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At least 433 records · Page 24

Influence of interface on composite failure

The influence of the interface on the composite system behavior is investigated by analytical modeling. The stress analysis is based on the two-dimensional finite element procedure in which twelve-node isoparametric elements with cubic shape functions are used. The location of possible failure sites is predicted by the strain energy density (SED) failure theory which assumes failure to coincide with locations of minimum SED while the locations of maximum SED correspond to regions of excessive distortion or yielding. The results of the analysis show that the way in which the modulus of elasticity varies within the interface is as important in modeling as the average interface modulus.

Sih, G. C.↗

Improved characterization of the Si-SiO2 interface

Refined quasi-static and conductance methods, based on effectively thin composite insulating layers, low-carrier-concentration bulk semiconductors, and low-level illumination, have been applied to an improved characterization of the (100) Si-SiO2 interface. Accurate measurement of both the total density of interface states and its major components as a function of energy in the forbidden gap have been made over four decades (10-billion to 100-trillion states/eV sq cm) on a single sample. The normal U-shaped density of states is resolved into separate valence- and conduction-band-derived contributions as well as impurity-derived contributions corresponding to concentrations on the order of 20 ppm at the interface.

Su, P.↗

Programable Interface Handles Many Peripherals

Microprocessor-based interface simplifies interconnection of peripheral device with common memory of network of minicomputers. Interface consists of microprocessor, bidirectional port that connects to common memory, bidirectional port that connects to user-selected peripheral, and asynchronous serial communications port. Programable interface is based around 6800 microprocessor. It is assembled from 90 integrated circuits.

Jasinski, M.↗

Spacelab's interface to payload experiments

The Spacelab Payload Standard Modular Electronics (SPSME) program has been designed to provide a standardized set of space-qualified low-power electronic modules from which an experimenter may economically implement a command and data management system. SPSME is based on the Computer Automated Measurement and Control (CAMAC) interface standards. To the system of CAMAC, SPSME adds Spacelab interface modules, a flight qualified system crate, and an efficient light-weight power supply to produce a system compatible with the Spacelab environments, the Spacelab Command and Data Management System interface, and any experiment.

Golemon, W. F.↗

Pulsed-echo interface wave characterization of bolted plates

Ultrasonic waves which propagate along the plane boundary separating two solid substrates were used to characterize aluminum and titanium plates adhesively bonded and bolted together. Wave pulses were used to produce interface waves between the aluminum and a Ti-6Al-4V titanium alloy bar by normal mode conversion. Interface wave reflections from bolt holes drilled through the interface were reconverted to surface wave pulses and detected by the same wedge by standard pulse-echo techniques. Time of flight measurements indicate that the reflected waves are a supersonic of longitudinal modes and circularly symmetric waves that propagate around the bolt hole.

Turner, T. M.↗

Attenuation of ultrasonic interface waves on metal-polymer-metal boundaries

The measured sensitivity of interface wave attenuation to defects near the bondline and to variations in the viscosity of the adhesive layer was compared with theoretical changes predicted by the Rokhin model. Differential interferometric optical measurements of interface wave attenuation due to defects near glass polymer metal boundaries are discussed. Pitch catch and pulse echo methods which use variable angle wedge transducers to generate and receive modified interface waves and to measure large bondline defects and adhesive viscosity are described.

Claus, R. O.↗

Direct observation of interface instability during crystal growth

The general aim of this investigation was to study interface stability and solute segregation phenomena during crystallization of a model system. Emphasis was to be placed on direct observational studies partly because this offered the possibility at a later stage of performing related experiments under substantially convection-free conditions in the space shuttle. The major achievements described in this report are: (1) the development of a new model system for fundamental studies of crystal growth from the melt and the measurement of a range of material parameters necessary for comparison of experiment with theory. (2) The introduction of a new method of measuring segregation coefficient using absorption of a laser beam by the liquid phase. (3) The comparison of segregation in crystals grown by gradient freezing and by pulling from the melt. (4) The introduction into the theory of solute segregation of an interface field term and comparison with experiment. (5) The introduction of the interface field term into the theories of constitutional supercooling and morphological stability and assessment of its importance.

Tiller, W. A.↗

XPS study of interface formation of CVD SiO2 on InSb

The interfacial chemistry of CVD SiO2 films deposited on thin native oxides grown on InSb substrates is examined using X-ray photoemission spectroscopy (XPS) and a relatively benign chemical etching technique for depth profiling. An intensity analysis of XPS spectra is used to derive the compositional structure of the interfaces obtained in the SiO2/native oxide/InSb system. Peak positions in these spectra are used to follow the change in substrate surface potential during the etch sequence, and to establish the chemical nature of the species formed during deposition and subsequent processing. Reaction of the substrate with oxygen resulted in an In-rich native oxide and 1-2 monolayers of excess elemental Sb at the native-oxide/substrate interface, incompletely oxidized silane reduced the native oxide, leaving less than 1 monolayer of elemental In at the SiO2/native oxide interface. Etch removal of this thin In-rich layer leads to a change in the substrate surface potential of 0.06 eV, corresponding to a net increase in positive charge. The results are consistent with simple thermodynamic considerations; they are also compared to previously reported studies of deposited dielectrics on III-V compound semiconductors.

Vasquez, R. P.↗

Photovoltaic array: Power conditioner interface characteristics

The electrical output (power, current, and voltage) of flat plate solar arrays changes constantly, due primarily to changes in cell temperature and irradiance level. As a result, array loads such as dc-to-ac power conditioners must be capable of accommodating widely varying input levels while maintaining operation at or near the maximum power point of the array. The array operating characteristics and extreme output limits necessary for the systematic design of array load interfaces under a wide variety of climatic conditions are studied. A number of interface parameters are examined, including optimum operating voltage, voltage energy, maximum power and current limits, and maximum open circuit voltage. The effect of array degradation and I-V curve fill factor or the array power conditioner interface is also discussed. Results are presented as normalized ratios of power conditioner parameters to array parameters, making the results universally applicable to a wide variety of system sizes, sites, and operating modes.

Gonzalez, C. C.↗

User interface design of software tool system as a technology transfer vehicle

Design considerations of an on going research project for developing an effective and easy to use tool system that supports entire maintenance phases are introduced. The primary focus is the design of an intelligent user interface mechanism. By analyzing why existing tools and tool systems are not used very effectively, we can define user requirements for the user interface mechanisms, specify design criteria of user interface functions, and introduce some features of the implementation. Because this project is still in process, intermediate evaluation and expected effectiveness are discussed.

Miyamoto, I.↗

Stress intensity factors in two bonded elastic layers containing cracks perpendicular to and on the interface. I Analysis. II - Solution and results

The basic crack problem which is essential for the study of subcritical crack propagation and fracture of layered structural materials is considered. Because of the apparent analytical difficulties, the problem is idealized as one of plane strain or plane stress. An additional simplifying assumption is made by restricting the formulation of the problem to crack geometries and loading conditions which have a plane of symmetry perpendicular to the interface. The general problem is formulated in terms of a coupled systems of four integral equations. For each relevant crack configuration of practical interest, the singular behavior of the solution near and at the ends and points of intersection of the cracks is investigated and the related characteristic equations are obtained. The edge crack terminating at and crossing the interface, the T-shaped crack consisting of a broken layer and a delamination crack, the cross-shaped crack which consists of a delamination crack intersecting a crack which is perpendicular to the interface, and a delamination crack initiating from a stress-free boundary of the bonded layers are some of the practical crack geometries considered. Previously announced in STAR as N80-18428 and N80-18429

Lu, M.-C.↗

Skin-stiffener interface stresses in composite stiffened panels

A model and solution method for determining the normal and shear stresses in the interface between the skin and the stiffener attached flange were developed. An efficient, analytical solution procedure was developed and incorporated in a sizing code for stiffened panels. The analysis procedure described provides a means to study the effects of material and geometric design parameters on the interface stresses. These stresses include the normal stress, and the shear stresses in both the longitudinal and the transverse directions. The tendency toward skin/stiffener separation may therefore be minimized by choosing appropriate values for the design variables. The most important design variables include the relative bending stiffnesses of the skin and stiffener attached flange, the bending stiffness of the stiffener web, and the flange width. The longitudinal compressive loads in the flange and skin have significant effects on the interface stresses.

Wang, J. T. S.↗

A flight test evaluation of the pilot interface with a digital advanced avionics system

A flight study was conducted to study pilot workload and the pilot interface with high levels of avionics capability and automation. The study was done in the context of general aviation, single-pilot IFR operations and utilized an experimental, digital, integrated avionics system. Results indicate that such advanced systems can provide improved information to the pilot and increased functional capability. The results also indicate that additional research is needed to increase the knowledge base required to design the pilot interfaces with highly capable systems. A CRT-based moving map display format tested provided excellent navigational situational awareness but was inferior to an HSI for manual path tracking. The complexity of navigation data management, autopilot management, and maintaining awareness of system status contributed to pilot workload and errors. Suggested guidelines for the design of the pilot/avionics interface for advanced avionics systems are given.

Hinton, D. A.↗

Integrated design checkout of shuttle payload avionics interfaces

Orbiter/payload avionics integration testing in the shuttle program are discussed. Payloads show extensive orbiter interfaces. The three testing modes used to verify orbiter/payload avionics interfaces are described. These modes consist of orbiter testing using generic payload simulators, payload testing utilizing the actual payload and a high fidelity orbiter simulator, and interface testing with the actual orbiter and payload. Several special avionics techniques, such as the split flight computer technique were developed for this testing. Experience from the first six shuttle cargoes is reviewed and problems found in testing that would have hampered mission success are emphasized.

Muratore, J. F.↗

Flight Experiment Demonstration System (FEDS) functional description and interface document

This document presents a functional description of the Flight Experiment Demonstration System (FEDS) and of interfaces between FEDS and external hardware and software. FEDS is a modification of the Automated Orbit Determination System (AODS). FEDS has been developed to support a ground demonstration of microprocessor-based onboard orbit determination. This document provides an overview of the structure and logic of FEDS and details the various operational procedures to build and execute FEDS. It also documents a microprocessor interface between FEDS and a TDRSS user transponder and describes a software simulator of the interface used in the development and system testing of FEDS.

Belcher, R. C.↗

Influence of interface ply orientation on fatigue damage of adhesively bonded composite joints

An experimental study of cracked-lap-shear specimens was conducted to determine the influence of adherend stacking sequence on debond initiation and damage growth in a composite-to-composite bonded joint. Specimens consisted of quasi-isotropic graphite/epoxy adherends bonded together with either FM-300 or EC 3445 adhesives. The stacking sequence of the adherends was varied such that 0 deg, 45 deg, or 90 deg plies were present at the adherend-adhesive interfaces. Fatigue damage initiated in the adhesive layer in those specimens with 0 deg nd 45 deg interface plies. Damage initiated in the form of ply cracking in the strap adherend for the specimens with 90 deg interface plies. The fatigue-damage growth was in the form of delamination within the composite adherends for specimens with the 90 deg and 45 deg plies next to the adhesive, while debonding in the adhesive resulted for the specimens with 0 deg plies next to the adhesive. Those joints with the 0 deg and 45 deg plies next to either adhesive has essentially the same fatigue-damage-initiation stress levels. These stress levels were 13 and 71 percent higher, respectively, than those for specimens with 90 deg plies next to the EC 3445 and FM-300 adhesives.

Johnson, W. S.↗