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At least 451 records · Page 25

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NASA NTRS1983

Sintering of reaction bonded silicon nitride

A process to produce sintered reaction-bonded Si3N4 (SRBSN) articles has been developed. This process consists of the addition of an appropriate sintering aid to reaction-bonded Si3N4 followed by sintering between 1780 and 2000 C, using an over pressure of nitrogen. The principal advantage of this process is the low sintering shrinkages of 5 to 10 percent. The properties and microstructure of two SRBSN systems sintered with MgO and Y2O3 additives are described and were found to be comparable to corresponding hot-pressed Si3N4 systems. Examples of applications of both systems are illustrated, demonstrating near net shape fabrication capability of the process.

Mangels, J. A.↗

NASA NTRS1985

Bonding Technique for Stiffened-Skin Structures

Consistent bond thickness achieved even in large, complicated parts. Spring Clamp positions and holds parts assembled on tooling plate. Stiffener and backing bar held against adhesive layer by clamp. Spring action of clamp keeps steady force on pieces as they cure, insuring consistent bond thickness.

Frickland, P. O.↗

NASA NTRS1983

Chemical bonding technology for terrestrial photovoltaic modules

Encapsulated photovoltaic modules must hold together for 20 years, reliably resisting delamination and separation of any of the component materials. Delamination of encapsulation materials from each other, or from solar cells and interconnects, can create voids for accumulation of water, promoting corrosive failure. Delamination of silicone elastomers from unprimed surfaces was a common occurrence with early modules, but the incidences of silicone delamination with later modules decreased when adhesion promoters recommended by silicone manufacturers were used. An investigation of silicone delamination from unprimed surfaces successfully identified the mechanism, which was related to atmospheric oxygen and moisture. This early finding indicated that reliance on physical bonding of encapsulation interfaces for long life in an outdoor environment would be risky. For long outdoor life, the material components of a module must therefore be held together by weather-stable adhesion promoters that desirably form strong, interfacial chemical bonds.

Coulter, D. R.↗

NASA NTRS1984

Advanced leading edge thermal-structure concept. Direct bond reusable surface insulation to a composite structure

An advanced leading-edge concept was analyzed using the space shuttle leading edge system as a reference model. The comparison indicates that a direct-bond system utilizing a high temperature (2700 F) fibrous refractory composite insulation tile bonded to a high temperature (PI/graphite) composite structure can result in a weight savings of up to 800 lb. The concern that tile damage or loss during ascent would result in adverse entry aerodynamics if a leading edge tile system were used is addressed. It was found from experiment that missing tiles (as many as 22) on the leading edge would not significantly affect the basic force-and-moment aerodynamic coefficients. Additionally, this concept affords a degree of redundancy to a thermal protection system in that the base structure (being a composite material) ablates and neither melts nor burns through when subjected to entry heating in the event tiles are actually lost or damaged during ascent.

Riccitiello, S. R.↗

NASA NTRS1984

Metallic Adhesion and Bonding

Although metallic adhesion has played a central part in much tribological speculation, few quantitative theoretical calculations are available. This is in part because of the difficulties involved in such calculations and in part because the theoretical physics community is not particularly involved with tribology. The calculations currently involved in metallic adhesion are summarized and shown that these can be generalized into a scaled universal relationship. Relationships exist to other types of covalent bonding, such as cohesive, chemisorptive, and molecular bonding. A simple relationship between surface energy and cohesive energy is offered.

Ferrante, J.↗

NASA NTRS1984

A new analysis of charge transfer and polarization for ligand-metal bonding - Model studies of Al4CO and Al4NH3

The nature of the bonding of CO and NH3 ligands to Al is analyzed, and the intra-unit charge polarization and inter-unit donation for the interaction of ligands with metals are studied. The consequences of metal-to-ligand and ligand-to-metal charge transfer are separately considered by performing a constrained space orbital variation (CSOV) with the electrons of the metal member of the complex in the field of frozen ligand. The electrons of the metal atoms are then frozen in the relaxed distribution given by the CSOV SCF wave function and the ligand electrons are allowed to relax. Quantitative measures of the importance of inter-unit charge transfers and intra-unit polarization are obtained using results of SCF studies of Al4CO and Al4NH3 clusters chosen to simulate the adsorption of the ligands at an on-top side of the Al(111) surface. The electrostatic attraction of the effective dipole moments of the metal and ligand units makes an important contribution to the bond.

Bagus, P. S.↗

NASA NTRS1985

Bonding Solar-Cell Modules

Status of research program on chemical bonding for solar-cell arrays subject of 57-page report. Program aimed at identifying, developing, and validating weather-stable chemical bonding promoters. Materials key to ensuring long life in encapsulated photovoltaic modules for electric-power generation. To be cost-effective, modules must hold together for at least 20 years, reliably resisting delamination and separation of component materials

Coulter, D. R.↗

NASA NTRS1985

Influence of interface ply orientation on fatigue damage of adhesively bonded composite joints

An experimental study of cracked-lap-shear specimens was conducted to determine the influence of adherend stacking sequence on debond initiation and damage growth in a composite-to-composite bonded joint. Specimens consisted of quasi-isotropic graphite/epoxy adherends bonded together with either FM-300 or EC 3445 adhesives. The stacking sequence of the adherends was varied such that 0 deg, 45 deg, or 90 deg plies were present at the adherend-adhesive interfaces. Fatigue damage initiated in the adhesive layer in those specimens with 0 deg nd 45 deg interface plies. Damage initiated in the form of ply cracking in the strap adherend for the specimens with 90 deg interface plies. The fatigue-damage growth was in the form of delamination within the composite adherends for specimens with the 90 deg and 45 deg plies next to the adhesive, while debonding in the adhesive resulted for the specimens with 0 deg plies next to the adhesive. Those joints with the 0 deg and 45 deg plies next to either adhesive has essentially the same fatigue-damage-initiation stress levels. These stress levels were 13 and 71 percent higher, respectively, than those for specimens with 90 deg plies next to the EC 3445 and FM-300 adhesives.

Johnson, W. S.↗

NASA NTRS1984

Interfacial bonding stability

Interfacial bonding stability by in situ ellipsometry was investigated. It is found that: (1) gamma MPS is an effective primer for bonding ethylene vinyl acetate (EVA) to aluminum; (2) ellipsometry is an effective in situ technique for monitoring the stability of polymer/metal interfaces; (3) the aluminized back surface of silicon wafers contain significant amounts of silicon and may have glass like properties.

Boerio, J.↗

NASA NTRS1985

Joint design for improved fatigue life of diffusion-bonded box-stiffened panels

Simple photoelastic models were used to identify a cross-section geometry that would eliminate the severe stress concentrations at the bond line between box stiffeners diffusion bonded to a panel skin. Experimental fatigue-test data from titanium test specimens quantified the allowable stress in terms of cycle life for various joint geometries. It is shown that the effect of stress concentration is reduced and an acceptable fatigue life is achieved.

Davis, R. C.↗

NASA NTRS1985

Coupled transient response of tiles bonded elastically to a finite flexible plate

Presented are several methods to study a system of tiles bonded elastically to a finite flexible plate responding to an impulse. First, a one-dimensional (1-D) approximation to the system is constructed using Timoshenko beam theory and transfer matrices. This simulates a strip one tile wide. Modal analysis determines the transient response to an impulse of short duration. Also presented are parametric studies of the effect of bond stiffness and the effect of stiffening from inplane stresses produced by large out-of-plane deflections. A two-dimensional (2-D) model is constructed from the eigenfunctions of the 1-D model in a Galerkin method using pairwise products of the 1-D modes as trial functions. Comparison of the two models establishes a factor applied to peak impulse pressure for results to agree.

El-Raheb, M.↗

NASA NTRS1985

Microstructure of reaction-bonded silicon nitride consolidated by isostatic hot-pressing

A microstructural examination and chemical analysis are conducted for reaction-bonded Si3N4 specimens that were isostatically hot pressed at 1850, 1950, and 2050 C. The present observations indicate that the previously reported increase in the 1200 C bend strength of reaction-bonded Si3N4, after pressing at 2050 C exclusively, is due to the relative oxygen levels of the isostatically hot pressed specimens; calculations show that an SiO2 content of less than about 2.2 vol pct is needed to yield the 1200 C strength increase.

Mieskowski, D. M.↗

NASA NTRS1986

Ultrasonic Bonding to Metalized Plastic

New technique makes it possible to bond wires ultrasonically to conductor patterns on such soft substrates as plain or ceramic-filled polytetrafluoroethylene. With ultrasonic bonding, unpackaged chips attached to soft circuit boards. Preferred because chips require substrate area and better matched electrically to circuit board at high frequencies.

Conroy, B. L.↗

NASA NTRS1985

Use of Hydration Inhibitors to Improve Bond Durability of Aluminum Adhesive Joints

An investigation is conducted of the mechanisms by which nitrilotris methylene phosphonic acid (NTMP) and related compounds are adsorbed onto oxidized aluminum surfaces to inhibit hydration and increase the durability of adhesive bonds formed with inhibitor-treated panels. P - O - Al bonds are identified as the basis of adsorption, and it is found that water initially adsorbed onto the etched aluminum surfaces is displaced by the NTMP. The hydration of the NTMP-treated surfaces occurs in three stages, namely the reverisble physisorption of water, the slow dissolution of NTMP followed by rapid hydration of the freshly exposed Al2O3 to AlOOH and further hydration of the surface to Al(OH)3. Five properties of an ideal inhibitor are identified.

Davis, G. D.↗

NASA NTRS1985

Interaction of mixed mode loading on cyclic debonding in adhesively bonded composite joints

A combined experimental and analytical investigation of an adhesively-bonded composite joint was conducted to characterize the fracture mode dependence of cyclic debonding. The system studied consisted of graphite/epoxy adherends bonded with EC 3445 adhesive. Several types of specimens are tested which provide the cyclic debond growth rate measurements under various load conditions: mode 1, mixed mode 1 to 2, and mostly mode 2. This study shows that the total strain-energy-release rate is the governing factor for cyclic debonding.

Mall, S.↗

NASA NTRS1985

Cryogenic insulation strength and bond tester

A method and apparatus for testing the tensile strength and bonding strength of sprayed-on foam insulation attached to metal cryogenic fuel tanks is described. A circular cutter is used to cut the insulation down to the surface of the metal tank to form plugs of the insulation for testing in situ on the tank. The apparatus comprises an electromechanical pulling device powered by a belt battery pack. The pulling device comprises a motor driving a mechanical pulling structure comprising a horizontal shaft connected to two bell cracks which are connected to a central member. When the lower end of member is attached to a fitting, which in turn is bonded to a plug, a pulling force is exerted on the plug sufficient to rupture it. The force necessary to rupture the plug or pull it loose is displayed as a digital read-out.

Schuerer, P. H.↗

NASA NTRS1984

Lightning protection guidelines and test data for adhesively bonded aircraft structures

The highly competitive marketplace and increasing cost of energy has motivated manufacturers of general aviation aircraft to utilize composite materials and metal-to-metal bonding in place of conventional fasteners and rivets to reduce weight, obtain smoother outside surfaces and reduce drag. The purpose of this program is protection of these new structures from hazardous lightning effects. The program began with a survey of advance-technology materials and fabrication methods under consideration for future designs. Sub-element specimens were subjected to simulated lightning voltages and currents. Measurements of bond line voltages, electrical sparking, and mechanical strength degradation were made to comprise a data base of electrical properties for new technology materials and basic structural configurations. The second hase of the program involved tests on full scale wing structures which contained integral fuel tanks and which were representative of examples of new technology structures and fuel systems. The purpose of these tests was to provide a comparison between full scale structural measurements and those obtained from the sub-element specimens.

Pryzby, J. E.↗

NASA NTRS1985

Differences in interfacial bond strengths of graphite fiber-epoxy resin composites

The effect of epoxy-size and degree of cure on the interfacial bonding of an epoxy-amine-graphite fiber composite system is examined. The role of the fiber-resin interface in determining the overall mechanical properties of composites is poorly understood. A good interfacial adhesive bond is required to achieve maximum stress transfer to the fibers in composites, but at the same time some form of energy absorbing interfacial interaction is needed to achieve high fracture toughening. The incompatibility of these two processes makes it important to understand the nature and basic factors involved at the fiber-resin interface as stress is applied. The mechanical properties including interlaminar shear values for graphite fiber-resin composites are low compared to glass and boron-resin composites. These differences have been attributed to poor fiber-matrix adhesion. Graphite fibers are commonly subjected to post-treatments including application of organic sizing in order to improve their compatibility with the resin matrix and to protect the fiber tow from damage during processing and lay-up. In such processes, sized graphite fiber tow is impregnated with epoxy resin and then layed-up i nto the appropriate configuration. Following an extended ambient temperature cure, the graphite-resin composite structure is cured at elevated temperature using a programmed temperature sequence to cure and then cool the product.

Needles, H. L.↗