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NASA NTRS2008

Array-scale performance of TES X-ray Calorimeters Suitable for Constellation-X

Having developed a transition-edge-sensor (TES) calorimeter design that enables high spectral resolution in high fill-factor arrays, we now present array-scale results from 32-pixel arrays of identical closely packed TES pixels. Each pixel in such an array contains a Mo/Au bilayer with a transition temperature of 0.1 K and an electroplated Au or Au/Bi xray absorber. The pixels in an array have highly uniform physical characteristics and performance. The arrays are easy to operate due to the range of bias voltages and heatsink temperatures over which solution better than 3 eV at 6 keV can be obtained. Resolution better than 3 eV has also been obtained with 2x8 time-division SQUID multiplexing. We will present the detector characteristics and show spectra acquired through the read-out chain from the multiplexer electronics through the demultiplexer software to real-time signal processing. We are working towards demonstrating this performance over the range of count rates expected in the observing program of the Constellation-X observatory. We mill discuss the impact of increased counting rate on spectral resolution, including the effects of crosstalk and optimal-filtering dead time.

Kilbourne, C. A.↗
NASA NTRS2008

Nano-Multiplication-Region Avalanche Photodiodes and Arrays

Nano-multiplication-region avalanche photodiodes (NAPDs), and imaging arrays of NAPDs integrated with complementary metal oxide/semiconductor (CMOS) active-pixel-sensor integrated circuitry, are being developed for applications in which there are requirements for high-sensitivity (including photoncounting) detection and imaging at wavelengths from about 250 to 950 nm. With respect to sensitivity and to such other characteristics as speed, geometric array format, radiation hardness, power demand of associated circuitry, size, weight, and robustness, NAPDs and arrays thereof are expected to be superior to prior photodetectors and arrays including CMOS active-pixel sensors (APSs), charge-coupled devices (CCDs), traditional APDs, and microchannelplate/ CCD combinations. Figure 1 depicts a conceptual NAPD array, integrated with APS circuitry, fabricated on a thick silicon-on-insulator wafer (SOI). Figure 2 presents selected aspects of the structure of a typical single pixel, which would include a metal oxide/semiconductor field-effect transistor (MOSFET) integrated with the NAPD. The NAPDs would reside in silicon islands formed on the buried oxide (BOX) layer of the SOI wafer. The silicon islands would be surrounded by oxide-filled insulation trenches, which, together with the BOX layer, would constitute an oxide embedding structure. There would be two kinds of silicon islands: NAPD islands for the NAPDs and MOSFET islands for in-pixel and global CMOS circuits. Typically, the silicon islands would be made between 5 and 10 m thick, but, if necessary, the thickness could be chosen outside this range. The side walls of the silicon islands would be heavily doped with electron-acceptor impurities (p+-doped) to form anodes for the photodiodes and guard layers for the MOSFETs. A nanoscale reach-through structure at the front (top in the figures) central position of each NAPD island would contain the APD multiplication region. Typically, the reach-through structure would be about 0.1 microns in diameter and between 0.3 and 0.4 nm high. The top layer in the reach-through structure would be heavily doped with electron-donor impurities (n+-doped) to make it act as a cathode. A layer beneath the cathode, between 0.1 and 0.2 nm thick, would be p-doped to a concentration .10(exp 17)cu cm. A thin n+-doped polysilicon pad would be formed on the top of the cathode to protect the cathode against erosion during a metal-silicon alloying step that would be part of the process of fabricating the array.

Zheng, Xinyu↗
NASA NTRS2009

Integrated Miniature Arrays of Optical Biomolecule Detectors

Integrated miniature planar arrays of optical sensors for detecting specific biochemicals in extremely small quantities have been proposed. An array of this type would have an area of about 1 cm2. Each element of the array would include an optical microresonator that would have a high value of the resonance quality factor (Q . 107). The surface of each microresonator would be derivatized to make it bind molecules of a species of interest, and such binding would introduce a measurable change in the optical properties of the microresonator. Because each microresonator could be derivatized for detection of a specific biochemical different from those of the other microresonators, it would be possible to detect multiple specific biochemicals by simultaneous or sequential interrogation of all the elements in the array. Moreover, the derivatization would make it unnecessary to prepare samples by chemical tagging. Such interrogation would be effected by means of a grid of row and column polymer-based optical waveguides that would be integral parts of a chip on which the array would be fabricated. The row and column polymer-based optical waveguides would intersect at the elements of the array (see figure). At each intersection, the row and column waveguides would be optically coupled to one of the microresonators. The polymer-based waveguides would be connected via optical fibers to external light sources and photodetectors. One set of waveguides and fibers (e.g., the row waveguides and fibers) would couple light from the sources to the resonators; the other set of waveguides and fibers (e.g., the column waveguides and fibers) would couple light from the microresonators to the photodetectors. Each microresonator could be addressed individually by row and column for measurement of its optical transmission. Optionally, the chip could be fabricated so that each microresonator would lie inside a microwell, into which a microscopic liquid sample could be dispensed.

Iltchenko, Vladimir↗
NASA NTRS2010

Phased Array Noise Source Localization Measurements Made on a Williams International FJ44 Engine

A 48-microphone planar phased array system was used to acquire noise source localization data on a full-scale Williams International FJ44 turbofan engine. Data were acquired with the array at three different locations relative to the engine, two on the side and one in front of the engine. At the two side locations the planar microphone array was parallel to the engine centerline; at the front location the array was perpendicular to the engine centerline. At each of the three locations, data were acquired at eleven different engine operating conditions ranging from engine idle to maximum (take off) speed. Data obtained with the array off to the side of the engine were spatially filtered to separate the inlet and nozzle noise. Tones occurring in the inlet and nozzle spectra were traced to the low and high speed spools within the engine. The phased array data indicate that the Inflow Control Device (ICD) used during this test was not acoustically transparent; instead, some of the noise emanating from the inlet reflected off of the inlet lip of the ICD. This reflection is a source of error for far field noise measurements made during the test. The data also indicate that a total temperature rake in the inlet of the engine is a source of fan noise.

Podboy, Gary G.↗
NASA NTRS2010

Use of a Microphone Phased Array to Determine Noise Sources in a Rocket Plume

A 70-element microphone phased array was used to identify noise sources in the plume of a solid rocket motor. An environment chamber was built and other precautions were taken to protect the sensitive condenser microphones from rain, thunderstorms and other environmental elements during prolonged stay in the outdoor test stand. A camera mounted at the center of the array was used to photograph the plume. In the first phase of the study the array was placed in an anechoic chamber for calibration, and validation of the indigenous Matlab(R) based beamform software. It was found that the "advanced" beamform methods, such as CLEAN-SC was partially successful in identifying speaker sources placed closer than the Rayleigh criteria. To participate in the field test all equipments were shipped to NASA Marshal Space Flight Center, where the elements of the array hardware were rebuilt around the test stand. The sensitive amplifiers and the data acquisition hardware were placed in a safe basement, and 100m long cables were used to connect the microphones, Kulites and the camera. The array chamber and the microphones were found to withstand the environmental elements as well as the shaking from the rocket plume generated noise. The beamform map was superimposed on a photo of the rocket plume to readily identify the source distribution. It was found that the plume made an exceptionally long, >30 diameter, noise source over a large frequency range. The shock pattern created spatial modulation of the noise source. Interestingly, the concrete pad of the horizontal test stand was found to be a good acoustic reflector: the beamform map showed two distinct source distributions- the plume and its reflection on the pad. The array was found to be most effective in the frequency range of 2kHz to 10kHz. As expected, the classical beamform method excessively smeared the noise sources at lower frequencies and produced excessive side-lobes at higher frequencies. The "advanced" beamform routine CLEAN-SC created a series of lumped sources which may be unphysical. We believe that the present effort is the first-ever attempt to directly measure noise source distribution in a rocket plume.

Panda, J.↗
NASA NTRS2011

Measurement of Phased Array Point Spread Functions for Use with Beamforming

Microphone arrays can be used to localize and estimate the strengths of acoustic sources present in a region of interest. However, the array measurement of a region, or beam map, is not an accurate representation of the acoustic field in that region. The true acoustic field is convolved with the array s sampling response, or point spread function (PSF). Many techniques exist to remove the PSF's effect on the beam map via deconvolution. Currently these methods use a theoretical estimate of the array point spread function and perhaps account for installation offsets via determination of the microphone locations. This methodology fails to account for any reflections or scattering in the measurement setup and still requires both microphone magnitude and phase calibration, as well as a separate shear layer correction in an open-jet facility. The research presented seeks to investigate direct measurement of the array's PSF using a non-intrusive acoustic point source generated by a pulsed laser system. Experimental PSFs of the array are computed for different conditions to evaluate features such as shift-invariance, shear layers and model presence. Results show that experimental measurements trend with theory with regard to source offset. The source shows expected behavior due to shear layer refraction when observed in a flow, and application of a measured PSF to NACA 0012 aeroacoustic trailing-edge noise data shows a promising alternative to a classic shear layer correction method.

Bahr, Chris↗
NASA NTRS2011

Impact of Improved Heat Sinking of an X-Ray Calorimeter Array on Crosstalk, Noise, and Background Events

The x-ray calorimeter array of the Soft X-ray Spectrometer (SXS) of the Astro-H satellite will incorporate a silicon thermistor array produced during the development of the X-Ray Spectrometer (XRS) of the Suzaku satellite. On XRS, inadequate heat sinking of the array led to several non-ideal effects. The thermal crosstalk, while too small to be confused with x-ray signals, nonetheless contributed a noise term that could be seen as a degradation in energy resolution at high flux. When energy was deposited in the silicon frame around the active elements of the array, such as by a cosmic ray, the resulting pulse in the temperature of the frame resulted in coincident signal pulses on most of the pixels. In orbit, the resolution was found to depend on the particle background rate. In order to minimize these effects on SXS, heat-sinking gold was applied to areas on the front and back of the array die, which was thermally anchored to the gold of its fanout board via gold wire bonds. The thermal conductance from the silicon chip to the fanout board was improved over that of XRS by an order of magnitude. This change was sufficient for essentially eliminating frame events and allowing high-resolution to be attained at much higher counting rates. We will present the improved performance, the measured crosstalk, and the results of the thermal characterization of such arrays.

Kilbourne, C. A.↗
NASA NTRS2006

Photodetector Arrays for Multicolor Visible/Infrared Imaging

Monolithic focal-plane arrays of photodetectors capable of imaging the same scenes simultaneously in multiple wavelength bands in the visible and infrared spectral regions have been proposed. In prior visible/infrared imaging systems, it has been standard practice to use separate optical trains to form images in visible and infrared wavelength bands on separate visibleand infrared-photodetector arrays. Because the proposal would enable the detection of images in multiple wavelength bands on the same focal plane, the proposal would make it unnecessary to use multiple optical trains. Hence, multispectral imaging systems could be made more compact and the difficulties of aligning multiple optical trains would be eliminated. Each pixel in an array according to the proposal would contain stacks of several photodetectors. The proposal is a logical extension of prior concepts of arrays of stacked photodetectors for imaging in two or three wavelength bands. For example, such an array was described in Three-Color Focal-Plane Array of Infrared QWIPs (NPO-20683), NASA Tech Briefs, Vol. 24, No. 5 (May 2000), page 26a. In one proposed design, (see figure), each pixel would be divided into four subpixels, one being dedicated to a visible- and-near-infrared (V) band, one to a combination of the V band and a verylong- wavelength infrared (VLWIR) band, one to a combination of the V band and a long-wavelength infrared (LWIR) band, and one to a combination of the V band and a medium-wavelength infrared (MWIR) band. For this purpose, each subpixel would include a GaAs-based positive/intrinsic/negative (PIN) photodiode for detection in the V band stacked with three quantum-well infrared photodetectors (QWIPs), each optimized for one of the aforementioned infrared bands. The stacks of photodetectors in all the subpixels would be identical except for the electrical connections, which would be configured to activate the various wavelengthband combinations.

Gunapala, Sarath↗
NASA NTRS2011

Initial Assessment of Acoustic Source Visibility with a 24-Element Microphone Array in the Arnold Engineering Development Center 80- by 120-Foot Wind Tunnel at NASA Ames Research Center

Measurements of background noise were recently obtained with a 24-element phased microphone array in the test section of the Arnold Engineering Development Center 80- by120-Foot Wind Tunnel at speeds of 50 to 100 knots (27.5 to 51.4 m/s). The array was mounted in an aerodynamic fairing positioned with array center 1.2m from the floor and 16 m from the tunnel centerline, The array plate was mounted flush with the fairing surface as well as recessed in. (1.27 cm) behind a porous Kevlar screen. Wind-off speaker measurements were also acquired every 15 on a 10 m semicircular arc to assess directional resolution of the array with various processing algorithms, and to estimate minimum detectable source strengths for future wind tunnel aeroacoustic studies. The dominant background noise of the facility is from the six drive fans downstream of the test section and first set of turning vanes. Directional array response and processing methods such as background-noise cross-spectral-matrix subtraction suggest that sources 10-15 dB weaker than the background can be detected.

Horne, William C.↗
NASA NTRS2003

Integrated Electrode Arrays for Neuro-Prosthetic Implants

Arrays of electrodes integrated with chip-scale packages and silicon-based integrated circuits have been proposed for use as medical electronic implants, including neuro-prosthetic devices that might be implanted in brains of patients who suffer from strokes, spinal-cord injuries, or amyotrophic lateral sclerosis. The electrodes of such a device would pick up signals from neurons in the cerebral cortex, and the integrated circuit would perform acquisition and preprocessing of signal data. The output of the integrated circuit could be used to generate, for example, commands for a robotic arm. Electrode arrays capable of acquiring electrical signals from neurons already exist, but heretofore, there has been no convenient means to integrate these arrays with integrated-circuit chips. Such integration is needed in order to eliminate the need for the extensive cabling now used to pass neural signals to data-acquisition and -processing equipment outside the body. The proposed integration would enable progress toward neuro-prostheses that would be less restrictive of patients mobility. An array of electrodes would comprise a set of thin wires of suitable length and composition protruding from and supported by a fine-pitch micro-ball grid array or chip-scale package (see figure). The associated integrated circuit would be mounted on the package face opposite the probe face, using the solder bumps (the balls of the ball grid array) to make the electrical connections between the probes and the input terminals of the integrated circuit. The key innovation is the insertion of probe wires of the appropriate length and material into the solder bumps through a reflow process, thereby fixing the probes in place and electrically connecting them with the integrated circuit. The probes could be tailored to any distribution of lengths and made of any suitable metal that could be drawn into fine wires. Furthermore, the wires could be coated with an insulating layer using anodization or other processes, to achieve the correct electrical impedance. The probe wires and the packaging materials must be biocompatible using such materials as lead-free solders. For protection, the chip and package can be coated with parylene.

Brandon, Erik↗
NASA NTRS2011

Programmable Aperture with MEMS Microshutter Arrays

A microshutter array (MSA) has been developed for use as an aperture array for multi-object selections in James Webb Space Telescope (JWST) technology. Light shields, molybdenum nitride (MoN) coating on shutters, and aluminum/aluminum oxide coatings on interior walls are put on each shutter for light leak prevention, and to enhance optical contrast. Individual shutters are patterned with a torsion flexure that permits shutters to open 90 deg. with a minimized mechanical stress concentration. The shutters are actuated magnetically, latched, and addressed electrostatically. Also, micromechanical features are tailored onto individual shutters to prevent stiction. An individual shutter consists of a torsion hinge, a shutter blade, a front electrode that is coated on the shutter blade, a backside electrode that is coated on the interior walls, and a magnetic cobalt-iron coating. The magnetic coating is patterned into stripes on microshutters so that shutters can respond to an external magnetic field for the magnetic actuation. A set of column electrodes is placed on top of shutters, and a set of row electrodes on sidewalls is underneath the shutters so that they can be electrostatically latched open. A linear permanent magnet is aligned with the shutter rows and is positioned above a flipped upside-down array, and sweeps across the array in a direction parallel to shutter columns. As the magnet sweeps across the array, sequential rows of shutters are rotated from their natural horizontal orientation to a vertical open position, where they approach vertical electrodes on the sidewalls. When the electrodes are biased with a sufficient electrostatic force to overcome the mechanical restoring force of torsion bars, shutters remain latched to vertical electrodes in their open state. When the bias is removed, or is insufficient, the shutters return to their horizontal, closed positions. To release a shutter, both the electrode on the shutter and the one on the back wall where the shutter sits are grounded. The shutters with one or both ungrounded electrodes are held open. Sub-micron bumps underneath light shields and silicon ribs on back walls are the two features to prevent stiction. These features ensure that the microshutter array functions properly in mechanical motions. The MSA technology can be used primarily in multi-object imaging and spectroscopy, photomask generation, light switches, and in the stepper equipment used to make integrated circuits and MEMS (microelectromechanical systems) devices.

Moseley, Samuel↗
NASA NTRS2012

Fabrication of a Kilopixel Array of Superconducting Microcalorimeters with Microstripline Wiring

A document describes the fabrication of a two-dimensional microcalorimeter array that uses microstrip wiring and integrated heat sinking to enable use of high-performance pixel designs at kilopixel scales (32 X 32). Each pixel is the high-resolution design employed in small-array test devices, which consist of a Mo/Au TES (transition edge sensor) on a silicon nitride membrane and an electroplated Bi/Au absorber. The pixel pitch within the array is 300 microns, where absorbers 290 microns on a side are cantilevered over a silicon support grid with 100-micron-wide beams. The high-density wiring and heat sinking are both carried by the silicon beams to the edge of the array. All pixels are wired out to the array edge. ECR (electron cyclotron resonance) oxide underlayer is deposited underneath the sensor layer. The sensor (TES) layer consists of a superconducting underlayer and a normal metal top layer. If the sensor is deposited at high temperature, the ECR oxide can be vacuum annealed to improve film smoothness and etch characteristics. This process is designed to recover high-resolution, single-pixel x-ray microcalorimeter performance within arrays of arbitrarily large format. The critical current limiting parts of the circuit are designed to have simple interfaces that can be independently verified. The lead-to-TES interface is entirely determined in a single layer that has multiple points of interface to maximize critical current. The lead rails that overlap the TES sensor element contact both the superconducting underlayer and the TES normal metal

Chervenak, James↗
NASA NTRS2012

Arrayed Micro-Ring Spectrometer System and Method of Use

A spectrometer system includes an array of micro-zone plates (MZP) each having coaxially-aligned ring gratings, a sample plate for supporting and illuminating a sample, and an array of photon detectors for measuring a spectral characteristic of the predetermined wavelength. The sample plate emits an evanescent wave in response to incident light, which excites molecules of the sample to thereby cause an emission of secondary photons. A method of detecting the intensity of a selected wavelength of incident light includes directing the incident light onto an array of MZP, diffracting a selected wavelength of the incident light onto a target focal point using the array of MZP, and detecting the intensity of the selected portion using an array of photon detectors. An electro-optic layer positioned adjacent to the array of MZP may be excited via an applied voltage to select the wavelength of the incident light.

Choi, Sang H.↗
NASA NTRS2012

Development And Test of A Digitally Steered Antenna Array for The Navigator GPS Receiver

Global Positioning System (GPS)-based navigation has become common for low-Earth orbit spacecraft as the signal environment is similar to that on the Earth s surface. The situation changes abruptly, however, for spacecraft whose orbital altitudes exceed that of the GPS constellation. Visibility is dramatically reduced and signals that are present may be very weak and more susceptible to interference. GPS receivers effective at these altitudes require increased sensitivity, which often requires a high-gain antenna. Pointing such an antenna can pose a challenge. One efficient approach to mitigate these problems is the use of a digitally steered antenna array. Such an antenna can optimally allocate gain toward desired signal sources and away from interferers. This paper presents preliminary results in the development and test of a digitally steered antenna array for the Navigator GPS research program at NASA s Goddard Space Flight Center. In particular, this paper highlights the development of an array and front-end electronics, the development and test of a real-time software GPS receiver, and implementation of three beamforming methods for combining the signals from the array. Additionally, this paper discusses the development of a GPS signal simulator which produces digital samples of the GPS L1C/A signals as they would be received by an arbitrary antenna array configuration. The simulator models transmitter and receiver dynamics, near-far and multipath interference, and has been a critical component in both the development and test of the GPS receiver. The GPS receiver system was tested with real and simulated GPS signals. Preliminary results show that performance improvement was achieved in both the weak signal and interference environments, matching analytical predictions. This paper summarizes our initial findings and discusses the advantages and limitations of the antenna array and the various beamforming methods.

Pinto, Heitor David↗
NASA NTRS2012

The Damper Spring Unit of the Sentinel 1 Solar Array

The Damper Spring Unit (DSU, see Figure 1) has been designed to provide the damping required to control the deployment speed of the spring driven solar array deployment in an ARA Mk3 or FRED based Solar Array in situations where the standard application of a damper at the root-hinge is not feasible. The unit consists of four major parts: a main bracket, an eddy current damper, a spring unit, an actuation pulley which is coupled via Kevlar cables to a synchro-pulley of a hinge. The damper slows down the deployment speed and prevents deployment shocks at deployment completion. The spring unit includes 4 springs which overcome the resistances of the damper and the specific DSU control cable loop. This means it can be added to any spring driven deployment system without major modifications of that system. Engineering models of the Sentinel 1 solar array wing have been built to identify the deployment behavior, and to help to determine the optimal pulley ratios of the solar array and to finalize the DSU design. During the functional tests, the behavior proved to be very sensitive for the alignment of the DSU. This was therefore monitored carefully during the qualification program, especially prior to the TV cold testing. During TV "Cold" testing the measured retarding torque exceeded the max. required value: 284 N-mm versus the required 247 N-mm. Although this requirement was not met, the torque balance analysis shows that the 284 N-mm can be accepted, because the spring unit can provide 1.5 times more torque than required. Some functional tests of the DSU have been performed without the eddy current damper attached. It provided input data for the ADAMS solar array wing model. Simulation of the Sentinel-1 deployment (including DSU) in ADAMS allowed the actual wing deployment tests to be limited in both complexity and number of tests. The DSU for the Sentinel-1 solar array was successfully qualified and the flight models are in production.

Doejaaren, Frans↗
NASA NTRS2013

Silicon Micromachined Microlens Array for THz Antennas

5 5 silicon microlens array was developed using a silicon micromachining technique for a silicon-based THz antenna array. The feature of the silicon micromachining technique enables one to microfabricate an unlimited number of microlens arrays at one time with good uniformity on a silicon wafer. This technique will resolve one of the key issues in building a THz camera, which is to integrate antennas in a detector array. The conventional approach of building single-pixel receivers and stacking them to form a multi-pixel receiver is not suited at THz because a single-pixel receiver already has difficulty fitting into mass, volume, and power budgets, especially in space applications. In this proposed technique, one has controllability on both diameter and curvature of a silicon microlens. First of all, the diameter of microlens depends on how thick photoresist one could coat and pattern. So far, the diameter of a 6- mm photoresist microlens with 400 m in height has been successfully microfabricated. Based on current researchers experiences, a diameter larger than 1-cm photoresist microlens array would be feasible. In order to control the curvature of the microlens, the following process variables could be used: 1. Amount of photoresist: It determines the curvature of the photoresist microlens. Since the photoresist lens is transferred onto the silicon substrate, it will directly control the curvature of the silicon microlens. 2. Etching selectivity between photoresist and silicon: The photoresist microlens is formed by thermal reflow. In order to transfer the exact photoresist curvature onto silicon, there needs to be etching selectivity of 1:1 between silicon and photoresist. However, by varying the etching selectivity, one could control the curvature of the silicon microlens. The figure shows the microfabricated silicon microlens 5 x5 array. The diameter of the microlens located in the center is about 2.5 mm. The measured 3-D profile of the microlens surface has a smooth curvature. The measured height of the silicon microlens is about 280 microns. In this case, the original height of the photoresist was 210 microns. The change was due to the etching selectivity of 1.33 between photoresist and silicon. The measured surface roughness of the silicon microlens shows the peak-to-peak surface roughness of less than 0.5 microns, which is adequate in THz frequency. For example, the surface roughness should be less than 7 microns at 600 GHz range. The SEM (scanning electron microscope) image of the microlens confirms the smooth surface. The beam pattern at 550 GHz shows good directivity.

Lee, Choonsup↗
NASA NTRS2013

Solar Array Structures for 300 kW-Class Spacecraft

State-of-the-art solar arrays for spacecraft provide on the order of 20 kW of electrical power, and they usually consist of 3J solar cells bonded to hinged rigid panels about 1 inch in thickness. This structural construction allows specific mass and packaging volumes of up to approximately 70 W/kg and 15 kW/m3 to be achieved. Significant advances in solar array structures are required for future very-high-power spacecraft (300+ kW), such as those proposed for pre-positioning heavy cargo on or near the Moon, Mars, or asteroids using solar electric propulsion. These applications will require considerable increases in both W/kg and kW/m3, and will undoubtedly require the use of flexible-substrate designs. This presentation summarizes work sponsored by NASA's Game Changing Development Program since Oct. 2011 to address the challenge of developing 300+ kW solar arrays. The work is primarily being done at NASA Langley, NASA Glenn, and two contractor teams (ATK and DSS), with technical collaboration from AFRL/Kirtland. The near-tem objective of the project is design, analysis, and testing of 30-50 kW solar array designs that are extensible to the far-term objective of 300+ kW. The work is currently focused on three designs: the MegaFlex concept by ATK, the Mega-ROSA concept by DSS, and an in-house 300-kW Government Reference Array concept. Each of these designs will be described in the presentation. Results obtained to date by the team, as well as future work plans, for the design, analysis, and testing of these large solar array structures will be summarized.

Pappa, Richard↗
NASA NTRS2014

Wake Vortex Detection: Phased Microphone vs. Linear Infrasonic Array

Sensor technologies can make a significant impact on the detection of aircraft-generated vortices in an air space of interest, typically in the approach or departure corridor. Current state-of-the art sensor technologies do not provide three-dimensional measurements needed for an operational system or even for wake vortex modeling to advance the understanding of vortex behavior. Most wake vortex sensor systems used today have been developed only for research applications and lack the reliability needed for continuous operation. The main challenges for the development of an operational sensor system are reliability, all-weather operation, and spatial coverage. Such a sensor has been sought for a period of last forty years. Acoustic sensors were first proposed and tested by National Oceanic and Atmospheric Administration (NOAA) early in 1970s for tracking wake vortices but these acoustic sensors suffered from high levels of ambient noise. Over a period of the last fifteen years, there has been renewed interest in studying noise generated by aircraft wake vortices, both numerically and experimentally. The German Aerospace Center (DLR) was the first to propose the application of a phased microphone array for the investigation of the noise sources of wake vortices. The concept was first demonstrated at Berlins Airport Schoenefeld in 2000. A second test was conducted in Tarbes, France, in 2002, where phased microphone arrays were applied to study the wake vortex noise of an Airbus 340. Similarly, microphone phased arrays and other opto-acoustic microphones were evaluated in a field test at the Denver International Airport in 2003. For the Tarbes and Denver tests, the wake trajectories of phased microphone arrays and lidar were compared as these were installed side by side. Due to a built-in pressure equalization vent these microphones were not suitable for capturing acoustic noise below 20 Hz. Our group at NASA Langley Research Center developed and installed an infrasonic array at the Newport News-Williamsburg International Airport early in the year 2013. A pattern of pressure burst, high-coherence intervals, and diminishing-coherence intervals was observed for all takeoff and landing events without exception. The results of a phased microphone vs. linear infrasonic array comparison will be presented.

Shams, Qamar A.↗