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At least 397 records · Page 22
All sourcesNASA NTRSDOE OSTI
NASA NTRS1994

Tough, processable simultaneous semi-interpenetrating polyimides

A high temperature semi-interpenetrating polymer network (semi-IPN) was developed which had significantly improved processability, damage tolerance, and mechanical performance when compared to the commercial Thermid materials. This simultaneous semi-IPN was prepared by mixing a thermosetting polyimide with a thermoplastic monomer precursor solution (NR150B2) and allowing them to react upon heating. This reaction occurs at a rate which decreases the flow and broadens the processing window. Upon heating at a higher temperature, there is an increase in flow. Because of the improved flow properties, broadened processing window and enhanced toughness, high strength polymer matrix composites, adhesives and molded articles can now be prepared from the acetylene endcapped polyimides which were previously inherently brittle and difficult to process.

Pater, Ruth H.↗
NASA NTRS1994

Process for preparing an assembly of an article and a polyimide which resists dimensional change, delamination and debonding when exposed to changes in temperature

An assembly of an article and a polyimide composition is prepared. The assembly resists dimensional change, delamination, or debonding when exposed to changes in temperature. An article is provided. A polyamic acid solution which yields a polyimide having a low coefficient of thermal expansion (CTE) was prepared. Equimolar quantities of an aromatic diamine and an aromatic dianhydride were reacted in a solvent medium to form a polyamic acid solution. A metal ion-containing additive was added to the solution. Examples of this additive are: TbCl3, DyCl3, ErCl3, TmCl3, Al(C5H7O2)3, and Er2S3. The polyamic acid solution was imidized and is combined with the article to form the assembly.

Stoakley, Diane M.↗
NASA NTRS1994

Structure-property relationships in addition polyimides. 1: Resins from four-ring aromatic diamines containing carbonyl and methylene groups

In an effort to improve the processing characteristics of addition-type polyimide resins the use of flexibilized four-ring aromatic diamine moieties was investigated. A series of 12 diamines containing carbonyl and methylene, as well as oxo and thio bridging groups, was synthesized. The diamines were polymerized with the dimethyl ester of 3.3', 4.4' - benzophenonetetracarboxylic acid (BTDE), using the monomethyl ester of nadic acid (NE) as an end-cap. The effect of diamine structure on the solubility and rheological properties during cure was determined. This paper also describes the effect of diamine structure and formulated molecular weight on the glass transition temperature and thermo-oxidative stability at elevated temperatures after various post-cure regimes. The results indicate that polyimides from some of the diamines containing methylene connecting groups have potential as matrix resins for long-term applications at temperatures up to 300 C.

Delvigs, Peter↗
NASA NTRS1995

Polyimides Made From PDMDA

Thermally stable linear aromatic polyimides with improved optical, electrical, and processing characteristics made from 3,3'-bis(3,4-dicarboxyphenoxy)diphenylmethane dianhydride (PDMDA). Made in form of powders that can be dissolved to cast thin films. Potentially useful as coating and matrix materials. Films made vary from transparent to pale yellow. Greater degrees of transparency and lower dielectric constants make these polyimides more suitable for use in some electronic and optical applications; e.g., as insulating materials on wires and protective films on solar photovoltaic cells.

St. Clair, Anne K.↗
NASA NTRS1995

A simulated RTM process for fabricating polyimide (AMB-21) carbon fiber composites

An experimental polyimide matrix, AMB-21 - supplied by NASA/LeRC, was especially formulated to be non-carcinogenic. It was also expected to be amenable to a Resin Transfer Molding Process (RTM). AMB-21 is a solid at room temperature and must be heated to a very high temperature to obtain a fluid state. However, even after heating it to a realistic high temperature, it was found to be too viscous for use in a RTM process. As a result, a promising approach was experimented leading to the introduction of the resin into a solvent solution in order to obtain a viscosity suitable for RTM. A mixture of methanol and tetrahydroferone was found to be a suitable solvent mixture. The matrix solution was introduced into carbon-fiber preform using two techniques: (1) injection of matrix into a Resin Transfer Mold after positioning the preform into the 'mold cavity', and (2) infiltration of matrix into the preform using the 'autoclave through-the-thickness transfer process'. After completing the resin transfer (infiltration) process, the 'filled' preform was heated to 300 F for one hour to reduce the solvent content. The temperature was then increased to 400 F under a vacuum to complete the solvent evaporation and to remove volatile products of the polyimide imidization. The impregnated preform was removed from the mold and press-cured at 200 psi and 600 FF for two hours. The resulting panel was found to be of reasonably good quality. This observation was based on the results obtained from short beam shear strength (700-8000 psi) tests and microscopic examination of the cross-section indicating a very low level of porosity. Further, the flash around the molded panels from the compression molding was free of porosity indicating the removal of volatiles, solvents, and other imidization products. Based on these studies, a new RTM mold containing a diaphragm capable of applying 200 psi at 600 F has been designed and constructed with the expectation that it will allow the incorporation of all of the above processing steps, including the consolidation with the preform in the mold cavity. Moreover, the new diaphragm design will enable to process larger preform panels. Processing studies with the diaphragm mold are being initiated.

Avva, V. Sarma↗
NASA NTRS1995

Statistical Design in Isothermal Aging of Polyimide Resins

Recent developments in research on polyimides for high temperature applications have led to the synthesis of many new polymers. Among the criteria that determines their thermal oxidative stability, isothermal aging is one of the most important. Isothermal aging studies require that many experimental factors are controlled to provide accurate results. In this article we describe a statistical plan that compares the isothermal stability of several polyimide resins, while minimizing the variations inherent in high-temperature aging studies.

Sutter, James K.↗
NASA NTRS1994

Effect Of Molecular Weight On Adhesive Properties Of The Phenylethynyl-Terminated Polyimide LARC(sup TM)-PETI-5

Future civilian aircraft will require the use of advanced adhesive systems with high temperature capabilities. One such material has been developed at the NASA Langley Research Center, a phenylethynyl-terminated polyimide given the designation LARC(sup TM)-PETI-5. Recent work has shown the advantages of similar phenylethynyl-terminated polyimides as films, moldings, adhesives, and composite matrix resins. Phenylethynyl-terminated oligomers provide greater processing windows than materials which incorporate simple ethynyl endcaps. Since these low molecular weight, low melt viscosity oligomers thermally cure without the evolution of volatile by-products, they provide an excellent means of producing polymers with high glass transition temperatures, excellent solvent resistance, and high mechanical properties. Three different versions of LARC(sup TM)-PETI-5 with theoretical number average molecular weights (M(sub n)s) of 250, 5000, and 10000 g/mol were synthesized in this work. Differential Scanning Calorimetry (DSC) measurements were performed on the dry powder form of these materials to establish cure conditions which result in high glass transition temperatures (T(sub g)s). Lap shear specimens were prepared from adhesive tape made from each material and with the thermal cure conditions determined from the DSC data. The tensile shear data established processing conditions which provided the best adhesive strengths. Further testing was performed to establish the properties of LARC(sup TM)-PETI-5 as an adhesive material and to determine its solvent resistance.

Cano, Roberto J.↗
NASA NTRS1998

Synthesis and Characterization of Polyimides with Ether Linkages

A series of polyimides derived from a newly synthesized diamine, namely, 4,4-bis(4-aminophenoxy)-2,2-dimethylbiphenyl (BAPD), were developed and characterized. Their physical and thermal properties were compared to polyimides based on'commercially available 2,2-bis(4-(4-aminophenoxy)phenyl)propane (BAPP).

Chuang, Kathy C.↗
NASA NTRS1999

Dimensionally Stable Ether-Containing Polyimide Copolymers

Novel polyimide copolymers containing ether linkages were prepared by the reaction of an equimolar amount of dianhydride and a combination of diamines. The polyimide copolymers described herein possess the unique features of low moisture uptake, dimensional stability, good mechanical properties, and moderate glass transition temperatures. These materials have potential application as encapsulants and interlayer dielectrics.

Fay, Catharine C.↗
NASA NTRS1999

Molecular Modeling of the Poling of Piezoelectric Polyimides

The computational method described in this paper allows the calculation of the dielectric relaxation strength of an amorphous polymer based solely upon its chemical structure. The 4,4' oxydiphthalic anhydride (ODPA) dianhydride and bis-aminophenoxybenzene (APB) diamine based polyimides, (beta-CN) APB-ODPA and APB-ODPA were studied. Amorphous cells were constructed and then poled using molecular dynamics. Dielectric relaxation strengths of Delta(epsilon) = 17.8 for (beta-CN) APB-ODPA and Delta(epsilon) = 7.7 for APB-ODPA were predicted. These values are in excellent agreement with the experimental values. It was found that both the pendant nitrile dipole and the backbone anhydride residue dipole make significant contributions to the polyimides dielectric response. Specifically, it was shown that the difference in the magnitude of the dielectric relaxations is directly attributable to the nitrile dipole. The size of the relaxations indicate an absence of cooperative dipolar motions, The model was used to explain these results in terms of the average orientation of the nitrile and anhydride dipoles to within 51 deg. and 63 deg., respectively, of the applied electric field.

Young, J. A.↗
NASA NTRS1998

Characterization of Thin Film Microstrip Lines on Polyimide

This paper presents an in depth characterization of thin film microstrip (TFMS) lines fabricated on Dupont PI-2611 polyimide. Measured attenuation and effective dielectric constant is presented for TFMS lines with thicknesses from 2.45-7.4 microns and line widths from 5-34.4 microns over the frequency range of 1-110 GHz. The attenuation is separated into conductor and dielectric losses to determine the loss tangent of Dupont PI-2611 polyimide over the microwave frequency range. In addition, the measured characteristics are compared to closed form equations for a and eff from the literature. Based on the comparisons, recommendations for the best dosed form design equations for TFMS are made.

Ponchak, George E.↗
NASA NTRS2001

Films, Preimpregnated Tapes and Composites Made from Polyimide "Salt-Like" Solutions

High quality films, preimpregnated tape (prepegs), and composites have been fabricated from polyimide precursor 'saltlike' solutions. These salt-like solutions have a low viscosity (5,000 to 10,000 cp) and a high solids content (50-65% by weight) and can be coated onto reinforcing fiber to produce prepegs with excellent tack and drape at 12-15% residual solvent (approximately 4-6% water from thermal imidization reaction). The processing of these types of prepegs significantly overcomes solvent removal problems and allows excellent fiber wet out. In addition, the physical characteristics of the polyimide precursor salt-like solutions permits processing into high-performance materials through the use of standard prepregging and composite fabrication equipment. The resultant composites are of high quality.

Cano, Roberto J.↗
NASA NTRS2001

Method To Prepare Processable Polyimides With Reactive Endogroups Using 1,3-bis(3-aminophenoxy)benzene

Polyimide copolymers were obtained containing 1,3-bis(3-aminophenoxy)benzene (APB) and other diamines and dianhydrides and terminating with the appropriate amount of reactive endcapper. The reactive endcappers studied include but should not be limited to 4-phenylethynyl phthalic anhydride (PEPA), 3-aminophenoxy-4'phenylethynylbenzophenone (3-APEB), maleic anhydride (MA) and nadic anhydride (5-norbomene-2,3-dicarboxylic anhydride, NA). Homopolymers containing only other diamines and dianhydrides which are not processable under conditions described previously can be made processable by incorporating various amounts of APB, depending on the chemical structures of the diamines and dianhydrides used. By simply changing the ratio of APB to the other diamine in the polyimide backbone, a material with a unique combination of solubility, Tg, Tm, melt viscosity, toughness and elevated temperature mechanical properties can be prepared. The copolymers that result from using APB to enhance processability have a unique combination of properties that include low pressure processing (200 psi and below), long term melt stability (several hours at 300° C. for the phenylethynyl terminated polymers), high toughness, improved solvent resistance, improved adhesive properties, and improved composite mechanical properties. These copolyimides are eminently suitable as adhesives, composite matrices, moldings, films and coatings.

Brian J Jensen↗
NASA NTRS2001

UV Curable Polyimides

The development of UV curable polyimides for high-temperature applications is a growing area of research activity. The objective of this technology is an attempt to bypass many of the issues associated with "typical" high-temperature polymers. For example, the use of toxic or mutagenic monomers (i.e., many aromatic diamines) can be prevented. Also, it proves to be a viable means in circumventing the problems associated with high-processing temperature of polymers, which cause thermally induced processing stresses (i.e., microcracking). The approach that we have been pursuing is Diels-Alder Polymerization. In this approach, we are generating dienes with light instead of heat. This process is called photoenolization. Several bismaleimides and bisacrylates are used as the dienophiles. The method is fairly general and a wide variety of diketones and bismaleimides can be used. UV curability processes are advantageous due to the following: (1) With such a wide variety of monomers, it allows for the use of nontoxic/nonmutagenic monomers; (2) Polyimides cure at room temperature, which reduces thermally induced stresses; (3) It reduces processing and tooling cost; (4) There are many potential applications for this technology, i.e., thin films as alignment layers for LC displays, photoresists, and photonic material as well as a potential market for use as adhesives.

Meador, Michael↗
NASA NTRS2001

Polyimide Based Nanocomposites for Affordable Space Transport

In setting forth its strategic plan, NASA has indicated that low-cost access to space is the key to unleashing the commercial potential of space and greatly expanding space research and exploration. The development of advanced materials will be an enabling technology for this quest for low-cost space access. In this research program, we are attempting to address the need for new advanced materials by developing high-performance nanodispersed inorganic/organic and organic/organic polyimide composites utilizing specific interactions. Our goal is to systematically manipulate these interactions and investigate the resulting processing morphology-property relationships. Specifically, we will investigate three main parameters on these relationships. These include (1) the type of polyimide; (2) the structure of the inorganic nanoparticle being used; and (3) manipulation of the interfacial energy. During the first year of this effort, we have demonstrated the successful synthesis of PMR-15/layered silicate nanocomposites. Morphological studies indicate that exfoliated structures were obtained in most instances, with a mixture of exfoliated and intercalated structures being observed also. Significant enhancements of the onset of decomposition were obtained by varying the strength of the interaction between the nanoparticle and the polymer. Varying the amount of a specific nanoparticle also affected the decomposition temperatures. A slight catalytic effect of the nanoparticles on both the imidization and crosslinking reaction has been observed and will be presented. In addition, incorporation of the nanoparticles was found to increase the glass transition temperature and slightly broaden the breadth of this relaxation.

Dean, Derrick↗