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At least 433 records · Page 24
All sourcesNASA NTRSDOE OSTI
NASA NTRS2020

NASA SpaceCube Intelligent Multi-Purpose System for Enabling Remote Sensing, Communication, and Navigation in Mission Architectures

New, innovative CubeSat mission concepts demand modern capabilities such as artificial intelligence and autonomy, constellation coordination, fault mitigation, and robotic servicing –all of which require vastly more processing resources than legacy systems are capable of providing. Enabling these domains within a scalable, configurable processing architecture is advantageous because it also allows for the flexibility to address varying mission roles, such as a command and data-handling system, a high-performance application processor extension, a guidance and navigation solution, or an instrument/sensor interface. This paper describes the NASA SpaceCube Intelligent Multi-Purpose System (IMPS), which allows mission developers to mix-and-match 1U (10 cm × 10 cm) CubeSat payloads configured for mission-specific needs. The central enabling component of the system architecture to address these concerns is the SpaceCube v3.0 Mini Processor. This single-board computer features the 20nm Xilinx Kintex UltraScale FPGA combined with a radiation-hardened FPGA monitor, and extensive IO to integrate and interconnect varying cards within the system. To unify the re-usable designs within this architecture, the CubeSat Card Standard was developed to guide design of 1U cards. This standard define spinout configurations, mechanical, and electrical specifications for 1U CubeSat cards, allowing the backplane and mechanical enclosure to be easily extended. NASA has developed several cards adhering to the standard (System-on-Chip, power card, etc.), which allows the flexibility to configure a payload from a common catalog of cards.

Advanced Avionics, Hybrid Processing, Data Process↗
NASA NTRS1984

Multi-100kW: Planar low cost solar array development

Seven low cost multi-100 kW planar solar array modules were fabricated and tested. Two different designs were used, demonstrating advanced solar array construction practices. Both module types utilized second generation gridded back cells featuring high efficiency and IR transparency. A silicon dioxide AR coating optimized for transmission at gamma = 1.7 microns was applied to the back surface. Two interconnect types, a single sheet printed circuit and a roll type, with alternate approaches to increasing transparency and reducing cost were designed and fabricated. Hinge stress and electrical power optimization were also examined. Two point designs were studied. The first design used a coilage longeron mast and is autonomously deployable. The second design used a Stac Beam for high natural frequency response and required astronaut assistance and assembly on orbit. It was conclusively demonstrated that planar arrays are the most cost effective design for use on the space station or other high power applications.

Source record↗
NASA NTRS2020

An Embedded Planar-Foil Capacitor Material, FPGA Based Interposer, Aimed at Improving System Performance and Reduced Board Size for Space Based Electronics

This paper presents our work to date in developing, and testing an embedded planar-foil capacitor based interposer intended to be integrated together with high-density components such as Field Programmable Gate Arrays (FPGAs), and Application Specific Integrated Circuit (ASIC) applications. FPGA devices typically have a large number of I/O and power pins. The high speed enabled by these devices requires a large number of discrete bypass capacitors as close as possible to the power pins. These capacitors take up a considerable amount of the board area on the application circuit board. Our interposer replaces these components freeing up space of traditional bypass capacitors for other circuitry. Our Interposer focuses on the needs of Micro Semi’s RTG4 FPGA. We developed the interposer using COTS embedded foil capacitors. The Interposer is customized to the capacitance requirements for each of the FPGA banks. We evaluated three foil manufactures Oak Mitsui, 3M and TDK. The three different designs were evaluated, but we will focus on the Oak-Mitsui based Interposer that we constructed and tested. Through simulations, we validate the horizontal and vertical interconnect inductances, that FPGA decoupling requirements are met. The use of the interposer results in an overall reduction in our Printed Wiring Board (PWB) area.

Hunter, Don J↗
NASA NTRS2005

High Resolution Aerospace Applications using the NASA Columbia Supercomputer

This paper focuses on the parallel performance of two high-performance aerodynamic simulation packages on the newly installed NASA Columbia supercomputer. These packages include both a high-fidelity, unstructured, Reynolds-averaged Navier-Stokes solver, and a fully-automated inviscid flow package for cut-cell Cartesian grids. The complementary combination of these two simulation codes enables high-fidelity characterization of aerospace vehicle design performance over the entire flight envelope through extensive parametric analysis and detailed simulation of critical regions of the flight envelope. Both packages. are industrial-level codes designed for complex geometry and incorpor.ats. CuStomized multigrid solution algorithms. The performance of these codes on Columbia is examined using both MPI and OpenMP and using both the NUMAlink and InfiniBand interconnect fabrics. Numerical results demonstrate good scalability on up to 2016 CPUs using the NUMAIink4 interconnect, with measured computational rates in the vicinity of 3 TFLOP/s, while InfiniBand showed some performance degradation at high CPU counts, particularly with multigrid. Nonetheless, the results are encouraging enough to indicate that larger test cases using combined MPI/OpenMP communication should scale well on even more processors.

Mavriplis, Dimitri J.↗
NASA NTRS1987

Development of a semi-autonomous service robot with telerobotic capabilities

The importance to the United States of semi-autonomous systems for application to a large number of manufacturing and service processes is very clear. Two principal reasons emerge as the primary driving forces for development of such systems: enhanced national productivity and operation in environments whch are hazardous to humans. Completely autonomous systems may not currently be economically feasible. However, autonomous systems that operate in a limited operation domain or that are supervised by humans are within the technology capability of this decade and will likely provide reasonable return on investment. The two research and development efforts of autonomy and telerobotics are distinctly different, yet interconnected. The first addresses the communication of an intelligent electronic system with a robot while the second requires human communication and ergonomic consideration. Discussed here are work in robotic control, human/robot team implementation, expert system robot operation, and sensor development by the American Welding Institute, MTS Systems Corporation, and the Colorado School of Mines--Center for Welding Research.

Jones, J. E.↗
NASA NTRSDate not supplied

Progress Towards SiC ASICs for Extreme Temperature and Radiation Environments

This presentation describes development and demonstrations of semiconductor integrated circuits (ICs) and ceramic packaging that are arguably the most environmentally durable transistor electronics ever demonstrated. Silicon carbide (SiC) junction field effect transistor-resistor (JFET-R) ICs fabricated by NASA Glenn Research Center with two-level interconnect have successfully operated for over 1 year in 500 °C air-ambient, 60 days in 460 °C and 9.3 MPa pressure caustic Venus surface environment test chamber, and radiation exposure through 7 Mrad(Si) total ionizing dose (TID) and 86 MeV-cm2/mg heavy ion strikes. Furthermore, these ICs have also demonstrated operation from -190 °C to +812 °C (over 1000 °C temperature span) without significant change in signal (input /output) or power supply voltages. While the operating frequency and functional complexity is far below silicon-based ICs, these SiC application specific ICs (ASICs) are nevertheless becoming capable of providing unique and advantageous harsh-environment circuit functionality without cooling/sheltering overhead. With modest adjustments, the SiC JFET-R fabrication process is compatible with semiconductor mass-production tools and materials. As an initial step towards manufacture, a majority of processing steps to realize the next SiC JFET-R IC prototype wafer run have been outsourced to commercial foundry. It is expected that further upscaling combined with technology transfer to commercial production will lower investment and risk barriers to useful application deployment.

high temperature↗
NASA NTRS1986

Evaluation of reliability modeling tools for advanced fault tolerant systems

The Computer Aided Reliability Estimation (CARE III) and Automated Reliability Interactice Estimation System (ARIES 82) reliability tools for application to advanced fault tolerance aerospace systems were evaluated. To determine reliability modeling requirements, the evaluation focused on the Draper Laboratories' Advanced Information Processing System (AIPS) architecture as an example architecture for fault tolerance aerospace systems. Advantages and limitations were identified for each reliability evaluation tool. The CARE III program was designed primarily for analyzing ultrareliable flight control systems. The ARIES 82 program's primary use was to support university research and teaching. Both CARE III and ARIES 82 were not suited for determining the reliability of complex nodal networks of the type used to interconnect processing sites in the AIPS architecture. It was concluded that ARIES was not suitable for modeling advanced fault tolerant systems. It was further concluded that subject to some limitations (the difficulty in modeling systems with unpowered spare modules, systems where equipment maintenance must be considered, systems where failure depends on the sequence in which faults occurred, and systems where multiple faults greater than a double near coincident faults must be considered), CARE III is best suited for evaluating the reliability of advanced tolerant systems for air transport.

Baker, Robert↗
NASA NTRS1991

An integrated Ka/Ku-band payload for personal, mobile and private business communications

The Canadian Department of Communications has been studying options for a government-sponsored demonstration payload to be launched before the end of the century. A summary of the proposed system concepts and network architectures for providing an advanced private business network service at Ku-band and personal and mobile communications at Ka-band is presented. The system aspects addressed include coverage patterns, traffic capacity, and grade of service, multiple access options as well as special problems, such as Doppler in mobile applications. Earth terminal types and the advanced payload concept proposed in a feasibility study for the demonstration mission are described. This concept is a combined Ka-band/Ku-band payload which incorporates a number of advanced satellite technologies including a group demodulator to convert single-channel-per-carrier frequency division multiple access uplink signals to a time division multiplex downlink, on-board signal regeneration, and baseband switching to support packet switched data operation. The on-board processing capability of the payload provides a hubless VSAT architecture which permits single-hop full mesh interconnectivity. The Ka-band and Ku-band portions of the payload are fully integrated through an on-board switch, thereby providing the capability for fully integrated services, such as using the Ku-band VSAT terminals as gateway stations for the Ka-band personal and mobile communications services.

Hayes, Edward J.↗
NASA NTRS2000

Evolutionary Cell Computing: From Protocells to Self-Organized Computing

On the path from inanimate to animate matter, a key step was the self-organization of molecules into protocells - the earliest ancestors of contemporary cells. Studies of the properties of protocells and the mechanisms by which they maintained themselves and reproduced are an important part of astrobiology. These studies also have the potential to greatly impact research in nanotechnology and computer science. Previous studies of protocells have focussed on self-replication. In these systems, Darwinian evolution occurs through a series of small alterations to functional molecules whose identities are stored. Protocells, however, may have been incapable of such storage. We hypothesize that under such conditions, the replication of functions and their interrelationships, rather than the precise identities of the functional molecules, is sufficient for survival and evolution. This process is called non-genomic evolution. Recent breakthroughs in experimental protein chemistry have opened the gates for experimental tests of non-genomic evolution. On the basis of these achievements, we have developed a stochastic model for examining the evolutionary potential of non-genomic systems. In this model, the formation and destruction (hydrolysis) of bonds joining amino acids in proteins occur through catalyzed, albeit possibly inefficient, pathways. Each protein can act as a substrate for polymerization or hydrolysis, or as a catalyst of these chemical reactions. When a protein is hydrolyzed to form two new proteins, or two proteins are joined into a single protein, the catalytic abilities of the product proteins are related to the catalytic abilities of the reactants. We will demonstrate that the catalytic capabilities of such a system can increase. Its evolutionary potential is dependent upon the competition between the formation of bond-forming and bond-cutting catalysts. The degree to which hydrolysis preferentially affects bonds in less efficient, and therefore less well-ordered, peptides is also critical to evolution of a non-genomic system. Based on these results, a new computational object called a "molnet" is defined. Like a neural network, it is formed of interconnected units that send "signals" to each other. Like molecules, neural networks have a specific function once their structure is defined. The difference between a molnet and traditional neural networks, is that input to molnets is not simply passed along and processed from input to output units, but rather it is utilized to form and break connections(bonds), and thus to form new structures. Molnets represent a powerful tool that can be used to understand the conditions under which chemical systems can form large molecules, such as proteins, and display ever more complex functions. This has direct applications, for example to the design of smart,synthetic fabrics. Additional information is contained in the original.

Colombano, Silvano↗
NASA NTRS2000

A Boundary Scan Test Vehicle for Direct Chip Attach Testing

To facilitate the new faster, better and cheaper spacecraft designs, smaller more mass efficient avionics and instruments are using higher density electronic packaging technologies such as direct chip attach (DCA). For space flight applications, these technologies need to have demonstrated reliability and reasonably well defined fabrication and assembly processes before they will be accepted as baseline designs in new missions. As electronics shrink in size, not only can repair be more difficult, but 49 probing" circuitry can be very risky and it becomes increasingly more difficult to identify the specific source of a problem. To test and monitor these new technologies, the Direct Chip Attach Task, under NASA's Electronic Parts and Packaging Program (NEPP), chose the test methodology of boundary scan testing. The boundary scan methodology was developed for interconnect integrity and functional testing at hard to access electrical nodes. With boundary scan testing, active devices are used and failures can be identified to the specific device and lead. This technology permits the incorporation of "built in test" into almost any circuit and thus gives detailed test access to the highly integrated electronic assemblies. This presentation will describe boundary scan, discuss the development of the boundary scan test vehicle for DCA and current plans for testing of direct chip attach configurations.

Parsons, Heather A.↗
NASA NTRS2003

Unified Models of Turbulence and Nonlinear Wave Evolution in the Extended Solar Corona and Solar Wind

The PI (Cranmer) and Co-I (A. van Ballegooijen) made significant progress toward the goal of building a "unified model" of the dominant physical processes responsible for the acceleration of the solar wind. The approach outlined in the original proposal comprised two complementary pieces: (1) to further investigate individual physical processes under realistic coronal and solar wind conditions, and (2) to extract the dominant physical effects from simulations and apply them to a one-dimensional and time-independent model of plasma heating and acceleration. The accomplishments in the report period are thus divided into these two categories: 1a. Focused Study of Kinetic MHD Turbulence. We have developed a model of magnetohydrodynamic (MHD) turbulence in the extended solar corona that contains the effects of collisionless dissipation and anisotropic particle heating. A turbulent cascade is one possible way of generating small-scale fluctuations (easy to dissipate/heat) from a pre-existing population of low-frequency Alfven waves (difficult to dissipate/heat). We modeled the cascade as a combination of advection and diffusion in wavenumber space. The dominant spectral transfer occurs in the direction perpendicular to the background magnetic field. As expected from earlier models, this leads to a highly anisotropic fluctuation spectrum with a rapidly decaying tail in the parallel wavenumber direction. The wave power that decays to high enough frequencies to become ion cyclotron resonant depends on the relative strengths of advection and diffusion in the cascade. For the most realistic values of these parameters, though, there is insufficient power to heat protons and heavy ions. The dominant oblique waves undergo Landau damping, which implies strong parallel electron heating. We thus investigated the nonlinear evolution of the electron velocity distributions (VDFs) into parallel beams and discrete phase-space holes (similar to those seen in the terrestrial magnetosphere) which are an alternate means of heating protons via stochastic interactions similar to particle-particle collisions. 1b. Focused Study of the Multi-Mode Detailed Balance Formalism. The PI began to explore the feasibility of using the "weak turbulence," or detailed-balance theory of Tsytovich, Melrose, and others to encompass the relevant physics of the solar wind. This study did not go far, however, because if the "strong" MHD turbulence discussed above is a dominant player in the wind's acceleration region, this formalism is inherently not applicable to the corona. We will continue to study the various published approaches to the weak turbulence formalism, especially with an eye on ways to parameterize nonlinear wave reflection rates. 2. Building the Unified Model Code Architecture. We have begun developing the computational model of a time-steady open flux tube in the extended corona. The model will be "unified" in the sense that it will include (simultaneously for the first time) as many of the various proposed physical processes as possible, all on equal footing. To retain this generality, we have formulated the problem in two interconnected parts: a completely kinetic model for the particles, using the Monte Carlo approach, and a finite-difference approach for the self-consistent fluctuation spectra. The two codes are run sequentially and iteratively until complete consistency is achieved. The current version of the Monte Carlo code incorporates gravity, the zero-current electric field, magnetic mirroring, and collisions. The fluctuation code incorporates WKJ3 wave action conservation and the cascade/dissipation processes discussed above. The codes are being run for various test problems with known solutions. Planned additions to the codes include prescriptions for nonlinear wave steepening, kinetic velocity-space diffusion, and multi-mode coupling (including reflection and refraction).

Cranmer, Steven R.↗
NASA NTRS2009

Smart and Intelligent Sensors

John C. Stennis Space Center (SSC) provides rocket engine propulsion testing for NASA's space programs. Since the development of the Space Shuttle, every Space Shuttle Main Engine (SSME) has undergone acceptance testing at SSC before going to Kennedy Space Center (KSC) for integration into the Space Shuttle. The SSME is a large cryogenic rocket engine that uses Liquid Hydrogen (LH2) as the fuel. As NASA moves to the new ARES V launch system, the main engines on the new vehicle, as well as the upper stage engine, are currently base lined to be cryogenic rocket engines that will also use LH2. The main rocket engines for the ARES V will be larger than the SSME, while the upper stage engine will be approximately half that size. As a result, significant quantities of hydrogen will be required during the development, testing, and operation of these rocket engines.Better approaches are needed to simplify sensor integration and help reduce life-cycle costs. 1.Smarter sensors. Sensor integration should be a matter of "plug-and-play" making sensors easier to add to a system. Sensors that implement new standards can help address this problem; for example, IEEE STD 1451.4 defines transducer electronic data sheet (TEDS) templates for commonly used sensors such as bridge elements and thermocouples. When a 1451.4 compliant smart sensor is connected to a system that can read the TEDS memory, all information needed to configure the data acquisition system can be uploaded. This reduces the amount of labor required and helps minimize configuration errors. 2.Intelligent sensors. Data received from a sensor be scaled, linearized; and converted to engineering units. Methods to reduce sensor processing overhead at the application node are needed. Smart sensors using low-cost microprocessors with integral data acquisition and communication support offer the means to add these capabilities. Once a processor is embedded, other features can be added; for example, intelligent sensors can make a health assessment to inform the data acquisition client when sensor performance is suspect. 3.Distributed sample synchronization. Networks of sensors require new ways for synchronizing samples. Standards that address the distributed timing problem (for example, IEEE STD 1588) provide the means to aggregate samples from many distributed smart sensors with sub-microsecond accuracy. 4. Reduction in interconnect. Alternative means are needed to reduce the frequent problems associated with cabling and connectors. Wireless technologies offer the promise of reducing interconnects and simultaneously making it easy to quickly add a sensor to a system.

Lansaw, John↗
NASA NTRS2001

Packaging Technology Developed for High-Temperature Silicon Carbide Microsystems

High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as sensors and electronics for space missions to the inner solar system, sensors for in situ combustion and emission monitoring, and electronics for combustion control for aeronautical and automotive engines. However, these devices cannot be used until they can be packaged in appropriate forms for specific applications. Suitable packaging technology for operation temperatures up to 500 C and beyond is not commercially available. Thus, the development of a systematic high-temperature packaging technology for SiC-based microsystems is essential for both in situ testing and commercializing high-temperature SiC sensors and electronics. In response to these needs, researchers at Glenn innovatively designed, fabricated, and assembled a new prototype electronic package for high-temperature electronic microsystems using ceramic substrates (aluminum nitride and aluminum oxide) and gold (Au) thick-film metallization. Packaging components include a ceramic packaging frame, thick-film metallization-based interconnection system, and a low electrical resistance SiC die-attachment scheme. Both the materials and fabrication process of the basic packaging components have been tested with an in-house-fabricated SiC semiconductor test chip in an oxidizing environment at temperatures from room temperature to 500 C for more than 1000 hr. These test results set lifetime records for both high-temperature electronic packaging and high-temperature electronic device testing. As required, the thick-film-based interconnection system demonstrated low (2.5 times of the room-temperature resistance of the Au conductor) and stable (decreased 3 percent in 1500 hr of continuous testing) electrical resistance at 500 C in an oxidizing environment. Also as required, the electrical isolation impedance between printed wires that were not electrically joined by a wire bond remained high (greater than 0.4 GW) at 500 C in air. The attached SiC diode demonstrated low (less than 3.8 W/mm2) and relatively consistent dynamic resistance from room temperature to 500 C. These results indicate that the prototype package and the compatible die-attach scheme meet the initial design standards for high-temperature, low-power, and long-term operation. This technology will be further developed and evaluated, especially with more mechanical tests of each packaging element for operation at higher temperatures and longer lifetimes.

Chen, Liang-Yu↗
NASA NTRS1976

Evaluation of advanced microelectronic fluxless solder-bump contacts for hybrid microcircuits

Technology for interconnecting monolithic integrated circuit chips with other components is investigated. The advantages and disadvantages of the current flip-chip approach as compared to other interconnection methods are outlined. A fluxless solder-bump contact technology is evaluated. Multiple solder-bump contacts were formed on silicon integrated circuit chips. The solder-bumps, comprised of a rigid nickel under layer and a compliant solder overlayer, were electroformed onto gold device pads with the aid of thick dry film photomasks. Different solder alloys and the use of conductive epoxy for bonding were explored. Fluxless solder-bump bond quality and reliability were evaluated by measuring the effects of centrifuge, thermal cycling, and high temperature storage on bond visual characteristics, bond electrical continuity, and bond shear tests. The applicability and suitability of this technology for hybrid microelectronic packaging is discussed.

Mandal, R. P.↗
NASA NTRS1982

Beyond the supercomputer

A NASA-directed development of massively parallel processor (MPP) computers is outlined, noting intended applications for data processing for near term earth resource and environment mapping, radar, and television transmissions. The MPP is designed to perform 100 billion operations/sec to obtain satisfactory image processing, while separate processing units correct distortions, register images, calculate correlation functions, and classify multispectral characteristics. Arrays of 1s and 0s will be manipulated in analog-to-digital conversions generating separate planes corresponding to powers of binaries. Data wires are replaced by fiber-optic tubes or thousands of wires, and single logic gates are replaced by thousands of logic gates and every memory element by thousands of memory elements. Features of the interconnections and the images control processor units are detailed, along with implementation of sliders for program flexibility.

Schaefer, D. H.↗
NASA NTRS1998

The mass storage testing laboratory at GSFC

Industry-wide benchmarks exist for measuring the performance of processors (SPECmarks), and of database systems (Transaction Processing Council). Despite storage having become the dominant item in computing and IT (Information Technology) budgets, no such common benchmark is available in the mass storage field. Vendors and consultants provide services and tools for capacity planning and sizing, but these do not account for the complete set of metrics needed in today's archives. The availability of automated tape libraries, high-capacity RAID systems, and high- bandwidth interconnectivity between processor and peripherals has led to demands for services which traditional file systems cannot provide. File Storage and Management Systems (FSMS), which began to be marketed in the late 80's, have helped to some extent with large tape libraries, but their use has introduced additional parameters affecting performance. The aim of the Mass Storage Test Laboratory (MSTL) at Goddard Space Flight Center is to develop a test suite that includes not only a comprehensive check list to document a mass storage environment but also benchmark code. Benchmark code is being tested which will provide measurements for both baseline systems, i.e. applications interacting with peripherals through the operating system services, and for combinations involving an FSMS. The benchmarks are written in C, and are easily portable. They are initially being aimed at the UNIX Open Systems world. Measurements are being made using a Sun Ultra 170 Sparc with 256MB memory running Solaris 2.5.1 with the following configuration: 4mm tape stacker on SCSI 2 Fast/Wide; 4GB disk device on SCSI 2 Fast/Wide; and Sony Petaserve on Fast/Wide differential SCSI 2.

Venkataraman, Ravi↗
NASA NTRS1993

Special purpose parallel computer architecture for real-time control and simulation in robotic applications

This is a real-time robotic controller and simulator which is a MIMD-SIMD parallel architecture for interfacing with an external host computer and providing a high degree of parallelism in computations for robotic control and simulation. It includes a host processor for receiving instructions from the external host computer and for transmitting answers to the external host computer. There are a plurality of SIMD microprocessors, each SIMD processor being a SIMD parallel processor capable of exploiting fine grain parallelism and further being able to operate asynchronously to form a MIMD architecture. Each SIMD processor comprises a SIMD architecture capable of performing two matrix-vector operations in parallel while fully exploiting parallelism in each operation. There is a system bus connecting the host processor to the plurality of SIMD microprocessors and a common clock providing a continuous sequence of clock pulses. There is also a ring structure interconnecting the plurality of SIMD microprocessors and connected to the clock for providing the clock pulses to the SIMD microprocessors and for providing a path for the flow of data and instructions between the SIMD microprocessors. The host processor includes logic for controlling the RRCS by interpreting instructions sent by the external host computer, decomposing the instructions into a series of computations to be performed by the SIMD microprocessors, using the system bus to distribute associated data among the SIMD microprocessors, and initiating activity of the SIMD microprocessors to perform the computations on the data by procedure call.

Fijany, Amir↗
NASA NTRS1996

CBGA/PBGA for Highly Reliable Applications

The Jet Propulsion Laboratory (JPL) is currently assessing the use of Ball Grid Arrays (BGAs) for National Aeronautics and Space Administration (NASA) spaceflight applications. This work is being funded through NASA Headquarters, Code Q. The objectives are to demonstrate the robustness, quality and reliability of BGAs technology, and to assist in the solicited industrial, academic and other related consortia to work together to leverage the related efforts into a synergistic effort. Initial results of these activities will be summarized and presented in this paper.

code Q BGA's ball grid arrays Advanced Interconnec↗