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At least 415 records · Page 23

Damage Assessment of Stress-Thermal Cycled high temperature

We report on the characterization of bismaleimide and polyimide carbon fiber composite, microcrack development under stress thermal cycling loading. Such cycles range from cryogenic temperatures associated with cryogenic fuel (LN, LOX) containment to high temperatures of 300 degrees Celsius associated with future hypervelocity aeropropulsion systems. Microcrack development thresholds as a function of temperature range of the thermal cycle; the number of cycles; the applied stress level imposed on the composite are reported. We have conducted stress-thermal cycles on thin bismaleimide-woven carbon fiber foils for three temperature range cycles: 1. Ambient temperature - -196 degrees celsius. 2. Ambient temperature - 150 degrees Celsius; 200 degrees Celsius; 250 degrees Celsius. 3. -196 degrees Celsius - 250 degrees Celsius. The Principle findings are that the full cycles from -196 degrees Celsius to to 250 degrees Celsius cause the most significant microcrack of development. These observations indicate that the high temperature portion of the cycle under load causes fiber-matrix interface failure and subsequent exposure to higher stresses at the cryogenic, low temperature region results in composite matrix microcracking as a result of the additional stresses associate with the fiber-matrix thermal expansion mismatch. Our initial studies for 12 ply PMR-II-50 polyimide/M60JB carbon fabric [0f,90f,90f,0f,0f,90f]ls composites will be presented. The stress-thermal cycle test procedure for these will be described. Moisture absorption characteristics between cycles will be used to monitor interconnected microcrack development. The applied stress level will be 75% of the composite cryogenic (-196 degrees Celsius) ultimate strength.

Ju, Jae-Hyung↗

Power Hibernation for Low-Cost Solar Powered Lunar Missions

Because the surface of the Moon drops to cryogenic temperatures, no solar-powered lunar spacecraft have reliably operated beyond a single lunar day. Passive thermal control cannot keep a spacecraft sufficiently warm for the 354-hour lunar night, and active thermal control requires a dramatic increase in battery mass at the expense of payload mass. Extreme conditions seen on the lunar surface suggest a radioisotope solution is ideal, but mass, cost, and schedule are inconsistent with low-cost frequent flight intent of the commercial lunar payload services (CLPS) program. To solve the issue of lunar night survivability without radioisotope sources of power and heat, a lunar power hibernation approach is being developed at the Glenn Research Center, which exploits the ability of common 18650 Lithium-ion cells to passively survive cryogenic freeze-thaw cycles and recover without apparent performance degradation. A key aspect of this hibernation approach is the use of cryogenically operable electronics that safely manage the restoration of the battery thermal environment at lunar dawn. A spacecraft utilizing this strategy will operate into the lunar night on batteries until the state of charge or spacecraft temperature reaches a predetermined threshold. At this point, systems are shut down and the battery is isolated from the main bus to prevent charge or discharge during the freezing and thawing transitions. The system remains passive until lunar dawn, where temperatures can reach as low as 50 K. All electronics must be tolerant to these conditions. When the solar arrays are finally illuminated at lunar dawn, the main bus power electronics will initiate a “cold start” and begin regulating array power. The main bus electronics must be designed to operate at cryogenic temperatures. Array power is used to warm the battery and passive electronics back to operational temperatures. Once batteries are returned to normal temperatures, diagnostics and precharging is performed, as needed, and the battery is reconnected. The overall spacecraft system reboots and returns to nominal operations until lunar night returns. To assure that we can develop batteries suited for many hibernation freeze/thaw cycles, STMD Space Technology Research Grant Program (STRG) has selected two principal investigators that will thoroughly characterize of the Li-ion cell through the freeze-thaw process, investigate degradation mechanisms, and identify potential diagnostic techniques. STMD STRG is also funding an investigation of Gallium-Nitride semiconductors for cryogenic power applications. This work includes physics-informed modeling that considers cryogenic conductivity, carrier mobility, and quantum effects that govern semiconductor performance at cryogenic temperatures. These models can enable engineers to develop accurate cryogenic simulation models that assist in the design of power controls stable over the entire lunar surface temperature range. Meanwhile, Glenn is performing cryogenic testing of batteries and electronics, establishing design guidelines for power applications in extreme cold lunar environment, and potentially developing a hibernation technology demonstrator. The hibernation approach will enable low-cost lunar robotic missions to extend their operating lifetime to many months while minimizing development costs and impact on payload capacity. The need for cryogenically operable electronics is restricted to only main bus power and battery controls, as the majority of systems simply need to passively tolerate cryogenic temperatures. This allows developers to continue to exploit the cost savings of legacy and COTS hardware with minimum modification. For these reasons, lunar power hibernation is a viable near-term solution for lunar night survivability for solar powered commercial landers.

Space power↗

Development of Electronics for Low-Temperature Space Missions

Electronic systems that are capable of operating at cryogenic temperatures will be needed for many future NASA space missions, including deep space probes and spacecraft for planetary surface exploration. In addition to being able to survive the harsh deep space environment, low-temperature electronics would help improve circuit performance, increase system efficiency, and reduce payload development and launch costs. Terrestrial applications where components and systems must operate in low-temperature environments include cryogenic instrumentation, superconducting magnetic energy storage, magnetic levitation transportation systems, and arctic exploration. An ongoing research and development project for the design, fabrication, and characterization of low-temperature electronics and supporting technologies at NASA Glenn Research Center focuses on efficient power systems capable of surviving in and exploiting the advantages of low-temperature environments. Supporting technologies include dielectric and insulating materials, semiconductor devices, passive power components, optoelectronic devices, and packaging and integration of the developed components into prototype flight hardware. An overview of the project is presented, including a description of the test facilities, a discussion of selected data from component testing, and a presentation of ongoing research activities being performed in collaboration with various organizations.

Patterson, Richard L.↗

NASA mechanical impact testing in high-pressure oxygen

Three independently developed high-pressure gaseous oxygen mechanical impact testers have been used to evaluate materials for the Space Shuttle Program. A test program evaluating the performance of these test systems is described. The gaseous and liquid oxygen test procedures and equipment are considered along with the material selection procedures. The results of the NASA mechanical impact tester variability study are presented, including penetration function curves and curve parameters and equivalent energies and comparisons of high-pressure testers at ambient pressure and temperature, ambient temperature and 34 MPa, and cryogenic temperature and 34 MPa. Finally, a summary of NASA mechanical impact test data is presented.

Bryan, C. J.↗

An investigation of the effect of surface impurities on the adsorption kinetics of hydrogen chemisorbed onto iron

The goal was to develop an understanding of heterogeneous kinetic processes for those molecular species which produce gaseous hydrogen degradation of the mechanical properties of metallic structural materials. Although hydrogen degradation of metallic materials is believed to result from dissolved protonic hydrogen, the heterogeneous hydrogen interface transport processes often dominate the kinetics of the degradation process. The initial step in the interface transport process is the dissociative chemisorption of the molecular species at the metal surface followed by hydrogen absorption into and transport through the bulk. Modern advanced aerospace applications often require the use of structural materials in high pressure hydrogen environments at temperatures which range from low cryogenic temperatures to very high temperatures (1300 K and greater). Materials proposed for these applications, such as the titanium aluminides, beta-titanium alloys, nickel- and cobalt-based superalloys, molybdenum-rhenium alloys, beryllium, and various beryllides, need to possess a high degree of immunity from hydrogen induced degradation of mechanical properties. In the present program, the interaction of hydrogen with the surfaces of alpha-2 (Ti3Al) titanium aluminide, gamma (TiAl) titanium aluminide, and beryllium were studied. The interaction of low pressure hydrogen with gamma titanium aluminide and beryllium was found to be relatively weak, in the sense that adsorption leads to a low surface concentration of dissociated hydrogen, i.e., the chemisorption process is reversible at room temperature (300 K) for gamma titanium aluminide and the sticking coefficient for chemisorption is extremely small for beryllium. Hydrogen was found to interact readily with alpha-2 titanium aluminide to form a stable surface hydride at 300 K. These results correlate well with other recent studies which show that the mechanical properties for alpha-2 titanium aluminide are readily degraded in hydrogen while gamma titanium aluminide exhibits less degradation and beryllium essentially no degradation. The interaction of oxygen with the surface of these materials has been studied, also, in the present program.

Shanabarger, Mickey R.↗

Study Acoustic Emissions from Composites

The purpose of this work will be to develop techniques for monitoring the acoustic emissions from carbon epoxy composite structures at cryogenic temperatures. Performance of transducers at temperatures ranging from ambient to cryogenic and the characteristics of acoustic emission from composite structures will be studied and documented. This entire effort is directed towards characterization of structures used in NASA propulsion programs such as the X-33.

Walker, James↗

Performance of the Micropower Voltage Reference ADR3430 Under Extreme Temperatures

Electronic systems designed for use in space exploration systems are expected to be exposed to harsh temperatures. For example, operation at cryogenic temperatures is anticipated in space missions such as polar craters of the moon (-223 C), James Webb Space Telescope (-236 C), Mars (-140 C), Europa (-223 C), Titan (-178 C), and other deep space probes away from the sun. Similarly, rovers and landers on the lunar surface, and deep space probes intended for the exploration of Venus are expected to encounter high temperature extremes. Electronics capable of operation under extreme temperatures would not only meet the requirements of future spacebased systems, but would also contribute to enhancing efficiency and improving reliability of these systems through the elimination of the thermal control elements that present electronics need for proper operation under the harsh environment of space. In this work, the performance of a micropower, high accuracy voltage reference was evaluated over a wide temperature range. The Analog Devices ADR3430 chip uses a patented voltage reference architecture to achieve high accuracy, low temperature coefficient, and low noise in a CMOS process [1]. The device combines two voltages of opposite temperature coefficients to create an output voltage that is almost independent of ambient temperature. It is rated for the industrial temperature range of -40 C to +125 C, and is ideal for use in low power precision data acquisition systems and in battery-powered devices. Table 1 shows some of the manufacturer s device specifications.

Patterson, Richard L.↗

A review of the NASA/OAST cryogenic coolers technology program

Low and ultra low temperature cryogenic cooler systems for future space missions include mechanical, solid cryogen, gas adsorption, superfluid helium, helium-3, and magnetic (adiabatic demagnetization) coolers. Operating lifetimes required vary from a few weeks for a Shuttle/Spacelab mission to as long as nine years for missions to the outer planets. Temperature requirements vary from tens to tenths of kelvin. At the higher temperature, cooling loads for detectors, instruments and associated shields may be as high as 15 watts. The general requirements for low and ultra low temperature and techniques that can be employed to achieve these temperatures at expected heat loads are discussed. The NASA Centers involved in the R & T efforts and the type of cooler systems on which they are focusing their effort are considered as well as the thrust of R & T effort for each cooler type. Projected missions that will use the technology are identified.

Lundholm, J. G., Jr.↗

Analysis and Design of the NASA Langley Cryogenic Pressure Box

A cryogenic pressure box was designed and fabricated for use at NASA Langley Research Center (LaRC) to subject 72 in. x 60 in. curved panels to cryogenic temperatures and biaxial tensile loads. The cryogenic pressure box is capable of testing curved panels down to -423 F (20K) with 54 psig maximum pressure on the concave side, and elevated temperatures and atmospheric pressure on the convex surface. The internal surface of the panel is cooled by high pressure helium as that is cooled to -423 F by liquid helium heat exchangers. An array of twelve independently controlled fans circulate the high pressure gaseous helium to provide uniform cooling on the panel surface. The load introduction structure, consisting of four stainless steel load plates and numerous fingers attaching the load plates to the test panel, is designed to introduce loads into the test panel that represent stresses that will he observed in the actual tank structure. The load plates are trace cooled with liquid nitrogen to reduce thermal gradients that may result in bending the load plates, and thus additional stresses in the test panel. The design of the cryogenic systems, load introduction structure, and control system are discussed in this report.

Glass, David E.↗