanding satellite communication application. This report outlines a frequency-hop burst modem design based on commercially available chips.

Source record↗
NASA NTRS1999

Camera-on-a-Chip

Jet Propulsion Laboratory's research on a second generation, solid-state image sensor technology has resulted in the Complementary Metal- Oxide Semiconductor Active Pixel Sensor (CMOS), establishing an alternative to the Charged Coupled Device (CCD). Photobit Corporation, the leading supplier of CMOS image sensors, has commercialized two products of their own based on this technology: the PB-100 and PB-300. These devices are cameras on a chip, combining all camera functions. CMOS "active-pixel" digital image sensors offer several advantages over CCDs, a technology used in video and still-camera applications for 30 years. The CMOS sensors draw less energy, they use the same manufacturing platform as most microprocessors and memory chips, and they allow on-chip programming of frame size, exposure, and other parameters.

Source record↗
DOE OSTI2014

A Control Chart Approach for Representing and Mining Data Streams with Shape Based Similarity

The mining of data streams for online condition monitoring is a challenging task in several domains including (electric) power grid system, intelligent manufacturing, and consumer science. Considering a power grid application in which thousands of sensors, called the phasor measurement units, are deployed on the power grid network to continuously collect streams of digital data for real-time situational awareness and system management. Depending on design, each sensor could stream between ten and sixty data samples per second. The myriad of sensory data captured could convey deeper insights about sequence of events in real-time and before major damages are done. However, the timely processing and analysis of these high-velocity and high-volume data streams is a challenge. Hence, a new data processing and transformation approach, based on the concept of control charts, for representing sequence of data streams from sensors is proposed. In addition, an application of the proposed approach for enhancing data mining tasks such as clustering using real-world power grid data streams is presented. The results indicate that the proposed approach is very efficient for data streams storage and manipulation.

big data↗
DOE OSTI2021

A functional modeling approach for quality assurance in metal additive manufacturing

Purpose: Due to the complexity of and variations in additive manufacturing (AM) processes, there is a level of uncertainty that creates critical issues in quality assurance (QA), which must be addressed by time-consuming and cost-intensive tasks. This deteriorates the process repeatability, reliability and part reproducibility. So far, many AM efforts have been performed in an isolated and scattered way over several decades. Here, a systematically integrated holistic view is proposed to achieve QA for AM. Design/methodology/approach: A systematically integrated view is presented to ensure the predefined part properties before/during/after the AM process. It consists of four stages, namely, QA plan, prospective validation, concurrent validation and retrospective validation. As a foundation for QA planning, a functional workflow and the required information flows are proposed by using functional design models: Icam DEFinition for Function Modeling. Findings: The functional design model of the QA plan provides the systematically integrated view that can be the basis for inspection of AM processes for the repeatability and qualification of AM parts for reproducibility. Research limitations/implications: A powder bed fusion process was used to validate the feasibility of this QA plan. Feasibility was demonstrated under many assumptions; real validation is not included in this study. Social implications: This study provides an innovative and transformative methodology that can lead to greater productivity and improved quality of AM parts across industries. Furthermore, the QA guidelines and functional design models provide the foundation for the development of a QA architecture and management system. Originality/value: This systematically integrated view and the corresponding QA plan can pose fundamental questions to the AM community and initiate new research efforts in the in-situ digital inspection of AM processes and parts.

36 MATERIALS SCIENCE↗
DOE OSTI2026

Smart Inverters, Dumb Risk: Taking Control of IBR Security in the Digital Age

This presentation addresses the security challenges posed by Inverter-Based Resources (IBRs) in the modern energy landscape. The presentation highlights the vulnerabilities and risks associated with IBRs, including the potential for cyber-attacks, the impact of insecure defaults, and the systemic risks posed by supply chain dependencies. Key topics covered include: 1) The increasing digital transformation in energy systems and the associated security risks. 2) Specific vulnerabilities in IBRs, including weak passwords, hardcoded credentials, and insecure web application interfaces. 3) The implications of persistent connectivity and the strategic risks posed by foreign-manufactured components. 4) The role of regulatory frameworks, such as NERC CIP, in addressing these challenges and the limitations of current oversight. 5) Practical solutions for mitigating risks, including secure design practices, vendor risk assessments, and the importance of strong passwords and role-based access control. The presentation underscores the necessity of a comprehensive, system-of-systems approach to securing IBRs, emphasizing the need for collaboration across various stakeholders, including operators, developers, and regulators, to ensure the resilience and security of the energy grid.

24 - POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2020

Additively Manufactured Tamper Evident Container (TEC)

Researchers at Los Alamos National Laboratory have developed a tamper evident container (TEC) to secure a broad variety of items from adversarial disclosure and espionage accidents. The new technology uses additive-manufacturing (AM) techniques for the concurrent creation of a container and arbitrarily complex-shaped three-dimensional tamper-sensitive features within its walls that authenticate the package. Analog and encrypted digital boards safely stored inside the TEC permanently record the complete security history of the protected items. Los Alamos is seeking commercial partners interested in further development and engineering prototype work.

42 ENGINEERING↗
DOE OSTI2017

Additively Manufactured IN718 Components with Wirelessly Powered and Interrogated Embedded Sensing

A methodology is described for embedding commercial-off-the-shelf sensors together with wireless communication and power circuit elements using direct laser metal sintered additively manufactured components. Physics based models of the additive manufacturing processes and sensor/wireless level performance models guided the design and embedment processes. A combination of cold spray deposition and laser engineered net shaping was used to fashion the transmitter/receiving elements and embed the sensors, thereby providing environmental protection and component robustness/survivability for harsh conditions. By design, this complement of analog and digital sensors were wirelessly powered and interrogated using a health and utilization monitoring system; enabling real-time, in situ prognostics and diagnostics.

embedded sensing↗
NASA NTRS2021

High operating temperature T2SL digital focal plane arrays for earth remote sensing instruments

In this presentation, we will report our recent efforts in achieving high performance in Antimonides type-II superlattice (T2SL) based infrared photodetectors using the barrier infrared detector (BIRD) architecture. The high operating temperature (HOT) BIRD focal plane arrays (FPAs) offer the same high performance, uniformity, operability, manufacturability, and affordability advantages as InSb. However, mid-wavelength infrared (MWIR) HOT-BIRD FPAs can operate at significantly higher temperatures (>150K) than InSb FPAs (typically 80K). Moreover, while InSb has a fixed cutoff wavelength (~5.4 µm), the HOT-BIRD offers a continuous adjustable cutoff wavelength, ranging from ~4 µm to >15 µm, and is therefore also suitable for long wavelength infrared (LWIR) as well. The LWIR detectors based on the BIRD architecture has also demonstrated significant operating temperature advantages over those based on traditional p-n junction designs. Two 6U SmalSat missions CIRAS (Cubesat Infrared Atmospheric Sounder) and HyTI (Hyperspectral Thermal Imager) are based on JPL’s T2SL BIRD focal plane arrays (FPAs). Based on III-V compound semiconductors, the BIRD FPAs offer a breakthrough solution for the realization of low cost (high yield), high-performance FPAs with excellent uniformity and pixel-to-pixel operability. We have also exploring the possibilities of integrating either metasurface resonator cavity or metasurface based flatlens with individual pixels to improve the signal-to-noise ratio of the detectors. Furthermore, we will discuss the advantages of the utilization of all digital read out integrated circuits with HOT-BIRDs.

Ghuman, and Parminder↗
DOE OSTI2025

Adaptive control for hybrid manufacturing

The primary objective of the technical collaboration is to validate and implement adaptive feed rate control, tool wear monitoring, and anomaly detection for the finish machining of additive components. Most additively manufactured components need finish machining to achieve surface finish and tolerance requirements. Distortions and surface roughness of additively manufactured components can result in high forces and tool breakage or excessive tool wear during post-additive finish machining, which can result in rework or part scrap. In this collaboration, methods, and models for feed rate control, tool wear monitoring, and anomaly detection via a digital twin will be evaluated and validated.

99 GENERAL AND MISCELLANEOUS↗
DOE OSTI2022

Unmanned Aerial Vehicle Synthetic Aperture RADAR for Surface Change Monitoring

Space-based and airplane-based synthetic aperture RADAR (SAR) can monitor ground height using interferometric SAR (InSAR) collections. However, fielding the airplane-based SAR is expensive and coordinating the frequency and timing of ground experiments with space-based SAR is challenging. This research explored the possibility of using a small, mobile unmanned aerial vehicle- base (UAV) SAR to see if it could provide a quick and inexpensive InSAR option for the Source Physics Experiment (SPE) Phase III project. Firstly, a local feasibility collection using a UAV-based SAR showed that InSAR products and height measurements were possible, but that in-scene fiducials were needed to assist in digital elevation model (DEM) construction. Secondly, an InSAR collection was planned and executed over the SPE Phase III site using the same platform configuration. We found that the image formation by the SAR manufacturer creates discontinuities, and that noise impacted the generation and accuracy of height maps. These processing artifacts need to be overcome to generate an accurate height map.

47 OTHER INSTRUMENTATION↗
DOE OSTI2025

Securing the Modern Grid: Federal Investments, Digitization, and Supply Chain Strategy

Across the United States (U.S.) grid expansion and modernization is underway, paving the way for accelerated load growth and intelligent resource management. Digitization of the grid is supported by several state and federal programs, providing support for utilities installing advanced metering infrastructure (AMI), AI-powered analytics systems, battery energy storage systems (BESS), and distributed energy resource management systems (DERMS) to transform the grid from a one-way power delivery system into an intelligent, responsive network that will enable faster load growth and power expansion of data centers for advanced artificial intelligence (AI) applications. The digital transformation of America's grid presents opportunity for increased efficiency and resiliency but also introduces new digital risks that require careful management. Digital equipment often contains several vulnerabilities such as unencrypted communication protocols, and persistent remote access capabilities that could be exploited to manipulate device settings, coordinate service disruptions, or inject false data into grid operations. These digital risks become particularly important as the grid must rapidly scale to support AI-driven data centers, which the administration has identified as essential for maintaining U.S. technological leadership and economic competitiveness. These vulnerabilities are compounded by supply chain realities: Chinese manufacturers currently produce 70-90% of essential grid components including inverters, batteries, and control systems, with the U.S. lacking domestic manufacturing capacity for critical assets like extra-high voltage transformers. Recent federal legislation has established Foreign Entity of Concern (FEOC) restrictions to address these risks, requiring projects to achieve escalating thresholds of non-FEOC content to receive tax credits while utilities work to expand sourcing channels for their supply chains and strengthen security measures. These restrictions arrive precisely when utilities face unprecedented electricity demand growth driven by the rapid growth in data centers, creating a considerable challenge: rapidly expanding infrastructure while navigating complex compliance requirements while lacking viable alternatives for many critical components. Idaho National Laboratory (INL) and its partners have developed practical approaches to help utilities navigate these intersecting challenges as they leverage federal investment to strengthen and grow the grid. These solutions include Cyber-Informed Engineering (CIE) principles that build resilience directly into systems, the Cirrus tool for secure cloud migration, and enhanced procurement guidance that embeds security requirements throughout equipment lifecycles. Federal initiatives, such as the Technical Assistance for Digital Assurance (TADA) project, provide direct support to utilities implementing these approaches while facilitating knowledge sharing across the industry. While these tools and frameworks cannot eliminate all risks inherent in foreign supply chain dependencies, they offer pragmatic pathways for strengthening security posture without sacrificing the deployment momentum essential to meeting surging electricity demand. Ultimately, securing America's digital energy infrastructure demands dedicated coordination across multiple fronts: building domestic supply chains, implementing robust digital assurance practices, and maintaining the aggressive modernization timeline necessary for reliability, resilience, and energy independence.

24 POWER TRANSMISSION AND DISTRIBUTION↗