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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Wire-dispensing tool which resembles mechanical pencil is used to wrap magnet wire around integrated circuit terminals uniformly and securely without damaging insulative coating on wire. Tool is hand-held and easily manipulated to execute wire wrapping movements.
Device recognizes variations in wire size and is being used during computer memory-plane fabrication. Decrease in wire diameter, due to stretching, permits removal of wire from memory-plant mold. Monitoring provides means of detecting imperfect wire and permits fabrication of computer memory plane to be stopped prior to its insertion into mold.
Using half-round reinforcing wires, electrodeposited matrix metal readily fills spaces between wires in intimate contact with wires and without voids. Procedure combines advantages of electroforming with high-strength of commonly available wire to produce non-welded shell structures for high pressure uses.
A digital fly-by-wire flight control system has been installed in an F-8C test airplane and has undergone extensive ground and flight testing as part of an overall program to develop digital fly-by-wire technology. This is the first airplane to fly with a digital fly-by-wire system as its primary means of control and with no mechanical reversion capability. Forty-two test flights were made for a total flight time of 57 hours. Six pilots participated in the evaluation. This paper presents an overview of the digital fly-by-wire program and discusses some of the flight-test results.
The feasibility of using digital fly-by-wire systems to control aircraft was demonstrated by developing and flight testing a single channel system, which used Apollo hardware, in an F-8C test airplane. This is the first airplane to fly with a digital fly-by-wire system as its primary means of control and with no mechanical reversion capability. The development and flight test of a triplex digital fly-by-wire system, which will serve as an experimental prototype for future operational digital fly-by-wire systems, is underway.
The program was undertaken to characterize the performance of small diameter aluminum wire ultrasonically bonded to conductors commonly encountered in hybrid assemblies, and to recommend guidelines for improving this performance. Wire, 25.4, 38.1 and 50.8 um (1, 1.5 and 2 mil), was used with bonding metallization consisting of thick film gold, thin film gold and aluminum as well as conventional aluminum pads on semiconductor chips. The chief tool for evaluating the performance was the double bond pull test in conjunction with a 72 hour - 150 C heat soak and -65 C to +150 C thermal cycling. In practice the thermal cycling was found to have relatively little effect compared to the heat soak. Pull strength will decrease after heat soak as a result of annealing of the aluminum wire; when bonded to thick film gold, the pull strength decreased by about 50% (weakening of the bond interface was the major cause of the reduction). Bonds to thin film gold lost about 30 - 40% of their initial pull strenth; weakening of the wire itself at the bond heel was the predominant cause. Bonds to aluminum substrate metallization lost only about 22%. Bonds between thick and thin film gold substrate metallization and semiconductor chips substantiated the previous conclusions but also showed that in about 20 to 25% of the cases, bond interface failure occurred at the semiconductor chip.
The feasibility of using digital fly by wire systems to control aircraft was demonstrated by developing and flight testing a single channel system, which used Apollo hardware, in an F-8C test airplane. This is the first airplane to fly with a digital fly by wire system as its primary means of control and with no mechanical reversion capability. The development and flight test of a triplex digital fly by wire system, which will serve as an experimental prototype for future operational digital fly by wire systems, are underway.
The printed wiring board system provides automated techniques for the design of printed circuit boards and hybrid circuit boards. The system consists of four programs: (1) the preprocessor program combines user supplied data and pre-defined library data to produce the detailed circuit description data; (2) the placement program assigns circuit components to specific areas of the board in a manner that optimizes the total interconnection length of the circuit; (3) the organizer program assigns pin interconnections to specific board levels and determines the optimal order in which the router program should attempt to layout the paths connecting the pins; and (4) the router program determines the wire paths which are to be used to connect each input pin pair on the circuit board. This document is intended to serve as a programmer's reference manual for the printed wiring board system. A detailed description of the internal logic and flow of the printed wiring board programs is included.
Semi-automatic-wire labeling equipment installs heat-shrink identification sleeves on small-diameter wires for moderate-size production runs. Supply reel contains wire of desired diameter and is cut into lengths set on the measuring rolls. Required number of identification sleeves are slipped over wire, which is then placed through sleeve-releasing mechanism. Sleeves are shrunk at 350 degrees F in an infrared oven.
A hot wire anemometer is described which has a body formed of heat resistant metal such as an alloy high in nickel content which supports a probe wire disposed in a V groove in the body. The V groove contains a high temperature ceramic adhesive that partially encompasses the downstream side of the probe wire. Mechanical and electrical connection to the probe wire is achieved through conductive support rods that are constructed of the same high temperature metal, insulation between the body and the conductor rods being provided by a coating of an oxide of the same material which coating is formed in situ. The oxide coating insulates the conductor rods from the body, mechanically fixes the conductors within the body, and maintains its integrity at elevated temperatures.
Crimp-type connectors reduce assembly and disassembly time. With design, no switch preparation is necessary and socket contracts are crimped to wires inserted in module attached to back of toggle switch engaging pins inside module to make electrical connections. Wires are easily removed with standard detachment tool. Design can accommodate wires of any gage and as many terminals can be placed on switch as wire gage and switch dimensions will allow.
Negator spring control guides wire harness between movable and fixed structure. It prevents electrical wire harness loop from jamming or being severed as wire moves in response to changes in position of aircraft rudder. Spring-loaded coiled cable controls wire loop regardless of rudder movement.
Ten slicing demonstrations on a multi-wire slurry saw, made to evaluate the silicon ingot wafering capabilities, reveal that the present sawing capabilities can provide usable wafer area from an ingot 1.05m/kg (e.g. kerf width 0.135 mm and wafer thickness 0.265 mm). Satisfactory surface qualities and excellent yield of silicon wafers were found. One drawback is that the add-on cost of producing water from this saw, as presently used, is considerably higher than other systems being developed for the low-cost silicon solar array project (LSSA), primarily because the saw uses a large quantity of wire. The add-on cost can be significantly reduced by extending the wire life and/or by rescue of properly plated wire to restore the diameter.
This mechanism was developed to dispense a small diameter wire which serves as a receiving antenna for electric field measurements on an Earth orbiting satellite. The antenna is deployed radially from a spinning satellite. A brushless dc motor drives a storage spool to dispense the wire at a controlled rate. Centrifugal force, acting on a mass attached to the end of the wire, keeps the wire in the radial position. The mechanism design, testing, and performance characteristics are discussed. Finally, operational data of the mechanism while in orbit are presented.
An investigation was conducted to discern the effects of centrifugal and Coriolis forces on a rotating hot-wire. The probe was calibrated in a wind tunnel as well as in a rotating mode. The effect of rotation was found to be negligibly small. A small change in cold resistance (1.5%) was observed in the rotating wire. The rotation seems to have a negligible effect on the fluid mechanics, heat transfer and material characteristics of the wire. This is a significant conclusion in view of the potential application of the hot-wire probe in a rotating passage (such as turbomachinery).
Long wire bundles twist into uniform spiral harnesses with help of simple apparatus. Wires pass through spacers and through hand-held tool with hole for each wire. Ends are attached to low speed bench motor. As motor turns, operator moves hand tool away forming smooth twists in wires between motor and tool. Technique produces harnesses that generate less radio-frequency interference than do irregularly twisted cables.
In an attempt to reduce fabrication time and costs, Wire Electrical Discharge Machine (Wire EDM) method was investigated as tool for fabricating matched blade roots and disk slots. Eight high-strength nickel-base superalloys were used. Computer-controlled Wire EDM technique provided high quality surfaces with excellent dimensional tolerances. Wire EDM method offers potential for substantial reductions in fabrication costs for "hard to machine" alloys and electrically conductive materials in specific high-precision applications.
Compact terminal box provides access to complex wiring harnesses for testing. Box accommodates more than twice as many wires as previous boxes. Box takes in wires via cable connectors and distributes them to contacts on box face. Instead of separate insulated jacks in metal face panel, box uses pairs of small military-standard metal sockets in precision-drilled plastic panel. Shorting plug provides continuity for wires when not being tested.