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Performance tests performed on a four-feed microstrip antenna and feed network are analyzed. Frequency response with and without amplifiers, an investigation of noise threshold, phase tracking, and jitter are included. Recommendations for further development of SPS power conversion modules are also included.
The technology development needed to support the satellite system conceptual design is amplified. Activities connected to RF, control, and structure of the MSAT UHF antenna are addressed. The antenna RF activities are considered, and two studies related to the reflector surface tolerance and the microstrip feed technology are described. The software and hardware needed to implement the attitude control conceptual design are reviewed. Antenna structure development for the reflector and the deployable supporting mast is discussed. UHF feed located electronics are addressed.
For the LMSS, the required beam isolation level necessitates that the computed C/I level under idealized conditions be equal or higher than 27 dB. This means that the received carrier in the footprint of any reference beam should be at least 27 dB higher than the aggregate power of the interfering carriers from all other cochannel beams. In order to achieve this beam isolation, the baseline design opts for a 7-frequency reuse plan in which only one mode of polarization is used. The possibility of using a 4-frequency and 2-polarization reuse plan, (i.e., 4 x 2 = 8 diversity), was investigated. The system implications of using a dual polarization scheme, the level of cross-polarization required to insure the desired 27 dB beam isolation, and whether or not the determined level of cross-polarization is achievable with the microstrip feed arrays used in the baseline design are considered.
Stripline antenna beam-forming network includes 87 beam ports and 136 feed-element ports and contained on only two microstrip boards. Both uplink and downlink strips supported on same boards. Originally used for communications coverage of continental United States for Land Mobile Satellite System, structure of interest to antenna designers in other applications.
The design of a low sidelobe 19 element microstrip cluster and its distribution network is described. The problem of spillover illumination of an adjacent reflector in a multiple aperture reflector system is addressed. A practical implementation of the array is presented which requires only one printed circuit board for the distribution network with the potential for being easily tailored to a wide range of excitation distributions.
Sixteen 30 dB 0.5 W amplifier modules were combined to satisfy the requirement for a graceful degradation. If one module fails, the output power drops by only 0.43 dB. Also, by incorporating all the gain stages within the combiner the overall combining efficiency is maximized. A 16 way waveguide divider combiner was developed to minimize the insertion loss associated with such a large corporate feed structure. Tests showed that the 16 way insertion loss was less than 0.5 dB. To minimize loss, a direct transition from waveguide to microstrip, using a finline on duroid substrate, was developed. The FETs fabricated on MBE grown material, demonstrated superior performances. For example, a 600 micrometer device was capable of 320 mW output power with 5 dB gain and 26.6% efficiency at 21 GHz. The 16 module amplifier gave 8.95 W saturated output power with 30 dB gain. The overall efficiency was 9%. The 3 dB bandwidth was 2.5 GHz. At 17.7 GHz the amplifier had 5 W output power and at 20.2 GHz it still had 4.4 W.
Three multifrequency, dual polarization SAR antenna designs are reviewed. The SAR antenna design specifications were for a "straw man' SAR which would approximate the requirements for projected shuttle-based SAR's. Therefore, the physical dimensions were constrained to be compatible with the space shuttle. The electrical specifications were similar to those of SIR-A and SIR-B with the addition of dual polarization and the addition of C and X band operation. Early in the antenna design considerations, three candidate technologies emerged as having promise. They were: (1) microstrip patch planar array antennas, (2) slotted waveguide planar array antennas, and (3) open-ended waveguide planar array antennas.
Results of analysis and design conducted as part of multiyear Microwave Landing System (MLS) study are reported. Design of airborne radio frequency RF MLS components was performed. MLS omnidirectional antennas are developed using microstrip technology. A remote, low-noise, radio frequency (RF) preamplifier is designed for airborne MLS installations.
Monolithic microwave integrated circuits (MMIC's) above 18 GHz were developed because of important potential system benefits in cost reliability, reproducibility, and control of circuit parameters. The importance of interconnection and packaging techniques that do not compromise these MMIC virtues is emphasized. Currently available microwave transmission media are evaluated to determine their suitability for MMIC interconnections. An antipodal finline type of microstrip waveguide transition's performance is presented. Packaging requirements for MMIC's are discussed for thermal, mechanical, and electrical parameters for optimum desired performance.
Calculated data are presented on the performance of printed antenna elements on substrates which may be electrically thick, as would be the case for printed antennas at millimeter wave frequencies. Printed dipoles and microstrip patch antennas on polytetrafluoroethylene (PTFE), quartz, and gallium arsenide substrates are considered. Data are given for resonant length, resonant resistance, bandwidth, loss due to surface waves, loss due to dielectric heating, and mutual coupling. Also presented is an optimization procedure for maximizing or minimizing power launched into surface waves from a multielement printed antenna array. The data are calculated by a moment method solution.
A parametric study was conducted to develop an electrooptic waveguide modulator for generating continuous tunable sideband power from an infrared CO2 laser. Parameters included were the waveguide configurations, microstrip dimensions device impedance, and effective dielectric constants. An optimum infrared laser modulator was established and was fabricated. This modulator represents the state-of-the-art integrated optical device, which has a three-dimensional topology to accommodate three lambda/4 step transformers for microwave impedance matching at both the input and output terminals. A flat frequency response of the device over 20 HGz or = 3 dB) was achieved. Maximum single sideband to carrier power greater than 1.2% for 20 W microwave input power at optical carrier wavelength of 10.6 microns was obtained.
The study of printed circuit discontinuities is necessary in order to design, for example, transitions between rectangular waveguides and printed circuits. New developments with respect to the analytical approaches to this problem are discussed. A summary of the progress in the experimental approach is presented. The accurate solution for the modes in various millimeter-wave waveguides is essential in the analysis of many integrated circuit components, such as filters and impedance transformers. Problems associated with the numerical computation of these modes in two frequently used waveguide forms, namely, the finline and microstrip, are presented. The spectral domain method of formulation, with a moment method solution, is considered. This approach can be readily extended to analyze an arbitrary configuration of dielectric and metallized regions in a shielded enclosure. Galerkin's method is used, where the testing and basic functions are the same. It is shown that the mode functions, or eigenfunctions, are more sensitive to errors than the phase constants, or eigenvalues. The approximate mode functions do not satisfy the orthogonality relationship well, resulting in difficulties when these modal solutions are used to form an approximate Green's function or are used in a mode matching analysis.
Etched metallic conductor lines on metal clad polymeric substrates are used for electronic component interconnections. Significant signal losses are observed for microstrip conductor lines used for interconnecting high frequency devices. At these frequencies, the electronic signal travels closer to the metal-polymer interface due to the skin effect. Copper-teflon interfaces were characterized by scanning electron microscopy (SEM) and Auger electron spectroscopy (AES) to determine the interfacial properties. Data relating roughness of the copper film to signal losses was compared to theory. Films used to enhance adhesion are found, to contribute to these losses.
The RF performance, size, pointing system, and cost were investigated concepts are: for a mechanically steered 1 x 4 tilted microstrip array, a mechanically steered fixed-beam conformal array, and an electronically steered conformal phased array. Emphasis is on the RF performance of the tilted 1 x 4 antenna array and methods for pointing the various antennas studied to a geosynchronous satellite. An updated version of satellite isolations in a two-satellite system is presented. Cost estimates for the antennas in quantities of 10,000 and 100,000 unites are summarized.
A perturbation-iteration technique is presented for determining the propagation constant and characteristic impedance of an unshielded microstrip transmission line. The method converges to the correct solution with a few iterations at each frequency and is equivalent to a full wave analysis. The perturbation-iteration method gives a direct solution for the propagation constant without having to find the roots of a transcendental dispersion equation. The theory is presented in detail along with numerical results for the effective dielectric constant and characteristic impedance for a wide range of substrate dielectric constants, stripline dimensions, and frequencies.
An integrated-circuit quadriphase shift keying (QPSK) exciter and modulator have demonstrated excellent performance directly modulating a carrier frequency of 60 GHz with an output phase error of less than 3 degrees and maximum amplitude error of 0.5 dB. The circuit consists of a 60-GHz Gunn VCO phase-locked to a low-frequency reference source, a 4th subharmonic mixer, and a QPSK modlator packaged into a small volume of 1.8 x 2.5 x 0.35 in. The use of microstrip has the advantages of small size, light-weight, and low-cost fabrication. The unit has the potential for multigigabit data rate applications.
Past and present studies of Multifunction Synthetic Aperture Radar Technology at NASA's Johnson Space Center have given attention to the design of lens antennas, planar arrays, and continuous apertures, such as reflectors. Current emphasis is on an interleaved, open ended waveguide array and microstrip antenna, with design work proceeding for multifrequency operation L, C, and X-band antennas, all of which possess multipolarization. In order to meet ground swath and azimuth resolution requirements, the antennas are designed to provide a beamwidth of 6.2 deg in elevation and 1 deg in azimuth.
This paper presents a progress summary of NASA's efforts in developing 20 and 30 GHz GaAs MMIC devices and an advanced satellite communications antenna system using these devices. In the interest of preserving resources such as frequency spectrum and orbital space the antenna system is being developed with multiple fixed spot beams and multiple scanning spot beams. NASA set high goals for the MMIC development to pushc GaAs technology. These goals and the main features of the MMIC devices are discussed. Some packaging and characterization considerations are also discussed. The 20 GHz transmit antenna and 30 GHz receive antenna are being developed separately. The approach selected is to perform contractual configuration studies, purchase a 20-GHz experimental antenna system (EAS) and perform in-house evaluation. The features and key specifications of the EAS are discussed. Additional supporting technologies such as effects of coupling on modest sized arrays, MMIC matching techniques, in-house analytical capability, wideband and dual frequency microstrip patch array development, and MMIC packaging techniques are described. Some plans for future are also discussed.