The effect of an electric field on the morphological stability of the crystal-melt interface of a binary alloy
A fully time-dependent linear stability analysis of the morphological stability of a planar interface during directional solidification of a binary alloy at constant velocity in the presence of an electric field, is performed. The electromigration of solute and the differing electrical conductivities of solid and liquid for a model in which the temperature gradient is constant are taken into account. The present results are compared with the constitutional supercooling criterion, and it is shown there may be substantial differences. A modified constitutional supercooling criterion which is valid over a large range of conditions is derived. It is also found under certain conditions that the onset of instability may be time dependent.