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At least 397 records · Page 22
All sourcesNASA NTRSDOE OSTI
NASA NTRS1982

Mechanical properties of adhesive systems at cryogenic and other temperatures

This paper presents a summary of the National Transonic Facility (NTF) fan blade adhesive characterization tests. Data was obtained at -300 F, room temperature (RT) and 200 F. The adhesive characterization data was acquired using specimens fabricated from materials orientated to simulate the lay up of the fan blades. Specimen fabrication, characterization tests, test equipment, test data, results and concluding remarks are reported. Adhesive test results are presented for specimens of the following types: lap shear, double lap shear, butt, short beam shear, flexure, and differential strain.

Staton, W. L.↗
NASA NTRS1983

Enhanced adhesion from high energy ion irradiation

It has been found that the adhesion of thin metal films on insulators, semiconductors, and metals could be improved by subjecting the material to a high-energy ion bombardment. Griffith et al. (1982) have first suggested a use of this technique with insulators. The present investigation has the objective to determine the mechanism for the adhesion enhancement. A description is presented of a preliminary transmission electron microscopy (TEM) study of thinned bonded samples of silver on silicon using electron diffraction. It is found that irradiation of a variety of thin film-substrate combinations by heavy ion beams will provide a remarkable improvement in the adherence of the film. The evidence for the mechanism involved in the enhancement of adhesion is discussed.

Werner, B. T.↗
NASA NTRS1984

Processing study of a high temperature adhesive

An adhesive-bonding process cycle study was performed for a polyimidesulphone. The high molecular weight, linear aromatic system possesses properties which make it attractive as a processable, low-cost material for elevated temperature applications. The results of a study to better understand the parameters that affect the adhesive properties of the polymer for titanium alloy adherends are presented. These include the tape preparation, the use of a primer and press and simulated autoclave processing conditions. The polymer was characterized using Fourier transform infrared spectroscopy, glass transition temperature determination, flow measurements, and weight loss measurements. The lap shear strength of the adhesive was used to evaluate the effects of the bonding process variations.

Progar, D. J.↗
NASA NTRS1984

Ceramic microstructure and adhesion

When a ceramic is brought into contact with a ceramic, a polymer, or a metal, strong bond forces can develop between the materials. The bonding forces will depend upon the state of the surfaces, cleanliness and the fundamental properties of the two solids, both surface and bulk. Adhesion between a ceramic and another solid are discussed from a theoretical consideration of the nature of the surfaces and experimentally by relating bond forces to interface resulting from solid state contact. Surface properties of ceramics correlated with adhesion include, orientation, reconstruction and diffusion as well as the chemistry of the surface specie. Where a ceramic is in contact with a metal their interactive chemistry and bond strength is considered. Bulk properties examined include elastic and plastic behavior in the surficial regions, cohesive binding energies, crystal structures and crystallographic orientation. Materials examined with respect to interfacial adhesive interactions include silicon carbide, nickel zinc ferrite, manganese zinc ferrite, and aluminum oxide. The surfaces of the contacting solids are studied both in the atomic or molecularly clean state and in the presence of selected surface contaminants.

Buckley, D. H.↗
NASA NTRS1984

Deformations and strains in adhesive joints by moire interferometry

Displacement fields in a thick adherend lap joint and a cracked lap shear specimen were measured by high sensitivity moire interferometry. Contour maps of in-plane U and V displacements were obtained across adhesive and adherent surfaces. Loading sequences ranged from modest loads to near-failure loads. Quantitative results are given for displacements and certain strains in the adhesive and along the adhesive/adherend boundary lines. The results show nonlinear displacements and strains as a function of loads or stresses and they show viscoelastic or time-dependent response. Moire interferometry is an excellent method for experimental studies of adhesive joint performance. Subwavelength displacement resolution of a few micro-inches, and spatial resolution corresponding to 1600 fringes/inch (64 fringes/mm), were obtained in these studies. The whole-field contour maps offer insights not available from local measurements made by high sensitivity gages.

Post, D.↗
NASA NTRS1985

STPI/LARC: A 200 deg C polyimide adhesive

A copolyimide, STPI/LARC, was prepared from the reaction of 3,3'4'benzophenonetetracarboxylic dianhydride (BTDA), equimolar quantities of m-phenylenediamine and 4,4'-oxydianiline, and a small amount of phthalic anhydride to control the molecular weight. The processability and adhesive properties of STPI/LARC were compared to those of a commercially available form of LARC-TPI. LARC-TPI, a thermoplastic polyimide, from the reaction of BTDA and 3,3'-diaminobenzophenone, had previously shown promise as a high temperature structural adhesive. Lap shear specimens were fabricated using adhesive tape prepared from each of the two polymers. Lap shear tests were performed at room temperature, 177 C, and 204 C before and after exposure to a 72-hour water-boil and to aging at 204 C.

Progar, D. J.↗
NASA NTRS1984

Cyclic debonding of adhesively bonded composites

To analyze the fatigue behavior of a simple composite-to-composite bonded joint, a combined experimental and analytical study of the cracked-lap-shear specimen subjected to constant-amplitude cyclic loading was undertaken. Two bonded systems were studied: T300/5208 graphite/epoxy adherends bonded with adhesives EC 3445 and with FM-300. For each bonded system, two specimen geometries were tested: (1) a strap adherend of 16 plies bonded to a lap adherend of 8 plies, and (2) a strap adherend of 8 plies bonded to a lap adherend of 16 plies. In all specimens tested, the fatigue failure was in the form of cyclic debonding with some 0 deg fiber pull-off from the strap adherend. The debond always grew in the region of adhesive that had the highest mode I (peel) loading and that region was close to the adhesive-strap interface. Furthermore, the measured cyclic debond growth rates correlated well with total strain energy release rates G(T) as well as with its components G(I) (peel) and G(II) (shear) for the mixed-mode loading in the present study.

Mall, S.↗
NASA NTRS1984

Fracture of composite-adhesive-composite systems

This program was undertaken to initiate the development of a test method for testing adhesive joints in metal-adhesive-composite systems. The uniform double cantilever beam (UDCB) and the width tapered beam (WTB) specimen geometries were evaluated for measuring Mode I fracture toughness in these systems. The WTB specimen is the preferred geometry in spite of the fact that it is more costly to machine than the UDCB specimen. The use of loading tabs attached to thin sheets of composites proved to be experimentally unsatisfactory. Consequently, a new system was developed to load thin sheets of adherends. This system allows for the direct measurement of displacement along the load line. In well made joints separation occurred between the plies rather than in the adhesive.

Ripling, E. J.↗
NASA NTRS1985

Ceramic microstructure and adhesion

When a ceramic is brought into contact with a ceramic, a polymer, or a metal, strong bond forces can develop between the materials. The bonding forces will depend upon the state of the surfaces, cleanliness and the fundamental properties of the two solids, both surface and bulk. Adhesion between a ceramic and another solid are discussed from a theoretical consideration of the nature of the surfaces and experimentally by relating bond forces to interface resulting from solid state contact. Surface properties of ceramics correlated with adhesion include, orientation, reconstruction and diffusion as well as the chemistry of the surface specie. Where a ceramic is in contact with a metal their interactive chemistry and bond strength is considered. Bulk properties examined include elastic and plastic behavior in the surficial regions, cohesive binding energies, crystal structures and crystallographic orientation. Materials examined with respect to interfacial adhesive interactions include silicon carbide, nickel zinc ferrite, manganese zinc ferrite, and aluminum oxide. The surfaces of the contacting solids are studied both in the atomic or molecularly clean state and in the presence of selected surface contaminants.

Buckley, D. H.↗
NASA NTRS1986

Rapid Adhesive Bonding of Composites

Strong bonds created in less time and with less power than use of conventional bonding methods. Rapid adhesive bonding (RAB) technique for composites uses high-frequency induction heating toroids to quickly heat metallic susceptor impregnated with thermoplastic adhesive or sandwiched between thermoset or thermoplastic adhesive cloths or films. Susceptor steel screen or perforated steel foil.

Stein, B. A.↗
NASA NTRS1985

Recent developments in polyimide and bismaleimide adhesives

Research on high temperature resin systems has intensified. In the Aerospace Industry, the motivation for this increased activity has been to replace heat resistant alloys of aluminum, stainless steel and titanium by lighter weight glass and carbon fiber reinforced composites. Applications for these structures include: (1) engine nacelles involving long time exposure (thousands of hours) to temperatures in the 150 to 300 C range, (2) supersonic military aircraft involving moderately long exposure (hundreds of hours) to temperatures of 150 to 200 C, and (3) missile applications involving only brief exposure (seconds or minutes) to temperatures up to 500 C and above. Because of fatigue considerations, whenever possible, it is preferable to bond rather than mechanically fasten composite structures. For this reason, the increased usage of high temperature resin matrix systems for composites has necessitated the devlopment of compatible and equally heat stable adhesive systems. The performance of high temperature epoxy, epoxy phenolic and condensation polyimide adhesives is reviewed. This is followed by a discussion of three recently developed types of adhesives: (1) condensation reaction polyimides having improved processing characteristics; (2) addition reaction polyimides; and (3) bismaleimides.

Politi, R. E.↗
NASA NTRS1986

Adhesive evaluation of thin films of LARC-TPI and LARC-TPI with 5 mol % ODA

A commercially available LARC-TPI film and an experimentally prepared film of LARC-TPI with 5 mol % of 4,4'-oxydianiline (ODA), designated as LARC-TPI/ODA in the report, supplied by Mitsui Toatsu Chemicals, Incorporated (MTCI), Japan, were evaluated as thermoplastic adhesive films for bonding Ti-6Al-4V. The LARC-TPI/ODA had been shown by MTCI to possess more flow than thermoplastic LARC-TPI and was, therefore, evaluated and compared to the LARC-TPI. Lap shear strength was used to evaluate the materials as adhesives. They were characterized after fracture by determining the glass transition temperature, Tg. The mode of failure was also reported. Thermal exposure at 204C for 500 and 1000 hrs and a 72-hour water-boil were conducted on lap shear specimens prepared with the two adhesive films. Lap shear tests were conducted at RT, 177C, 204C, and 232C before and after exposures.

Progar, D. J.↗
NASA NTRS1984

Evaluation of high temperature structural adhesives for extended service

The preliminary evaluation of crosslinked polyphenyl quinoxaline (X-PPQ), LARC-TPI, ethyl terminated polysulfone (ETPS), and crosslinked polyimide (X-PI) as adhesives is presented. Lap shear strength stability under thermal, combined thermal/humidity, and stressed and unstressed Skydrol exposure was determined. The X-PPQ, LARC-TPI, and X-PI exhibited good adhesive performance at 505K (450 F) after 1000 hours at 505K. These three polymers also performed well after exposure to combined elevated temperature/high humidity, as well as, to Skydrol while under stress. The ETPS exhibited good ambient temperature adhesive properties, but performed poorly under all other exposure conditions, presumably due to inadequate chain extension and crosslinking.

Hendricks, C. L.↗
NASA NTRS1987

Ceramic Adhesive for High Temperatures

Fused-silica/magnesium-phosphate adhesive resists high temperatures and vibrations. New adhesive unaffected by extreme temperatures and vibrations. Assuring direct bonding of gap filters to tile sidewalls, adhesive obviates expensive and time-consuming task of removal, treatment, and replacement of tiles.

Stevens, Everett G.↗
NASA NTRS1987

Adhesion, friction, and deformation of ion-beam-deposited boron nitride films

The tribological properties and mechanical strength of boron nitride films were investigated. The BN films were predominantly amorphous and nonstoichiometric and contained small amounts of oxides and carbides. It was found that the yield pressure at full plasticity, the critical load to fracture, and the shear strength of interfacial adhesive bonds (considered as adhesion) depended on the type of metallic substrate on which the BN was deposited. The harder the substrate, the greater the critical load and the adhesion. The yield pressures of the BN film were 12 GPa for the 440C stainless steel substrate, 4.1 GPa for the 304 stainless steel substrate, and 3.3 GPa for the titanium substrate.

Miyoshi, Kazuhisa↗
NASA NTRS1987

Adhesive evaluation of new polyimides

During the past 10 to 15 years, the Materials Division at NASA Langley Research Center (LaRC) has developed several novel high temperature polyimide adhesives for anticipated needs of the aerospace industry. These developments have resulted from fundamental studies of structure-property relationships in polyimides. Recent research at LaRC has involved the synthesis and evaluation of copolyimides which incorporate both flexibilizing bridging groups and meta-linked benzene rings. The purpose was to develop systems based on low cost, readily available monomers. Two of these copolyimides evaluated as adhesives for bonding titanium alloy, Ti(6Al-4V), are identified as LARC-STPI and STPI-LARC-2. Lap shear strength (LSS) measurements were used to determine the strength and durability of the adhesive materials. LSS results are presented for LARC-TPI and LARC-STPI lap shear specimens thermally exposed in air at 232 C for up to 5000 hrs. LARC-TPI was shown to perform better than the copolymer LARC-STPI which exhibited poor thermooxidative performance possibly due to the amines used which would tend to oxidize easier than the benzophenone system in LARC-TPI.

Stclair, Terry L.↗
NASA NTRS1987

Interfacial adhesion of carbon fibers

Relative adhesion strengths between AS4, AS1, and XAS carbon fibers and thermoplastic polymers were determined using the embedded single filament test. Polymers studied included polycarbonate, polyphenylene oxide, polyetherimide, polysulfone, polyphenylene oxide blends with polystyrene, and polycarbonate blends with a polycarbonate polysiloxane block copolymer. Fiber surface treatments and sizings improved adhesion somewhat, but adhesion remained well below levels obtained with epoxy matrices. An explanation for the differences between the Hercules and Grafil fibers was sought using X ray photon spectroscopy, wetting, scanning electron microscopy and thermal desorption analysis.

Bascom, Willard D.↗
NASA NTRS1985

The effects of molecular weight on the single lap shear creep and constant strain rate behavior of thermoplastic polyimidesulfone adhesive

The bonded shear creep and constant strain rate behaviors of zero, one, and three percent endcapped thermoplastic polyimidesulfone adhesive were examined at room and elevated temperatures. Endcapping was accomplished by the addition of phthalic anhydrides. The primary objective was to determine the effects of molecular weight on the mechanical properties of the adhesive. Viscoelastic and nonlinear elastic constitutive equations were utilized to model the adhesive. Ludwik's and Crochet's relations were used to describe the experimental failure data. The effects of molecular weight changes on the above mentioned mechanical behavior were assessed. The viscoelastic Chase-Goldsmith and elastic nonlinear relations gave a good fit to the experimental stress strain behavior. Crochet's relations based on Maxwell and Chase-Goldsmith models were fit to delayed failure data. Ludwik's equations revealed negligible rate dependence. Ultimate stress levels and the safe levels for creep stresses were found to decrease as molecular weight was reduced.

Dembosky, Stanley K.↗