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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 433 records · Page 24
All sourcesNASA NTRSDOE OSTI
NASA NTRS1998

Microfabricated Chemical Sensors for Safety and Emission Control Applications

Chemical sensor technology is being developed for leak detection, emission monitoring, and fire safety applications. The development of these sensors is based on progress in two types of technology: 1) Micromachining and microfabrication (MicroElectroMechanical Systems (MEMS)-based) technology to fabricate miniaturized sensors. 2) The development of high temperature semiconductors, especially silicon carbide. Using these technologies, sensors to measure hydrogen, hydrocarbons, nitrogen oxides, carbon monoxide, oxygen, and carbon dioxide are being developed. A description is given of each sensor type and its present stage of development. It is concluded that microfabricated sensor technology has significant potential for use in a range of aerospace applications.

Hunter, G. W.↗
NASA NTRS1999

Fabrication of Pop-up Detector Arrays on Si Wafers

High sensitivity is a basic requirement for a new generation of thermal detectors. To meet the requirement, close-packed, two-dimensional silicon detector arrays have been developed in NASA Goddard Space Flight Center. The goal of the task is to fabricate detector arrays configured with thermal detectors such as infrared bolometers and x-ray calorimeters to use in space fliGht missions. This paper focuses on the fabrication and the mechanical testing of detector arrays in a 0.2 mm pixel size, the smallest pop-up detectors being developed so far. These array structures, nicknamed "PUDS" for "Pop-Up Detectors", are fabricated on I pm thick, single-crystal, silicon membranes. Their designs have been refined so we can utilize the flexibility of thin silicon films by actually folding the silicon membranes to 90 degrees in order to obtain close-packed two-dimensional arrays. The PUD elements consist of a detector platform and two legs for mechanical support while also serving as electrical and thermal paths. Torsion bars and cantilevers connecting the detector platform to the legs provide additional flexures for strain relief. Using micro-electromechanical structure (MEMS) fabrication techniques, including photolithography, anisotropic chemical etching, reactive-ion etching, and laser dicing, we have fabricated PLTD detector arrays of fourteen designs with a variation of four parameters including cantilever length, torsion bar length and width, and leg length. Folding tests were conducted to test mechanical stress distribution for the array structures. We obtained folding yields and selected optimum design parameters to reach minimal stress levels. Computer simulation was also employed to verify mechanical behaviors of PUDs in the folding process. In addition, scanning electron microscopy was utilized to examine the flatness of detectors and the alignment of detector pixels in arrays. The fabrication of thermistors and heaters on the pop-up detectors is under way, preparing us for the next step of the experiment, the thermal test.

Li, Mary J.↗
NASA NTRS1998

Broadband Infrared Antireflection Structured Silicon Surfaces

Silicon and germanium are materials often used for IR windows and optical elements. However they have a very high index of refraction, in the order of three to four, which causes large reflection losses on each surface. These losses are especially high under large angles of incidence which are often desirable if signals are faint and fast optics are to be used. Solid antireflection coatings are either not available because materials with appropriate index of refraction do not exist, or their use is limited to a small wavelength range and small angles of incidence. We will present the status of our work to calculate, create, and test the performance of graded structures in Si to reduce its surface reflection. The structures are expected to work over the very broad wavelength range of 10 microns to 1000 microns and a wide range of angle of incidence. We have identified several high aspect ratio MEMS process techniques to create the structures and have done 3D electromagnetic modeling, which predicts significant effects. Measurements on different samples have validated our modeling.

Stewart, Kenneth↗
NASA NTRS1999

Broadband Infrared Antireflection Structured Silicon Surfaces

Silicon and germanium are materials often used for IR windows and optical elements. However they have a very high index of refraction, in the order of three to four, which causes large reflection losses on each surface. These losses are especially high under large angles of incidence which are often desirable if signals are faint and fast optics are to be used. Solid antireflection coatings are either not available because materials with appropriate index of refraction do not exist, or their use is limited to a small wavelength range and small angles of incidence. We will present the status of our work to calculate, create, and test the performance of graded structures in Si to reduce its surface reflection. The structures are expected to work over the very broad wavelength range of 10 to 1000 micrometers and a wide range of angle of incidence. We have identified several high aspect ratio MEMS process techniques to Create the structures and have done 3D electromagnetic modeling, which predicts significant effects. Measurements on different samples have validated our modeling.

Stewart, Kenneth↗
NASA NTRS1999

Broadband Infrared Antireflection Structured Silicon Surfaces

Silicon and germanium are materials often used for infrared (IR) windows and optical elements. However they have a very high index of refraction, in the order of three to four, which causes large reflection losses on each surface. These losses are especially high under large angles of incidence which are often desirable if signals are faint and fast optics are to be used. Solid antireflection coatings are either not available because materials with appropriate index of refraction do not exist, or their use is limited to a small wavelength range and small angles of incidence. We will present the status of our work to calculate, create, and test the performance of graded structures in Si to reduce its surface reflection. The structures are expected to work over the very broad wavelength range of 10 micron to 1000 micron and a wide range of angle of incidence. We.have identified several high aspect ratio MEMS process techniques to create the structures and have done 3D electromagnetic modeling, which predicts significant effects. Measurements on different samples have validated our modeling.

Stewart, Kenneth↗
NASA NTRS1999

STS-93 Post Flight Presentation

An overview of Flight STS-93 is presented. The primary objective of the STS-93 mission was to deploy the Advanced X-Ray Astrophysics Facility (AXAF), also known as the Chandra X-ray Observatory. The mission flew on the Columbia Shuttle, on July 22, 1999. This facility is the most sophisticated X-ray observatory ever built. Other payloads on STS-93 were: (1) the Midcourse Space Experiment (MSX), (2) Shuttle Ionospheric Modification with Pulsed Local Exhaust (SIMPLEX), (3) Southwest Ultraviolet Imaging System (SWUIS), (4) Gelation of Sols: Applied Microgravity Research (GOSAMR), Space Tissue Loss-B (STL-B), (5) Light Weight Flexible Solar Array Hinge (LFSAH), (6) Cell Culture Module (CCM), and (7) the Shuttle Amateur Radio Experiment-II (SAREX-II), (8) EarthKam, (9) Plant Growth Investigations in Microgravity (PGIM), (10) Commercial Generic Bioprocessing Apparatus (CGBA), (11) Micro-Electrical Mechanical System (MEMS), and (12) the Biological Research in Canisters (BRIC). The crew was: Eileen M. Collins, Mission Commander, the first female shuttle commander; Jeffrey S. Ashby, Pilot; Steven A. Hawley , Mission Specialist; Catherine G. Coleman, Mission Specialist; Michel Tognini (CNES), Mission Specialist. The video contains views of life aboard the space shuttle. This mission featured both a night launching and a night landing at the Kennedy Space Center.

Source record↗
NASA NTRS2000

Parametric Study of Variable Emissivity Radiator Surfaces

The goal of spacecraft thermal design is to accommodate a high function satellite in a low weight and real estate package. The extreme environments that the satellite is exposed during its orbit are handled using passive and active control techniques. Heritage passive heat rejection designs are sized for the hot conditions and augmented for the cold end with heaters. The active heat rejection designs to date are heavy, expensive and/or complex. Incorporating an active radiator into the design that is lighter, cheaper and more simplistic will allow designers to meet the previously stated goal of thermal spacecraft design Varying the radiator's surface properties without changing the radiating area (as with VCHP), or changing the radiators' views (traditional louvers) is the objective of the variable emissivity (vary-e) radiator technologies. A parametric evaluation of the thermal performance of three such technologies is documented in this paper. Comparisons of the Micro-Electromechanical Systems (MEMS), Electrochromics, and Electrophoretics radiators to conventional radiators, both passive and active are quantified herein. With some noted limitations, the vary-e radiator surfaces provide significant advantages over traditional radiators and a promising alternative design technique for future spacecraft thermal systems.

Grob, Lisa M.↗
NASA NTRS2000

Development of Individually Addressable Micro-Mirror-Arrays for Space Applications

We have been developing a 32 x 32 prototype array of individually addressable Micro-Mirrors capable of operating at cryogenic temperature for Earth and Space Science applications. Micro-Mirror-Array technology has the potential to revolutionize imaging and spectroscopy systems for NASA's missions of the 21st century. They can be used as programmable slits for the Next Generation Space Telescope, as smart sensors for a steerable spectrometer, as neutral density filters for bright scene attenuation etc. The, entire fabrication process is carried out in the Detector Development Laboratory at NASA, GSFC. The fabrication process is low temperature compatible and involves integration of conventional CMOS technology and surface micro-machining used in MEMS. Aluminum is used as the mirror material and is built on a silicon substrate containing the CMOS address circuit. The mirrors are 100 microns x l00 microns in area and deflect by +/- 10 deg induced by electrostatic actuation between two parallel plate capacitors. A pair of thin aluminum torsion straps allow the mirrors to tilt. Finite-element-analysis and closed form solutions using electrostatic and mechanical torque for mirror operation were developed and the results were compared with laboratory performance. The results agree well both at room temperature and at cryogenic temperature. The development demonstrates the first cryogenic operation of two-dimensional Micro-Mirrors with bi-state operation. Larger arrays will be developed meeting requirements for different science applications. Theoretical analysis, fabrication process, laboratory test results and different science applications will be described in detail.

Dutta, Sanghamitra B.↗
NASA NTRS2000

Cooperative Mission Concepts Using Biomorphic Explorers

Inspired by the immense variety of naturally curious explorers (insects, animals, and birds), their wellintegrated biological sensor-processor suites, efficiently packaged in compact but highly dexterous forms, and their complex, intriguing, cooperative behavior, this paper focuses on "Biomorphic Explorers", their defination/classification, their designs, and presents planetary exploration scenarios based on the designs. Judicious blend of bio-inspired concepts and recent advances in micro-air vehicles, microsensors, microinstruments, MEMS, and microprocessors clearly suggests that the time of small, dedicated, low cost explorers that capture some of the key features of biological systems has arrived. Just as even small insects like ants, termites, honey bees etc working cooperatively in colonies can achieve big tasks, the biomorphic explorers hold the potential for obtaining science in-accessible by current large singular exploration platforms.

Thakoor, S.↗
NASA NTRS2000

Microelectromechanical Switches for Phased Array Antennas

Preliminary results are presented on the fabrication and testing of a MicroElectro-Mechanical (MEM) microstrip series switch. This switch is being developed for use in a K-band phased array antenna that NASA will use for communication links in its Earth orbiting satellites. Preliminary insertion loss and isolation measurements are presented.

Ponchak, George E.↗
NASA NTRS1999

Advanced Interconnect Roadmap for Space Applications

This paper presents the NASA electronic parts and packaging program for space applications. The topics include: 1) Forecasts; 2) Technology Challenges; 3) Research Directions; 4) Research Directions for Chip on Board (COB); 5) Research Directions for HDPs: Multichip Modules (MCMs); 6) Research Directions for Microelectromechanical systems (MEMS); 7) Research Directions for Photonics; and 8) Research Directions for Materials. This paper is presented in viewgraph form.

Galbraith, Lissa↗
NASA NTRS2000

Fracture Tests of Etched Components Using a Focused Ion Beam Machine

Many optical MEMS device designs involve large arrays of thin (0.5 to 1 micron components subjected to high stresses due to cyclic loading. These devices are fabricated from a variety of materials, and the properties strongly depend on size and processing. Our objective is to develop standard and convenient test methods that can be used to measure the properties of large numbers of witness samples, for every device we build. In this work we explore a variety of fracture test configurations for 0.5 micron thick silicon nitride membranes machined using the Reactive Ion Etching (RIE) process. Testing was completed using an FEI 620 dual focused ion beam milling machine. Static loads were applied using a probe. and dynamic loads were applied through a piezo-electric stack mounted at the base of the probe. Results from the tests are presented and compared, and application for predicting fracture probability of large arrays of devices are considered.

Kuhn, Jonathan, L.↗
NASA NTRS2000

Development of Hybrid Sensor Arrays for Sensor Arrays for Simultaneous Measurement of Pressure and Shear Stress Distribution

This document reports on the progress in developing hybrid sensors for the simultaneous measurement of pressure and shear stress. The key feature for the success of the proposed hybrid sensor array is the ability to deposit Cu-Ni alloy with proper composition (55 - 45) on a silicon wafer to form a strain gage. This alloy strain gage replaces the normally used Si strain gages in MEMS, which are highly nonlinear and temperature dependent. The copper nickel, with proper composition (55 - 45), was successfully deposited on a silicon wafer with a few trials during this period of the project. Pictures of the Cu-Ni alloy strain gage and the x-ray spectra indicating the composition are shown. The planned tests are also reviewed.

Source record↗
NASA NTRS1999

Thin Film Li Ion Microbatteries for NASA Applications

Rechargeable thin film microbatteries have recently become the topic of widespread research for use in low power applications such as battery-backed CMOS memory, miniaturized implantable medical devices and smart cards. In particular, the Center for Integrated Space Microsystems (CISM) at NASA's Jet Propulsion Laboratory has interest in applying this technology for secondary power systems in miniaturized satellites, microsensors, microactuators and other remote MEMS applications. The general requirements of the microbatteries for these applications are high specific energy, wide range of temperature stability. low self-discharge rate, and flexibility of cell design. The thin film Li ion materials system using LiCoO2(LiPO(x)N(1-x))SnO is expected to fulfill these requirements.

West, W. C.↗
NASA NTRS2001

Micro Navigator

Miniature high-performance low-mass space avionics systems are desired for planned future outer planetary exploration missions (i.e. Europa Orbiter/Lander, Pluto-Kuiper Express). The spacecraft fuel and mass requirements enabling orbit insertion is the driving requirement. The Micro Navigator is an integrated autonomous Guidance, Navigation & Control (GN&C)micro-system that would provide the critical avionics function for navigation, pointing, and precision landing. The Micro Navigator hardware and software allow fusion of data from multiple sensors to provide a single integrated vehicle state vector necessary for six degrees of freedom GN&C. The benefits of this MicroNavigator include: 1) The Micro Navigator employs MEMS devices that promise orders of magnitude reductions in mass power and volume of inertial sensors (accelerometers and gyroscopes), celestial sensing devices (startracker, sun sensor), and computing element; 2) The highly integrated nature of the unit will reduce the cost of flight missions. a) The advanced miniaturization technologies employed by the Micro Navigator lend themselves to mass production, and therefore will reduce production cost of spacecraft. b) The integral approach simplifies interface issues associated with discrete components and reduces cost associated with integration and test of multiple components; and 3) The integration of sensors and processing elements into a single unit will allow the Micro Navigator to encapsulate attitude information and determination functions into a single object. This is particularly beneficial for object-oriented software architectures that are used in advanced spacecraft. Additional information is contained in the original extended abstract.

Blaes, B. R.↗
NASA NTRS2001

Heterogeneous Integration, An Approach to High Density and High Flexibility Electronic Packaging

Key to the design of spacecraft for exploration of the outer planets will be the development of highly integrated and mass/volume efficient electronic systems. Exploration of the outer planets will require optimized propulsion approaches which mandates mass minimization. If one looks at a mission such as the Europa Lander, a high mass/volume efficiency feeds back directly into lower mass for radiation shielding. Concurrently the long mission lengths will drive the need for fault isolation and fault tolerance. The ability to build distributed electronic systems is an inherent requirement and one which is enabled by heterogeneous integration. The electronic packaging approach must be capable of interconnecting various components at a scale comparable with that on the components themselves (chip scale) and it must facilitate efficient integration of the electronics with elements of the spacecraft such as structure or antennae. The concept of 'Heterogeneous Integration' is being explored in the System On A Chip (SOAC) Project at JPL. The goal, of this approach to electronic packaging, is to enable the fabrication and assembly of complete electronic subsystems from components fabricated by a range of processes. Included in such a system could be MEMS sensors, SOI mixed signal ASICs, micro scale passive components and micro power. Secondarily the compact size will enable distributed architectures and integrated assemblies. Additional information is contained in the original extended abstract.

DAgostino, S. A.↗
NASA NTRS2001

System Miniaturization Via Heterogeneous Integration of Electronic Devices for Deep Space Missions

The scientific devices designed for each of the Outer Planets Program Focuses will likely be groundbreaking not only with respect to their scientific role but also regarding the electronics required to perform such investigations. In the past, the performance of packaged electronics was limited by the components themselves, with minimal influence of the packaging technology. The rapid development of integrated circuit technology, however, has drastically increased the importance of packaging technology in the ultimate performance of devices. If not carefully considered in the overall design, the packaging may become the limiting factor in the operation of the system. Although industry is responsible for several significant accomplishments in the field of electronics packaging, deep space/outer planet missions must take into account additional requirements such as extremely low temperatures, high radiation levels, hermetic sealing, and severe size and weight limitations. Therefore, the present investigation has been designed to meet the needs of NASA's sensor intensive outer planets program by combining (using flip chip technology) an array of devices (including analog, digital, power volt-age, passives, and MEMS) into a miniaturized heterogeneous system and utilizing optical buses to enable autonomy. Additional information is contained in the original extended abstract.

DelCastillo, L.↗
NASA NTRS2001

Advanced RF Front End Technology

The ability to achieve low-mass low-cost micro/nanospacecraft for Deep Space exploration requires extensive miniaturization of all subsystems. The front end of the Telecommunication subsystem is an area in which major mass (factor of 10) and volume (factor of 100) reduction can be achieved via the development of new silicon based micromachined technology and devices. Major components that make up the front end include single-pole and double-throw switches, diplexer, and solid state power amplifier. JPL's Center For Space Microsystems - System On A Chip (SOAC) Program has addressed the challenges of front end miniaturization (switches and diplexers). Our objectives were to develop the main components that comprise a communication front end and enable integration in a single module that we refer to as a 'cube'. In this paper we will provide the latest status of our Microelectromechanical System (MEMS) switches and surface micromachined filter development. Based on the significant progress achieved we can begin to provide guidelines of the proper system insertion for these emerging technologies. Additional information is contained in the original extended abstract.

Herman, M. I.↗