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Reviews the many factors that affect interconnect reliability of emerging chip scale package (CSP) assemblies. These include: package type, package build, board design, and assembly variables.
This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.
The described effort is phase one of the development of a Computer Aided Design (CAD) software to be used to perform radiometric sensor design. The software package will be referred to as SCAD and is directed toward the preliminary phase of the design of space based sensor system. The approach being followed is to develop a modern, graphic intensive, user friendly software package using existing software as building blocks. The emphasis will be directed toward the development of a shell containing menus, smart defaults, and interfaces, which can accommodate a wide variety of existing application software packages. The shell will offer expected utilities such as graphics, tailored menus, and a variety of drivers for I/O devices. Following the development of the shell, the development of SCAD is planned as chiefly selection and integration of appropriate building blocks. The phase one development activities have included: the selection of hardware which will be used with SCAD; the determination of the scope of SCAD; the preliminary evaluation of a number of software packages for applicability to SCAD; determination of a method for achieving required capabilities where voids exist; and then establishing a strategy for binding the software modules into an easy to use tool kit.
An interactive software package which provides design solutions for both standard linear quadratic regulator (LQR) and suboptimal linear regulator problems is described. Intended for time-invariant continuous systems, the package is easily modified to include sampled-data systems. LQR designs are obtained by established techniques while the large class of suboptimal problems containing controller and/or performance index options is solved using a robust gradient minimization technique. Numerical examples demonstrate features of the package and recent developments are described.
Soft magnetic cores are rarely used in application without packaging. The packaging mechanically integrates the core into the rest of the design and can support other external forces such as winding stress. Material data sheets typically offer core performance in an unstressed environment, that represents a best-case scenario for materials with non-zero magnetostriction. This work will show the impact of various packaging solutions on core properties as well as best practices, both material and packaging design. A particular emphasis will be placed on packaging solutions for aerospace applications.
New high temperature low power 8-pin packages have been fabricated using commercial fabrication service. These packages are made of aluminum nitride and 96 percent alumina with Au metallization. The new design of these packages provides the chips inside with EM shielding. Wirebond geometry control has been achieved for precise mechanical tests. Au wirebond samples with 45 degree heel-angle have been tested using wireloop test module. The geometry control improves the consistency of measurement of the wireloop breaking point.Also reported on is a parametric study of the thermomechanical reliability of a Au thick-film based SiC die-attach assembly using nonlinear finite element analysis (FEA) was conducted to optimize the die-attach thermo-mechanical performance for operation at temperatures from room temperature to 500 degrees Centigrade. This parametric study centered on material selection, structure design and process control.
Spectral and spatial filtering in detector package of lunar laser ranging probes
The operating requirements, system design characteristics, high voltage packaging considerations, nonstandard components development, and test results for the transmitter experiment package (TEP) are described. The TEP is used for broadcasting power transmission from the Communications Technology Satellite. The TEP consists of a 12 GHz, 200-watt output stage tube (OST), a high voltage processing system that converts the unregulated spacecraft solar array power to the regulated voltages required for OST operation, and a variable conductance heat pipe system that is used to cool the OST body.
The figure depicts a miniature cantilever-type anemometer that has been developed as a prototype of compact, relatively nonintrusive anemometers that can function at temperatures up to 600 C and that can be expected to be commercially mass-producible at low cost. The design of this anemometer, and especially the packaging aspect of the design, is intended to enable measurement of turbulence in the high-temperature, high-vibration environment of a turbine engine or in any similar environment. The main structural components of the anemometer include a single-crystal SiC cantilever and two polycrystalline SiC clamping plates, all made from chemical-vapor-deposited silicon carbide. Fabrication of these components from the same basic material eliminates thermal-expansion mismatch, which has introduced spurious thermomechanical stresses in cantilever-type anemometers of prior design. The clamping plates are heavily oxidized to improve electrical insulation at high temperature. A cavity that serves as a receptacle for the clamped end of the cantilever is etched into one end of one clamping plate. Trenches that collectively constitute a socket for a multipin electrical plug (for connection to external electronic circuitry) are etched into the opposite end of this clamping plate. Metal strips for electrical contact are deposited on one face of the other clamping plate. Piezoresistive single-crystal SiC thin-film strain gauges are etched in the n-type SiC epilayer in a Wheatstone-bridge configuration. Metal contact pads on the cantilever that extend into the clamping-receptacle area, are obtained by deposition and patterning using standard semiconductor photolithography and etching methods. The cantilever and the two clamping plates are assembled into a sandwich structure that is then clamped in a stainless-steel housing. The Wheatstone- bridge carrying SiC cantilever with the metal contact pads on the piezoresistors is slid into the receptacle in the bottom clamping plate. The top clamping plate is brought into contact with the bottom plate so that the narrow section of the metal strips on the top clamp plate aligns with the metal contact pads on the cantilever. When the parts are clamped together, the metal strips provide electrical connections between the Wheatstone-bridge contact points and the sides the trenches that constitute the socket for the multipin electrical plug. Hence, to connect the Wheatstone bridge to external circuitry for processing of the anemometer readout, one need only insert the plug in the socket. In operation, the cantilever end of the stainless-steel housing is mounted flush with an engine wall and the unclamped portion of the cantilever is exposed into the flow. The cantilever is deflected in direct proportion to the force induced by component of flow parallel to the engine wall and perpendicular to the broad exposed face of the cantilever. The maximum strain on the cantilever occurs at the clamped edge and is measured by the piezoresistors, which are located there. The corresponding changes in resistance manifest themselves in the output of the Wheatstone bridge.
Yet Another Menu Manager (YAMM) computer program an application-independent menuing package of software designed to remove much difficulty and save much time inherent in implementation of front ends of large packages of software. Provides complete menuing front end for wide variety of applications, with provisions for independence from specific types of terminals, configurations that meet specific needs of users, and dynamic creation of menu trees. Consists of two parts: description of menu configuration and body of application code. Written in C.
The objective of this contract is to explore optical design concepts for the PRISM spectrograph and produce a preliminary optical design. An exciting optical configuration has been developed which will allow both wavelength bands to be imaged onto the same detector array. At present the optical design is only partially complete because PRISM will require a fairly elaborate optical system to meet its specification for throughput (area*solid angle). The most complex part of the design, the spectrograph camera, is complete, providing proof of principle that a feasible design is attainable. This camera requires 3 aspheric mirrors to fit inside the 20x60 cm cross-section package. A complete design with reduced throughput (1/9th) has been prepared. The design documents the optical configuration concept. A suitable dispersing prism material, CdTe, has been identified for the prism spectrograph, after a comparison of many materials.
Voyager spacecraft subsystem level requirements in guidance and control, power, propulsion, and engineering mechanics including structures and packaging
A unique focal plane array (FPA) assembly combining both electronic and optical components in a single hermetically sealed hybrid package has been designed to meet the performance requirements imposed on the focal plane assembly in the Visual and Infrared Mapping Spectrometer (VIMS) for the Mars Observer (MO) mission. Inside the FPA package is a configuration of three multiplexed linear arrays containing 320 detector elements, a combination of Si and InSb, allowing continuous spectral coverage from 0.35 to 5.14 microns. An optical subassembly consisting of two spectral order-sorting filters with intrinsic field-of-view apertures requiring critical optical alignment is also internal to the hybrid. Several engineering issues arose during the MO/VIMS FPA development phase which had challenging design ramifications. FPA performance requirements, design approach, and critical issues are discussed.
This paper describes the design, construction, testing, and successful flight of the Attitude Sensor Package. The payload was assembled on a standard HITCHHIKER experiment mounting plate, and made extensive use of the carrier's power and data handling capabilities. The side mounted HITCHHIKER version was chosen, since this configuration provided the best viewing conditions for the instruments. The combustion was successfully flown on board Space Shuttle Columbia (STS-52), in October 1992. The payload was one of the 14 experiments of the In-Orbit Technology Demonstration Program (Phase 1) of the European Space Agency.
A method to qualify the Rover Low Gain Antenna (RLGA) for use during the Mars Science Laboratory (MSL) mission has been devised. The RLGA antenna must survive all ground operations, plus the nominal 670 Martian sol mission that includes the summer and winter seasons of the Mars thermal environment. This qualification effort was performed to verify that the RLGA design, its bonding, and packaging processes are adequate. The qualification test was designed to demonstrate a survival life of three times more than all expected ground testing, plus a nominal 670 Martian sol missions. Baseline RF tests and a visual inspection were performed on the RLGA hardware before the start of the qualification test. Functional intermittent RF tests were performed during thermal chamber breaks over the course of the complete qualification test. For the return loss measurements, the RLGA antenna was moved to a test area. A vector network analyzer was calibrated over the operational frequency range of the antenna. For the RLGA, a simple return loss measurement was performed. A total of 2,010 (3 670 or 3 times mission thermal cycles) thermal cycles was performed. Visual inspection of the RLGA hardware did not show any anomalies due to the thermal cycling. The return loss measurement results of the RLGA antenna after the PQV (Package Qualification and Verification) test did not show any anomalies. The antenna pattern data taken before and after the PQV test at the uplink and downlink frequencies were unchanged. Therefore, the developed design of RLGA is qualified for a long-duration MSL mission.
The use of the OPTDES.BYU package developed to assist the engineer in obtaining efficient designs is discussed. The package helps the engineer to perform the following fundamental tasks in the design process: (1) interfacing with existing analysis software; (2) defining and redefining the design problem; (3) searching for improved designs; and (4) interpreting results from the design process.
Recent moisture resistance tests of various multilayer top brazed ceramic flat packs and leaded and unleaded chip carriers has revealed a serious design defect. These packages, which utilize a tungsten interconnect system, in the presence of high humidity, suffer a galvanic corrosion which anodically consumes the tungsten. This process can continue until the package suffers an open circuit. The test results indicate that the lead plating system does not adequately seal off the interface area where the tungsten stripe egresses from the inside of the package. Leaded and leadless chip carrier packages were also subjected to the moisture resistance test. The familiar red and green corrosion products were visible after the test was completed. Careful sectioning of the chip carriers has revealed that the tungsten interconnect stripe instead of exiting under the castellations, exits at the top of the castellation and is thus vulnerable to the attack of moisture. These basic design faults severely impact the reliability of these packages.
A focal plane assembly combining hybrid electronic components with passive optical components within a single hermetically sealed package has been designed by Cincinnati Electronics to meet the performance requirements imposed by the Comet Rendezvous/Asteroid Flyby (CRAF) and Cassini Visible and Infrared Mapping Spectrometers (VIMSs). A single line array of 256 InSb photodiodes, accessed by two 1 x 128 multiplexers, provides continuous spectral coverage from 0.85 to 5.1 microns. Intrinsic field-of-view apertures and a unique order sorting filter require critical optical alignment within the hybrid. FPA performance requirements, design approach, and critical issues are discussed.