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At least 415 records · Page 23
All sourcesNASA NTRSDOE OSTI
NASA NTRS2015

Intelligent Design and Intelligent Failure

Good Evening, my name is Greg Jerman and for nearly a quarter century I have been performing failure analysis on NASA's aerospace hardware. During that time I had the distinct privilege of keeping the Space Shuttle flying for two thirds of its history. I have analyzed a wide variety of failed hardware from simple electrical cables to cryogenic fuel tanks to high temperature turbine blades. During this time I have found that for all the time we spend intelligently designing things, we need to be equally intelligent about understanding why things fail. The NASA Flight Director for Apollo 13, Gene Kranz, is best known for the expression "Failure is not an option." However, NASA history is filled with failures both large and small, so it might be more accurate to say failure is inevitable. It is how we react and learn from our failures that makes the difference.

Jerman, Gregory↗
NASA NTRS1992

Postbuckling failure of composite plates with central holes

The postbuckling failure of square composite plates with central holes is analyzed numerically and experimentally. The particular plates studies have stacking sequences of: (+ and - 45/0/90)(sub 2S); (+ and - 45/0(sub 2))(sub 2S); (+ and - 45/0(sub 6))(sub S); and (+ and - 45)(sub 4S). A simple plate geometry, one with a hole diameter to plate width ratio of 0.3 is compared. Failure load, failure mode, and failure location are predicted numerically by using the finite element method. Predictions are compared with experimental results. In numerical failure analysis the interlaminar shear stresses, as well as the inplane stresses are taken into account. An issue addressed in this study is the possible mode shape change of the plate during loading. It is predicted that the first three laminates fail due to excessive stresses in the fiber direction, and more importantly, that the load level is independent of whether the laminate is deformed in a one-half or two-half wave configuration. It is predicted that the fourth laminate fails due to excessive inplane shear stress. Interlaminar shear failure is not predicted for any laminates. For the first two laminates the experimental observations correlated well with the predictions. Experimentally, the third laminate failed along the side support due to interlaminar shear strength S(sub 23). The fourth experimental laminate failed due to inplane shear in the location predicted, however material softening resulted in a different failure load from predictions.

Lee, H. H.↗
NASA NTRS2018

Implementation of a Matrix Crack Spacing Parameter in a Continuum Damage Mechanics Finite Element Model

Continuum Damage Mechanics (CDM) based progressive damage and failure analysis (PDFA) methods have demonstrated success in a variety of finite element analysis (FEA) implementations. However, the technical maturity of CDM codes has not yet been proven for the full design space of composite materials in aerospace applications. CDM-based approaches represent the presence of damage by changing the local material stiffness definitions and without updating the original mesh or element integration schemes. Without discretely representing cracks and their paths through the mesh, damage in models with CDM-based materials is often distributed in a region of partially damaged elements ahead of stress concentrations. Having a series of discrete matrix cracks represented by a softened region may affect predictions of damage propagation and, thus, structural failure. This issue can be mitigated by restricting matrix damage development to discrete, fiber-aligned rows of elements; hence CDM-based matrix cracks can be implemented to be more representative of discrete matrix cracks. This paper evaluates the effect of restricting CDM matrix crack development to discrete, fiber-aligned rows where the spacing of these rows is controlled by a user-defined crack spacing parameter. Initially, the effect of incrementally increasing matrix crack spacing in a unidirectional center notch coupon is evaluated. Then, the lessons learned from the center notch specimen are applied to open-hole compression finite element models. Results are compared to test data, and the limitations, successes, and potential of the matrix crack spacing approach are discussed.

Hyder, Imran↗
NASA NTRS1988

Computer codes for thermal analysis of a solid rocket motor nozzle

A number of computer codes are available for performing thermal analysis of solid rocket motor nozzles. Aerotherm Chemical Equilibrium (ACE) computer program can be used to perform one-dimensional gas expansion to determine the state of the gas at each location of a nozzle. The ACE outputs can be used as input to a computer program called Momentum/Energy Integral Technique (MEIT) for predicting boundary layer development development, shear, and heating on the surface of the nozzle. The output from MEIT can be used as input to another computer program called Aerotherm Charring Material Thermal Response and Ablation Program (CMA). This program is used to calculate oblation or decomposition response of the nozzle material. A code called Failure Analysis Nonlinear Thermal and Structural Integrated Code (FANTASTIC) is also likely to be used for performing thermal analysis of solid rocket motor nozzles after the program is duly verified. A part of the verification work on FANTASTIC was done by using one and two dimension heat transfer examples with known answers. An attempt was made to prepare input for performing thermal analysis of the CCT nozzle using the FANTASTIC computer code. The CCT nozzle problem will first be solved by using ACE, MEIT, and CMA. The same problem will then be solved using FANTASTIC. These results will then be compared for verification of FANTASTIC.

Chauhan, Rajinder Singh↗
NASA NTRS2019

Dormancy Should Be Avoided for Mars and Deep Space Recycling Life Support

Mars is the crucial goal of human exploration beyond the Earth-moon system. The Mars round trip transit vehicle has been expected to use a regenerative Life Support System (LSS) similar to the one on the International Space Station (ISS). It often assumed that the Mars transit LSS will be operated on the outward trip to Mars, placed in dormancy while the full crew explores the surface, and then restored to operation for the return trip to Earth. The major difference between Mars missions and operations in the Earth-moon system is the need for much higher reliability for Mars missions, since rapid resupply of parts and materials or a quick crew return to Earth are not possible. Mars systems must achieve intrinsic high reliability by design, test, failure analysis, and redesign and then increase operational robustness by providing spare parts and redundant systems. Further requiring the LSS to be capable of dormancy and restoration to operation greatly increases the difficulty of design, test, and verification. The process of implementing dormancy and then restoring operation would add significant risk to the mission. Dormancy should be avoided for Mars and can be avoided several ways. First and most obvious, some crew can remain continually on board. If no crew can remain onboard, dormancy can still be avoided if an unused spare LSS is activated for the return trip, rather than restarting the used out bound system. Systems similar to the ISS LSS would have a significant probability of failure on a Mars trip and therefore would require two or three spares. Another full spare LSS could be provided as the return trip system, rather than refurbishing a used LSS.

dormancy↗
NASA NTRS2001

Global Failure Modes in Composite Structures

Composite materials provide well-known advantages for space and aeronautical applications in terms of strength and rigidity to weight ratios and other mechanical properties. As a consequence, their use has experienced a constant increase in the past decades and it is anticipated that this trend will be maintained in the near future. At the same time, being these materials relatively new compared to metals, and having failure characteristics completely different from them, their damage growth and their failure mechanisms are not as well understood in a predictive sense. For example, while in metals fracture produces "clean" cracks with their well defined analytically stress fields at the crack tip, composite fracture is a more complex phenomenon. Instead of a crack, we confront a "damage zone" that may include fiber breakage, fiber microbuckling, fiber pullout, matrix cracking, delamination, debonding or any combination of all these different mechanisms. These phenomena are prevalent in any failure process through an aircraft structure, whether one addresses a global failure such as the ripping of a fuselage or wing section, or whether one is concerned with the failure initiation near a thickness change at stringers or other reinforcement. Thus the topic that has been under consideration has wide application in any real structure and is considered an essential contribution to the predictive failure analysis capability for aircraft containing composite components. The heterogeneity and the anisotropy of composites are not only advantageous but essential characteristics, yet these same features provide complex stress fields, especially in the presence of geometrical discontinuities such as notches, holes or cutouts or structural elements such as stiffeners, stringers, etc. To properly address the interaction between a damage/crack front and a hole with a stringer it is imperative that the stress and deformation fields of the former be (sufficiently well) characterized. The question of "scaling" is an essential concern in any structural materials investigation. For example, experiments in the past have shown that the "strength" of a composite depends on hole size. As a consequence the validity of traditional fracture mechanics concepts applied to composite materials failure must be questioned. The size of the fibers, the dimensions of the laminae, etc. together with the fact that, because of the layered anisotropy, the stress field is no longer two-dimensional, prevent the otherwise obviously confident use of "similarity concepts". Therefore, the question needs to be raised of whether in composites "size matters or not", i.e., whether the results obtained in a laboratory using small coupons are truly representative of the situation involving a full scale component.

Knauss, W. G.↗
NASA NTRS2001

Deformation and Life Analysis of Composite Flywheel Disk and Multi-disk Systems

In this study an attempt is made to put into perspective the problem of a rotating disk, be it a single disk or a number of concentric disks forming a unit. An analytical model capable of performing an elastic stress analysis for single/multiple, annular/solid, anisotropic/isotropic disk systems, subjected to both pressure surface tractions, body forces (in the form of temperature-changes and rotation fields) and interfacial misfits is derived and discussed. Results of an extensive parametric study are presented to clearly define the key design variables and their associated influence. In general the important parameters were identified as misfit, mean radius, thickness, material property and/or load gradation, and speed; all of which must be simultaneously optimized to achieve the "best" and most reliable design. Also, the important issue of defining proper performance/merit indices (based on the specific stored energy), in the presence of multiaxiality and material anisotropy is addressed. These merit indices are then utilized to discuss the difference between flywheels made from PMC and TMC materials with either an annular or solid geometry. Finally two major aspects of failure analysis, that is the static and cyclic limit (burst) speeds are addressed. In the case of static limit loads, upper, lower, and out-of-plane bounds for disks with constant thickness are presented for both the case of internal pressure loading (as one would see in a hydroburst test) and pure rotation (as in the case of a free spinning disk). The results (interaction diagrams) are displayed graphically in designer friendly format. For the case of fatigue, a representative fatigue/life master curve is illustrated in which the normalized limit speed versus number of applied cycles is given for a cladded TMC disk application.

Arnold, S. M.↗
NASA NTRS2014

Reliability of CGA/LGA/HDI Package Board/Assembly (Final Report)

Package manufacturers are now offering commercial-off-the-shelf column grid array (COTS CGA) packaging technologies in high-reliability versions. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronics packages. The previous reports, released in January of 2012 and January of 2013, presented package test data, assembly information, and reliability evaluation by thermal cycling for CGA packages with 1752, 1517, 1509, and 1272 inputs/outputs (I/Os) and 1-mm pitch. It presented the thermal cycling (-55C either 100C or 125C) test results for up to 200 cycles. This report presents up to 500 thermal cycles with quality assurance and failure analysis evaluation represented by optical photomicrographs, 2D real time X-ray images, dye-and-pry photomicrographs, and optical/scanning electron Microscopy (SEM) cross-sectional images. The report also presents assembly challenge using reflowing by either vapor phase or rework station of CGA and land grid array (LGA) versions of three high I/O packages both ceramic and plastic configuration. A new test vehicle was designed having high density interconnect (HDI) printed circuit board (PCB) with microvia-in-pad to accommodate both LGA packages as well as a large number of fine pitch ball grid arrays (BGAs). The LGAs either were assembled onto HDI PCB as an LGA or were solder paste print and reflow first to form solder dome on pads before assembly. Both plastic BGAs with 1156 I/O and ceramic LGAs were assembled. It also presented the X-ray inspection results as well as failures due to 200 thermal cycles. Lessons learned on assembly of ceramic LGAs are also presented.

Ghaffaroam. Reza↗
NASA NTRS1999

Analyses of Transistor Punchthrough Failures

The failure of two transistors in the Altitude Switch Assembly for the Solid Rocket Booster followed by two additional failures a year later presented a challenge to failure analysts. These devices had successfully worked for many years on numerous missions. There was no history of failures with this type of device. Extensive checks of the test procedures gave no indication for a source of the cause. The devices were manufactured more than twenty years ago and failure information on this lot date code was not readily available. External visual exam, radiography, PEID, and leak testing were performed with nominal results Electrical testing indicated nearly identical base-emitter and base-collector characteristics (both forward and reverse) with a low resistance short emitter to collector. These characteristics are indicative of a classic failure mechanism called punchthrough. In failure analysis punchthrough refers to an condition where a relatively low voltage pulse causes the device to conduct very hard producing localized areas of thermal runaway or "hot spots". At one or more of these hot spots, the excessive currents melt the silicon. Heavily doped emitter material diffuses through the base region to the collector forming a diffusion pipe shorting the emitter to base to collector. Upon cooling, an alloy junction forms between the pipe and the base region. Generally, the hot spot (punch-through site) is under the bond and no surface artifact is visible. The devices were delidded and the internal structures were examined microscopically. The gold emitter lead was melted on one device, but others had anomalies in the metallization around the in-tact emitter bonds. The SEM examination confirmed some anomalies to be cosmetic defects while other anomalies were artifacts of the punchthrough site. Subsequent to these analyses, the contractor determined that some irregular testing procedures occurred at the time of the failures heretofore unreported. These testing irregularities involved the use of a breakout box and were the likely cause of the failures. There was no evidence to suggest a generic failure mechanism was responsible for the failure of these transistors.

Nicolas, David P.↗