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Hybrid circuitry can be installed into standard round bayonet connectors, to eliminate wiring from connector to circuit. Circuits can be connected directly into either section of connector pair, eliminating need for hard wiring to that section.
Optical interface losses between transmitter-to-fiber interface, connector-to-connector interface, and fiber-to-receiver interface were studied. System effects such as pulse dispersion, risetimes of the sources and detectors, type of fibers used, output power of the sources, and detector sensitivity were considered. Data bus systems such as TEE, Star, and Hybrid were analyzed. The matter of single fiber versus bundle technologies for future avionics systems was considered. The existing data bus system on Space Shuttle was examined and an optical analog was derived for a fiber bundle system, along with the associated power margin. System tests were performed on a feasibility model of a 9-port Star data bus system including BER, star losses, connector losses, etc. The same system was subjected to EMI between the range of 200 Hz to 10 GHz at 20V/m levels. A lightning test was also performed which simulated the conditions similar to those on Space Shuttle. The data bus system was found to be EMI and lightning hard. It is concluded that an optical data bus system is feasible for shuttle orbiter type vehicles.
Apparatus for adapting a general purpose and effector device to a special purpose and effector is disclosed which includes an adapter bracket assembly which provides a mechanical and electrical interface between the end effector devices. The adapter bracket assembly includes an adapter connector post which interlocks with a diamond shaped gripping channel formed in closed jaws of the general purpose end effector. The angularly intersecting surfaces of the connector post and gripping channel prevent any relative movement there between. Containment webs constrain the outer finger plates of the general purpose jaws to prevent pitch motion. Electrical interface is provided by conical, self aligning electrical connector components carried by respective ones of said end effectors.
New harness for electrical wiring includes plugs that do not loosen from vibration. Ground braids prevented from detaching from connectors and constrained so braids do not open into swollen "birdcage" sections. Spring of stainless steel encircles ground braid. Self-locking connector contains ratchet not only preventing connector from opening, but tightens when vibrated.
The Spartan attitude control system (ACS) control electronics assembly cold plate has a standard connector interface to the rest of the Spartan payload and ground equipment. The connectors carry gyro signals, optical sensor signals, the experiment interface, the gas command decoder interface, and a pneumatics interface. Different flights can employ different optical sensor complements; the ACS engineer must accordingly connect the sensor error signals to the proper pins and connectors on the ACS electronics.
A connector assembly comprised of two halves, each respectively including a shell type connector subassembly, one being an active half and the other being a passive half is described. The active half includes an alignment cusp that causes a coupling motion in response to coming in contact with the outer portion of the other half, which causes the respective connectors within the two subassemblies to move toward each other into coupling relationship at twice the rate at which the two subassemblies come together. Both halves are adapted to rotate about and translate along respective mutually orthogonal axes to facilitate an interconnection.
Experiments are described which were conducted at the JPL Advanced Teleoperator Lab to demonstrate and evaluate the effectiveness of various teleoperator control modes in the performance of a simulated Solar Max Satellite Repair (SMSR) task. THe SMSR was selected as a test because it is very rich in performance capability requirements and it actually has been performed by two EVA astronauts in the Space Shuttle Bay in 1984. The main subtasks are: thermal blanket removal; installation of a hinge attachment for electrical panel opening; opening of electrical panel; removal of electrical connectors; relining of cable bundles; replacement of electrical panel; securing parts and cables; re-mate electrical connectors; closing of electrical panel; and reinstating thermal blanket. The current performance experiments are limited to thermal blanket cutting, electrical panel unbolting and handling electrical bundles and connectors. In one formal experiment even different control modes were applied to the unbolting and reinsertion of electrical panel screws subtasks. The seven control modes are alternative combinations of manual position and rate control with force feedback and remote compliance referenced to force-torque sensor information. Force-torque sensor and end effector position data and task completion times were recorded for analysis and quantification of operator performance.
Frequent or regular testing of multiconductor cables terminated in multipin conductors tedious, if not impossible, task. This inexpensive circuit simplifies open/short testing and is amenable to automation. In operation, pair of connectors selected to match pair of connectors installed on each of cables to be tested. As many connectors accommodated as required, and each can have as many conductors as required. Testing technique implemented with this circuit automated easily with electronic controls and computer interface. Printout provides status of each conductor in cable, indicating which, if any, of conductors has open or short circuit.
Service equipment for use in hostile environments is presented. The equipment includes a detachable service unit secured to a stationary service unit. The detachable service unit includes a housing with an exterior plate, a power control interface for connection to an exterior power source, locating pins located in said exterior plate, an electrical connector in the exterior plate electrically coupled to said power control interface, and a pair of clamping receptacles formed in the exterior plate and located on adjacent opposite edges of the exterior plate. The stationary unit includes an electrical connector for connection to the electrical connector of the detachable service unit, a clamping apparatus for clamping and unclamping the detachable service unit from the stationary unit, a base clamp assembly for mounting the clamping apparatus onto the stationary unit, and locating pin holes for receiving the locating pins and aligning the detachable service unit onto the stationary unit. The detachable service unit have mating scalloped faces which aid in alignment and provide a mechanism for heat dissipation.
Service equipment for use in hostile environments includes a detachable service unit secured to a stationary service unit. The detachable service unit includes a housing with an exterior plate, a power control interface for connection to an exterior power source, locating pins located in said exterior plate, an electrical connector in the exterior plate electrically coupled to said power control interface, and a pair of clamping receptacles formed in the exterior plate and located on adjacent opposite edges of the exterior plate. The stationary unit includes an electrical connector for connection to the electrical connector of the detachable service unit, a clamping apparatus for clamping and unclamping the detachable service unit from the stationary unit, a base clamp assembly for mounting the clamping apparatus onto the stationary unit, and locating pin holes for receiving the locating pins and aligning the detachable service unit onto the stationary unit. The detachable service unit and stationary unit have mating scalloped faces which aid in alignment and provide a mechanism for heat dissipation.
Proposed mechanism applies spring preload to electrical connector only while needed during insertion of electronics box into supporting frame. Once connector fully mated, mechanism relieves preload. As result, supporting structure sized to handle only individual load applied briefly by each connector on box during insertion.
A method and apparatus for processing a wafer comprising a material selected from an electrical semiconducting material and an electrical insulating material is presented. The wafer has opposed generally planar front and rear sides and a peripheral edge, wherein said wafer is pressed against a pad in the presence of a slurry to reduce its thickness. The thickness of the wafer is controlled by first forming a recess such as a dimple on the rear side of the wafer. A first electrical conducting strip extends from a first electrical connection means to the base surface of the recess to the second electrical connector. The first electrical conducting strip overlies the base surface of the recess. There is also a second electrical conductor with an electrical potential source between the first electrical connector and the second electrical connector to form. In combination with the first electrical conducting strip, the second electrical conductor forms a closed electrical circuit, and an electrical current flows through the closed electrical circuit. From the front side of the wafer the initial thickness of the wafer is reduced by lapping until the base surface of the recess is reached. The conductive strip is at least partially removed from the base surface to automatically stop the lapping procedure and thereby achieve the desired thickness.
Aerospace vehicle programs have always counted on the cables and connectors to provide power, grounding, data and time synchronization throughout a vehicle's life-cycle. Even with numerous improvements, wiring and connector problems and sensors continue to be key failure points, causing many hours of troubleshooting and replacement. Costly flight delays have been precipitated by the need to troubleshoot cables/connections, and/or repair a sensor. Wiring continues to be too expensive to remove once it is installed, even with the weight penalties. Miles of test instrumentation and low flight sensor wires still plague the aerospace industry. New technology options for data connectivity, processing and micro/nano manufacturing are making it possible to retrofit existing vehicles, like the Space Shuttle. New vehicles can now develop architectures that provide for and take advantage of alternatives to wired connectivity. This project motivates the aerospace industry and technology providers to establish: (1) A new emphasis for system engineering approaches to reduce cables and connectors. (2) Provisions for modularity and accessibility in the vehicle architecture. (3) A set of technologies that support alternatives to wired connectivity.
A three-dimensional connection system uses a plurality of printed wiring boards with connectors completely around the printed wiring boards, and connected by an elastomeric interface connector. The device includes internal space to allow room for circuitry. The device is formed by stacking an electronics module, an elastomeric interface board on the electronics module such that the interface board's exterior makes electrical connection with the connectors around the perimeter of the interface board, but the internal portion is open to allow room for the electrical devices on the printed wiring board. A plurality of these devices are stacked between a top stiffener and a bottom device, and held into place by alignment elements.
There is a need to provide a portable and cost-effective galvanic isolation between ground support equipment and flight hardware such that any unforeseen voltage differential between ground and power supplies is eliminated. An interface board was designed for use between the ground support equipment and the flight hardware that electrically isolates all input and output signals and faithfully reproduces them on each side of the interface. It utilizes highly integrated multi-channel isolating devices to minimize size and reduce assembly time. This single-board solution provides appropriate connector hardware and breakout of required flight signals to individual connectors as needed for various ground support equipment. The board utilizes multi-channel integrated circuits that contain transformer coupling, thereby allowing input and output signals to be isolated from one another while still providing high-fidelity reproduction of the signal up to 90 MHz. The board also takes in a single-voltage power supply input from the ground support equipment and in turn provides a transformer-derived isolated voltage supply to power the portion of the circuitry that is electrically connected to the flight hardware. Prior designs used expensive opto-isolated couplers that were required for each signal to isolate and were time-consuming to assemble. In addition, these earlier designs were bulky and required a 2U rack-mount enclosure. The new design is smaller than a piece of 8.5 ~11-in. (.22 ~28-mm) paper and can be easily hand-carried where needed. The flight hardware in question is based on a lineage of existing software-defined radios (SDRs) that utilize a common interface connector with many similar input-output signals present. There are currently four to five variations of this SDR, and more upcoming versions are planned based on the more recent design.
This invention is an electronically commutated brushless motor controller that incorporates Hall-array sensing in a small, 42-gram package that provides 4096 absolute counts per motor revolution position sensing. The unit is the size of a miniature hockey puck, and is a 44-pin male connector that provides many I/O channels, including CANbus, RS-232 communications, general-purpose analog and digital I/O (GPIO), analog and digital Hall inputs, DC power input (18-90 VDC, 0-l0 A), three-phase motor outputs, and a strain gauge amplifier. This controller replaces air cooling with conduction cooling via a high-thermal-conductivity epoxy casting. A secondary advantage of the relatively good heat conductivity that comes with ultra-small size is that temperature differences within the controller become smaller, so that it is easier to measure the hottest temperature in the controller with fewer temperature sensors, or even one temperature sensor. Another size-sensitive design feature is in the approach to electrical noise immunity. At a very small size, where conduction paths are much shorter than in conventional designs, the ground becomes essentially isopotential, and so certain (space-consuming) electrical noise control components become unnecessary, which helps make small size possible. One winding-current sensor, applied to all of the windings in fast sequence, is smaller and wastes less power than the two or more sensors conventionally used to sense and control winding currents. An unexpected benefit of using only one current sensor is that it actually improves the precision of current control by using the "same" sensors to read each of the three phases. Folding the encoder directly into the controller electronics eliminates a great deal of redundant electronics, packaging, connectors, and hook-up wiring. The reduction of wires and connectors subtracts substantial bulk and eliminates their role in behaving as EMI (electro-magnetic interference) antennas. A shared knowledge by each motor controller of the state of all the motors in the system at 500 Hz also allows parallel processing of higher-level kinematic matrix calculations.
The Hyperspectral Microwave Atmospheric Sounder (HyMAS) is being developed at Lincoln Laboratories and accommodated by the Goddard Space Flight Center for a flight opportunity on a NASA research aircraft. The term "hyperspectral microwave" is used to indicate an all-weather sounding that performs equivalent to hyperspectral infrared sounders in clear air with vertical resolution of approximately 1 km. Deploying the HyMAS equipped scanhead with the existing Conical Scanning Microwave Imaging Radiometer (CoSMIR) shortens the path to a flight demonstration. Hyperspectral microwave is achieved through the use of independent RF antennas that sample the volume of the Earth s atmosphere through various levels of frequencies, thereby producing a set of dense, spaced vertical weighting functions. The simulations proposed for HyMAS 118/183-GHz system should yield surface precipitation rate and water path retrievals for small hail, soft hail, or snow pellets, snow, rainwater, etc. with accuracies comparable to those of the Advanced Technology Microwave Sounder. Further improvements in retrieval methodology (for example, polarization exploitation) are expected. The CoSMIR instrument is a packaging concept re-used on HyMAS to ease the integration features of the scanhead. The HyMAS scanhead will include an ultra-compact Intermediate Frequency Processor (IFP) module that is mounted inside the door to improve thermal management. The IFP is fabricated with materials made of Low-Temperature Co-fired Ceramic (LTCC) technology integrated with detectors, amplifiers, A/D conversion and data aggregation. The IFP will put out 52 channels of 16 bit data comprised of 4-9 channel data streams for temperature profiles and 2-8 channel streams for water vapor. With the limited volume of the existing CoSMIR scanhead and new HyMAS front end components, the HyMAS team at Goddard began preliminary layout work inside the new drum. Importing and re-using models of the shell, the scan head computer, and the slip rings developed for CoSMIR was the starting point. The next step was to modify the antenna faceplate to accommodate the dimensions of the three dual polarization Gaussian Optics Antenna (GOA) assemblies. Two mechanical concepts for the core technology, the hyperspectral IFP, were captured in a design tradeoff. Connector models considered minimum bend radii for the IFP analog connectors. Hyperspectral imaging is accomplished by strategically using a short wavelength intermediate frequency of 18-29 GHz, and thus reducing the size of components in the connection of the front end to the IFP. The SMK (2.92mm) Series connector will lay near the hinge line to minimize its flexing. The digital output of the IFP will use a Serial Peripheral Interface (SPI) that must be accommodated by the scan head computer. To make that computer more reliable, maintainable, and forward compatible with the 52 HyMAS channels, a testbed of the scan head, calibration, and archive computers and the PIC24 microprocessor that resides on the IFP is in development. The computers will be programmed using a new framework application called Interoperable Remote Component (IRC). This software allows flexibility to program computers that communicate with each other and can adapt easily to the emerging HyMAS requirements for data format, algorithms, and graphical user interface (GUI). It is expected that the CoSMIR instrument will cut over to the IRC after it is adapted on an updated CoSMIR testbed.
Safe-to-mate testing is a common hardware safety practice where impedance measurements are made on unpowered hardware to verify isolation, continuity, or impedance between pins of an interface connector. A computer-based instrumentation solution has been developed to resolve issues. The ASTM is connected to the circuit under test, and can then quickly, safely, and reliably safe-to-mate the entire connector, or even multiple connectors, at the same time.