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At least 415 records · Page 23

Carbon-Nanotube Conductive Layers for Thin-Film Solar Cells

Thin, transparent layers comprising mats of carbon nanotubes have been proposed for providing lateral (that is, inplane) electrical conductivities for collecting electric currents from the front surfaces of the emitter layers of thin-film solar photovoltaic cells. Traditionally, thin, semitransparent films of other electrically conductive materials (usually, indium tin oxide, zinc oxide, or cadmium sulfide) have been used for this purpose. As in the cases of the traditional semitransparent conductive films, the currents collected by the nanotube layers would, in turn, be further collected by front metal contact stripes. Depending on details of a specific solar-cell design, the layer of carbon nanotubes would be deposited in addition to, or instead of, a semitransparent layer of one of these traditional conductive materials (see figure). The proposal is expected to afford the following advantages: The electrical conductivity of the carbon- nanotube layer would exceed that of the corresponding semitransparent layer of traditional electrically conductive material. The greater electrical conductivity of the carbon-nanotube layer would make it possible to retain adequate lateral electrical conductivity while reducing the thickness of, or eliminating entirely, the traditional semitransparent conductive layer. As a consequence of thinning or elimination of the traditional semitransparent conductive layer, less light would be absorbed, so that more of the incident light would be available for photovoltaic conversion. The greater electrical conductivity of the carbon-nanotube layer would make it possible to increase the distance between front metal contact stripes, in addition to (or instead of) thinning or eliminating the layer of traditional semitransparent conductive material. Consequently, the fraction of solar-cell area shadowed by front metal contact stripes would be reduced again, making more of the incident light available for photovoltaic conversion. The electrical conductivities of individual carbon nanotubes can be so high that the mat of carbon nanotubes could be made sparse enough to be adequately transparent while affording adequate lateral electrical conductivity of the mat as a whole. The thickness of the nanotube layer would be chosen so that the layer would contribute significant lateral electrical conductivity, yet would be as nearly transparent as possible to incident light. A typical thickness for satisfying these competing requirements is expected to lie between 50 and 100 nm. The optimum thickness must be calculated by comparing the lateral electrical conductivity, the distance between front metal stripes, and the amount of light lost by absorption in the nanotube layer.

Landis, Geoffrey A.↗

Conductive plastics

Electrically conductive plastics fabrication and applications limitations, discussing plastic matrix materials loaded with various conductive fillers

Litant, I.↗

Utah FORGE 5-2419: Temperature Testing of Proppants for EGS and Stimulation of Electromagnetic Fracture Mapping Using Electrically-Conducive Proppants - 2024 Annual Workshop Presentation

This is a presentation on the Temperature Testing of Proppants for EGS and Stimulation of Electromagnetic Fracture Mapping Using Electrically-Conducive Proppants by Stevens Institute of Technology, presented by Cheng Chen. This video slide presentation discusses well controlled laboratory experiments testing the high-temperature performance of electrically-conductive and non-electrically-conductive proppants in maintaining fractures hydraulic and electrical conductivities to understand and quantify the thermal-hydrologic-mechanical-chemical mechanisms that regulate the observed behaviors. This will be tested using proppant/fracture imaging via borehole electromagnetic measurements. This presentation was featured in the Utah FORGE R&D Annual Workshop on August 15, 2024.

15 GEOTHERMAL ENERGY↗

Change of Electrical and Transport Properties of Nickel Oxide by Carrier Concentration and Temperature through First-Principle Calculations

Abstract Nickel is typically used as one of the main components in electrical contact devices or connectors. Nickel oxide (NiO) is usually formed on the surfaces of electrodes and can negatively impact system performance by introducing electrical contact resistance. The thermal, electrical, and transport properties of NiO, as a Mott insulator or a p-type semiconductor, can be altered by operating and environmental conditions such as temperature and stress/strain by contact. In this study, we investigate the fundamental material properties of NiO through the first-principle calculations. First, we obtain and compare the lattice parameter, magnetic moment, and electronic structure for NiO via the WIEN2K simulations with four different potentials (i.e., GGA, GGA + U, LSDA, and LSDA + U). Then, using the WIEN2K simulation results with LSDA + U potential that produces a highly accurate bandgap for NiO, we calculate the electrical conductivity and electrical part of the thermal conductivity of nickel and NiO as a function of temperature and carrier concentration through the BoltzTraP simulations. Systematic simulation results revealed that the electrical conductivity relative to the relaxation time for NiO increases with the carrier concentration, while it shows a slightly decreasing trend with temperature under a fixed carrier concentration. By contrast, the electrical part of the thermal conductivity shows an increasing trend considering carrier concentration and temperature.

Shah, Nayem Md. Reza↗

Thermal and electrical contact conductance studies

Prediction of electrical and thermal contact resistance for pressed, nominally flat contacts is complicated by the large number of variables which influence contact formation. This is reflected in experimental results as a wide variation in contact resistances, spanning up to six orders of magnitude. A series of experiments were performed to observe the effects of oxidation and surface roughness on contact resistance. Electrical contact resistance and thermal contact conductance from 4 to 290 K on OFHC Cu contacts are reported. Electrical contact resistance was measured with a 4-wire DC technique. Thermal contact conductance was determined by steady-state longitudinal heat flow. Corrections for the bulk contribution ot the overall measured resistance were made, with the remaining resistance due solely to the presence of the contact.

Vansciver, S. W.↗

Thermal conductivity and electrical resistivity of porous material

Thermal conductivity and electrical resistivity of porous materials, including 304L stainless steel Rigimesh, 304L stainless steel sintered spherical powders, and OFHC sintered spherical powders at different porosities and temperatures are reported and correlated. It was found that the thermal conductivity and electrical resistivity can be related to the solid material properties and the porosity of the porous matrix regardless of the matrix structure. It was also found that the Wiedermann-Franz-Lorenz relationship is valid for the porous materials under consideration. For high conductivity materials, the Lorenz constant and the lattice component of conductivity depend on the material and are independent of the porosity. For low conductivity, the lattice component depends on the porosity as well.

Koh, J. C. Y.↗

Apparatus for use in determining surface conductivity at microwave frequencies

An apparatus is provided for use in determining surface conductivity of a flat or shaped conductive material at microwave frequencies. A plate has an electrically conductive surface with first and second holes passing through the plate. An electrically conductive material under test (MUT) is maintained in a spaced apart relationship with the electrically conductive surface of the plate by one or more non-conductive spacers. A first coupling loop is electrically shielded within the first hole while a second coupling loop is electrically shielded within the second hole. A dielectric resonator element is positioned between the first and second coupling loops, while also being positioned closer to the MUT than the electrically conductive surface of the plate. Microwave energy at an operating frequency f is supplied from a signal source to the first coupling loop while microwave energy received at the second coupling loop is measured. The apparatus is capable of measuring the Q-factor of the dielectric resonator situated in the cavity existing between the electrically conductive surface of the plate and the MUT. Surface conductivity of the electrically conductive surface can be determined via interpolation using: 1) the measured Q-factor with the electrically conductive surface in place, and 2) the measured Q-factor when the MUT is replaced with reference standards having known surface conductivities.

Hearn, Chase P.↗

Apparatus for Use in Determining Surface Conductivity at Microwave Frequencies

An apparatus is provided for use in determining surface conductivity of a flat or shaped conductive material at microwave frequencies. A plate has an electrically conductive surface with first and second holes passing through the plate. An electrically conductive material under test (MUT) is maintained in a spaced apart relationship with the electrically conductive surface of the plate by one or more nonconductive spacers. A first coupling loop is electrically shielded within the first hole while a second coupling loop is electrically shielded within the second hole. A dielectric resonator element is positioned between the first and second coupling loops, while also being positioned closer to the MUT than the electrically conductive surface of the plate. Microwave energy at an operating frequency f is supplied from a signal source to the first coupling loop while microwave energy received at the second coupling loop is measured. The apparatus is capable of measuring the Q-factor of the dielectric resonator situated in the 'cavity' existing between the electrically conductive surface of the plate and the MUT. Surface conductivity of the electrically conductive surface can be determined via interpolation using: 1 ) the measured Q-factor with the electrically conductive surface in place, and 2) the measured Q-factor when the MUT is replaced with reference standards having known surface conductivities.

Hearn, Chase P.↗

Mesoscale Effects of Composition and Calendering in Lithium-Ion Battery Composite Electrodes

Macrohomogeneous battery models are widely used to predict battery performance, necessarily relying on effective electrode properties, such as specific surface area, tortuosity, and electrical conductivity. While these properties are typically estimated using ideal effective medium theories, in practice they exhibit highly non-ideal behaviors arising from their complex mesostructures. In this paper, we computationally reconstruct electrodes from X-ray computed tomography of 16 nickel–manganese–cobalt-oxide electrodes, manufactured using various material recipes and calendering pressures. Due to imaging limitations, a synthetic conductive binder domain (CBD) consisting of binder and conductive carbon is added to the reconstructions using a binder bridge algorithm. Reconstructed particle surface areas are significantly smaller than standard approximations predicted, as the majority of the particle surface area is covered by CBD, affecting electrochemical reaction availability. Finite element effective property simulations are performed on 320 large electrode subdomains to analyze trends and heterogeneity across the electrodes. Significant anisotropy of up to 27% in tortuosity and 47% in effective conductivity is observed. Electrical conductivity increases up to 7.5× with particle lithiation. We compare the results to traditional Bruggeman approximations and offer improved alternatives for use in cell-scale modeling, with Bruggeman exponents ranging from 1.62 to 1.72 rather than the theoretical value of 1.5. We also conclude that the CBD phase alone, rather than the entire solid phase, should be used to estimate effective electronic conductivity. This study provides insight into mesoscale transport phenomena and results in improved effective property approximations founded on realistic, image-based morphologies.

25 ENERGY STORAGE↗

Conductive trace interconnection tape

A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate comprises a top insulating layer, an electrically conductive layer, and a bottom insulating layer. The top insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape. The electrically conductive layer is positioned underneath the top insulating layer. The electrically conductive layer is formed from electrically conductive material and includes electrical interconnect traces, electrical component pads, or electrically conductive planar portions. The bottom insulating layer is positioned underneath the electrically conductive layer. The bottom insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on the printed circuit board or flexible circuit substrate.

Hatch, Stephen McGarry↗

Conductive trace interconnection tape

A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate comprises a top insulating layer, an electrically conductive layer, and a bottom insulating layer. The top insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape. The electrically conductive layer is positioned underneath the top insulating layer. The electrically conductive layer is formed from electrically conductive material and includes electrical interconnect traces, electrical component pads, or electrically conductive planar portions. The bottom insulating layer is positioned underneath the electrically conductive layer. The bottom insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on the printed circuit board or flexible circuit substrate.

Hatch, Stephen McGarry↗

RFID-Enabled Angular Position Sensing System

An angular position sensing system includes a first support with ring-shaped elements disposed thereon and spaced apart from one another in a curvilinear arrangement. Each ring-shaped element includes an electrically-conductive ring and an RFID integrated circuit electrically coupled to its electrically-conductive ring. A second support has an antenna coupled thereto that defines an electrically-conductive path commensurate in size and shape to at least a portion of the electrically-conductive ring. An interrogator transmits a signal to the antenna wherein electric current is generated along the antenna's electrically-conductive path and electromagnetic energy emanates from the antenna. Any ring-shaped element and its RFID integrated circuit energized by the electromagnetic energy generates in response a data transmission for receipt by the interrogator. A processor coupled to the interrogator derives information related to an angular position of one of the first support and second support using the data transmission.

Fink, Patrick W.↗

Gasket Assembly for Sealing Mating Surfaces

A pair of substantially opposed mating surfaces are joined to each other and sealed in place by means of an electrically-conductive member which is placed in proximity to the mating surfaces. The electrically-conductive member has at least one element secured thereto which is positioned to contact the mating surfaces, and which softens when the electrically-conductive member is heated by passing an electric current therethrough. The softened element conforms to the mating surfaces, and upon cooling of the softened element the mating surfaces are joined together in an effective seal. Of particular significance is an embodiment of the electrically-conductive member which is a gasket having an electrically-conductive gasket base and a pair of the elements secured to opposite sides of the gasket base. This embodiment is positioned between the opposed mating surfaces to be joined to each other. Also significant is an embodiment of the electrically-conductive member which is an electrically-conductive sleeve having an element secured to its inner surface. This embodiment surrounds cylindrical members the bases of which are the substantially opposed mating surfaces to be joined, and the element on the inner surface of the sleeve contacts the outer surfaces of the cylindrical members.

Bryant, Melvin A., III↗

In-Situ Wire Damage Detection System

An in-situ system for detecting damage in an electrically conductive wire. The system includes a substrate at least partially covered by a layer of electrically conductive material forming a continuous or non-continuous electrically conductive layer connected to an electrical signal generator adapted to delivering electrical signals to the electrically conductive layer. Data is received and processed to identify damage to the substrate or electrically conductive layer. The electrically conductive material may include metalized carbon fibers, a thin metal coating, a conductive polymer, carbon nanotubes, metal nanoparticles or a combination thereof.

Williams, Martha K.↗

Semiconductor to Metal Transition in the Solids/Melts of Te and Pseudo-Binary of Hg1-xCdxTe for x = 0, 0.1 and 0.2

This paper reports the experimentally measured thermal and electrical conductivities from which the Lorenz numbers as functions of temperature were derived for the solids and melts of elemental Te and samples of Hg1-xCdxTe of x = 0, 0.1 and 0.2. The structural changes in the vicinity of the solid-liquid phase transition of elemental Te and various Hg1-xCdxTe solid solutions were assessed by closely examining these experimental properties and the derived Lorenz numbers. The values of Lorenz numbers for the solids of these samples were higher than the value of L0, i.e., the Lorenz number for the free electron gas derived by Sommerfeld, implying the characteristics of non-degenerate semiconductor. With the increasing value of x, or the larger bandgap, the materials become more non-degenerate with larger deviation from L0. As the solids started to melt, the measured values of Lorenz number for all samples started to decrease and eventually reached and maintained at values close to L0 at higher temperatures. The trend of the Lorenz number indicates that the transition from non-degenerate semiconductor of the solid samples to metal or degenerate semiconductor when the samples temperature reached above their liquidus temperatures.

thermal conductivity↗

Electrochemical Deposition Of Conductive Copolymers

Experiments show electrically conductive films are deposited on glassy carbon or indium tin oxide substrates by electrochemical polymerization of N-{(3-trimethoxy silyl) propyl} pyrrole or copolymerization with pyrrole. Copolymers of monomer I and pyrrole exhibit desired electrical conductivity as well as desired adhesion and other mechanical properties. When fully developed, new copolymerization process useful in making surface films of selectable conductivity.

Nagasubramanian, Ganesan↗

Embedded Heaters for Joining or Separating Plastic Parts

A proposed thermal-bonding technique would make it possible to join or separate thermoplastic parts quickly and efficiently. The technique would eliminate the need for conventional welding or for such conventional fastening components as bolted flanges or interlocking hooks. The technique could be particularly useful in the sign industry (in which large quantities of thermoplastics are used) or could be used to join plastic pipes. A thin sheet of a suitable electrically conductive material would be formed to fit between two thermoplastic parts to be joined (see figure). The electrically conductive sheet and the two parts would be put together tightly, then an electrical current would be sent through the conductor to heat the thermoplastic locally. The magnitude of the current and the heating time would be chosen to generate just enough heat to cause the thermoplastic to adhere to both sides of the electrically conductive sheet. Optionally, the electrically conductive sheet could contain many small holes to provide purchase or to increase electrical resistance to facilitate the generation of heat. After thermal bonding, the electrically conductive sheet remains as an integral part of the structure. If necessary, the electrically conductive sheet can be reheated later to separate the joined thermoplastic parts.

Bryant, Melvin A., III↗

Shockwave Consolidation of Nanostructured Thermoelectric Materials

Nanotechnology based thermoelectric materials are considered attractive for developing highly efficient thermoelectric devices. Nano-structured thermoelectric materials are predicted to offer higher ZT over bulk materials by reducing thermal conductivity and increasing electrical conductivity. Consolidation of nano-structured powders into dense materials without losing nanostructure is essential towards practical device development. Using the gas atomization process, amorphous nano-structured powders were produced. Shockwave consolidation is accomplished by surrounding the nanopowder-containing tube with explosives and then detonating. The resulting shock wave causes rapid fusing of the powders without the melt and subsequent grain growth. We have been successful in generating consolidated nano-structured bismuth telluride alloy powders by using the shockwave technique. Using these consolidated materials, several types of thermoelectric power generating devices have been developed. Shockwave consolidation is anticipated to generate large quantities of nanostructred materials expeditiously and cost effectively. In this paper, the technique of shockwave consolidation will be presented followed by Seebeck Coefficient and thermal conductivity measurements of consolidated materials. Preliminary results indicate a substantial increase in electrical conductivity due to shockwave consolidation technique.

Prasad, Narasimha S.↗