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All sourcesNASA NTRSDOE OSTI
DOE OSTI2020

Materials Data on Cu3OF5 by Materials Project

Cu3OF5 crystallizes in the triclinic P-1 space group. The structure is three-dimensional. there are four inequivalent Cu+2.33+ sites. In the first Cu+2.33+ site, Cu+2.33+ is bonded to one O2- and five F1- atoms to form CuOF5 octahedra that share corners with eight CuO2F4 octahedra and edges with two CuOF5 octahedra. The corner-sharing octahedra tilt angles range from 43–67°. The Cu–O bond length is 1.86 Å. There are a spread of Cu–F bond distances ranging from 1.98–2.27 Å. In the second Cu+2.33+ site, Cu+2.33+ is bonded to two equivalent O2- and four F1- atoms to form CuO2F4 octahedra that share corners with eight CuOF5 octahedra and edges with two equivalent CuF6 octahedra. The corner-sharing octahedra tilt angles range from 43–58°. Both Cu–O bond lengths are 1.88 Å. There are two shorter (1.95 Å) and two longer (2.40 Å) Cu–F bond lengths. In the third Cu+2.33+ site, Cu+2.33+ is bonded to six F1- atoms to form CuF6 octahedra that share corners with eight CuOF5 octahedra and edges with two CuO2F4 octahedra. The corner-sharing octahedra tilt angles range from 43–67°. There are a spread of Cu–F bond distances ranging from 1.89–2.35 Å. In the fourth Cu+2.33+ site, Cu+2.33+ is bonded to two equivalent O2- and four F1- atoms to form CuO2F4 octahedra that share corners with eight CuO2F4 octahedra and edges with two equivalent CuOF5 octahedra. The corner-sharing octahedra tilt angles range from 44–52°. Both Cu–O bond lengths are 2.06 Å. There is two shorter (1.97 Å) and two longer (1.99 Å) Cu–F bond length. O2- is bonded in a distorted trigonal planar geometry to three Cu+2.33+ atoms. There are five inequivalent F1- sites. In the first F1- site, F1- is bonded in a distorted trigonal planar geometry to three Cu+2.33+ atoms. In the second F1- site, F1- is bonded in a 3-coordinate geometry to three Cu+2.33+ atoms. In the third F1- site, F1- is bonded in a 3-coordinate geometry to three Cu+2.33+ atoms. In the fourth F1- site, F1- is bonded in a 3-coordinate geometry to three Cu+2.33+ atoms. In the fifth F1- site, F1- is bonded in a 3-coordinate geometry to three Cu+2.33+ atoms.

36 MATERIALS SCIENCE↗
DOE OSTI2025

Boosting Hydrogenation of CO 2 Using Cationic Cu Atomically Dispersed on 2D γ‐Al 2 O 3 Nanosheets

The continuous development of novel catalytic approaches is crucial for advancing efficient CO 2 hydrogenation processes. Drawing inspiration from single-atom catalysis and 2D materials, we designed a new 2D single-atom catalyst with excellent thermal stability by thermally treating Cu-adsorbed γ-AlOOH nanosheets, which yielded a Cu/γ-Al 2 O 3 catalyst with high activity in the hydrogenation of CO 2 -yielding methanol (CH 3 OH), dimethyl ether (DME), and CO as products. The active Cu sites are monodispersed and highly stable due to their cationic oxidation state and their substitution for pentacoordinated aluminum (Al P ) sites on particle surfaces. This study demonstrates an efficient approach for achieving a high CO 2 hydrogenation rate (30.45 mol mol −1 h −1 ) using a catalyst system that lacks metallic Cu centers, traditionally considered essential for H₂ dissociation, and employs what was previously thought to be an inert metal oxide (γ-Al 2 O 3 ) for CO and CH 3 OH production. Ongoing mechanistic studies aim to elucidate the synergy between cationic Cu single atoms and γ-Al 2 O 3 , a Lewis acid support, in facilitating hydrogen (H 2 ) activation and methanol formation.

2D catalyst↗
DOE OSTI2020

Diffraction gratings with two-orders-of-magnitude-enhanced dispersion rates for sub-meV resolution soft X-ray spectroscopy

Diffraction gratings with large angular dispersion rates are central to obtaining high spectral resolution in grating spectrometers operating over a broad spectral range from infrared to soft X-ray domains. The greatest challenge is of course to achieve large dispersion rates in the short-wavelength X-ray domain. Here it is shown that crystals in non-coplanar asymmetric X-ray Bragg diffraction can function as high-reflectance broadband soft X-ray diffraction gratings with dispersion rates that are at least two orders of magnitude larger than those that are possible with state-of-the-art man-made gratings. Additionally, this opens new opportunities to design and implement soft X-ray resonant inelastic scattering (RIXS) spectrometers with spectral resolutions that are up to two orders of magnitude higher than what is currently possible, to further advance a very dynamic field of RIXS spectroscopy, and to make it competitive with inelastic neutron scattering. Examples of large-dispersion-rate crystal diffraction gratings operating near the 930 eV L 3 absorption edge in Cu and of the 2.838 keV L 3 -edge in Ru are presented.

73 NUCLEAR PHYSICS AND RADIATION PHYSICS↗
NASA NTRS1990

Electronic state and superconductivity of YBa2Cu3-xO7-y (M=Al,Zn and Sn) systems

A series of YBa2Cu(3-x)MxO(7-y) (M=Al,Zn and Sn) single phase samples were prepared, and the measurements of the crystal structure, oxygen content, electric resistivity, thermoelectric power, Mossbauer spectrum, XPS and superconductivity were performed. The experimental results of X ray powder diffraction, Mossbauer spectrum and oxygen content show that the Zn(2+) and the Al(3+) occupy the Cu(2) site in Cu-O planes and the Cu(1) site in Cu-O chains respectively, but the Sn(4+) occupies both the Cu(1) sites. As regards the properties in superconducting state, both the Zn(2+) and the Al(3+) depress T(sub c) strongly, but the Sn(4+) does not. As for the electronic transport properties in normal state, the system doped by Al(3+) displays a rapid increase of resistivity and some electron localization-like effects, and the thermoelectric power enhances obviously; the series contained Zn(2+) almost shows no changes of electric resistivity but the sign of the thermoelectric power is reversed. Other results are given and briefly discussed.

Zhao, Y.↗
DOE OSTI2020

Materials Data on Cu39S20 by Materials Project

Cu39S20 crystallizes in the triclinic P1 space group. The structure is three-dimensional. there are thirty-nine inequivalent Cu+1.03+ sites. In the first Cu+1.03+ site, Cu+1.03+ is bonded to one Cu+1.03+ and four S2- atoms to form distorted CuCuS4 tetrahedra that share corners with six CuCu2S4 tetrahedra, edges with two CuCu2S4 tetrahedra, and a faceface with one CuS6 octahedra. The Cu–Cu bond length is 2.45 Å. There are a spread of Cu–S bond distances ranging from 2.31–2.48 Å. In the second Cu+1.03+ site, Cu+1.03+ is bonded in a distorted trigonal planar geometry to three S2- atoms. There are one shorter (2.30 Å) and two longer (2.36 Å) Cu–S bond lengths. In the third Cu+1.03+ site, Cu+1.03+ is bonded to two Cu+1.03+ and four S2- atoms to form distorted CuCu2S4 tetrahedra that share a cornercorner with one CuS6 octahedra, corners with two CuCuS4 tetrahedra, and edges with five CuCu2S4 tetrahedra. The corner-sharing octahedral tilt angles are 53°. There are one shorter (2.49 Å) and one longer (2.50 Å) Cu–Cu bond lengths. There are a spread of Cu–S bond distances ranging from 2.36–2.48 Å. In the fourth Cu+1.03+ site, Cu+1.03+ is bonded in a 6-coordinate geometry to four Cu+1.03+ and six S2- atoms. There are two shorter (2.52 Å) and one longer (2.53 Å) Cu–Cu bond lengths. There are a spread of Cu–S bond distances ranging from 2.60–2.93 Å. In the fifth Cu+1.03+ site, Cu+1.03+ is bonded to two Cu+1.03+ and four S2- atoms to form distorted CuCu2S4 tetrahedra that share a cornercorner with one CuS6 octahedra, corners with three CuCuS4 tetrahedra, and edges with five CuCuS4 tetrahedra. The corner-sharing octahedral tilt angles are 51°. The Cu–Cu bond length is 2.46 Å. There are a spread of Cu–S bond distances ranging from 2.36–2.50 Å. In the sixth Cu+1.03+ site, Cu+1.03+ is bonded to two Cu+1.03+ and four S2- atoms to form distorted CuCu2S4 tetrahedra that share a cornercorner with one CuS6 octahedra, corners with two CuCuS4 tetrahedra, and edges with six CuCu2S4 tetrahedra. The corner-sharing octahedral tilt angles are 52°. The Cu–Cu bond length is 2.50 Å. There are a spread of Cu–S bond distances ranging from 2.37–2.48 Å. In the seventh Cu+1.03+ site, Cu+1.03+ is bonded in a 6-coordinate geometry to four Cu+1.03+ and six S2- atoms. There are one shorter (2.54 Å) and one longer (2.56 Å) Cu–Cu bond lengths. There are a spread of Cu–S bond distances ranging from 2.64–2.89 Å. In the eighth Cu+1.03+ site, Cu+1.03+ is bonded in a 3-coordinate geometry to five S2- atoms. There are a spread of Cu–S bond distances ranging from 2.40–3.07 Å. In the ninth Cu+1.03+ site, Cu+1.03+ is bonded in a 4-coordinate geometry to one Cu+1.03+ and four S2- atoms. There are a spread of Cu–S bond distances ranging from 2.28–2.51 Å. In the tenth Cu+1.03+ site, Cu+1.03+ is bonded to one Cu+1.03+ and four S2- atoms to form distorted CuCuS4 tetrahedra that share corners with five CuCuS4 tetrahedra, edges with two CuCu2S4 tetrahedra, and a faceface with one CuS6 octahedra. The Cu–Cu bond length is 2.45 Å. There are a spread of Cu–S bond distances ranging from 2.30–2.49 Å. In the eleventh Cu+1.03+ site, Cu+1.03+ is bonded in a 3-coordinate geometry to four S2- atoms. There are a spread of Cu–S bond distances ranging from 2.38–3.05 Å. In the twelfth Cu+1.03+ site, Cu+1.03+ is bonded in a 1-coordinate geometry to three S2- atoms. There are a spread of Cu–S bond distances ranging from 2.39–2.67 Å. In the thirteenth Cu+1.03+ site, Cu+1.03+ is bonded to two Cu+1.03+ and four S2- atoms to form distorted CuCu2S4 tetrahedra that share corners with two CuCu2S4 tetrahedra and edges with six CuCuS4 tetrahedra. There are one shorter (2.46 Å) and one longer (2.51 Å) Cu–Cu bond lengths. There are a spread of Cu–S bond distances ranging from 2.28–2.54 Å. In the fourteenth Cu+1.03+ site, Cu+1.03+ is bonded in a 4-coordinate geometry to one Cu+1.03+ and four S2- atoms. The Cu–Cu bond length is 2.56 Å. There are a spread of Cu–S bond distances ranging from 2.29–2.55 Å. In the fifteenth Cu+1.03+ site, Cu+1.03+ is bonded in a 5-coordinate geometry to four Cu+1.03+ and six S2- atoms. There are one shorter (2.45 Å) and one longer (2.57 Å) Cu–Cu bond lengths. There are a spread of Cu–S bond distances ranging from 2.61–2.97 Å. In the sixteenth Cu+1.03+ site, Cu+1.03+ is bonded in a 2-coordinate geometry to three S2- atoms. There are a spread of Cu–S bond distances ranging from 2.35–2.69 Å. In the seventeenth Cu+1.03+ site, Cu+1.03+ is bonded to one Cu+1.03+ and four S2- atoms to form distorted CuCuS4 tetrahedra that share corners with five CuCuS4 tetrahedra, edges with three CuCuS4 tetrahedra, and a faceface with one CuS6 octahedra. There are a spread of Cu–S bond distances ranging from 2.30–2.46 Å. In the eighteenth Cu+1.03+ site, Cu+1.03+ is bonded in a distorted trigonal planar geometry to three S2- atoms. There are one shorter (2.30 Å) and two longer (2.36 Å) Cu–S bond lengths. In the nineteenth Cu+1.03+ site, Cu+1.03+ is bonded to six S2- atoms to form distorted CuS6 octahedra that share corners with five CuCu2S4 tetrahedra and faces with four CuCuS4 tetrahedra. There are a spread of Cu–S bond distances ranging from 2.62–2.85 Å. In the twentieth Cu+1.03+ site, Cu+1.03+ is bonded in a 3-coordinate geometry to four S2- atoms. There are a spread of Cu–S bond distances ranging from 2.45–2.91 Å. In the twenty-first Cu+1.03+ site, Cu+1.03+ is bonded to one Cu+1.03+ and four S2- atoms to form distorted CuCuS4 tetrahedra that share corners with six CuCuS4 tetrahedra, edges with two CuCu2S4 tetrahedra, and a faceface with one CuS6 octahedra. The Cu–Cu bond length is 2.44 Å. There are a spread of Cu–S bond distances ranging from 2.31–2.47 Å. In the twenty-second Cu+1.03+ site, Cu+1.03+ is bonded to two Cu+1.03+ and four S2- atoms to form a mixture of distorted corner and edge-sharing CuCu2S4 tetrahedra. There are one shorter (2.44 Å) and one longer (2.52 Å) Cu–Cu bond lengths. There are a spread of Cu–S bond distances ranging from 2.29–2.54 Å. In the twenty-third Cu+1.03+ site, Cu+1.03+ is bonded in a 5-coordinate geometry to four Cu+1.03+ and six S2- atoms. The Cu–Cu bond length is 2.53 Å. There are a spread of Cu–S bond distances ranging from 2.62–2.96 Å. In the twenty-fourth Cu+1.03+ site, Cu+1.03+ is bonded in a 10-coordinate geometry to four Cu+1.03+ and six S2- atoms. There are one shorter (2.44 Å) and one longer (2.46 Å) Cu–Cu bond lengths. There are a spread of Cu–S bond distances ranging from 2.66–2.83 Å. In the twenty-fifth Cu+1.03+ site, Cu+1.03+ is bonded to two Cu+1.03+ and four S2- atoms to form distorted CuCu2S4 tetrahedra that share corners with three CuCuS4 tetrahedra and edges with five CuCu2S4 tetrahedra. There are a spread of Cu–S bond distances ranging from 2.29–2.55 Å. In the twenty-sixth Cu+1.03+ site, Cu+1.03+ is bonded to two Cu+1.03+ and four S2- atoms to form distorted CuCu2S4 tetrahedra that share corners with two CuCu2S4 tetrahedra and edges with five CuCuS4 tetrahedra. There are a spread of Cu–S bond distances ranging from 2.29–2.55 Å. In the twenty-seventh Cu+1.03+ site, Cu+1.03+ is bonded in a 3-coordinate geometry to four S2- atoms. There are a spread of Cu–S bond distances ranging from 2.38–3.12 Å. In the twenty-eighth Cu+1.03+ site, Cu+1.03+ is bonded in a 3-coordinate geometry to two Cu+1.03+ and five S2- atoms. There are one shorter (2.41 Å) and one longer (2.43 Å) Cu–Cu bond lengths. There are a spread of Cu–S bond distances ranging from 2.43–2.99 Å. In the twenty-ninth Cu+1.03+ site, Cu+1.03+ is bonded in a 4-coordinate geometry to two Cu+1.03+ and four S2- atoms. The Cu–Cu bond length is 2.56 Å. There are a spread of Cu–S bond distances ranging from 2.28–2.51 Å. In the thirtieth Cu+1.03+ site, Cu+1.03+ is bonded in a distorted trigonal planar geometry to one Cu+1.03+ and three S2- atoms. There are a spread of Cu–S bond distances ranging from 2.31–2.37 Å. In the thirty-first Cu+1.03+ site, Cu+1.03+ is bonded in a 3-coordinate geometry to four Cu+1.03+ and six S2- atoms. The Cu–Cu bond length is 2.48 Å. There are a spread of Cu–S bond distances ranging from 2.58–2.91 Å. In the thirty-second Cu+1.03+ site, Cu+1.03+ is bonded in a 2-coordinate geometry to three S2- atoms. There are a spread of Cu–S bond distances ranging from 2.32–2.70 Å. In the thirty-third Cu+1.03+ site, Cu+1.03+ is bonded to two Cu+1.03+ and four S2- atoms to form distorted CuCu2S4 tetrahedra that share a cornercorner with one CuS6 octahedra, corners with three CuCuS4 tetrahedra, and edges with five CuCu2S4 tetrahedra. The corner-sharing octahedral tilt angles are 53°. There are a spread of Cu–S bond distances ranging from 2.37–2.50 Å. In the thirty-fourth Cu+1.03+ site, Cu+1.03+ is bonded in a 3-coordinate geometry to four S2- atoms. There are a spread of Cu–S bond distances ranging from 2.37–3.01 Å. In the thirty-fifth Cu+1.03+ site, Cu+1.03+ is bonded to one Cu+1.03+ and four S2- atoms to form distorted CuCuS4 tetrahedra that share a cornercorner with one CuS6 octahedra, corners with six CuCuS4 tetrahedra, and edges with three CuCuS4 tetrahedra. The corner-sharing octahedral tilt angles are 50°. There are a spread of Cu–S bond distances ranging from 2.30–2.53 Å. In the thirty-sixth Cu+1.03+ site, Cu+1.03+ is bonded in a 1-coordinate geometry to three S2- atoms. There are a spread of Cu–S bond distances ranging from 2.36–2.68 Å. In the thirty-seventh Cu+1.03+ site, Cu+1.03+ is bonded in a distorted trigonal planar geometry to three S2- atoms. There are a spread of Cu–S bond distances ranging from 2.30–2.36 Å. In the thirty-eighth Cu+1.03+ site, Cu+1.03+ is bonded in a 3-coordinate geometry to five S2- atoms. There are a spread of Cu–S bond distances ranging from 2.39–3.11 Å. In the thirty-ninth Cu+1.03+ site, Cu+1.03+ is bonded in a 2-coordinate geometry to four S2- atoms. There are a spread of Cu–S bond distances ranging from 2.39–3.07 Å. There are twenty inequivalent S2- sites. In the first S2- site, S2- is bonded in a 8-coordinate geometry to eight Cu+1.03+ atoms. In the second S2- site, S2- is bonded in a 9-coordinate geometry to nine Cu+1.03+ atoms. In the third S2- site, S2- is bonded in a 9-coordinate geometry to nine Cu+1.03+ atoms. In the fourth S2- site, S2- is bonded in a 8-coordinate geometry to eight Cu+1.03+ atoms. In the fifth S2- site, S2- is bonded in a 4-coordinate geometry to seven Cu+1.03+ atoms. In the sixth S2- site, S2- is bonded in a 9-coordinate geometry to nine Cu+1.03+ atoms. In the seventh S2- site, S2- is bonded in a 4-coordinate geometry to ten Cu+1.03+ atoms. In the eighth S2- site, S2- is bonded in a 4-coordinate geometry to six Cu+1.03+ atoms. In the ninth S2- site, S2- is bonded in a 8-coordinate geometry to eight Cu+1.03+ atoms. In the tenth S2- site, S2- is bonded in a 4-coordinate geometry to six Cu+1.03+ atoms. In the eleventh S2- site, S2- is bonded in a 4-coordinate geometry to ten Cu+1.03+ atoms. In the twelfth S2- site, S2- is bonded in a 9-coordinate geometry to nine Cu+1.03+ atoms. In the thirteenth S2- site, S2- is bonded in a 4-coordinate geometry to seven Cu+1.03+ atoms. In the fourteenth S2- site, S2- is bonded in a 4-coordinate geometry to six Cu+1.03+ atoms. In the fifteenth S2- site, S2- is bonded in a 9-coordinate geometry to nine Cu+1.03+ atoms. In the sixteenth S2- site, S2- is bonded in a 4-coordinate geometry to seven Cu+1.03+ atoms. In the seventeenth S2- site, S2- is bonded in a 9-coordinate geometry to nine Cu+1.03+ atoms. In the eighteenth S2- site, S2- is bonded in a 9-coordinate geometry to nine Cu+1.03+ atoms. In the nineteenth S2- site, S2- is bonded in a 10-coordinate geometry to ten Cu+1.03+ atoms. In the twentieth S2- site, S2- is bonded in a 9-coordinate geometry to nine Cu+1.03+ atoms.

36 MATERIALS SCIENCE↗
DOE OSTI2020

Materials Data on Tl8Cu4F11 by Materials Project

Cu4Tl8F11 crystallizes in the triclinic P1 space group. The structure is three-dimensional. there are eight inequivalent Cu sites. In the first Cu site, Cu is bonded in a 3-coordinate geometry to three F atoms. There are a spread of Cu–F bond distances ranging from 2.03–2.33 Å. In the second Cu site, Cu is bonded in a distorted T-shaped geometry to three F atoms. There are a spread of Cu–F bond distances ranging from 1.84–2.46 Å. In the third Cu site, Cu is bonded in a linear geometry to two F atoms. There is one shorter (1.84 Å) and one longer (1.86 Å) Cu–F bond length. In the fourth Cu site, Cu is bonded in a 3-coordinate geometry to three F atoms. There are a spread of Cu–F bond distances ranging from 1.87–2.22 Å. In the fifth Cu site, Cu is bonded in a distorted L-shaped geometry to one Tl and two F atoms. The Cu–Tl bond length is 2.99 Å. There are one shorter (2.04 Å) and one longer (2.28 Å) Cu–F bond lengths. In the sixth Cu site, Cu is bonded in a 2-coordinate geometry to three F atoms. There are a spread of Cu–F bond distances ranging from 1.87–2.50 Å. In the seventh Cu site, Cu is bonded in a linear geometry to two F atoms. There is one shorter (1.85 Å) and one longer (1.86 Å) Cu–F bond length. In the eighth Cu site, Cu is bonded in a linear geometry to three F atoms. There are a spread of Cu–F bond distances ranging from 1.84–2.66 Å. There are sixteen inequivalent Tl sites. In the first Tl site, Tl is bonded in a distorted single-bond geometry to one F atom. The Tl–F bond length is 2.61 Å. In the second Tl site, Tl is bonded in a 1-coordinate geometry to four F atoms. There are a spread of Tl–F bond distances ranging from 2.57–2.78 Å. In the third Tl site, Tl is bonded in a distorted L-shaped geometry to two F atoms. There are one shorter (2.46 Å) and one longer (2.66 Å) Tl–F bond lengths. In the fourth Tl site, Tl is bonded in a 1-coordinate geometry to one F atom. The Tl–F bond length is 2.54 Å. In the fifth Tl site, Tl is bonded in a 2-coordinate geometry to three F atoms. There are a spread of Tl–F bond distances ranging from 2.42–2.72 Å. In the sixth Tl site, Tl is bonded in a 3-coordinate geometry to three F atoms. There are a spread of Tl–F bond distances ranging from 2.68–2.73 Å. In the seventh Tl site, Tl is bonded in a 1-coordinate geometry to two F atoms. There are one shorter (2.41 Å) and one longer (2.70 Å) Tl–F bond lengths. In the eighth Tl site, Tl is bonded in a distorted single-bond geometry to one F atom. The Tl–F bond length is 2.64 Å. In the ninth Tl site, Tl is bonded in a 4-coordinate geometry to one Cu and three F atoms. There are a spread of Tl–F bond distances ranging from 2.73–2.79 Å. In the tenth Tl site, Tl is bonded in a 3-coordinate geometry to three F atoms. There are a spread of Tl–F bond distances ranging from 2.55–2.68 Å. In the eleventh Tl site, Tl is bonded in a single-bond geometry to one F atom. The Tl–F bond length is 2.52 Å. In the twelfth Tl site, Tl is bonded in a distorted trigonal non-coplanar geometry to three F atoms. There are a spread of Tl–F bond distances ranging from 2.57–2.67 Å. In the thirteenth Tl site, Tl is bonded in a 1-coordinate geometry to five F atoms. There are a spread of Tl–F bond distances ranging from 2.61–2.76 Å. In the fourteenth Tl site, Tl is bonded in a 1-coordinate geometry to two F atoms. There are one shorter (2.45 Å) and one longer (2.69 Å) Tl–F bond lengths. In the fifteenth Tl site, Tl is bonded in a single-bond geometry to one F atom. The Tl–F bond length is 2.47 Å. In the sixteenth Tl site, Tl is bonded in a 4-coordinate geometry to four F atoms. There are a spread of Tl–F bond distances ranging from 2.63–2.74 Å. There are twenty-two inequivalent F sites. In the first F site, F is bonded in a bent 120 degrees geometry to two Cu atoms. In the second F site, F is bonded in a 2-coordinate geometry to three Tl atoms. In the third F site, F is bonded in a distorted single-bond geometry to one Cu and two equivalent Tl atoms. In the fourth F site, F is bonded in a distorted single-bond geometry to one Cu and one Tl atom. In the fifth F site, F is bonded in a single-bond geometry to one Cu atom. In the sixth F site, F is bonded in a 3-coordinate geometry to two Cu and one Tl atom. In the seventh F site, F is bonded in a 3-coordinate geometry to one Cu and two Tl atoms. In the eighth F site, F is bonded in a single-bond geometry to one Cu and two equivalent Tl atoms. In the ninth F site, F is bonded in a 1-coordinate geometry to one Cu and two Tl atoms. In the tenth F site, F is bonded in a water-like geometry to two Tl atoms. In the eleventh F site, F is bonded in a distorted rectangular see-saw-like geometry to one Cu and three Tl atoms. In the twelfth F site, F is bonded in a 4-coordinate geometry to one Cu and three Tl atoms. In the thirteenth F site, F is bonded in a 1-coordinate geometry to one Cu and two Tl atoms. In the fourteenth F site, F is bonded in a distorted trigonal planar geometry to three Tl atoms. In the fifteenth F site, F is bonded in a 3-coordinate geometry to one Cu and two Tl atoms. In the sixteenth F site, F is bonded in a distorted single-bond geometry to one Cu and one Tl atom. In the seventeenth F site, F is bonded in a 3-coordinate geometry to one Cu and two Tl atoms. In the eighteenth F site, F is bonded in a distorted bent 120 degrees geometry to one Cu and one Tl atom. In the nineteenth F site, F is bonded in a distorted single-bond geometry to one Cu and two equivalent Tl atoms. In the twentieth F site, F is bonded in a distorted single-bond geometry to one Cu and one Tl atom. In the twenty-first F site, F is bonded in a 3-coordinate geometry to one Cu and two Tl atoms. In the twenty-second F site, F is bonded in a 2-coordinate geometry to one Cu and two Tl atoms.

36 MATERIALS SCIENCE↗
DOE OSTI2020

In Situ Transmission Electron Microscopy Study of Conductive Filament Formation in Copper Oxides

The structural and electrical property changes of two types of copper oxides (CuO and Cu 2 O) under voltage bias are studied with in situ transmission electron microscopy (TEM). The phases of different materials are confirmed with electron diffraction. In both types of oxides, dynamic conductive path formation and dissolution are observed. The decrease in resistance of CuO film is found to be accompanied with the formation of Cu 4 O 3 phase where the electric field strength is highest. We also find that the decrease in resistivity of Cu 2 O film is more extensive and occurs in an area depending on the level of current compliance. In conclusion, the physical mechanisms responsible for the observations and their implications for the formation of conducting regions in copper oxide-based memristors are discussed.

36 MATERIALS SCIENCE↗
DOE OSTI2020

Materials Data on Cu6OF11 by Materials Project

Cu6OF11 crystallizes in the triclinic P1 space group. The structure is three-dimensional. there are six inequivalent Cu+2.17+ sites. In the first Cu+2.17+ site, Cu+2.17+ is bonded to one O2- and five F1- atoms to form a mixture of edge and corner-sharing CuOF5 octahedra. The corner-sharing octahedra tilt angles range from 46–57°. The Cu–O bond length is 1.85 Å. There are a spread of Cu–F bond distances ranging from 1.94–2.37 Å. In the second Cu+2.17+ site, Cu+2.17+ is bonded to six F1- atoms to form a mixture of edge and corner-sharing CuF6 octahedra. The corner-sharing octahedra tilt angles range from 46–58°. There are a spread of Cu–F bond distances ranging from 1.92–2.33 Å. In the third Cu+2.17+ site, Cu+2.17+ is bonded to six F1- atoms to form CuF6 octahedra that share corners with eight CuF6 octahedra and edges with two CuOF5 octahedra. The corner-sharing octahedra tilt angles range from 48–57°. There are a spread of Cu–F bond distances ranging from 1.94–2.31 Å. In the fourth Cu+2.17+ site, Cu+2.17+ is bonded to one O2- and five F1- atoms to form CuOF5 octahedra that share corners with eight CuOF5 octahedra and edges with two CuF6 octahedra. The corner-sharing octahedra tilt angles range from 42–54°. The Cu–O bond length is 1.84 Å. There are a spread of Cu–F bond distances ranging from 1.94–2.37 Å. In the fifth Cu+2.17+ site, Cu+2.17+ is bonded to six F1- atoms to form CuF6 octahedra that share corners with eight CuOF5 octahedra and edges with two CuF6 octahedra. The corner-sharing octahedra tilt angles range from 44–57°. There are a spread of Cu–F bond distances ranging from 1.92–2.33 Å. In the sixth Cu+2.17+ site, Cu+2.17+ is bonded to one O2- and five F1- atoms to form distorted CuOF5 octahedra that share corners with eight CuF6 octahedra and edges with two CuOF5 octahedra. The corner-sharing octahedra tilt angles range from 42–58°. The Cu–O bond length is 2.04 Å. There are a spread of Cu–F bond distances ranging from 1.94–2.40 Å. O2- is bonded in a distorted trigonal planar geometry to three Cu+2.17+ atoms. There are eleven inequivalent F1- sites. In the first F1- site, F1- is bonded in a 3-coordinate geometry to three Cu+2.17+ atoms. In the second F1- site, F1- is bonded in a 3-coordinate geometry to three Cu+2.17+ atoms. In the third F1- site, F1- is bonded in a distorted trigonal planar geometry to three Cu+2.17+ atoms. In the fourth F1- site, F1- is bonded in a distorted trigonal planar geometry to three Cu+2.17+ atoms. In the fifth F1- site, F1- is bonded in a 3-coordinate geometry to three Cu+2.17+ atoms. In the sixth F1- site, F1- is bonded in a distorted trigonal planar geometry to three Cu+2.17+ atoms. In the seventh F1- site, F1- is bonded in a distorted trigonal planar geometry to three Cu+2.17+ atoms. In the eighth F1- site, F1- is bonded in a distorted trigonal planar geometry to three Cu+2.17+ atoms. In the ninth F1- site, F1- is bonded in a 3-coordinate geometry to three Cu+2.17+ atoms. In the tenth F1- site, F1- is bonded in a 3-coordinate geometry to three Cu+2.17+ atoms. In the eleventh F1- site, F1- is bonded in a 3-coordinate geometry to three Cu+2.17+ atoms.

36 MATERIALS SCIENCE↗
DOE OSTI2025

Hybrid Doping Strategy with High‐Entropy Cu/Fe Surface Modification and Zr Bulk Incorporation for Ni‐Rich Cathodes

A hybrid doping strategy combining Zr 4+ bulk doping with high-entropy Cu 2+ /Fe 3+ surface doping is developed to enhance the structural and interfacial stability of Ni-rich layered oxide cathodes. Cu and Fe are selectively introduced at the particle surface via a surface-selective ion-exchange process, forming a ≈15 nm Fe-rich layer while preserving the layered framework. Compared to the pristine cathode, the hybrid sample exhibits significantly improved electrochemical performance in both half-cell and full-cell configurations. In half-cells, the hybrid retains 88.5% and 90.2% after 100 cycles at 1C under 4.6 and 4.5 V, respectively. During high-voltage full-cell cycling, the hybrid cathode maintains over 80% capacity retention, whereas the pristine counterpart retains less than 10% under identical conditions over the same cycling period. XPS, EELS, and DEMS analyses confirm improved oxygen retention, suppressed gas evolution, and stable surface chemistry, while DFT calculations indicate enhanced Me–O bonding in the selected Fe 0.75 Cu 0.25 (Mn 1/16 Co 2/16 Ni 13/16 )O 2 surface composition, which is identified through DFT-calculated mixing energy reaching a minimum at this ratio, indicating the most thermodynamically favorable configuration. In conclusion, these results demonstrate the effectiveness of this hybrid doping strategy in mitigating coupled degradation pathways in Ni-rich cathodes.

15 GEOTHERMAL ENERGY↗
DOE OSTI2020

Insights into the methanol synthesis mechanism via CO 2 hydrogenation over Cu-ZnO-ZrO2 catalysts: Effects of surfactant/Cu-Zn-Zr molar ratio

In this study, we evaluated aspects of the CO 2 hydrogenation mechanism, correlating structure-activity relationships of Cu-ZnO-ZrO 2 catalysts prepared by one-pot surfactant-assisted co-precipitation with different surfactant ratios. Identifying the CO 2 hydrogenation pathway intermediates is key to controlling the reaction selectivity. Experimental evidence shows that the CO 2 is dissociating into CO* and O* onto the surface of the Cu-ZnO-ZrO 2 catalyst. The adsorption and dissociation of CO2 were evidenced by a combination of in situ ambient-pressure X-ray Photoelectron Spectroscopy (AP-XPS) and Fourier Transform Infrared Spectroscopy (FTIR) with a transmission cell. AP-XPS showed that the catalysts are composed of a Cu 2+ , Zr 3+ , and Zr 4+ mixture and two kinds of Zn 2+ species. After the H 2 reduction process, only Cu 2+ was reduced to Cu0. The Zn and Zr species were oxidized by the dissociated O* species. In situ transmission FTIR showed that CO was adsorbed onto the Cu+/0 sites. The catalyst with the higher surfactant molar ratio exhibited the highest CO 2 conversion close to the equilibrium conversion, as well as a good methanol formation rate.

36 MATERIALS SCIENCE↗
DOE OSTI2022

Selective catalytic reduction of NOx with NH 3 over Ce-Mn oxide and Cu-SSZ-13 composite catalysts – Low temperature enhancement

A composite catalyst comprised of ceria-manganese oxide and Cu-SSZ-13 components represents a potential solution for improving selective catalytic reduction (SCR) of NOx by ammonia. Here, clarity is provided to the pathway of promotion on these catalysts at low temperatures (< 200 °C), and it is shown that improved performance comes solely from interaction of the oxide phase with Brønsted acid bound NH 3 . We demonstrate that at low temperatures, the catalytic components interact via oxide-derived nitrites/nitrite-precursors (e.g., HONO, N 2 O 3 ) reacting with Brønsted acid bound NH3 from the zeolite. Then, only at elevated temperatures is the influence of the oxide phase on Cu redox in the Cu-SSZ-13 observed. Furthermore, we show how the oxide component has the great potential to circumvent NH 4 NO 3 inhibition on Cu-SSZ-13 in the composite catalysts at low temperatures by bypassing the formation of nitrates from NO 2 disproportionation, thus providing a practical solution to improving low temperature SCR reactivity.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2020

Effects on Human Non-Small Lung Cancer Cell growth of Cu(II), Au(III) and Re(I) Complexes Containing N-donor Pyridyl Ligands: A Senior Undergraduate Research Project

Hands-on synthetic laboratory experiences are critically important for undergraduate chemistry majors. A senior undergraduate research experience at the College of Wooster is presented in the current work. The inorganic complexes [Cu(phenan) 2 (NO 3 ) 2 ] (1; phenan = phenanthridine) and [Au(phenan)Cl 3 ](2) were prepared by metallation of the phenan ligand in a 1:1 CH 3 OH/CH 2 Cl 2 mixture at room temperature. Complex 1 is a new inorganic coordination compound. The structures were confirmed by X-ray crystallography. Complex 1 reveals a distorted octahedral geometry around the central Cu (II) metal ion. In complex 2, the Au(III) atom exhibits a square planar geometry. In addition, we investigated [Cu(dmeobpy)(H 2 O) 2 ][NO 3 ] 2 (3; dmeobpy = 4,4’-dimethoxy-2,2’-bipyridine), [Cu(bap)(NO 3 ) 2 ](4; bap = 2,6-bis(azaindole)pyridine) and [Re(CO) 3 (dmeobpy)Cl] (5). The cytoxocities of 1-5, phenan, dmeobpy, bap and cisplatin were evaluated against several human non-small cell lung cancer cell lines (NCI-H1975, HCC827, NCI-H460, and NCI-A549). Compound 1 exhibited modest antitumor activity against the HCC827 cell line, with an IC 50 value of 19 µM. Compound 3 exhibits lower cytotoxic activity than 1. Finally, the cytotoxic activity of complex 5 (IC 50 < 11 µM) is significantly greater than 1 and 3 against the H1975 cancer cell line.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2020

Highly selective electrocatalytic CO 2 reduction to ethanol by metallic clusters dynamically formed from atomically dispersed copper

Direct electrochemical conversion of CO 2 to ethanol offers a promising strategy of lowering CO 2 emission while storing energy from renewable electricity. However, current electrocatalysts offer only limited selectivity toward ethanol. Here we report a copper catalyst synthesized by a unique Cu-Li amalgm method over a commercial carbon support that achieved Faradaic efficiency (FE) higher than 91% at -0.7 V (RHE) and the active potential as low as -0.4 V (RHE) during direct electrocatalytic CO 2 -to-ethanol conversion. The catalyst also demonstrated stability over an extended period of operation. A strong correlation between the catalytic selectivity and the initial Cu atoms dispersion was found and Operando X-ray absorption spectroscopy identified a dynamic and reversible transformation from atomically dispersed copper atoms to Cu n (n = 3 and 4) under the electrochemical reaction. Frist-principles calculations further elucidate the possible catalytic mechanism of CO 2 reduction over Cu n .

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2023

Living Filter Designs for In-Line Recovery and Sorting of Critical materials

This project explored “bio-mining” of critical materials from electronic waste (E-waste) streams by developing living filters arrays capable of recovering these materials, focusing on the platinum group metals (PGMs) and rare earth elements (REEs). While highly toxic, E-waste is considered a valuable “urban mine” as it contains critical materials such as PGMs and REEs with orders of magnitude higher purity than the richest ores. The aim of the project was to: (1) develop mechanically robust, silk-based biomaterial filtration membranes that can capture REEs from dilute aqueous waste; (2) design and build 3D bioprinted living filters containing encapsulated electrochemically active bacteria (EAB) capable of bio-reducing PGMs and recovering them from waste streams; and (3) constructing combined living filter arrays using both components to efficiently capture REE and PGM from the same waste stream. The developed silk-based filtration membranes were self-assembled using silk-nanofibrils (SNFs) derived from silkworm (Bombyx mori) cocoons in conjunction with recombinant silk-elastin-like proteins (SELPs), which contained lanthanide-binding peptide tags (LBTs) with a high affinity and specificity towards REEs. These 100% biodegradable protein-based membranes were capable of recovering up to 85% of model REE ions (Tb 3+ ) filtered through the membrane, with ~50% recovery achieved in the presence of high concentrations (100X) of common interfering metals (Ca 2+ , Cu 2+ , Fe 3+ , Zn 2+ ). REE captured by the membranes were easily recovered by applying a low pH desorption buffer. The membranes also demonstrated substantial reusability, with only a 30% loss in binding capacity after 4 cycles of REE binding and recovery. To recover the PGMs, we created a bottom-up assembling strategy to construct a living hydrogel composed of a seamlessly integrated living catalyst, Shewanella loihica PV-4 (PV-4), for metal reduction, and their structural and functional linkers, bio-reduced graphene oxide (B-rGO). This hydrogel demonstrated a close to 90% recovery of model metal ions, Pd, from a simulated e-waste leaching stream with minimum-to-no biomass production. It’s also worth noting that the Pd recovery is initiated immediately after the introduction of living hydrogel, compared to conventional biocarriers that required start-up times within hours to days. Overall, these living hydrogels demonstrated superior bioactivity, structural integrity, and agility over existing biocarriers, which offers extensive opportunities to advance the biological metal recovery with unparallel efficiency, reduced energy/material consumption, and minimal environmental impact.

36 MATERIALS SCIENCE↗
DOE OSTI2020

Materials Data on Cu6OF11 by Materials Project

Cu6OF11 is zeta iron carbide-derived structured and crystallizes in the triclinic P1 space group. The structure is three-dimensional. there are six inequivalent Cu+2.17+ sites. In the first Cu+2.17+ site, Cu+2.17+ is bonded to six F1- atoms to form a mixture of corner and edge-sharing CuF6 octahedra. The corner-sharing octahedra tilt angles range from 44–55°. There are a spread of Cu–F bond distances ranging from 1.93–2.34 Å. In the second Cu+2.17+ site, Cu+2.17+ is bonded to one O2- and five F1- atoms to form CuOF5 octahedra that share corners with eight CuF6 octahedra and edges with two CuOF5 octahedra. The corner-sharing octahedra tilt angles range from 44–57°. The Cu–O bond length is 2.02 Å. There are a spread of Cu–F bond distances ranging from 1.99–2.36 Å. In the third Cu+2.17+ site, Cu+2.17+ is bonded to one O2- and five F1- atoms to form CuOF5 octahedra that share corners with eight CuOF5 octahedra and edges with two CuF6 octahedra. The corner-sharing octahedra tilt angles range from 44–57°. The Cu–O bond length is 1.87 Å. There are a spread of Cu–F bond distances ranging from 1.93–2.37 Å. In the fourth Cu+2.17+ site, Cu+2.17+ is bonded to one O2- and five F1- atoms to form CuOF5 octahedra that share corners with eight CuF6 octahedra and edges with two CuOF5 octahedra. The corner-sharing octahedra tilt angles range from 44–55°. The Cu–O bond length is 1.88 Å. There are a spread of Cu–F bond distances ranging from 1.98–2.21 Å. In the fifth Cu+2.17+ site, Cu+2.17+ is bonded to six F1- atoms to form CuF6 octahedra that share corners with eight CuF6 octahedra and edges with two CuOF5 octahedra. The corner-sharing octahedra tilt angles range from 47–55°. There are a spread of Cu–F bond distances ranging from 1.96–2.29 Å. In the sixth Cu+2.17+ site, Cu+2.17+ is bonded to six F1- atoms to form CuF6 octahedra that share corners with eight CuOF5 octahedra and edges with two CuF6 octahedra. The corner-sharing octahedra tilt angles range from 47–55°. There are a spread of Cu–F bond distances ranging from 1.95–2.33 Å. O2- is bonded in a distorted trigonal planar geometry to three Cu+2.17+ atoms. There are eleven inequivalent F1- sites. In the first F1- site, F1- is bonded in a distorted trigonal planar geometry to three Cu+2.17+ atoms. In the second F1- site, F1- is bonded in a 3-coordinate geometry to three Cu+2.17+ atoms. In the third F1- site, F1- is bonded in a 3-coordinate geometry to three Cu+2.17+ atoms. In the fourth F1- site, F1- is bonded in a distorted trigonal planar geometry to three Cu+2.17+ atoms. In the fifth F1- site, F1- is bonded in a distorted trigonal planar geometry to three Cu+2.17+ atoms. In the sixth F1- site, F1- is bonded in a 3-coordinate geometry to three Cu+2.17+ atoms. In the seventh F1- site, F1- is bonded in a distorted trigonal planar geometry to three Cu+2.17+ atoms. In the eighth F1- site, F1- is bonded in a distorted trigonal planar geometry to three Cu+2.17+ atoms. In the ninth F1- site, F1- is bonded in a distorted trigonal planar geometry to three Cu+2.17+ atoms. In the tenth F1- site, F1- is bonded in a distorted trigonal planar geometry to three Cu+2.17+ atoms. In the eleventh F1- site, F1- is bonded in a distorted trigonal planar geometry to three Cu+2.17+ atoms.

36 MATERIALS SCIENCE↗
DOE OSTI2020

Materials Data on Cu3OF5 by Materials Project

Cu3OF5 is zeta iron carbide-derived structured and crystallizes in the monoclinic Pc space group. The structure is three-dimensional. there are three inequivalent Cu+2.33+ sites. In the first Cu+2.33+ site, Cu+2.33+ is bonded to one O2- and five F1- atoms to form a mixture of edge and corner-sharing CuOF5 octahedra. The corner-sharing octahedra tilt angles range from 39–61°. The Cu–O bond length is 1.95 Å. There are a spread of Cu–F bond distances ranging from 1.95–2.19 Å. In the second Cu+2.33+ site, Cu+2.33+ is bonded to one O2- and five F1- atoms to form a mixture of edge and corner-sharing CuOF5 octahedra. The corner-sharing octahedra tilt angles range from 39–61°. The Cu–O bond length is 1.87 Å. There are a spread of Cu–F bond distances ranging from 1.94–2.28 Å. In the third Cu+2.33+ site, Cu+2.33+ is bonded to one O2- and five F1- atoms to form a mixture of edge and corner-sharing CuOF5 octahedra. The corner-sharing octahedra tilt angles range from 41–56°. The Cu–O bond length is 1.84 Å. There are a spread of Cu–F bond distances ranging from 1.91–2.35 Å. O2- is bonded in a trigonal planar geometry to three Cu+2.33+ atoms. There are five inequivalent F1- sites. In the first F1- site, F1- is bonded in a distorted trigonal planar geometry to three Cu+2.33+ atoms. In the second F1- site, F1- is bonded in a 3-coordinate geometry to three Cu+2.33+ atoms. In the third F1- site, F1- is bonded in a distorted trigonal planar geometry to three Cu+2.33+ atoms. In the fourth F1- site, F1- is bonded in a 3-coordinate geometry to three Cu+2.33+ atoms. In the fifth F1- site, F1- is bonded in a 3-coordinate geometry to three Cu+2.33+ atoms.

36 MATERIALS SCIENCE↗
DOE OSTI2020

Materials Data on Cu3OF5 by Materials Project

Cu3OF5 crystallizes in the monoclinic P2_1 space group. The structure is three-dimensional. there are three inequivalent Cu+2.33+ sites. In the first Cu+2.33+ site, Cu+2.33+ is bonded to one O2- and five F1- atoms to form a mixture of distorted edge and corner-sharing CuOF5 octahedra. The corner-sharing octahedra tilt angles range from 39–56°. The Cu–O bond length is 1.97 Å. There are a spread of Cu–F bond distances ranging from 1.97–2.42 Å. In the second Cu+2.33+ site, Cu+2.33+ is bonded to one O2- and five F1- atoms to form a mixture of edge and corner-sharing CuOF5 octahedra. The corner-sharing octahedra tilt angles range from 46–56°. The Cu–O bond length is 1.89 Å. There are a spread of Cu–F bond distances ranging from 1.97–2.26 Å. In the third Cu+2.33+ site, Cu+2.33+ is bonded to one O2- and five F1- atoms to form a mixture of edge and corner-sharing CuOF5 octahedra. The corner-sharing octahedra tilt angles range from 39–56°. The Cu–O bond length is 1.84 Å. There are a spread of Cu–F bond distances ranging from 1.90–2.30 Å. O2- is bonded in a trigonal planar geometry to three Cu+2.33+ atoms. There are five inequivalent F1- sites. In the first F1- site, F1- is bonded in a distorted trigonal planar geometry to three Cu+2.33+ atoms. In the second F1- site, F1- is bonded in a 3-coordinate geometry to three Cu+2.33+ atoms. In the third F1- site, F1- is bonded in a 3-coordinate geometry to three Cu+2.33+ atoms. In the fourth F1- site, F1- is bonded in a distorted trigonal planar geometry to three Cu+2.33+ atoms. In the fifth F1- site, F1- is bonded in a 3-coordinate geometry to three Cu+2.33+ atoms.

36 MATERIALS SCIENCE↗
DOE OSTI2020

Materials Data on Cu6OF11 by Materials Project

Cu6OF11 crystallizes in the triclinic P1 space group. The structure is three-dimensional. there are six inequivalent Cu+2.17+ sites. In the first Cu+2.17+ site, Cu+2.17+ is bonded to six F1- atoms to form a mixture of edge and corner-sharing CuF6 octahedra. The corner-sharing octahedra tilt angles range from 44–55°. There are a spread of Cu–F bond distances ranging from 1.93–2.32 Å. In the second Cu+2.17+ site, Cu+2.17+ is bonded to six F1- atoms to form a mixture of edge and corner-sharing CuF6 octahedra. The corner-sharing octahedra tilt angles range from 49–53°. There are a spread of Cu–F bond distances ranging from 1.94–2.30 Å. In the third Cu+2.17+ site, Cu+2.17+ is bonded to one O2- and five F1- atoms to form CuOF5 octahedra that share corners with eight CuF6 octahedra and edges with two equivalent CuOF5 octahedra. The corner-sharing octahedra tilt angles range from 45–58°. The Cu–O bond length is 1.84 Å. There are a spread of Cu–F bond distances ranging from 1.92–2.36 Å. In the fourth Cu+2.17+ site, Cu+2.17+ is bonded to six F1- atoms to form a mixture of edge and corner-sharing CuF6 octahedra. The corner-sharing octahedra tilt angles range from 45–54°. There are a spread of Cu–F bond distances ranging from 1.95–2.30 Å. In the fifth Cu+2.17+ site, Cu+2.17+ is bonded to six F1- atoms to form a mixture of edge and corner-sharing CuF6 octahedra. The corner-sharing octahedra tilt angles range from 49–52°. There are a spread of Cu–F bond distances ranging from 1.96–2.24 Å. In the sixth Cu+2.17+ site, Cu+2.17+ is bonded to two equivalent O2- and four F1- atoms to form distorted CuO2F4 octahedra that share corners with eight CuF6 octahedra and edges with two equivalent CuO2F4 octahedra. The corner-sharing octahedra tilt angles range from 44–58°. There is one shorter (1.88 Å) and one longer (2.03 Å) Cu–O bond length. There are a spread of Cu–F bond distances ranging from 1.97–2.42 Å. O2- is bonded in a trigonal planar geometry to three Cu+2.17+ atoms. There are eleven inequivalent F1- sites. In the first F1- site, F1- is bonded in a distorted trigonal planar geometry to three Cu+2.17+ atoms. In the second F1- site, F1- is bonded in a distorted trigonal planar geometry to three Cu+2.17+ atoms. In the third F1- site, F1- is bonded in a 3-coordinate geometry to three Cu+2.17+ atoms. In the fourth F1- site, F1- is bonded in a distorted trigonal planar geometry to three Cu+2.17+ atoms. In the fifth F1- site, F1- is bonded in a distorted trigonal planar geometry to three Cu+2.17+ atoms. In the sixth F1- site, F1- is bonded in a 3-coordinate geometry to three Cu+2.17+ atoms. In the seventh F1- site, F1- is bonded in a 3-coordinate geometry to three Cu+2.17+ atoms. In the eighth F1- site, F1- is bonded in a distorted trigonal planar geometry to three Cu+2.17+ atoms. In the ninth F1- site, F1- is bonded in a distorted trigonal planar geometry to three Cu+2.17+ atoms. In the tenth F1- site, F1- is bonded in a 2-coordinate geometry to three Cu+2.17+ atoms. In the eleventh F1- site, F1- is bonded in a distorted trigonal planar geometry to three Cu+2.17+ atoms.

36 MATERIALS SCIENCE↗