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At least 433 records · Page 24

Poly-Pattern Compressive Segmentation of ASTER Data for GIS

Pattern-based segmentation of multi-band image data, such as ASTER, produces one-byte and two-byte approximate compressions. This is a dual segmentation consisting of nested coarser and finer level pattern mappings called poly-patterns. The coarser A-level version is structured for direct incorporation into geographic information systems in the manner of a raster map. GIs renderings of this A-level approximation are called pattern pictures which have the appearance of color enhanced images. The two-byte version consisting of thousands of B-level segments provides a capability for approximate restoration of the multi-band data in selected areas or entire scenes. Poly-patterns are especially useful for purposes of change detection and landscape analysis at multiple scales. The primary author has implemented the segmentation methodology in a public domain software suite.

Myers, Wayne↗

Making Complex Electrically Conductive Patterns on Cloth

A method for automated fabrication of flexible, electrically conductive patterns on cloth substrates has been demonstrated. Products developed using this method, or related prior methods, are instances of a technology known as 'e-textiles,' in which electrically conductive patterns ar formed in, and on, textiles. For many applications, including high-speed digital circuits, antennas, and radio frequency (RF) circuits, an e-textile method should be capable of providing high surface conductivity, tight tolerances for control of characteristic impedances, and geometrically complex conductive patterns. Unlike prior methods, the present method satisfies all three of these criteria. Typical patterns can include such circuit structures as RF transmission lines, antennas, filters, and other conductive patterns equivalent to those of conventional printed circuits. The present method overcomes the limitations of the prior methods for forming the equivalent of printed circuits on cloth. A typical fabrication process according to the present method involves selecting the appropriate conductive and non-conductive fabric layers to build the e-textile circuit. The present method uses commercially available woven conductive cloth with established surface conductivity specifications. Dielectric constant, loss tangent, and thickness are some of the parameters to be considered for the non-conductive fabric layers. The circuit design of the conductive woven fabric is secured onto a non-conductive fabric layer using sewing, embroidery, and/or adhesive means. The portion of the conductive fabric that is not part of the circuit is next cut from the desired circuit using an automated machine such as a printed-circuit-board milling machine or a laser cutting machine. Fiducials can be used to align the circuit and the cutting machine. Multilayer circuits can be built starting with the inner layer and using conductive thread to make electrical connections between layers.

Chu, Andrew↗

Patterning of Indium Tin Oxide Films

A relatively rapid, economical process has been devised for patterning a thin film of indium tin oxide (ITO) that has been deposited on a polyester film. ITO is a transparent, electrically conductive substance made from a mixture of indium oxide and tin oxide that is commonly used in touch panels, liquid-crystal and plasma display devices, gas sensors, and solar photovoltaic panels. In a typical application, the ITO film must be patterned to form electrodes, current collectors, and the like. Heretofore it has been common practice to pattern an ITO film by means of either a laser ablation process or a photolithography/etching process. The laser ablation process includes the use of expensive equipment to precisely position and focus a laser. The photolithography/etching process is time-consuming. The present process is a variant of the direct toner process an inexpensive but often highly effective process for patterning conductors for printed circuits. Relative to a conventional photolithography/ etching process, this process is simpler, takes less time, and is less expensive. This process involves equipment that costs less than $500 (at 2005 prices) and enables patterning of an ITO film in a process time of less than about a half hour.

Immer, Christopher↗

Vascular Patterning Analysis by VESGEN 2D/3D with Bioinformatics: Updates for Rodent Tissues

Fractally branching vascular systems are a complex physiological requirement shared by humans with all higher terrestrial life forms, including other vertebrates, insects, and higher land plants. Vascular trees, networks, and tree-network composites are therefore mapped and quantified by the VESsel GENeration Analysis (VESGEN) software according to weighted physiological vascular rules that include vessel connectivity, tapering and bifurcational branching. According to fluid dynamics, successful vascular transport depends upon a complex distributed system of highly regulated laminar flow. VESGEN has elucidated changes in vascular patterning resulting from inflammatory, developmental and other signaling pathways within numerous tissues of major model organisms important for Space Biology, especially for rodents. Important early stage regenerative opportunities have been identified by VESGEN vascular analysis for visual impairments in the human retina, and is currently being used for research into astronaut visual and ocular disorders associated with long duration missions. The VESGEN 2D software is a mature, automated, widely published capability for which beta testing and public release by NASA is planned for the upcoming year. Early-stage capabilities for VESGEN 3D analysis are under development for the rodent retina and intestine as prototype tissues. A prototype VESGEN 2D Bioinformatics software capability has also been developed to associate phenotypic changes in molecular expression with vascular structure and function. By new VESGEN bioinformatic innovations, expression patterns of the genetic, transcriptional, protein and other markers for regulatory molecules such as vascular endothelial growth factor (VEGF) and their receptors, often indicators of tissue oxygenation status, are co-localized with alterations in vascular pattern. Biomarkers are therefore mapped and quantified as information dimensions directly correlated with the spatial dimensions of a vascular pattern. Further important technology innovations by NASA include substantial image segmentation advances for more automated binary extraction of the grayscale vascular patterns, together with informative associated image quality assessments. Vascular mapping and quantification capabilities for the rodent retina and intestine are illustrated for VESGEN 2D, along with technology status reports on VESGEN 3D and Bioinformatic capabilities. Research partially supported by Ames Center Innovation Awards.

Parsons-Wingerter, P.↗

A Screening Method Using Pulsed-Power Combined with Infrared Imaging to Detect Pattern Defects in Bulk Metal Foil or Thin Film Resistors

Bulk metal foil and thin film resistors occasionally contain localized defects within the etched resistor pattern. Common defects of this type include in-line constrictions referred to as notches, unremoved resistor material bridges between adjacent pattern lines, and embedded non-conductive particles in the resistor material. Such defects are prone to fracture due to thermomechanical fatigue during powered operation, especially power cycling, resulting in positive resistance change and open circuit failure modes. Common screening methods of optical microscopy, short time overload power tests (e.g., 6.25x rated power for 5 seconds) and burn-in (e.g., 1.5x rated power for 100 hours) are useful, but they are not always effective at removing devices with such defects. An improved method has been developed to screen for localized resistor pattern defects. The method involves the application of brief, high power electrical pulses at a low duty cycle while inspecting the resistor with a high resolution, high speed infrared camera. The following test conditions were found to be suitable for this purpose: 6.25x rated power, 1 to 5 pulses, 50 ms pulse width and 10% duty cycle. During the power pulsing, localized constrictions in the resistor pattern are identifiable as hot spots via the infrared camera. Reject criteria can be established based on observations of hot spots. To assess its effectiveness, a total of two hundred eighty (280) surface mount foil resistors (40 each from 7 different lots) were screened using this infrared technique. The screening identified twenty-nine (29) resistors with significant hot spots in the resistor pattern. All 280 resistors were then subjected to an industry standard 10,000 hour life test at 1x rated power at 70°C with power cycled for 90 minutes on and 30 minutes off. During life testing, three resistors exhibited positive resistance change failure mode. All three failures were due to thermomechanical fatigue failure of localized bridge defects at the locations identified via infrared screening. The results of this evaluation illustrate the benefits of the pulsed-power infrared detection screening technique to identify reliability suspect foil or thin film resistors that may escape common screening methods.

screening↗

A Screening Method Using Pulsed-Power Combined with Infrared Imaging to Detect Pattern Defects in Bulk Metal Foil or Thin Film Resistors

Bulk metal foil and thin film resistors occasionally contain localized defects within the etched resistor pattern. Common defects of this type include in-line constrictions referred to as notches, unremoved resistor material bridges between adjacent pattern lines, and embedded non-conductive particles in the resistor material. Such defects are prone to fracture due to thermomechanical fatigue during powered operation, especially power cycling, resulting in positive resistance change and open circuit failure modes. Common screening methods of optical microscopy, short time overload power tests (e.g., 6.25x rated power for 5 seconds) and burn-in (e.g., 1.5x rated power for 100 hours) are useful, but they are not always effective at removing devices with such defects. An improved method has been developed to screen for localized resistor pattern defects. The method involves the application of brief, high power electrical pulses at a low duty cycle while inspecting the resistor with a high resolution, high speed infrared camera. The following test conditions were found to be suitable for this purpose: 6.25x rated power, 1 to 5 pulses, 50 ms pulse width and 10% duty cycle. During the power pulsing, localized constrictions in the resistor pattern are identifiable as hot spots via the infrared camera. Reject criteria can be established based on observations of hot spots. To assess its effectiveness, a total of two hundred eighty (280) surface mount foil resistors (40 each from 7 different lots) were screened using this infrared technique. The screening identified twenty-nine (29) resistors with significant hot spots in the resistor pattern. All 280 resistors were then subjected to an industry standard 10,000 hour life test at 1x rated power at 70°C with power cycled for 90 minutes on and 30 minutes off. During life testing, three resistors exhibited positive resistance change failure mode. All three failures were due to thermomechanical fatigue failure of localized bridge defects at the locations identified via infrared screening. The results of this evaluation illustrate the benefits of the pulsed-power infrared detection screening technique to identify reliability suspect foil or thin film resistors that may escape common screening methods.

screening↗

Evaluation of X-Ray Reflectors by Optical Diffraction Patterns

Performance of X-ray reflectors affects that of X-ray mirrors. Modern X-ray mirrors have thousands of reflectors to gain large effective area. Evaluation of the reflectors is an important process in production of the mirrors. A diffraction pattern dominates reflector image when the parallel optical beam illuminates the reflector along its optical axis because the reflectors are used at grazing incident angles of around 1 deg and their effective width are 1–10 mm. A diffraction pattern from the entire reflector surface can be acquired at once with the aid of a lens. The diffraction pattern holds information of the surface profiles of the reflectors. To quantitatively evaluate the reflectors with the diffraction pattern, we created a diffraction pattern model by the wave optics with the ideal surface profile and fitted it to data. As a result, a correlation between fitting residual and the normal vector distribution of the surface profile was found. With our method, the reflectors can be evaluated and sorted out more efficiently.

Hayashi, Takayuki↗

Brief Communication: Preliminary ICESat-2 (Ice, Cloud and Land Elevation Satellite-2) Measurements of Outlet Glaciers Reveal Heterogeneous Patterns of Seasonal Dynamic Thickness Change

Dynamic changes of marine-terminating outlet glaciers are projected to be responsible for about half of future ice loss from the Greenland Ice Sheet. However, we lack a unified, process-based understanding that can explain the observed dynamic changes of all outlet glaciers. Many glaciers undergo seasonal dynamic thickness changes, and classifying the patterns of seasonal thickness change can improve our understanding of the processes that drive glacier behavior. The Ice, Cloud and land Elevation Satellite-2 (ICESat-2) provides space-based, seasonally repeating altimetry measurements of the ice sheets, allowing us to quantify near-termini seasonal dynamic thickness patterns of 37 outlet glaciers around the Greenland Ice Sheet. We classify the glaciers into seven common patterns of seasonal thickness change over a 2-year period from 2019 to 2020. We find small groupings of neighboring glaciers with similar patterns of seasonal thickness change, but, within larger sectors of the ice sheet, patterns of seasonal thickness change are mostly heterogeneous. Future studies can build upon our results by extending these time series, comparing seasonal dynamic thickness changes with external forcings, such as ocean temperature and meltwater runoff, and with other dynamic variables such as seasonal glacier velocity and terminus position changes.

Christian J Taubenberger↗

Detecting and Characterizing Patterns of Failure in Complex Engineered Systems: an Ontology Development and Clustering Approach

While the causes of failures in complex engineered systems are often clear in hindsight, it can be challenging to predict failures proactively during the design of novel engineered products or systems. Identifying patterns can be useful for capturing common characteristics that may lead to failure. In this paper, we present a methodology for identifying patterns of failure from NASA’s publicly available Lessons Learned Information System (LLIS). We apply an ontology development and clustering approach to identify representative patterns leading to failures in historical lessons learned. A joint inductive-deductive approach reveals the key themes in lessons that lead to failure, which are formalized and recorded as an ontology of complex systems failure causes. Documents from the LLIS are manually tagged with relevant characteristics from the ontology. From the tagged set, clustering is used to capture co-occurring sets of characteristics that lead to failure. The primary contribution of this work is a method for extracting a set of generic failure patterns in complex engineered systems and characteristics for these patterns that can be identified at design time, knowledge of which can be used to plan mitigation strategies.

Systems Engineering↗

Detecting and Characterizing Patterns of Failure in Complex Systems: An Ontology Development and Clustering Approach

While the causes of failures in complex engineered systems are often clear in hindsight, it can be challenging to predict failures proactively during the design of novel engineered products or systems. Identifying patterns can be useful for capturing common characteristics that may lead to failure. In this paper, we present a methodology for identifying patterns of failure from NASA’s publicly available Lessons Learned Information System (LLIS). We apply an ontology development and clustering approach to identify representative patterns leading to failures in historical lessons learned. A joint inductive-deductive approach reveals the key themes in lessons that lead to failure, which are formalized and recorded as an ontology of complex systems failure causes. Documents from the LLIS are manually tagged with relevant characteristics from the ontology. From the tagged set, clustering is used to capture co-occurring sets of characteristics that lead to failure. The primary contribution of this work is a method for extracting a set of generic failure patterns in complex engineered systems and characteristics for these patterns that can be identified at design time, knowledge of which can be used to plan mitigation strategies.

Systems Engineering↗

Method of lift-off patterning thin films in situ employing phase change resists

Method for making a patterned thin film of an organic semiconductor. The method includes condensing a resist gas into a solid film onto a substrate cooled to a temperature below the condensation point of the resist gas. The condensed solid film is heated selectively with a patterned stamp to cause local direct sublimation from solid to vapor of selected portions of the solid film thereby creating a patterned resist film. An organic semiconductor film is coated on the patterned resist film and the patterned resist film is heated to cause it to sublime away and to lift off because of the phase change.

36 MATERIALS SCIENCE↗

Patterning by area selective oxidation

Technologies are described for methods for producing a pattern of a material on a substrate. The methods may comprise receiving a patterned block copolymer on a substrate. The patterned block copolymer may include a first polymer block domain and a second polymer block domain. The method may comprise exposing the patterned block copolymer to a light effective to oxidize the first polymer block domain in the patterned block copolymer. The method may comprise applying a precursor to the block copolymer. The precursor may infuse into the oxidized first polymer block domain and generate the material. The method may comprise applying a removal agent to the block copolymer. The removal agent may be effective to remove the first polymer block domain and the second polymer block domain from the substrate, and may not be effective to remove the material in the oxidized first polymer block domain.

36 MATERIALS SCIENCE↗

Performance Study of the First 2D Prototype of Vertically Integrated Pattern Recognition Associative Memory (VIPRAM)

Extremely fast pattern recognition capabilities are necessary to find and fit billions of tracks at the hardware trigger level produced every second anticipated at high luminosity LHC (HL-LHC) running conditions. Associative Memory (AM) based approaches for fast pattern recognition have been proposed as a potential solution to the tracking trigger. However, at the HL-LHC, there is much less time available and speed performance must be improved over previous systems while maintaining a comparable number of patterns. The Vertically Integrated Pattern Recognition Associative Memory (VIPRAM) Project aims to achieve the target pattern density and performance goal using 3DIC technology. The first step taken in the VIPRAM work was the development of a 2D prototype (protoVIPRAM00) in which the associative memory building blocks were designed to be compatible with the 3D integration. In this paper, we present the results from extensive performance studies of the protoVIPRAM00 chip in both realistic HL-LHC and extreme conditions. Results indicate that the chip operates at the design frequency of 100 MHz with perfect correctness in realistic conditions and conclude that the building blocks are ready for 3D stacking. We also present performance boundary characterization of the chip under extreme conditions.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Understanding the Impact of Memory Access Patterns in Intel Processors

Because of increasing complexity in the memory hierarchy, predicting the performance of a given application in a given processor is becoming more difficult. The problem is worsened by the fact that the hardware needed to deal with more complex memory traffic also affects energy consumption. Moreover, in a heterogeneous system with shared main memory, the memory traffic between the last level cache (LLC) and the memory creates contention between other processors and accelerator devices. For these reasons, it is important to investigate and understand the impact of different memory access patterns on the memory system. This study investigates the interplay between Intel processors' memory hierarchy and different memory access patterns in applications. The authors explore sequential streaming and strided memory access patterns with the objective of predicting LLC-dynamic random access memory (DRAM) traffic for a given application in given Intel architectures. Moreover, the impact of prefetching is also investigated in this study. Experiments with different Intel micro-architectures uncover mechanisms to predict LLC-DRAM traffic that can yield up to 99% accuracy for sequential streaming access patterns and up to 95% accuracy for strided access patterns.

Alaul haque monil, Mohammad↗

Solid-state information pattern discriminating switch

A maze-based switch generally having three functional blocks is disclosed. The first functional block handles communications by accepting an entered maze pattern from an external system controller and outputting the entered maze pattern (and optionally its directional complement) to the second functional block. The second functional block stores the maze pattern (and optionally its directional complement) to a permanent storage element and outputs the stored, entered maze pattern and its directional complement to a series of transistors in the third functional block. The third functional block is an electronic maze in which a correct maze pattern and its directional complement must be received by the transistors for the transistors to pass electrical power through the electronic maze to a connected element. The third functional block may alternatively be implemented with optical elements, optoelectronic elements, microelectromechanical elements, or elements formed by other microsystem technologies.

Galambos, Paul C.↗

Earth microbial co-occurrence network reveals interconnection pattern across microbiomes

Microbial interactions shape the structure and function of microbial communities; microbial association networks in specic environments have been widely developed to explore these complex systems, but their wired pattern across microbiomes in various environments at the global scale remains unexplored. Here we have inferred an Earth microbial association network from a communal catalogue with 23,595 samples and 12,646 exact sequence variants from 14 environments in the Earth Microbiome Project dataset. Results: This non-random scale-free Earth microbial association network consisted of 8 taxonomy distinct modules linked with dierent environments, which featured environment specic microbial associations. Dierent topological features of subnetworks inferred from datasets trimmed into uniform size indicate distinct association patterns in the microbiomes of various environments. The proportions of specialist edges, which ranged from 43.0% to 65.7%, highlight that environmental specic microbial associations are essential features of microbiomes in various environments. Based on edge-overlap similarity, the microbiomes of various environments were clustered into two groups, which were mainly bridged by the microbiomes of plant and animal surface. Acidobacteria Gp2 and Nisaea were identied as hubs in most of subnetworks. Negative edges proportions ranged from 1.9% in the soil subnetwork to 48.9% the non-saline surface subnetwork, suggesting various environments experience distinct intensities of competition or niche dierentiation. Conclusion: This investigation provides a new resource for examining Earth microbial association patterns across environments and emphasizes the network perspective for comprehensively understanding unique microbiome features. Keywords: Association pattern; Earth microbiomes; Genelist edges; Network hubs; Negative associations; Specialist edges; Topological properties

59 BASIC BIOLOGICAL SCIENCES↗

Island scanning pattern optimization for residual deformation mitigation in laser powder bed fusion via sequential inherent strain method and sensitivity analysis

Laser powder bed fusion (L-PBF) has emerged as one of the mainstream additive manufacturing approaches for fabricating metal parts with complex geometries and intricate internal structures. However, large deformation associated with rapid heating and cooling can lead to build failure and requires post-processing which may increase manufacturing cost and prolong the production period. Here in this work, an island scanning pattern design method is proposed to optimize the scanning direction of each island in order to reduce part deformation after cutting off the build platform. The objective of this optimization is to minimize the upward bending of the part after sectioning, which allows the part deformation to satisfy the tolerance requirement or reduce the post heat treatment time. Inherent strain method is employed in the sequential finite element analysis consisting of layer-by-layer activations and sectioning for fast residual distortion prediction. Full sequential sensitivity analysis for the formulated optimization is provided to update the island scanning directions. To show the feasibility and effectiveness of the proposed method, the scanning patterns of a block structure and a connecting rod were designed and parts were fabricated using an open architecture L-PBF machine. The fabrication experiments demonstrated that the residual deformation of both parts fabricated by optimized scanning pattern can be reduced by over 50% compared to the initial scanning patterns, which demonstrate the effectiveness of the proposed method.

36 MATERIALS SCIENCE↗

Intelligent load pattern modeling and denoising using improved variational mode decomposition for various calendar periods

This paper proposes a novel approach to identify the load patterns considering calendar impact and denoising process, which advances the state of art of load identification and load forecasting to a more flexible and adaptive extent by revealing the correlation between load profile and the substantial influence factors. With the rapid development and the promising application of energy intemet and grid modernization, the accurate load modeling and forecasting especially by load pattern modeling (LPM) have become more and more critical to observe and estimate load profile so as to optimize the operation efficiency of the power grid. Traditional methods mostly focus on the static LPM itself which are unable to account the non-linear and highly dynamic load fluctuations in order to balance the demand of the power grid during various calendar period (VCP) scheduling. In this paper, a load pattern modeling method for power grid considering the impact of typical calendar effects is proposed using a combination of improved variational mode decomposition (IVMD) and deep belief network (DBN) algorithm. Firstly, an index of load curve curvature (LCC) is proposed to improve the selection of value K in the conventional VMD algorithm. The value K of the intrinsic modality is determined by adopting LCC to better quantify the average instantaneous frequency of the modal decomposition of the VMD and to reduce the elevated stochasticity of k. Secondly, an optimization formulation is developed based on adaptive segmented loop decomposition of the typical correlation coefficient to suppress the edge effect in VMD decomposition, which would enable the reconstructed curve to incorporate the variabilities from the initial data. Finally, the IVMD and DBN algorithms are jointly implemented to optimize the accuracy of VCP load pattern modeling curve regression. Numerical examples have been performed with the results proving that the proposed method significantly outperforms the state-of-art in reducing the modeling error of VCP load curve, improving the overall forecasting accuracy, and reducing load dispatching cost.

deep belief network↗